Metallic silicon powder ultrasonic vibration screening machine

Abstract

This utility model discloses an ultrasonic vibrating sieving machine for metallic silicon powder, including a sieving cylinder; a screen is arranged inside the sieving cylinder, and a column is also arranged inside the sieving cylinder; a mounting platform is arranged on the column; a buffer mechanism is arranged on the mounting platform; the buffer mechanism is located at the bottom of the sieving cylinder; and an ultrasonic transducer is arranged on the buffer mechanism. The buffer mechanism serves as an intermediate buffer structure between the ultrasonic transducer and the screen. Because the buffer mechanism uses a spring return mechanism, the spring's return speed is lower than the operating frequency of the ultrasonic transducer. Therefore, the frequency of the impact of the striking head on the screen will also be lower than the frequency of the ultrasonic transducer itself. Simultaneously, there are at least three ultrasonic transducers that strike different positions on the screen. The three ultrasonic transducers work alternately. Although the striking frequency of a single striking head at a certain point will decrease, the three alternating transducers can compensate for each other, thus maintaining the overall vibration frequency of the screen.

Description

Technical Field

[0001] This utility model relates to a screening machine, specifically an ultrasonic vibration screening machine for metallic silicon powder, belonging to the technical field of powder screening machines. Background Technology

[0002] High-frequency ultrasonic vibrations accelerate the surface of a screen, instantly breaking down van der Waals forces and electrostatic adsorption between silicon powder particles. This reduces agglomeration and screen clogging. The metallic silicon powder gains additional energy under vibration, transitioning from static accumulation to dynamic jumping, increasing the probability of passing through the screen and preventing blockage. However, due to the extremely high frequency of the ultrasonic transducer's impact on the metal screen, thin screens (less than 0.1 mm) are prone to breakage, requiring frequent replacements. In contrast, traditional ultrasonic vibrating screens typically have transducers in direct contact with the screen, as illustrated in Chinese Patent Document CN20981 0657U, where the screen directly receives the transducer's impact. While this method ensures frequency, ordinary metals cannot withstand such impacts without damage. Utility Model Content

[0003] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose an ultrasonic vibration screening machine for metallic silicon powder, which provides impact buffer, extends the service life of the screen, and has a simple and reasonable structure.

[0004] The technical solution adopted by this utility model is as follows: an ultrasonic vibration screening machine for metallic silicon powder, including a screening cylinder; a screen is provided inside the screening cylinder, and a column is also provided inside the screening cylinder; an installation platform is provided on the column; a buffer mechanism is provided on the installation platform; the buffer mechanism is located at the bottom of the screening cylinder; and an ultrasonic transducer is provided on the buffer mechanism.

[0005] Furthermore, the buffer mechanism comprises at least three sets, evenly distributed on the mounting platform; each buffer mechanism corresponds to an ultrasonic transducer; and each buffer mechanism includes a support rod disposed on the surface of the mounting platform.

[0006] Furthermore, the buffer mechanism also includes a swing rod; one end of the swing rod is provided with a hinge groove; the swing rod is rotatably connected to the body of the support rod through the hinge groove.

[0007] Furthermore, the upper side of the swing rod is connected to the support rod via a spring; the ultrasonic transducer is located on the other side of the support rod opposite the spring; and a striking head is provided at the upper end of the swing rod.

[0008] Furthermore, a receiving platform is provided at the other end of the swing arm opposite the striking head; the outer side of the striking head is protected by a flexible sheath.

[0009] Furthermore, the screen has cross-arranged transverse and longitudinal skeletons; the striking head contacts the bottom of the transverse and longitudinal skeletons.

[0010] Furthermore, a first wiring hole is provided inside the support rod; a second wiring hole is provided inside the mounting platform and the column; the first wiring hole and the second wiring hole are connected; the bottom of the screening cylinder is arched; a powder outlet is provided at the lowest position of the bottom of the screening cylinder; and the column is located at the highest position of the bottom of the screening cylinder.

[0011] This invention offers the following advantages: It employs a buffer mechanism as an intermediate buffer between the ultrasonic transducer and the screen. Since the buffer mechanism uses a spring return mechanism, the spring's return speed is slower than the ultrasonic transducer's operating frequency. Therefore, the frequency of the impact head striking the screen will also be lower than the ultrasonic transducer's own frequency. Simultaneously, at least three ultrasonic transducers strike different positions on the screen. These three transducers work alternately. Although the impact frequency of a single striking head at a particular point will decrease, the three alternating transducers can compensate for this, maintaining the overall vibration frequency of the screen. This method ensures that the striking positions of the transducers are not easily damaged, extending their service life. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model.

[0013] Figure 2 This is a schematic diagram of the buffer mechanism.

[0014] Figure 3 This is a schematic diagram of the structure of the first and second wiring holes.

[0015] Figure 4 This is a top-view diagram of the screen.

