Micro heat source structure, atomizing core and electronic device
By setting hollow patterns or raised/recessed structures on the impedance body on the substrate, the current path is changed, which solves the problem of low thermal radiation efficiency of traditional micro resistors and achieves more efficient heat radiation and transfer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GLASSMICRO (CHONGQING) SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-03-31
- Publication Date
- 2026-06-19
AI Technical Summary
Traditional micro-resistors have low thermal radiation efficiency and limitations in heat transfer efficiency.
By setting hollow patterns or raised/recessed structures on the substrate to alter the current conduction path and increase the resistance, the heat radiation efficiency can be improved.
It effectively improves heat transfer efficiency and enhances the heating effect of the micro heat source structure.
Smart Images
Figure CN224369076U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic component technology, and in particular relates to a micro heat source structure, atomizing core and electronic device. Background Technology
[0002] A resistor, or simply resistor, is a conductor that impedes the flow of electric current. Because a resistor is an energy-consuming element that opposes the flow of current, it can generate heat through resistance. However, traditional miniature resistors dedicate the entire component to heating and transferring heat, resulting in limitations in heat transfer efficiency and low thermal radiation efficiency. Utility Model Content
[0003] This application provides a micro heat source structure, which aims to solve the problem of low thermal radiation efficiency in existing resistors.
[0004] The embodiments of this application are implemented as follows: a micro heat source structure is provided, comprising:
[0005] Substrate, the substrate having a first surface; and
[0006] Impedance body disposed on the first surface;
[0007] The impedance body has at least one hollowed-out pattern.
[0008] Furthermore, the cutout pattern can be either a closed pattern or an open pattern.
[0009] Furthermore, the substrate has a second surface opposite to the first surface, and the substrate is provided with heat dissipation holes that penetrate the first and second surfaces of the substrate. The projection of the hollow pattern on the first surface at least partially covers the projection of the heat dissipation holes on the first surface.
[0010] Furthermore, the substrate has a second surface opposite to the first surface, and the substrate is provided with heat dissipation holes that penetrate the first and second surfaces of the substrate. The projection of the hollow pattern on the first surface and the projection of the heat dissipation holes on the first surface do not overlap.
[0011] Furthermore, the hollowed-out pattern forms a hollowed-out area, and the portion of the impedance body located in the hollowed-out area has branches extending into the hollowed-out area.
[0012] Furthermore, it also includes a heat dissipation layer, which is disposed on the second surface and partially fills the heat dissipation holes.
[0013] Furthermore, it also includes a protective layer disposed on the first surface and covering the impedance body.
[0014] Furthermore, the substrate is a glass substrate.
[0015] Secondly, this application also provides a micro heat source structure, comprising:
[0016] Substrate, the substrate having a first surface; and
[0017] Impedance body disposed on the first surface;
[0018] The first surface is provided with at least one protrusion or pit, the impedance body covers the protrusion or pit, or the impedance body is provided with at least one protrusion.
[0019] Thirdly, this application also provides an atomizing core, including the micro heat source structure as described above.
[0020] Fourthly, this application also provides an electronic device including the micro heat source structure as described above.
[0021] The beneficial effects of this application are as follows: The micro heat source structure provided by this application includes a substrate having a first surface; and an impedance body disposed on the first surface; the impedance body is provided with at least one hollow pattern. By setting the hollow pattern, the conduction path of the impedance body is changed, the resistance is increased, and the impedance body can radiate heat more effectively, thereby improving the overall heat transfer efficiency. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the impedance body of an embodiment of the micro heat source structure provided in this application;
[0023] Figure 2 This is a schematic diagram of the impedance body of another embodiment of the micro heat source structure provided in this application;
[0024] Figure 3 This is a cross-sectional schematic diagram of an embodiment of the micro heat source structure provided in this application;
[0025] Figure 4 This is a cross-sectional schematic diagram of another embodiment of the micro heat source structure provided in this application;
[0026] Figure 5 This is a schematic diagram of an embodiment of the micro heat source structure provided in this application, showing that the impedance body is provided with a support.
[0027] Figure 6 This is a cross-sectional view of an embodiment of the micro heat source structure provided in this application, showing that the heat dissipation holes and the hollowed-out pattern do not overlap.
[0028] Explanation of reference numerals in the attached figures:
[0029] 100-Substrate, 110-First surface, 120-Second surface, 130-Heat dissipation hole, 200-Impedance body, 300-Knockout pattern, 310-Support, 400-Electrode, 500-Heat dissipation layer, 600-Protective layer, 610-Window. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this application and are not intended to limit this application.
