Flooring substrate for floor heating with good heat conduction

Abstract

This utility model relates to the field of flooring substrate technology, specifically to a flooring substrate for underfloor heating with good thermal conductivity. It includes a board body, which comprises a thin substrate, a heat-conducting core board, and a fiberboard arranged sequentially. The fiberboard includes a main board and auxiliary heat-conducting layers disposed on the upper and lower surfaces of the main board. A slot is provided on the upper surface of one side of the board body, and a retaining plate is provided on the lower surface of the other side of the board body. Several support blocks are provided on the lower surface of the main board. This utility model, by combining several heat-conducting boards and heat-conducting layers, ensures both good thermal conductivity and the quality of the substrate. Furthermore, the suspended structure at the top and bottom further enhances the thermal conductivity of the underfloor heating system. The side-sliding assembly is replaced with a direct snap-fit ​​installation, greatly improving the ease of assembly of the flooring substrate.

Description

Technical Field

[0001] This utility model relates to a floor substrate for underfloor heating with good thermal conductivity, and particularly to a floor substrate for underfloor heating with good thermal conductivity, belonging to the technical field of floor substrates. Background Technology

[0002] Flooring refers to the surface layer of a building's ground or floor. It is made of wood or other materials. There are many types of flooring, classified by structure as follows: solid wood flooring, engineered wood flooring, three-layer engineered wood flooring, bamboo flooring, preservative-treated flooring, cork flooring, and the most popular multi-layer engineered wood flooring, etc.

[0003] However, existing underfloor heating systems have low heat transfer efficiency, resulting in low utilization and failing to meet user needs. Furthermore, the side-sliding connection used during installation makes the process inconvenient.

[0004] Therefore, it is urgent to improve the flooring substrate for underfloor heating with good thermal conductivity in order to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of this utility model is to provide a floor substrate for underfloor heating with good thermal conductivity. By combining several boards and thermally conductive layers with good thermal conductivity, both good thermal conductivity and the quality of the substrate are guaranteed. At the same time, the floating structure set at the top and bottom can further improve the thermal conductivity of underfloor heating. In addition, the side sliding assembly installation is adjusted to direct snap-fit ​​installation, which greatly improves the convenience of assembling the floor substrate.

[0006] To achieve the above objectives, the main technical solution adopted by this utility model includes: a floor substrate for underfloor heating with good thermal conductivity, comprising a board body, wherein the board body comprises a thin substrate, a heat-conducting core board and a fiberboard arranged sequentially, wherein the fiberboard comprises a main board and auxiliary heat-conducting layers disposed on the upper and lower end faces of the main board, wherein a slot is provided on the upper end face of one side of the board body, a card plate is provided on the lower end face of the other side of the board body, and a plurality of support blocks are provided on the lower end face of the main board.

[0007] Preferably, the heat-conducting core plate is made by pressing iron scraps and wood blocks together.

[0008] Preferably, the fiberboard is a high-density fiberboard, and the fiberboard also contains carbon fiber filaments.

[0009] Preferably, the auxiliary heat-conducting layer contains graphite powder and metal particles.

[0010] Preferably, a magnetic suction plate is provided on the lower end face inside the card slot, the card plate is engaged with the card slot, and a second magnetic suction plate is provided on the lower end face that attracts the magnetic suction plate.

[0011] Preferably, the height of the upper end face of the plate near the slot is lower than the height of the plate, the lower end face of the card plate is higher than the lower end face of the plate, and the height of the card plate is adapted to the depth of the slot.

[0012] Preferably, a plurality of the support blocks are evenly distributed on the lower end face of the board, the support blocks are cross-shaped support blocks, and a plurality of through holes extending to the lower end face of the fiberboard are formed on the surface of the support blocks.

[0013] This utility model has at least the following beneficial effects:

[0014] 1. By utilizing a thin substrate, a heat-conducting core board, a fiberboard, and an auxiliary heat-conducting layer set within the fiberboard in sequence, the floor substrate ensures both good heat conduction and quality. Furthermore, the use of perforated cross-shaped support blocks creates a suspended structure, further enhancing the heat conduction of the underfloor heating system. Additionally, the side-sliding assembly has been changed to a direct snap-fit ​​installation, greatly improving the ease of assembly for the floor substrate. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0016] Figure 1 This is a cross-sectional view of the present invention;

[0017] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 3 This is a three-dimensional structural diagram of the bottom part of this utility model;

[0019] Figure 4 For the present utility model Figure 1 Enlarged view at point A;

[0020] Figure 5 For the present utility model Figure 1 Enlarged view at point B;

[0021] Figure 6 This is a three-dimensional structural diagram of the support block of this utility model.

[0022] In the diagram, 1 is the plate body; 101 is the thin substrate; 102 is the heat-conducting core plate; 103 is the fiberboard; 104 is the auxiliary heat-conducting layer; 2 is the slot; 3 is the card plate; 4 is the support block; 5 is the main board; 6 is the magnetic plate; 7 is the second magnetic plate; and 8 is the through hole. Detailed Implementation

[0023] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0024] like Figures 1-6 As shown, the floor substrate for underfloor heating with good thermal conductivity provided in this embodiment includes a board body 1. The board body 1 includes a thin substrate 101, a heat-conducting core board 102 and a fiberboard 103 arranged sequentially. The heat-conducting core board 102 is made by pressing iron scraps and wood blocks. The use of iron scraps and wood blocks in the heat-conducting core board can significantly enhance the thermal conductivity of the floor, making the heat from underfloor heating more evenly distributed throughout the floor and improving living comfort.

