Optical thickness measurement module

Abstract

This utility model discloses an optical thickness measurement module. Its key technical features include a transmitter plate and a receiver plate facing each other. The thin film material to be measured is located between the transmitter plate and the receiver plate. The transmitter plate is equipped with a plurality of LEDs arranged in two parallel rows, with adjacent LEDs in each row staggered. The receiver plate has two rows of receiving sensors corresponding to the positions of the two rows of LEDs. This utility model reduces interference and has the advantage of high detection accuracy.

Description

Technical Field

[0001] This utility model relates to the field of measurement equipment technology, and more specifically to an optical thickness measurement module. Background Technology

[0002] Polymer dielectric capacitor film is a commonly used encapsulation material, especially for encapsulating semiconductor chips. Due to technological advancements, electronic products are becoming increasingly miniaturized, and electronic components must also be reduced in size. Therefore, electronic circuits need to be highly dense and highly integrated to meet the increasingly sophisticated requirements of electronic components.

[0003] Current capacitor film production equipment can effectively produce capacitor films, but there are still some drawbacks in detecting the thickness of the produced capacitor films. Existing detection methods generally include mechanical detection and optical detection. Mechanical detection requires contact with the film, which can easily damage the surface of the capacitor film. Optical detection is a non-contact detection method. With optical filtering and existing mature algorithm compensation, the thickness of the capacitor film can be calculated from the transmittance.

[0004] However, the current problem with optical inspection is the interference between adjacent LEDs and adjacent sensors. If adjacent LEDs and adjacent sensors are far apart, the film thickness at the gap will not be detected, making it impossible to fully detect every position of the film. If the LEDs are too close together, the light emitted by one LED can easily interfere with multiple sensors, resulting in a decrease in the accuracy of thickness detection. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides an optical thickness measurement module that reduces interference and offers high detection accuracy.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an optical thickness measurement module, comprising an emitting plate and a receiving plate facing each other, wherein the thin film material to be measured is located between the emitting plate and the receiving plate for measurement, wherein a plurality of LED beads are provided on the emitting plate, the LED beads are arranged in two parallel rows, and adjacent LED beads in the two rows are staggered; wherein two rows of receiving sensors are provided on the receiving plate corresponding to the positions of the two rows of LED beads.

[0007] The present invention is further configured as follows: a base for mounting a transmitter plate and a receiver plate is provided in the middle of the base for the thin film material to be tested to pass through, and a grid plate is provided on the upper and lower sides of the gap, and a plurality of strip grid holes corresponding to the positions of the lamp beads are opened on the grid plate.

[0008] The present invention is further configured such that: the grid plate is made of an opaque material or its surface is covered with an opaque material.

[0009] The present invention is further configured such that the spacing between adjacent LED beads in the same row is greater than or equal to the width of the LED beads.

[0010] The present invention is further configured such that the position of one row of LED beads corresponds to the interval position of another row of LED beads, so as to form a staggered arrangement of LED beads.

[0011] The present invention is further configured to include a circuit module, the circuit module comprising a voltage regulator circuit module, a transmitting main control chip, a receiving main control chip, and a communication module; the voltage regulator circuit module is used to supply power to the transmitting main control chip, the receiving main control chip, and the communication module.

[0012] The present invention is further configured such that: the transmitting main control chip is provided with an analog brightness control module, which is used to control the brightness of the lamp beads.

[0013] The present invention is further configured such that: the receiving main control chip is used to receive and send the signal from the receiving sensor to an external terminal through the communication module.

[0014] In summary, this utility model has the following beneficial effects:

[0015] This invention effectively solves the interference problem between adjacent receiving sensors caused by unbalanced light by setting misaligned LED beads and misaligned receiving sensors adapted to the positions of the LED beads through physical displacement. This method can improve detection accuracy without using higher performance LED beads and receiving sensors. It is a low-cost and highly feasible solution that achieves higher precision in capacitor film production quality inspection. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the transmitter plate.

[0017] Figure 2 This is a schematic diagram of the receiver board.

