Wafer film deposition apparatus for chip production

Abstract

This utility model relates to the field of chip manufacturing technology, specifically to a wafer thin film deposition equipment for chip manufacturing, comprising: a support leg and a worktable. The worktable is provided at the upper end of the support leg, and a sliding groove is provided on the worktable. A clamping mechanism is provided on the worktable, and a bracket is provided inside the clamping mechanism. A limit groove is provided on the bracket, and a hydraulic rod is provided on the bracket. A horizontal plate is provided at the telescopic end of the hydraulic rod, and second sliders are provided at both ends of the horizontal plate. A disk cover is provided at the bottom end of the horizontal plate, and a deposition mechanism is provided on the worktable. A fixing plate is provided inside the deposition mechanism, and a servo motor is provided on the fixing plate. A threaded rod is rotatably mounted on the output end of the servo motor through a coupling, and a deposition assembly is provided on the worktable. The clamping mechanism can cover the upper end of the placement disk, and the deposition mechanism can perform wafer thin film deposition.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, specifically to a wafer thin film deposition equipment for chip manufacturing. Background Technology

[0002] Chemical vapor deposition (CVD) is a traditional technique for preparing thin films. Its principle is to utilize gaseous precursor reactants, through intermolecular chemical reactions, to decompose certain components in the gaseous precursors and form active groups. These groups collide with the substrate surface and undergo adsorption, diffusion migration, and chemical reactions, ultimately forming a thin film. CVD is the most widely used technique in modern industry for depositing a variety of thin film materials, including a wide range of insulating thin film materials, most metal thin film materials, and metal alloy thin film materials.

[0003] In response, Chinese patent application number CN222923235U discloses a wafer carrier device and thin film deposition equipment, relating to the field of chemical vapor deposition equipment technology. The wafer carrier device includes a wafer carrier and a cooling structure; the wafer carrier has a wafer placement area for placing the wafer to be deposited; the cooling structure is connected to the wafer carrier, and the cooling structure and the wafer to be deposited are located on opposite sides of the wafer carrier, with the orthographic projection of the cooling structure onto the wafer carrier surrounding the outer periphery of the wafer placement area. This wafer carrier device can improve the problem of over-cooling of thin films, thereby reducing the risk of thin film cracking.

[0004] However, existing wafer thin film deposition equipment for chip manufacturing requires the deposition of wafer thin films during the chip manufacturing process. However, the upper side of the placement tray is always open during the operation of the existing equipment, which prevents the cold air from flowing evenly within the placement tray, resulting in poor wafer thin film deposition effect.

[0005] Therefore, in order to solve the above problems, a wafer thin film deposition equipment for chip manufacturing is proposed. Utility Model Content

[0006] The purpose of this invention is to provide a wafer thin film deposition device for chip manufacturing, in order to solve the problem mentioned in the background art that the existing wafer thin film deposition device for chip manufacturing needs to deposit wafer thin films during the chip manufacturing process, but the upper side of the placement tray is always open during the operation of the existing device, and the cold air cannot flow evenly in the placement tray, thus resulting in poor wafer thin film deposition effect.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a wafer thin film deposition equipment for chip production, comprising: a support leg and a worktable, the upper end of the support leg being provided with the worktable, a sliding groove being provided on the worktable, a clamping mechanism being provided on the worktable, a bracket being provided inside the clamping mechanism, a limit groove being provided on the bracket, and a hydraulic rod being provided on the bracket, a horizontal plate being provided at the telescopic end of the hydraulic rod, second sliders being provided at both ends of the horizontal plate, and a disk cover being provided at the bottom end of the horizontal plate, and a deposition mechanism being provided on the worktable, a fixing plate being provided inside the deposition mechanism, a servo motor being provided on the fixing plate, and a threaded rod being rotatably mounted on the output end of the servo motor via a coupling, and a deposition assembly being provided on the worktable, wherein the clamping mechanism can cover the upper end of the placement disk, and the deposition mechanism can perform wafer thin film deposition.

[0008] Preferably, the deposition assembly includes a support plate, and a first slider is fixedly installed at the bottom of the support plate. The support plate is slidably installed in a groove on the worktable via the first slider, and the support plate can be moved within the groove via the first slider.

[0009] Preferably, a threaded sleeve is fixedly installed at the bottom end of the support plate, and the threaded sleeve is threaded onto a threaded rod. The threaded rod can drive the support plate to move through the threaded sleeve at the bottom end of the support plate.

[0010] Preferably, a placement plate is fixedly installed on the support plate, a cooling pipe is fixedly installed on the outside of the placement plate, and an air inlet pipe is fixedly installed on one side of the cooling pipe, with the support plate used to support and fix the placement plate.

[0011] Preferably, the bracket is fixedly installed on the workbench, the hydraulic rod is fixedly installed on the bracket, and the cross plate is fixedly installed on the hydraulic rod. The bracket can support and fix the hydraulic rod.

