Chip connection device and chip processing equipment

Abstract

The utility model belongs to chip processing technical field discloses a kind of chip connection device and chip processing equipment.The chip connection device is used to connect chip from ejector device, and the chip connection device includes driving structure and connection finger arm, two are arranged at intervals in connection finger arm, connection finger arm is connected with driving structure, and driving structure drives at least one connection finger arm to move, to make two connection finger arms mutually close or away;Two connection finger arms are each equipped with connection finger, and two connection fingers are used to support adsorption chip back face.By using driving structure to drive at least one connection finger arm to move, so that two connection finger arms can mutually close or away, to adapt to chip of different sizes, and the connection finger of two connection finger arms can directly support adsorption chip from chip back face, complete chip connection, subsequent chip does not need to be turned over, can effectively save time, to carry out subsequent chip processing.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a chip connection device and chip processing equipment. Background Technology

[0002] Semiconductor chip manufacturing refers to the process of producing integrated circuit chips from raw materials (usually silicon) through a series of complex technological steps.

[0003] In the prior art, after the chip is lifted from the center of the back side using an ejector device, it is then picked up from the front side using a suction cup (i.e., the ejector device acts on the back side of the chip, and the suction cup acts on the front side of the chip). After that, the chip needs to be flipped over for subsequent processing.

[0004] Therefore, there is an urgent need to provide a chip connection device and chip processing equipment to connect the chip from the ejection device and directly pick up the back of the chip without flipping the chip, saving time for subsequent chip processing. Utility Model Content

[0005] The purpose of this invention is to provide a chip connection device and a chip processing equipment, which can connect the chip from the ejection device and directly pick up the back of the chip without flipping the chip, saving time for subsequent chip processing.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] This utility model provides a chip connection device for connecting a chip from an ejection device. The chip connection device includes a driving structure and connection finger arms. Two connection finger arms are spaced apart and connected to the driving structure. The driving structure drives at least one connection finger arm to move so that the two connection finger arms move closer or further apart from each other. Each of the two connection finger arms is provided with connection fingers, which are used to support and adsorb the back of the chip.

[0008] As an optional technical solution for a chip connection device, it also includes a transmission component. The drive structure is connected to the two connection finger arms through the transmission component to drive at least one of the connection finger arms, so as to make the two connection finger arms move closer or further apart.

[0009] As an optional technical solution for a chip connection device, it also includes two sliders, with the two connection finger arms respectively fixed on the two sliders. The drive structure is provided with a slide rail, and each connection finger arm is slidably mounted on the slide rail via one of the sliders.

[0010] As an optional technical solution for chip connection device, the connection fingers are provided with connection surfaces, and the connection surfaces of the two connection fingers are flush to fit against the back of the chip to jointly support the chip.

[0011] As an optional technical solution for a chip connector, it also includes a suction device. The connector finger arm is provided with an air passage, and the connector surface is provided with an adsorption port. One end of the air passage is connected to the suction device, and the other end of the air passage is connected to the adsorption port. The suction device is used to generate negative pressure at the adsorption port.

[0012] As an optional technical solution for chip connection device, a pressure measurement sensor is also included, which is disposed at the adsorption port or in the air passage for measuring air pressure.

[0013] As an optional technical solution for a chip connection device, the connection fingers are provided with limiting surfaces, which intersect with the connection surface. The limiting surfaces of the two connection fingers are arranged opposite to each other to limit or clamp the chip from both sides.

[0014] As an optional technical solution for chip connection devices, the driving structure is surrounded by a barrier.

[0015] As an optional technical solution for chip connection devices, the connection finger and the connection finger arm are detachably connected.

[0016] This utility model provides a chip processing equipment, including an ejection device and the chip connection device described above.

[0017] Beneficial effects:

[0018] This invention provides a chip bonding device for bonding chips from an ejector. The device includes a driving structure and two bonding finger arms spaced apart. Each finger arm is connected to the driving structure, which drives at least one finger arm to move, allowing the two finger arms to move closer or further apart. Each finger arm has bonding fingers that support and adhere to the back of the chip. By using the driving structure to move at least one finger arm, the two finger arms can move closer or further apart to accommodate chips of different sizes. Furthermore, the bonding fingers of the two finger arms can directly support and adhere to the chip from its back, completing the chip bonding process without the need for subsequent chip flipping, effectively saving time for subsequent chip processing.

[0019] This utility model provides a chip processing equipment, including an ejection device and a chip connection device. By setting the chip connection device, the chip is connected from the ejection device without flipping the chip, which improves the chip processing efficiency. Attached Figure Description

[0020] Figure 1 This is a first-view structural schematic diagram of the chip connection device provided in this embodiment of the present invention;

[0021] Figure 2 This is a second-view structural schematic diagram of the chip connection device provided in this embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the chip connection device and chip provided in this embodiment of the utility model;

[0023] Figure 4 This is a partial structural diagram of the connecting finger provided in an embodiment of the present utility model.