[0018] Figure 3 This is a partial structural diagram of the base cross-section.

[0019] Figure 4 This is a block diagram of the circuit module connection.

[0020] Reference numerals: 1. Transmitter plate; 2. Receiver plate; 3. LED bead; 4. Receiver sensor; 5. Base; 501. Gap; 502. Grid plate; 6. Strip grid hole. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to the accompanying drawings.

[0022] This embodiment discloses an optical thickness measurement module, such as Figure 1-4 As shown, the apparatus includes a transmitting plate 1 and a receiving plate 2 facing each other. The thin film material to be measured, such as an ultra-thin capacitor film produced by a vacuum capacitor film production line, is located between the transmitting plate 1 and the receiving plate 2 for measurement. The transmitting plate 1 is equipped with several LED beads 3 arranged in two parallel rows, with adjacent LED beads in each row staggered. The receiving plate 2 has two rows of receiving sensors 4 corresponding to the positions of the two rows of LED beads 3. The advantage of using optical measurement to measure the thickness of the capacitor film through this structure is that it is a non-contact measurement, avoiding contact with the capacitor film surface and preventing damage. It is also suitable for online measurement, offering fast measurement speeds to meet the real-time detection needs of high-speed production lines. Specifically, the LED beads 3 can be white visible light sources. A portion of the emitted light is absorbed after passing through the capacitor film, and the remaining light transmitted through the capacitor film is received by the receiving sensors 4 on the receiving plate 2. The transmittance of the capacitor film is calculated based on the ratio of emitted to transmitted light. The method of calculating the thickness using the transmittance is the same as in existing technologies. To illustrate this example simply: the thickness can be pre-obtained through mechanical thickness measurement, and then a standard curve of "thickness-transmittance" can be established with the obtained transmittance data. This allows for the inverse calculation of thickness from transmittance during subsequent measurements. For ease of data processing, the transmittance data can also be calculated as optical density (OD) data for further processing. Furthermore, this embodiment employs a staggered arrangement of two rows of LEDs, with corresponding staggered arrangements of the receiving sensors. This arrangement physically increases the distance between adjacent LEDs and the receiving sensors, reducing the possibility of interference. Without this staggered arrangement, for example, if LED A emits light, a small amount of scattered light might originate from LED B, or a small amount of light from LED A entering receiving sensor A might be scattered onto receiving sensor B, causing receiving sensor B to incorrectly receive the light signal, resulting in interference. Therefore, the physical staggered arrangement significantly reduces the possibility of interference, improving measurement accuracy.

[0023] Furthermore, the spacing between adjacent LED beads 3 in the same row is greater than or equal to the width of the LED bead, and the position of one row of LED beads 3 corresponds to the spacing position of another row of LED beads, forming a staggered arrangement of the LED beads. This arrangement is reasonable and makes full use of the space. Firstly, the increased spacing between adjacent LED beads and receiving sensors in the same row reduces the possibility of interference. Secondly, the staggered arrangement of the second row of LED beads and receiving sensors fills the gap between the first row of LED beads and receiving sensors, thereby increasing the density of LED beads 3 and receiving sensors 4 in the lateral direction without causing interference, thus achieving high-precision and complete coverage of the entire capacitor film. For example, in this embodiment, the width of the LED beads 3 and receiving sensors 4 is 1.5mm, and the spacing is set to 2mm. Normally, in a row, there is one LED bead 3 and receiving sensor 4 every 2mm in the lateral direction. However, with the staggered arrangement described above, there is one LED bead 3 and receiving sensor 4 every 0.25mm in the lateral direction, greatly increasing the density and more completely covering the entire capacitor film. The thickness of the capacitor film at each position can be accurately measured.