[0031] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0035] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference values and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0036] The micro heat source structure provided in this application includes a substrate having a first surface; and an impedance body disposed on the first surface; the impedance body has at least one hollow pattern. By setting the hollow pattern, the conduction path of the impedance body is changed, enabling the impedance body to radiate heat more effectively when generating heat, thereby improving the overall heat transfer efficiency.
[0037] like Figures 1 to 6 As shown, one embodiment of this application provides a micro heat source structure, including:
[0038] Substrate 100, substrate 100 having a first surface 110; and
[0039] Impedance body 200 is disposed on the first surface 110;
[0040] The impedance body 200 is provided with at least one hollow pattern 300.
[0041] In practice, the micro heat source structure provided in this application can be regarded as a resistive element, wherein the substrate 100 is used to support the impedance body 200.
[0042] Optionally, the substrate 100 may be made of an insulating material, such as glass, plastic or other insulating materials. The substrate 100 is preferably made of glass substrate 100, but there is no limitation.
[0043] The impedance body 200 is the core of the micro heat source structure and acts as a heat source. The impedance body 200 can be a resistor body or an interdigitated (forked) structure body.
[0044] Optionally, the impedance body 200 can be in the form of a strip or a block structure. For example, the impedance body 200 can be designed as a long strip that is straight, curved, spiral or wavy.
[0045] It should be noted that the shape of the impedance body 200 described above is an example of the embodiments of this application, and not a specific limitation of this application. In some other embodiments, the impedance body 200 may also adopt other shapes. For example, all or part of the impedance body 200 may be designed as a snake shape, without limitation.
[0046] Optionally, the impedance body 200 can be prepared by electroplating, PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), PCVD (plasma chemical vapor deposition), or other methods, without limitation.
[0047] The impedance body 200 is provided with at least one hollowed-out pattern 300, such as Figure 1 As shown, these cutout patterns 300 penetrate the impedance body 200, meaning that the locations of the cutout patterns 300 are empty. For example, when the impedance body is a metal film electroplated on the substrate surface, the cutout patterns 300 are areas on the substrate surface where no metal film is plated. Current can only be conducted through areas other than the cutout patterns 300. Because of the cutout areas, the current conduction path is bent, lengthened, and / or its cross-section is reduced, thereby increasing the resistance of the conduction path, increasing heat generation, and thus improving heat transfer efficiency.
[0048] Optionally, the cutout pattern 300 includes at least one of square, circular, elliptical, polygonal, or irregular shapes, without limitation.
[0049] Optionally, the cutout pattern 300 can be fabricated simultaneously with the preparation of the impedance body 200. For example, if the impedance body 200 is electroplated in a specific area of the substrate 100, then the remaining areas will have a cutout pattern 300 without deposited metal.
[0050] Alternatively, the hollow pattern 300 can also be formed by etching or physical means after the impedance body 200 is prepared.
[0051] As one possible implementation, the size, number, and arrangement of the cutout patterns 300 can be set according to actual conditions (such as the length and width of the impedance body 200 and the required heating efficiency, etc.) and are not limited.
[0052] Optionally, the several hollowed-out patterns 300 can be arranged in strips, squares, or other ways, without limitation.
[0053] Optionally, the impedance body 200 is provided with electrodes 400, for example, electrodes 400 are provided at both ends of the impedance body 200, such as... Figure 1 As shown, electrode 400 is used for electrical connection with an external circuit to connect resistive components into the circuit and realize the corresponding functions.
[0054] Optionally, the cutout pattern 300 can be a closed pattern or a non-closed pattern, without limitation. Among them, a closed pattern refers to a pattern that is completely located within the impedance body 200, while a non-closed pattern refers to a pattern located at the edge of the impedance body 200. In this case, the non-closed pattern can be regarded as a slot at the edge of the impedance body 200, which allows for more combinations of cutout patterns 300, more varied current conduction paths, and wider applicability.
[0055] Optionally, the cutout pattern 300 forms a cutout area, and the portion of the impedance body 200 located within the cutout area has a branch 310 extending into the cutout area, such as... Figure 5 As shown. By setting the support 310, the hollow pattern 300 can be made more disordered, thereby making the current conduction path more tortuous, increasing the resistance of the impedance body 200, and enhancing the heating effect.