[0016] Wherein: 1 is the screening cylinder, 2 is the screen, 2-1 is the transverse frame, 2-2 is the longitudinal frame, 3 is the column, 4 is the mounting platform, 5 is the ultrasonic transducer, 6 is the support rod, 6-1 is the first wiring hole, 7 is the swing rod, 7-1 is the striking head, 7-2 is the receiving platform, 8 is the spring, and 9 is the second wiring hole. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0018] See Figures 1-3This application discloses an ultrasonic vibration screening machine for metallic silicon powder, including a screening cylinder 1; a screen 2 is provided inside the screening cylinder 1, and a column 3 is also provided inside the screening cylinder 1; a mounting platform 4 is provided on the column 3; a buffer mechanism is provided on the mounting platform 4; the buffer mechanism is located at the bottom of the screening cylinder 1; and an ultrasonic transducer 5 is provided on the buffer mechanism.

[0019] Furthermore, the buffer mechanism comprises at least three sets, evenly distributed on the mounting platform 4; each buffer mechanism corresponds one-to-one with an ultrasonic transducer 5; and each buffer mechanism includes a support rod 6 disposed on the surface of the mounting platform 4.

[0020] Furthermore, the buffer mechanism also includes a swing rod 7; one end of the swing rod 7 is provided with a hinge groove; the swing rod 7 is rotatably connected to the body of the support rod 6 through the hinge groove.

[0021] Furthermore, the upper side of the swing rod 7 is connected to the support rod 6 via a spring 8; the ultrasonic transducer 5 is located on the other side of the support rod 6 opposite to the spring 8; and a striking head 7-1 is provided at the upper end of the swing rod 7.

[0022] Furthermore, the swing arm 7 is provided with a receiving platform 7-2 at the other end opposite to the striking head 7-1; the outer side of the striking head 7-1 is protected by a flexible sheath.

[0023] Specifically, in this embodiment, each operation of the ultrasonic transducer 5 strikes the receiving platform 7-2 of the swing rod 7, causing the swing rod 7 to rotate upwards, allowing its striking head 7-1 to contact the transverse or longitudinal frame of the screen 2. After the ultrasonic transducer 5 separates from the swing rod 7, the spring 8 pushes the swing rod 7 downwards. During the downward rotation of the swing rod 7, the ultrasonic transducer has already moved multiple times (due to its faster frequency); and at least three transducers work alternately. The striking frequency of a single swing rod 7 is lower than the operating frequency of the ultrasonic transducer, effectively protecting the screen. Furthermore, the multiple transducers compensate for each other, ensuring the overall vibration frequency of the screen.

[0024] Furthermore, the screen 2 has a transverse skeleton 2-1 and a longitudinal skeleton 2-2 arranged in a cross pattern; the striking head 7-1 contacts the bottom of the transverse skeleton and the longitudinal skeleton.

[0025] Furthermore, the support rod 6 is provided with a first wiring hole 6-1; the mounting platform and the column are provided with a second wiring hole 9; the first wiring hole and the second wiring hole are connected; the bottom of the screening cylinder is arched; the lowest position of the bottom of the screening cylinder is provided with a powder outlet; the column is located at the highest position of the bottom of the screening cylinder.

[0026] Specifically, in this embodiment, the wiring of the ultrasonic transducer 5 can be led out from the first wiring hole 6-1 and the second wiring hole 9 and from the bottom of the screening cylinder 1.

[0027] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. An ultrasonic vibrating sieve for metallic silicon powder, comprising a sieve cylinder; wherein a screen is provided inside the sieve cylinder, characterized in that: The screening cylinder is also equipped with a column; the column is equipped with a mounting platform; the mounting platform is equipped with a buffer mechanism; the buffer mechanism is located at the bottom of the screening cylinder; and the buffer mechanism is equipped with an ultrasonic transducer.

2. The ultrasonic vibrating sieve for metallic silicon powder according to claim 1, characterized in that: The buffer mechanism comprises at least three sets, evenly distributed on the mounting platform; each buffer mechanism corresponds to an ultrasonic transducer; the buffer mechanism includes a support rod set on the surface of the mounting platform.

3. The ultrasonic vibrating sieve for metallic silicon powder according to claim 2, characterized in that: The buffer mechanism further includes a swing rod; one end of the swing rod is provided with a hinge groove; the swing rod is rotatably connected to the body of the support rod through the hinge groove.

4. The ultrasonic vibrating sieve for metallic silicon powder according to claim 3, characterized in that: The upper side of the swing rod is connected to the support rod via a spring; the ultrasonic transducer is located on the other side of the support rod opposite the spring; and a striking head is provided at the upper end of the swing rod.

5. The ultrasonic vibrating sieve for metallic silicon powder according to claim 4, characterized in that: The swing arm is provided with a receiving platform at the other end opposite the striking head; the striking head is protected by a flexible sheath on the outside.

6. The ultrasonic vibrating sieve for metallic silicon powder according to claim 5, characterized in that: The screen has cross-arranged transverse and longitudinal skeletons; the striking head contacts the bottom of the transverse and longitudinal skeletons.

7. The ultrasonic vibrating sieve for metallic silicon powder according to claim 6, characterized in that: The support rod is provided with a first wiring hole; the mounting platform and the column are provided with a second wiring hole; the first wiring hole and the second wiring hole are connected; the bottom of the screening cylinder is arched; the lowest position of the bottom of the screening cylinder is provided with a powder outlet; the column is located at the highest position of the bottom of the screening cylinder.

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