[0024] Furthermore, refer to Figure 3 The system includes a base 5 for mounting the transmitter plate 1 and receiver plate 2. A gap 501 for the thin film material to be tested to pass through is provided in the center of the base 5. A grid plate 502 is provided on the upper and lower sides of the gap 501. The grid plate 502 has several strip-shaped grid holes 6 corresponding to the positions of the LED beads 3. The strip-shaped grid holes 6 are arranged according to the density of the LED beads 3, and their function is to further ensure the directional emission and reception of light, further improving accuracy. It should be noted that the grid plate 502 is made of opaque material or its surface is covered with opaque material to ensure that light only exits and enters through the opened strip-shaped grid holes 6.

[0025] Furthermore, refer to Figure 4 The system includes a circuit module, which comprises a voltage regulator module, a transmitting main control chip, a receiving main control chip, and a communication module. The voltage regulator module supplies power to the transmitting main control chip, the receiving main control chip, and the communication module. Specifically, in this embodiment, the voltage regulator module includes a DC 5V voltage regulator circuit and a DC 3.3V voltage regulator circuit, suitable for powering electronic components with different requirements. Simultaneously, the transmitting main control chip has an analog brightness control module, which controls the brightness of the LED bead 3. Using an analog brightness control module allows for better brightness adjustment. Different reference brightness levels can be adjusted for materials of different thicknesses. For example, when the capacitor film is particularly thin, a high brightness may result in very high transmittance measurements, making it difficult to accurately obtain thickness data. In this case, the reference brightness can be lowered to increase the data difference and better obtain the thickness data of the capacitor film.

[0026] Furthermore, the main control chip receives the signal from sensor 4 and transmits it to an external terminal via the communication module. Using the above method, a mature RS485 communication module is preferred. After transmission to the external terminal, the signal can be processed with greater data processing capabilities. Furthermore, optical filtering and algorithm compensation methods can be combined to improve accuracy. Simultaneously, it facilitates remote monitoring of measurement data, ensuring quality control in capacitor film production.

[0027] In summary, this invention improves measurement accuracy and solves interference problems by adopting a reasonable physical layout while maintaining the original performance of the LED beads and receiving sensor. It is a low-cost and highly feasible solution, and has been proven to be stable and reliable in the long term through experiments, thus possessing high practical value.

[0028] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the design concept of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An optical thickness measurement module, comprising a transmitter plate (1) and a receiver plate (2) facing each other, wherein the thin film material to be measured is located between the transmitter plate (1) and the receiver plate (2) for measurement, characterized in that: The transmitting plate (1) is provided with a number of lamp beads (3), and the lamp beads (3) are arranged in two parallel rows, with adjacent lamp beads in the two rows being staggered; the receiving plate (2) is provided with two rows of receiving sensors (4) corresponding to the positions of the two rows of lamp beads (3).

2. The optical thickness measurement module according to claim 1, characterized in that: It includes a base (5) for mounting the transmitter plate (1) and the receiver plate (2). The base (5) has a gap (501) in the middle for the thin film material to be tested to pass through. The gap (501) has a grid plate (502) on the upper and lower sides. The grid plate (502) has a number of strip grid holes (6) corresponding to the positions of the lamp beads (3).

3. The optical thickness measurement module according to claim 2, characterized in that: The grid plate (502) is made of opaque material or its surface is covered with opaque material.

4. The optical thickness measurement module according to claim 1, characterized in that: The spacing between adjacent LED beads (3) in the same row is greater than or equal to the width of the LED bead.

5. The optical thickness measurement module according to claim 4, characterized in that: The positions of one row of LED beads (3) correspond to the spacing of another row of LED beads, so as to form a staggered arrangement of LED beads.

6. The optical thickness measurement module according to claim 1, characterized in that: The system includes a circuit module, which comprises a voltage regulator circuit module, a transmitting main control chip, a receiving main control chip, and a communication module; the voltage regulator circuit module is used to supply power to the transmitting main control chip, the receiving main control chip, and the communication module.

7. The optical thickness measurement module according to claim 6, characterized in that: The main control chip for transmitting is equipped with an analog brightness control module, which is used to control the brightness of the lamp beads (3).

8. An optical thickness measurement module according to claim 6, characterized in that: The receiving main control chip is used to receive and send the signal from the receiving sensor (4) to an external terminal through the communication module.

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