Dual series single BGA test fixture

Abstract

The utility model relates to BGA test fixture technical field, and disclose a two series single BGA test fixture. Including detection platform, the detection platform top fixedly connected with test fixture body, the test fixture body inside is equipped with the positioning slot, the positioning slot inside fixedly connected with test needle board, the test needle board top even fixedly connected with a plurality of probes, the test fixture body top is hinged with the cover plate through the hinge mode, the positioning slot inside and located test needle board surface top is provided with the auxiliary clamping mechanism, the auxiliary clamping mechanism includes the reference bar fixedly connected in test needle board corner top, two the support block inner wall all are equipped with rectangle slot. The utility model utilizes the clamping plate reset cooperation reference bar to BGA chip plays the fixed role, ensures different specifications size's BGA chip to be able to always contact with probe under the cover plate cooperation pressure block effect, promotes different specifications BGA chip test efficiency and test result accuracy.

Description

Technical Field

[0001] This utility model relates to the field of BGA test fixture technology, specifically to a two-series single BGA test fixture. Background Technology

[0002] With the increasing operating frequency and integration of ICs, traditional wire bonding is no longer sufficient, and IC substrates must be used for packaging. The mainstream IC substrates, based on their packaging methods, include three types: BGA (Ball Grid Array), CSP (Chip Scale Package), and FC (Flip Chip). Currently, the latter two are the mainstream. In addition, after BGA chips are manufactured, they need to be tested using test fixtures.

[0003] In practical applications, BGA chip testing fixtures test the BGA chips through probes in positioning slots. To ensure precise contact between the probes and the BGA chip, the positioning slots that limit the position of the BGA chip are usually designed to match the size of the BGA chip. When encountering large-sized BGA chips, it is necessary to redesign and manufacture a suitable test fixture, which in turn affects the testing efficiency of BGA chip products. Utility Model Content

[0004] The purpose of this invention is to provide a two-series single BGA test fixture to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides a two-series single BGA test fixture, including a test stage, a test fixture body fixedly connected to the top of the test stage, a positioning groove inside the test fixture body, a test probe plate fixedly connected inside the positioning groove, a plurality of probes evenly fixedly connected to the top of the test probe plate, a cover plate hinged to the top of the test fixture body, and an auxiliary clamping mechanism provided inside the positioning groove and above the surface of the test probe plate.

[0006] As a further improvement to this technical solution, the auxiliary clamping mechanism includes a reference rod fixedly connected to the top of the corner of the test needle plate. Two support blocks are symmetrically fixedly connected to the side wall of the positioning groove. A rectangular groove is opened on the inner side wall of each of the two support blocks. A slider is slidably connected inside each of the two rectangular grooves. A clamping plate is fixedly connected between the side walls of the two sliders. An elastic element is also fixedly connected to the outer wall of the two sliders away from the clamping plate. The end of the elastic element away from the clamping plate is fixedly connected to the inner side wall of the rectangular groove. The support blocks, rectangular grooves, clamping plates, sliders, and elastic elements are arranged in two sets in a clockwise direction inside the positioning groove.

[0007] By using a clamping plate for reset, along with a reference rod, the BGA chip is fixed in place, ensuring that BGA chips of different sizes are always in contact with the probes under the action of the cover plate and the pressure block, thereby improving the testing efficiency and accuracy of BGA chips of different sizes.

[0008] As a further improvement to this technical solution, a pressure block is fixedly connected to the bottom of the cover plate, the size of the pressure block is adapted to the size of the positioning groove, and a first connecting block is fixedly connected to the outer wall of the end of the cover plate, with inclined grooves opened at the bottom of both ends of the first connecting block.

[0009] The clamping block can press the BGA chip firmly when the cover is closed, ensuring that the BGA chip makes contact with the probe and conducts electricity.