[0025] Furthermore, the fiberboard 103 is a high-density fiberboard, and the fiberboard 103 also contains carbon fiber filaments. High-density fiberboard has a high density and a low thermal conductivity coefficient, and it also has good thermal insulation performance. By adding carbon fiber filaments, its thermal conductivity can be further improved. As the core layer or base layer of the composite floor, after the addition of heat conductors, the high-density fiberboard can more effectively conduct the heat from the underfloor heating to the floor surface, thereby improving the heating efficiency of the underfloor heating system.

[0026] The fiberboard 103 includes a main board 5 and an auxiliary heat-conducting layer 104 disposed on the upper and lower surfaces of the main board 5. The auxiliary heat-conducting layer 104 contains graphite powder and metal particles. Aluminum and copper metal particles and graphite are both excellent heat-conducting materials. They have a high thermal conductivity and can quickly transfer heat. Adding a thin metal or graphite layer to the structure of the composite floor can significantly improve the thermal conductivity of the floor.

[0027] A slot 2 is provided on the upper end face of one side of the board 1, and a card plate 3 is provided on the lower end face of the other side of the board 1. A magnetic suction plate 6 is provided on the lower end face inside the slot 2. The card plate 3 is engaged with the slot 2, and a second magnetic suction plate 7 is provided on the lower end face that is attracted to the magnetic suction plate 6. The height of the upper end face of the board 1 near the slot 2 is lower than the height of the board 1, and the lower end face of the card plate 3 is higher than the lower end face of the board 1. The height of the card plate 3 is adapted to the depth of the slot 2. When multiple floor substrates are spliced, the card plate 3 on one board 1 is inserted into the slot 2 on another board 1. When the boards are engaged, they can be fixed by the magnetic suction plate 6 and the second magnetic suction plate 7. Since the card plate 3 and the slot 2 are perfectly matched and tightly engaged, there will be no shaking. When the boards are engaged, the height difference between the two sides can be used to ensure that the upper end face of the boards 1 is flush when they are spliced.

[0028] The lower end face of the main board 5 is provided with several support blocks 4, which are evenly distributed on the lower end face of the board 1. The support blocks 4 are cross-shaped support blocks, and several through holes 8 are opened on the surface of the support blocks 4, which penetrate to the lower end face of the fiberboard 103. The board 1 is suspended and supported by the support blocks 4. The suspension support can form a heat transfer channel between the floor and the ground, thereby reducing its thermal resistance. Heat can be transferred more smoothly from the underfloor heating system to the floor surface and then further radiated into the indoor space, thereby directly improving the thermal conductivity of the floor. At the same time, the gap between the floor and the ground may cause the floor to deform and be damaged due to thermal expansion and contraction. The suspension installation method reduces these gaps and reduces the stress concentration phenomenon caused by temperature changes, which helps to maintain the stability and durability of the floor.

[0029] Furthermore, by adopting a special structure of a cross-shaped support block with through holes 8, it not only improves the support performance but also minimizes the contact area between the floor and the ground, ensuring heat flow and improving the thermal conductivity.

[0030] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" as used throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.

[0031] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes that element.

[0032] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A floor substrate for underfloor heating with good thermal conductivity, comprising a board body (1), characterized in that: The plate (1) includes a thin substrate (101), a heat-conducting core plate (102) and a fiberboard (103) arranged in sequence. The fiberboard (103) includes a main plate (5) and an auxiliary heat-conducting layer (104) disposed on the upper and lower surfaces of the main plate (5). A slot (2) is provided on the upper surface of one side of the plate (1), and a card plate (3) is provided on the lower surface of the other side of the plate (1). Several support blocks (4) are provided on the lower surface of the main plate (5).

2. The floor substrate for underfloor heating with good thermal conductivity according to claim 1, characterized in that: The heat-conducting core plate (102) is made by pressing iron scraps and wood blocks.

3. The floor substrate for underfloor heating with good thermal conductivity according to claim 1, characterized in that: The fiberboard (103) is a high-density fiberboard, and the fiberboard (103) also contains carbon fiber filaments.

4. The floor substrate for underfloor heating with good thermal conductivity according to claim 1, characterized in that: The auxiliary heat-conducting layer (104) contains graphite powder and metal particles.

5. The floor substrate for underfloor heating with good thermal conductivity according to claim 1, characterized in that: The lower end face inside the card slot (2) is provided with a magnetic suction plate (6), the card plate (3) is engaged with the card slot (2) and the lower end face is provided with a second magnetic suction plate (7) that is attracted to the magnetic suction plate (6).

6. The floor substrate for underfloor heating with good thermal conductivity according to claim 5, characterized in that: The height of the upper surface of the plate (1) near the slot (2) is lower than the height of the plate (1), the lower surface of the card plate (3) is higher than the lower surface of the plate (1), and the height of the card plate (3) is adapted to the depth of the slot (2).

7. The floor substrate for underfloor heating with good thermal conductivity according to claim 1, characterized in that: Several support blocks (4) are evenly distributed on the lower end face of the plate (1). The support blocks (4) are cross-shaped support blocks. Several through holes (8) are opened on the surface of the support blocks (4) to the lower end face of the fiberboard (103).

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