[0056] Furthermore, the substrate 100 has a second surface 120 opposite to the first surface 110, and the substrate 100 is provided with heat dissipation holes 130, such as... Figure 3 As shown. Optionally, the heat dissipation hole 130 penetrates the first surface 110 and the second surface 120 of the substrate 100, and the projection of the hollow pattern 300 on the first surface 110 at least covers part of the projection of the heat dissipation hole 130 on the first surface 110.
[0057] The first surface 110 and the second surface 120 are opposite sides. For example, when the first surface 110 is the top surface of the substrate 100, the second surface 120 is the bottom surface of the substrate 100. This will not be elaborated further.
[0058] By providing heat dissipation holes 130, the heat generated by the impedance body 200 can be effectively conducted to the second surface 120 of the substrate 100, increasing the surface area of the micro heat source structure and thus improving heat conduction efficiency. Furthermore, the perforated pattern 300 covering the heat dissipation holes 130 helps reduce the etching area of the metal or the amount of etching solution used during the photolithography stage, thereby controlling production costs.
[0059] As one possible implementation method, such as Figure 6 As shown, the projection of the cutout pattern 300 on the first surface 110 does not overlap with the projection of the heat dissipation hole 130 on the first surface 110. With the above arrangement, part of the heat generated by the impedance body 200 is conducted to the heat dissipation hole 130, so that the heat can be further conducted to the second surface 120 of the substrate 100, which is beneficial for heating of gas or liquid during the transmission process and improves the heat conduction efficiency.
[0060] Furthermore, the micro heat source structure provided in this application also includes a heat dissipation layer 500, which is disposed on the second surface 120 and partially fills the heat dissipation holes 130.
[0061] In practice, the heat dissipation layer 500 can be made in the same process (e.g., electroplating) as the impedance body 200. That is, the material of the heat dissipation layer 500 can be the same as the material of the impedance body 200, and the heat dissipation layer 500 is partially filled in the heat dissipation holes 130, thereby quickly absorbing heat to improve heat dissipation efficiency.
[0062] As one possible implementation, the heat dissipation layer 500 may also be provided with perforations corresponding to the positions of the heat dissipation holes 130. By providing perforations, the gas flow of the micro heat source structure can be effectively increased, thereby improving the heat conduction efficiency.
[0063] Furthermore, the micro heat source structure provided in this application also includes a protective layer 600 disposed on the first surface 110 and covering the impedance body 200.
[0064] Optionally, the protective layer 600 covers the impedance body 200, that is, the substrate 100, the impedance body 200, and the protective layer 600 are arranged sequentially, such as... Figure 4 As shown. By setting the protective layer 600, the impedance body 200 can be protected against oxidation and corrosion.
[0065] Optionally, the protective layer 600 is provided with a window 610 that extends to the impedance body 200 to expose the electrode 400, facilitating the electrical connection between the micro heat source structure and the external circuit.
[0066] Optionally, the protective layer 600 may also be provided with through holes corresponding to the hollowed-out pattern 300 to ensure smooth gas flow and improve thermal radiation efficiency.
[0067] Furthermore, the protective layer 600 can also be made of a material with high thermal conductivity. The thermally conductive layer not only protects the impedance body 200 from oxidation, but also conducts heat and improves the heat transfer efficiency.
[0068] In some possible embodiments, this application also provides another micro heat source structure, including:
[0069] Substrate 100, substrate 100 having a first surface 110; and
[0070] Impedance body 200 is disposed on the first surface 110;
[0071] The first surface 110 is provided with at least one protrusion or pit, the impedance body 200 covers the protrusion or pit, or the impedance body 200 is provided with at least one protrusion.
[0072] In practice, the micro heat source structure provided in this application can be regarded as a resistive element, wherein the substrate 100 is used to support the impedance body 200.
[0073] Optionally, the substrate 100 may be made of an insulating material, such as glass, plastic or other insulating materials. The substrate 100 is preferably made of glass substrate 100, but there is no limitation.
[0074] The impedance body 200 is the core of the micro heat source structure and acts as a heat source. The impedance body 200 can be a resistor body or an interdigitated (forked) structure body.
[0075] Optionally, the impedance body 200 can be in the form of a strip or a block structure. For example, the impedance body 200 can be designed as a long strip that is straight, curved, spiral or wavy.
[0076] It should be noted that the shape of the impedance body 200 described above is an example of the embodiments of this application, and not a specific limitation of this application. In some other embodiments, the impedance body 200 may also adopt other shapes. For example, all or part of the impedance body 200 may be designed as a snake shape, without limitation.