[0010] As a further improvement to this technical solution, a second connecting block is fixedly connected to the outer wall of the end of the test fixture body at the corresponding position of the first connecting block, and a magnet is fixedly connected inside the second connecting block, with the top of the magnet magnetically attracted to the bottom of the first connecting block.

[0011] The first connecting block and the magnet magnetically engage to securely connect the cover plate to the test fixture body, facilitating subsequent testing of the BGA chip.

[0012] As a further improvement to this technical solution, through grooves are symmetrically opened on the inner walls of both ends of the second connecting block. A lifting rod is hinged inside each of the two through grooves. A torsion spring is sleeved inside the hinge of each of the two lifting rods. The ends of the two lifting rods near the magnet are located below the end of the first connecting block. Anti-slip sleeves are fixedly connected to the outer walls of the ends of the two lifting rods away from the magnet.

[0013] By pressing down on the end of the lifting rod away from the magnet, the lifting rod is flipped inside the through slot. This separates the magnet from the first connecting block and lifts the cover plate, making it easier to remove the BGA chip after testing inside the positioning slot, thus assisting in the loading and unloading of the BGA chip.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] In this second series of single BGA test fixtures, an auxiliary clamping mechanism is set up so that after the large-size BGA chip is placed in place, the elastic rebound characteristic of the elastic element causes the clamping plate to reset and, together with the reference rod, fixes the BGA chip. This ensures that BGA chips of different sizes can always be in contact with the probe under the action of the cover plate and the pressure block, thereby improving the testing efficiency and accuracy of BGA chips of different sizes. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a three-dimensional structural diagram of the test fixture body of the utility model;

[0018] Figure 3 This is a three-dimensional structural diagram of the internal structure of the test fixture body of the utility model;

[0019] Figure 4 This is a three-dimensional structural diagram of the relevant components of the auxiliary clamping mechanism of the utility model;

[0020] Figure 5 This is a three-dimensional structural diagram of the cover plate of the utility model.

[0021] The meanings of the labels in the diagram are as follows:

[0022] 1. Testing platform; 11. Slider; 2. Test fixture body; 21. Positioning groove; 22. Test needle plate; 23. Probe; 3. Cover plate; 4. Auxiliary clamping mechanism; 41. Reference rod; 42. Support block; 43. Rectangular groove; 44. Clamping plate; 45. Elastic element; 51. Pressure block; 52. First connecting block; 53. Inclined groove; 61. Second connecting block; 62. Magnet; 63. Through groove; 64. Lifting rod; 7. Anti-slip sleeve. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Example 1

[0026] Please see Figures 1-5As shown, this embodiment provides a two-series single BGA test fixture, including a test stage 1. A test fixture body 2 is fixedly connected to the top of the test stage 1. A positioning groove 21 is provided inside the test fixture body 2. A test probe plate 22 is fixedly connected inside the positioning groove 21. A plurality of probes 23 are evenly fixedly connected to the top of the test probe plate 22. A cover plate 3 is hinged to the top of the test fixture body 2. An auxiliary clamping mechanism 4 is provided inside the positioning groove 21 and above the surface of the test probe plate 22. The auxiliary clamping mechanism 4 includes a reference rod fixedly connected to the top of the corner of the test probe plate 22. 41. Two support blocks 42 are symmetrically fixedly connected to the side wall of the positioning groove 21. The inner side wall of each support block 42 is provided with a rectangular groove 43. A slider 11 is slidably connected inside each of the two rectangular grooves 43. A clamping plate 44 is fixedly connected between the side walls of the two sliders 11. An elastic element 45 is also fixedly connected to the outer wall of the side of the two sliders 11 away from the clamping plate 44. The end of the elastic element 45 away from the clamping plate 44 is fixedly connected to the inner side wall of the rectangular groove 43. The support blocks 42, rectangular grooves 43, clamping plates 44, sliders 11 and elastic elements 45 are arranged in two sets in a clockwise direction inside the positioning groove 21.