[0024] In the picture:

[0025] 100. Chip; 10. Drive structure; 11. Slide rail; 12. Enclosure; 20. Slider; 30. Connecting finger arm; 31. Connecting finger; 311. Connecting surface; 312. Limiting surface; 313. Adsorption port. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0027] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0030] like Figures 1 to 4 As shown, this embodiment provides a chip connection device for connecting a chip 100 from an ejection device. The chip connection device includes a driving structure 10 and connection finger arms 30. Two connection finger arms 30 are spaced apart and connected to the driving structure 10. The driving structure 10 drives at least one connection finger arm 30 to move so that the two connection finger arms 30 move closer or further apart from each other. Each of the two connection finger arms 30 is provided with a connection finger 31, which is used to support the back of the adsorbed chip 100.

[0031] Chip 100 has a bonding surface for bonding with other semiconductor materials (such as wafers, chips), and the back side of chip 100 is disposed opposite to the bonding surface of chip 100 along the thickness direction of chip 100.

[0032] By using the driving structure 10 to drive at least one connecting finger arm 30 to move, the two connecting finger arms 30 can move closer or further apart to accommodate chips 100 of different sizes. The connecting fingers 31 of the two connecting finger arms 30 can directly support and adsorb the chip 100 from the back of the chip 100 to complete the chip connection. There is no need to flip the chip 100 afterward, which can effectively save time for subsequent chip processing and improve chip processing efficiency.

[0033] Specifically, it also includes a transmission assembly. The drive structure 10 is connected to two connecting finger arms 30 via the transmission assembly to drive at least one connecting finger arm 30, allowing the two connecting finger arms 30 to move closer or further apart. By setting up the drive structure 10 and the transmission assembly, the drive structure 10 drives at least one connecting finger arm 30 to move via the transmission assembly, allowing the two connecting finger arms 30 to move closer or further apart, achieving flexible adjustment of the position of the two connecting finger arms 30 and providing good adaptability. The drive structure 10 can be a motor or a cylinder, and the transmission assembly can be a lead screw and nut, or a gear and rack structure, etc.

[0034] In this embodiment, the drive structure 10 drives the two connecting finger arms 30 to move synchronously through the transmission component; in other embodiments, the drive structure 10 can also drive only one connecting finger arm 30 to move through the transmission component.

[0035] In this embodiment, the chip connection device further includes two sliders 20, and two connection finger arms 30 are respectively fixed on the two sliders 20. The drive structure 10 is provided with a slide rail 11, and each connection finger arm 30 is slidably disposed on the slide rail 11 via a slider 20. By providing a slide rail 11 on the drive structure 10, the sliding engagement between the slider 20 and the slide rail 11 restricts the movement direction of the connection finger arm 30.

[0036] It is understood that the drive structure 10 includes a base plate and a drive assembly. The drive assembly and the slide rail 11 are both connected to the base plate. The transmission assembly is connected to the base plate and to the slider 20. The drive assembly drives the slider 20 to move along the slide rail 11 through the transmission assembly, thereby driving the connecting finger arm 30 to move.

[0037] Optionally, a baffle 12 is provided around the drive structure 10. By providing the baffle 12 around the drive structure 10, the chip 100 can be protected, preventing debris generated by friction during operation of the drive structure 10 and movement of the slider 20 from falling and contaminating the chip 100. The slide rail 11 can be fixed to the outside of the baffle 12 or to the top of the drive structure 10.

[0038] Optionally, the connecting fingers 31 are provided with connecting surfaces 311, and the connecting surfaces 311 of the two connecting fingers 31 are flush and used to fit against the back of the chip 100 to jointly support the chip 100. By setting the connecting surfaces 311 of the two connecting fingers 31 to be flush, the connecting surfaces 311 of the two connecting fingers 31 are respectively attached to the two sides of the back of the chip 100 to ensure the stability of the chip 100 support.

[0039] To adsorb the chip 100, the chip connection device also includes a suction device. An air passage is provided within the connection finger arm 30, and an adsorption port 313 is provided on the contact surface 311 of the connection finger 31. One end of the air passage is connected to the suction device, and the other end is connected to the adsorption port 313. The suction device generates negative pressure at the adsorption port 313. By providing an air passage within the connection finger arm 30 and an adsorption port 313 on the connection finger 31, the chip 100 is adsorbed using negative pressure, resulting in stronger and more stable adsorption force. This ensures the stability of chip 100 adsorption and allows for application to chips 100 of different shapes and sizes, exhibiting high size compatibility.

[0040] Optionally, the chip connection device also includes a pressure measurement sensor, which is located at the adsorption port 313 or inside the air passage to measure air pressure. By setting up the pressure measurement sensor, the device can determine whether the chip 100 is adsorbed at the adsorption port 313 based on the air pressure value detected by the sensor. This allows for real-time monitoring of the adsorption status, preventing abnormal processing interruptions and avoiding displacement or drop of the chip 100 due to adsorption failure. The specific principle and type of the pressure measurement sensor can be found in existing technologies.