[0077] Optionally, the impedance body 200 can be prepared by electroplating, PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), PCVD (plasma chemical vapor deposition), or other methods, without limitation.
[0078] The first surface 110 has at least one protrusion or pit. When the impedance body 200 is fabricated on the first surface 110, the impedance body 200 will also cover the protrusion or pit, thereby forming a protrusion structure or a pit structure of the impedance body 200. By forming a protrusion structure or a pit structure on the impedance body 200, the current path of the impedance body 200 can be effectively changed, the resistance value can be increased, and the impedance body 200 can radiate heat more effectively, thereby improving the heating efficiency of the micro heat source structure.
[0079] As one possible implementation, at least one protrusion can be directly provided on the impedance body 200. That is, a protrusion structure can also be generated on the flat surface of the first surface 110 to change the current path of the impedance body 200 and improve the heating efficiency of the micro heat source structure.
[0080] In practice, the protruding structure of the impedance body 200 can be formed by multiple fabrications and stacking at the same location during the fabrication of the impedance body 200, which will not be elaborated further.
[0081] This application also provides an atomizing core, including the micro heat source structure as described above.
[0082] The atomizer core is the core component of atomizers, e-cigarettes, or other atomizing electronic products. It is mainly responsible for heating and vaporizing liquid drugs, e-liquids, or other liquids that need to be atomized to produce mist particles and achieve the atomization effect.
[0083] Those skilled in the art will understand that, for the sake of convenience and brevity, the structure and implementation principle of the atomizing core described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0084] This application also provides an electronic device including the micro heat source structure described above.
[0085] In practice, electronic devices include, but are not limited to, atomizers, humidifiers, temperature controllers, drug delivery systems, smart wearable devices, micro-analytical instruments, beauty devices, de-icers for automobiles or aerospace, exhaust gas treatment equipment for vehicles or equipment, and other related components, without specific limitations.
[0086] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the structure and implementation principle of the electronic device described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0087] The micro heat source structure provided in this application includes a substrate 100 having a first surface 110; and an impedance body 200 disposed on the first surface 110. The impedance body 200 is provided with at least one hollow pattern 300, or the first surface 110 is provided with at least one protrusion or pit, and the impedance body 200 covers the protrusion or pit, or the impedance body 200 is provided with at least one protrusion. By providing the hollow pattern 300 or by providing at least one protrusion or pit on the impedance body 200, the conduction path of the impedance body 200 is changed, the resistance is increased, and the impedance body 200 can radiate heat more effectively, thereby improving the overall heat transfer efficiency.
[0088] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A micro heat source structure, characterized by, include: A substrate having a first surface; as well as An impedance body disposed on the first surface; The impedance body has at least one hollowed-out pattern.
2. The micro heat source structure as described in claim 1, characterized in that, The cutout pattern can be either a closed pattern or a non-closed pattern.
3. The micro heat source structure as described in claim 1, characterized in that, The substrate has a second surface opposite to the first surface, and the substrate is provided with heat dissipation holes that penetrate the first surface and the second surface of the substrate. The projection of the hollow pattern on the first surface at least partially covers the projection of the heat dissipation holes on the first surface.
4. The micro heat source structure as described in claim 1, characterized in that, The substrate has a second surface opposite to the first surface, and the substrate is provided with heat dissipation holes that penetrate the first surface and the second surface of the substrate. The projection of the hollow pattern on the first surface does not overlap with the projection of the heat dissipation holes on the first surface.
5. The micro heat source structure as described in claim 1, characterized in that, The hollowed-out pattern forms a hollowed-out area, and the portion of the impedance body located in the hollowed-out area has a branch extending into the hollowed-out area.
6. The micro heat source structure as described in claim 3 or 4, characterized in that, It also includes a heat dissipation layer, which is disposed on the second surface and partially fills the heat dissipation holes.
7. The micro heat source structure as described in claim 1, characterized in that, It also includes a protective layer disposed on the first surface and covering the impedance body.
8. The micro heat source structure as described in claim 1, characterized in that, The substrate is a glass substrate.
9. A micro heat source structure, characterized in that, include: A substrate having a first surface; and An impedance body disposed on the first surface; The first surface is provided with at least one protrusion or pit, and the impedance body covers the protrusion or pit, or the impedance body is provided with at least one protrusion.
10. An atomizing core, characterized in that, Includes the micro heat source structure as described in any one of claims 1 to 9.
11. An electronic device, characterized in that, Includes the micro heat source structure as described in any one of claims 1 to 9.