[0012] Preferably, the second slider is fixedly installed at both ends of the horizontal plate, and the two ends of the horizontal plate are slidably installed in the limiting groove on the bracket through the second slider. The disc cover is detachably installed at the bottom end of the horizontal plate, and the horizontal plate can drive the second slider to slide in the limiting groove.

[0013] Preferably, the fixing plate is fixedly installed on the workbench, the servo motor is fixedly installed on the fixing plate, and one end of the threaded rod is rotatably installed on the workbench through a limiting sleeve. The fixing plate can support and fix the servo motor.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. By setting up a deposition mechanism, thin films can be deposited on wafers. Compared with the existing structure, which cannot move the placement tray as needed, this utility model uses a structure within the deposition mechanism to drive a support plate to move on the worktable via a servo motor and a threaded rod, thereby moving the placement tray. A cooler can be connected to an air inlet pipe to cool the outside of the placement tray through a cooling pipe, thereby improving the practicality of the device.

[0016] 2. By incorporating a pressing mechanism, the upper end of the placement tray can be sealed. Compared to existing structures that cannot seal the upper end of the placement tray, this invention utilizes a pressing mechanism that uses a hydraulic rod to move a horizontal plate, which in turn moves the tray cover to seal the upper end of the placement tray, thereby improving the device's working efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0018] Figure 1 This is a front view schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a front view schematic diagram of the main structure of the present utility model;

[0020] Figure 3 This is a frontal cross-sectional view of the deposition mechanism of this utility model;

[0021] Figure 4 This is a frontal cross-sectional view of the deposition assembly of this utility model;

[0022] Figure 5 This is a schematic cross-sectional view of the pressing mechanism of this utility model.

[0023] In the diagram: 1. Support leg; 2. Worktable; 21. Slide groove; 3. Deposition mechanism; 31. Fixing plate; 32. Servo motor; 33. Threaded rod; 34. Deposition assembly; 341. Support plate; 342. First slider; 343. Threaded sleeve; 344. Placement tray; 345. Cooling pipe; 346. Air inlet pipe; 4. Pressing mechanism; 41. Bracket; 42. Limiting groove; 43. Hydraulic rod; 44. Horizontal plate; 45. Second slider; 46. Tray cover. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model; the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In addition, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0026] Please see Figures 1-5 One embodiment provided by this utility model:

[0027] The servo motor 32 and hydraulic rod 43 used in this application are products that can be purchased directly from the market. Their principles and connection methods are existing technologies well known to those skilled in the art, so they will not be described in detail here.

[0028] A wafer thin film deposition equipment for chip manufacturing includes: a support leg 1 and a worktable 2. The worktable 2 is located at the upper end of the support leg 1. A sliding groove 21 is formed on the worktable 2. A clamping mechanism 4 is provided on the worktable 2. A bracket 41 is provided inside the clamping mechanism 4. A limit groove 42 is formed on the bracket 41. A hydraulic rod 43 is provided on the bracket 41. A horizontal plate 44 is provided at the telescopic end of the hydraulic rod 43. A second slider 45 is provided at both ends of the horizontal plate 44. A disk cover 46 is provided at the bottom end of the horizontal plate 44. A deposition mechanism 3 is provided on the worktable 2. A fixing plate 31 is provided inside the deposition mechanism 3. A servo motor 32 is provided on the fixing plate 31. A threaded rod 33 is rotatably mounted on the output end of the servo motor 32 through a coupling. A deposition assembly 34 is provided on the worktable 2. By setting this component, the disk cover 46 and the placement disk 344 can be sealed by the clamping mechanism 4, and the wafer thin film can be deposited by the deposition mechanism 3.

[0029] As a further improvement of this utility model, the deposition assembly 34 is provided with a support plate 341. A first slider 342 is fixedly installed at the bottom end of the support plate 341, and the support plate 341 is slidably installed in the groove 21 on the worktable 2 through the first slider 342. By setting this component, the support plate 341 can be slidably installed in the groove 21 on the worktable 2 through the first slider 342 at the bottom end of the support plate 341.

[0030] As a further improvement of this utility model, a threaded sleeve 343 is fixedly installed at the bottom end of the support plate 341. The threaded sleeve 343 is threaded onto the threaded rod 33. By setting this component, the support plate 341 can be moved by the movement of the threaded sleeve 343 on the threaded rod 33.

[0031] As a further improvement of this utility model, a placement plate 344 is fixedly installed on the support plate 341, and a cooling pipe 345 is fixedly installed on the outside of the placement plate 344. An air inlet pipe 346 is fixedly installed on one side of the cooling pipe 345. By setting this component, the placement plate 344 can be cooled by the cooling pipe 345 on the placement plate 344.

[0032] As a further improvement of this utility model, the bracket 41 is fixedly installed on the workbench 2, the hydraulic rod 43 is fixedly installed on the bracket 41, and the horizontal plate 44 is fixedly installed on the hydraulic rod 43. By setting this component, the hydraulic rod 41 can be supported and fixed by the bracket 41.