[0041] Optionally, the connecting finger 31 is detachably connected to the connecting finger arm 30. By providing a detachable connecting finger 31 on the connecting finger arm 30, it is convenient to replace and maintain the connecting finger 31. In this embodiment, the connecting finger arm 30 is composed of multiple connecting plates connected by bolts; the connecting finger 31 is fixed to the end of the connecting finger arm 30 by bolts, and the connecting finger 31 and the connecting finger arm 30 are sealed together to ensure the airway's airtightness.

[0042] Optionally, a limiting surface 312 is provided on the connecting finger 31, the limiting surface 312 intersects with the connecting surface 311, and the limiting surfaces 312 of the two connecting fingers 31 are arranged opposite each other to limit or clamp the chip 100 from both sides.

[0043] By setting the limiting surfaces 312 of the two connecting fingers 31 to face each other, when the two connecting finger arms 30 approach each other, the limiting surfaces 312 of the two connecting fingers 31 can limit or clamp the chip 100 from both sides, further preventing the chip 100 from shifting or falling off.

[0044] In this embodiment, the connecting finger 31 is Z-shaped, and the top of the connecting finger 31 is fixed to the bottom surface of the end of the connecting finger arm 30; the connecting finger 31 on each connecting finger arm 30 extends toward the direction of approaching another connecting finger arm 30, and the two connecting fingers 31 are located between the two connecting finger arms 30; the suction port 313 is located on the connecting surface 311 and is located in the middle of the connecting surface 311.

[0045] Another aspect of this embodiment provides a chip processing apparatus, which includes an ejector device and a chip connection device. By setting the chip connection device, the chip 100 is connected from the ejector device without flipping the chip 100, thereby improving the processing efficiency of the chip 100.

[0046] The following is a detailed description of the chip connection device's operation:

[0047] The ejector pin of the ejector device lifts the chip 100, and the drive structure 10 drives the connecting finger arm 30 to move, so that the two connecting fingers 31 move to the target position. As the slider 20 slides, the two connecting fingers 31 gradually approach each other, and the connecting surface 311 of the connecting fingers 31 contacts the back of the chip 100. The connecting fingers 31 adsorb the chip 100 through the suction port 313. The chip connecting device picks up the chip 100 from the back, avoiding contact with the bonding surface of the chip 100, thereby completing the chip connection. Subsequently, other transfer devices remove the chip 100. When the chip 100 is removed, the suction port 313 of the chip connecting device is released, and the drive structure 10 drives the slider 20 to slide, so that the two connecting fingers 31 move away from each other, thereby releasing the chip 100.

[0048] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A chip connector, characterized in that, For connecting a chip (100) from an ejection device, the chip connection device includes a drive structure (10) and connection finger arms (30). Two connection finger arms (30) are spaced apart and connected to the drive structure (10). The drive structure (10) drives at least one connection finger arm (30) to move so that the two connection finger arms (30) move closer to or further away from each other. Each of the two connection finger arms (30) is provided with a connection finger (31), which is used to support and adsorb the back of the chip (100).

2. The chip connection device according to claim 1, characterized in that, It also includes a transmission assembly, wherein the drive structure (10) is connected to the two connecting finger arms (30) through the transmission assembly to drive at least one of the connecting finger arms (30) so that the two connecting finger arms (30) move closer to or further away from each other.

3. The chip connection device according to claim 1, characterized in that, It also includes two sliders (20), and the two connecting finger arms (30) are respectively fixed on the two sliders (20). The drive structure (10) is provided with a slide rail (11), and each connecting finger arm (30) is slidably disposed on the slide rail (11) through one of the sliders (20).

4. The chip connection device according to claim 1, characterized in that, The connecting fingers (31) are provided with connecting surfaces (311), and the connecting surfaces (311) of the two connecting fingers (31) are flush with each other to fit against the back of the chip (100) to jointly support the chip (100).

5. The chip connection device according to claim 4, characterized in that, It also includes a suction device, the connecting finger arm (30) is provided with an air passage, the connecting surface (311) is provided with an adsorption port (313), one end of the air passage is connected to the suction device, and the other end of the air passage is connected to the adsorption port (313). The suction device is used to generate negative pressure at the adsorption port (313).

6. The chip connection device according to claim 5, characterized in that, It also includes a pressure measurement sensor, which is disposed at the adsorption port (313) or in the airway for measuring air pressure.

7. The chip connection device according to claim 4, characterized in that, The connecting finger (31) is provided with a limiting surface (312), which intersects with the connecting surface (311). The limiting surfaces (312) of the two connecting fingers (31) are arranged opposite to each other to limit or clamp the chip (100) from both sides.

8. The chip connection device according to claim 1, characterized in that, The drive structure (10) is surrounded by a barrier (12).

9. The chip connection device according to claim 1, characterized in that, The connecting finger (31) is detachably connected to the connecting finger arm (30).

10. Chip processing equipment, characterized in that, It includes an ejection device and a chip connection device as described in any one of claims 1-9.

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