LED lamp bead unit capable of cutting LED circuit board

Abstract

This utility model provides an LED bead unit with a scalable LED circuit board, relating to the field of LED beads. The LED bead unit with a scalable LED circuit board includes an LED bead structure. A solder pad is fixedly connected to the bottom of the LED bead structure. A mounting ring is fixedly connected to the outer surface of the LED bead structure. A heat transfer ring is sleeved on the outer surface of the LED bead structure. A cooling fin structure is fixedly connected to the lower surface of the heat transfer ring. This LED bead unit with a scalable LED circuit board achieves good heat dissipation for the LED bead structure through the cooperation of the mounting ring, heat transfer ring, combined positioning block, combined slot structure, cooling fin structure, and connecting frame. It also facilitates the installation and removal of the heat dissipation components, solving the problem of current LED bead units easily generating high temperatures during long-term operation. High temperature is a fatal flaw of semiconductor devices, causing excessively high temperatures to reduce the service life of the LED bead unit and even damage it.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, specifically to an LED lamp bead unit that can be cut into LED circuit boards. Background Technology

[0002] LED LED beads are a new type of decorative light, supplementing linear light sources and floodlighting. They are intelligent lights that can replace displays of a certain size by achieving a point-to-surface effect through pixel color mixing. Pixel pitch: the distance from the center of one pixel to the center of another, also known as "P-", such as P3, P6, etc. Pixel density is reflected in the distance between pairs of pixels; pixel pitch and pixel density are physical characteristics of a display screen. Information capacity is the unit of information that can be displayed per unit area of ​​pixel density. The smaller the pixel pitch, the higher the pixel density, the more information can be displayed per unit area, and the closer the suitable viewing distance. The larger the pixel pitch, the lower the pixel density, the less information can be displayed per unit area, and the farther the suitable viewing distance. Because LEDs are close to "point" light sources, the design of lighting fixtures is relatively convenient; however, when used for large-area displays, the current and power consumption are relatively high. LEDs are generally used in electronic devices such as indicator lights, digital tubes, display panels, and optocouplers. They are also commonly used in optical communication and decoration of building outlines, amusement parks, billboards, streets, stages, and other places. Currently, LED lamp bead units are prone to high temperatures during long-term operation. High temperature is a fatal flaw of semiconductor devices. Excessive temperature will reduce the service life of LED lamp bead units and cause damage. Utility Model Content

[0003] The purpose of this invention is to provide an LED bead unit that can cut LED circuit boards, which solves the problem that current LED bead units are prone to high temperatures during long-term operation. High temperature is a fatal flaw of semiconductor devices, and excessively high temperature will cause the LED bead unit to reduce its service life and be damaged.

[0004] Technical solution

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: an LED bead unit for cutting LED circuit boards, comprising an LED bead structure, wherein the bottom of the LED bead structure is fixedly connected to a bead solder foot, the outer surface of the LED bead structure is fixedly connected to a mounting ring, the outer surface of the LED bead structure is sleeved with a heat transfer ring, the lower surface of the heat transfer ring is fixedly connected to a cooling fin structure, the number of cooling fin structures is two, and a connecting frame is fixedly connected between the two cooling fin structures.

[0006] Furthermore, the lower surface of the heat transfer ring overlaps with the upper surface of the mounting ring.

[0007] Furthermore, the upper surface of the mounting ring is provided with a combined slot structure, and a combined positioning block is engaged inside the combined slot structure. The upper surface of the combined positioning block is fixedly connected to the lower surface of the heat transfer ring.

[0008] This invention provides an LED bead unit with a cuttable LED circuit board. It has the following advantages:

[0009] This LED chip unit, which can cut LED circuit boards, achieves excellent heat dissipation for the LED chip structure through the cooperation of mounting rings, heat transfer rings, combined positioning blocks, combined slot structures, cooling fin structures, and connecting frames. At the same time, it facilitates the installation and removal of heat dissipation components, solving the problem that current LED chip units are prone to high temperatures during long-term operation. High temperature is a fatal flaw of semiconductor devices, and excessive temperature will reduce the service life of LED chip units and cause damage. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of this utility model;

[0011] Figure 2 This is a front view of the structure of this utility model.

[0012] The components include: 1. LED lamp bead structure; 2. Lamp bead solder feet; 3. Mounting ring; 4. Heat transfer ring; 5. Combined positioning block; 6. Combined slot structure; 7. Cooling fin structure; and 8. Connecting bracket. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0014] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0015] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0016] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0017] like Figure 1-2 As shown, this utility model embodiment provides an LED lamp bead unit with a cuttable LED circuit board, including an LED lamp bead structure 1. The bottom of the LED lamp bead structure 1 is fixedly connected to a lamp bead solder foot 2. The outer surface of the LED lamp bead structure 1 is fixedly connected to a mounting ring 3. A heat transfer ring 4 is sleeved on the outer surface of the LED lamp bead structure 1. The lower surface of the heat transfer ring 4 overlaps with the upper surface of the mounting ring 3. A combined slot structure 6 is opened on the upper surface of the mounting ring 3. A combined positioning block 5 is snapped into the inside of the combined slot structure 6. The upper surface of the combined positioning block 5 is fixedly connected to the lower surface of the heat transfer ring 4. A cooling fin structure 7 is fixedly connected to the lower surface of the heat transfer ring 4. There are two cooling fin structures 7. A connecting frame 8 is fixedly connected between the two cooling fin structures 7.

[0018] Working principle: After the LED bead structure 1 is soldered onto the circuit board, the heat transfer ring 4 is placed on the surface of the LED bead structure 1 and pushed downwards, so that the heat transfer ring 4 drives the combined positioning block 5 to be inserted into the combined slot structure 6, thereby completing the installation of the cooling fin structure 7. When the LED bead structure 1 generates temperature, the temperature will be absorbed and dissipated by the heat transfer ring 4 and transferred to the cooling fin structure 7 and the connecting bracket 8 for heat dissipation.

[0019] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An LED bead unit for cutting LED circuit boards, comprising an LED bead structure (1), characterized in that: The bottom of the LED lamp bead structure (1) is fixedly connected with a lamp bead solder foot (2), the outer surface of the LED lamp bead structure (1) is fixedly connected with an installation ring (3), the outer surface of the LED lamp bead structure (1) is fitted with a heat transfer ring (4), and the lower surface of the heat transfer ring (4) is fixedly connected with a cooling fin structure (7).

2. The LED bead unit of a cuttable LED circuit board according to claim 1, characterized in that: The lower surface of the heat transfer ring (4) overlaps with the upper surface of the mounting ring (3).

3. The LED bead unit of a cuttable LED circuit board according to claim 1, characterized in that: The number of cooling fin structures (7) is two, and a connecting frame (8) is fixedly connected between the two cooling fin structures (7).

4. The LED bead unit of a cuttable LED circuit board according to claim 1, characterized in that: The upper surface of the mounting ring (3) is provided with a combined slot structure (6), and a combined positioning block (5) is engaged inside the combined slot structure (6).

5. The LED bead unit of a cuttable LED circuit board according to claim 4, characterized in that: The upper surface of the combined positioning block (5) is fixedly connected to the lower surface of the heat transfer ring (4).

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