[0033] As a further improvement of this utility model, the second slider 45 is fixedly installed at both ends of the horizontal plate 44, and the two ends of the horizontal plate 44 are slidably installed in the limiting groove 42 on the bracket 41 through the second slider 45. The disc cover 46 is detachably installed at the bottom end of the horizontal plate 44. By setting this component, the horizontal plate 44 can be moved in the limiting groove 43 on the bracket 41 through the second slider 45.

[0034] As a further improvement of this utility model, the fixing plate 31 is fixedly installed on the workbench 2, the servo motor 32 is fixedly installed on the fixing plate 31, and one end of the threaded rod 33 is rotatably installed on the workbench 2 through the limiting sleeve. By setting this component, the servo motor 32 can be supported and fixed by the fixing plate 31.

[0035] Working principle: When a wafer thin film deposition equipment for chip production is needed, the device is supported by the support leg 1 and powered on by the existing power supply. The wafer thin film to be processed is placed in the placement tray 344. The servo motor 32 in the deposition mechanism 3 drives the threaded rod 33 to rotate. The threaded rod 33 drives the threaded sleeve 343 to move, which in turn causes the support plate 341 to slide in the slide groove 21 on the worktable 2 via the first slider 342, thereby moving the placement tray. The placement tray 344 is cooled by the existing air cooler connected to the air inlet pipe 346 and the cooling pipe 345. The hydraulic rod 43 in the clamping mechanism 4 drives the horizontal plate 44 to move in the limiting groove 42 via the second slider 45. The horizontal plate 44 then drives the tray cover 46 to seal the upper end of the placement tray 344, and the deposition process can begin.

[0036] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Those skilled in the art can readily implement this utility model based on the accompanying drawings and the above description. However, any modifications, alterations, or equivalent variations made by those skilled in the art without departing from the scope of the utility model's technical solution, utilizing the disclosed technical content, are considered equivalent embodiments of this utility model. Furthermore, any equivalent changes, alterations, or variations made to the above embodiments based on the essential technology of this utility model are still within the protection scope of this utility model's technical solution.

Claims

1. A wafer thin film deposition apparatus for chip manufacturing, comprising: Support leg (1) and worktable (2), the upper end of the support leg (1) is provided with worktable (2), and the worktable (2) is provided with a sliding groove (21); The feature is that: a clamping mechanism (4) is provided on the worktable (2), a bracket (41) is provided inside the clamping mechanism (4), a limit groove (42) is provided on the bracket (41), and a hydraulic rod (43) is provided on the bracket (41). A horizontal plate (44) is provided at the telescopic end of the hydraulic rod (43), and a second slider (45) is provided at both ends of the horizontal plate (44). A disc cover (46) is provided at the bottom end of the horizontal plate (44). A deposition mechanism (3) is provided on the worktable (2), a fixed plate (31) is provided inside the deposition mechanism (3), a servo motor (32) is provided on the fixed plate (31), and a threaded rod (33) is rotatably installed at the output end of the servo motor (32) through a coupling. A deposition assembly (34) is provided on the worktable (2).

2. The wafer thin film deposition equipment for chip manufacturing according to claim 1, characterized in that: The deposition assembly (34) is provided with a support plate (341), and a first slider (342) is fixedly installed at the bottom of the support plate (341). The support plate (341) is slidably installed in the groove (21) on the worktable (2) through the first slider (342).

3. The wafer thin film deposition equipment for chip manufacturing according to claim 2, characterized in that: A threaded sleeve (343) is fixedly installed at the bottom of the support plate (341), and the threaded sleeve (343) is threadedly installed on the threaded rod (33).

4. The wafer thin film deposition equipment for chip manufacturing according to claim 3, characterized in that: A placement plate (344) is fixedly installed on the support plate (341), a cooling pipe (345) is fixedly installed on the outside of the placement plate (344), and an air inlet pipe (346) is fixedly installed on one side of the cooling pipe (345).

5. The wafer thin film deposition equipment for chip manufacturing according to claim 1, characterized in that: The bracket (41) is fixedly installed on the workbench (2), the hydraulic rod (43) is fixedly installed on the bracket (41), and the horizontal plate (44) is fixedly installed on the hydraulic rod (43).

6. The wafer thin film deposition equipment for chip manufacturing according to claim 1, characterized in that: The second slider (45) is fixedly installed at both ends of the horizontal plate (44). The two ends of the horizontal plate (44) are slidably installed in the limiting groove (42) on the bracket (41) through the second slider (45). The disc cover (46) is detachably installed at the bottom end of the horizontal plate (44).

7. The wafer thin film deposition equipment for chip manufacturing according to claim 1, characterized in that: The fixed plate (31) is fixedly installed on the workbench (2), the servo motor (32) is fixedly installed on the fixed plate (31), and one end of the threaded rod (33) is rotatably installed on the workbench (2) through the limiting sleeve.

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