[0027] By placing the BGA chip inside the positioning slot 21, the BGA chip is positioned on the surface of the probe 23. Simultaneously, the side frame of the BGA chip needs to conform to the contour of the reference rod 41. For normal-sized BGA chips, they are placed directly, and the cover plate 3 is immediately closed for testing. When a large-sized BGA chip needs to be placed inside the positioning slot 21, the edge of the large-sized BGA chip will simultaneously push the two clamping plates 44, causing the clamping plates 44 to slide within the rectangular slot 43 via the slider 11, while simultaneously pressing the elastic element 45. The elastic element 45 consists of a spring, a limiting element, and a housing. After the large-sized BGA chip is placed in place, the spring's rebound characteristic causes the clamping plates 44 to reset, and together with the reference rod 41, it fixes the BGA chip, ensuring that BGA chips of different sizes are always in contact with the probe 23 under the action of the cover plate 3 and the pressure block 51, thus improving the accuracy of test results for BGA chips of different sizes.

[0028] A pressure block 51 is fixedly connected to the bottom of the cover plate 3. The size of the pressure block 51 is adapted to the size of the positioning groove 21. When the cover plate 3 is closed, the pressure block 51 can press the BGA chip to ensure that the BGA chip and the probe 23 are in contact and conducting. A first connecting block 52 is fixedly connected to the outer wall of the end of the cover plate 3. Both ends of the first connecting block 52 are provided with inclined grooves 53. The inclined grooves 53 allow the end of the lifting rod 64 located inside the through groove 63 to engage with the inclined groove 53, which can prevent the lifting rod 64 from engaging with the first connecting block 52. If the contact of the first connecting block 52 is unstable, a second connecting block 61 is fixedly connected to the outer wall of the end of the test fixture body 2 at the corresponding position of the first connecting block 52. A magnet 62 is fixedly connected inside the second connecting block 61. The top of the magnet 62 is magnetically attracted to the bottom of the first connecting block 52. When the cover plate 3 closes the opening of the positioning groove 21, the first connecting block 52 is located on the surface of the second connecting block 61. Through the magnetic attraction between the first connecting block 52 and the magnet 62, the cover plate 3 is firmly connected to the test fixture body 2, which facilitates the subsequent testing of the BGA chip.

[0029] The inner walls of both ends of the second connecting block 61 are symmetrically provided with through grooves 63. Each through groove 63 has a lifting rod 64 hinged inside. A torsion spring is fitted inside the hinge of each lifting rod 64. The ends of the two lifting rods 64 near the magnet 62 are located below the end of the first connecting block 52. When the first connecting block 52 and the magnet 62 are magnetically attracted, pressing down on the end of the lifting rod 64 away from the magnet 62 causes the lifting rod 64 to flip inside the through groove 63. During this flipping process, the torsion spring is compressed, causing the end of the lifting rod 64 inside the through groove 63 to engage with the inclined groove 53, preventing further lifting. The contact between rod 64 and the first connecting block 52 is unstable. By separating magnet 62 from the first connecting block 52 and lifting cover plate 3, it is convenient to remove the BGA chip after testing inside positioning slot 21, thus achieving the purpose of assisting in the loading and unloading of BGA chip. In addition, under the rebound action of torsion spring, the lifting rod 64 is reset for easy use next time. Anti-slip sleeves 7 are fixedly connected to the outer wall of the end of the two lifting rods 64 away from magnet 62. The anti-slip sleeves 7 increase the friction of the outer wall of the end of the lifting rod 64 away from through slot 63, which facilitates the operation of the lifting rod 64.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A two-series single BGA test fixture, comprising a test stage (1), wherein a test fixture body (2) is fixedly connected to the top of the test stage (1), a positioning groove (21) is provided inside the test fixture body (2), a test probe plate (22) is fixedly connected inside the positioning groove (21), and a plurality of probes (23) are uniformly fixedly connected to the top of the test probe plate (22), characterized in that: The top of the test fixture body (2) is hinged to a cover plate (3) by a hinge, and an auxiliary clamping mechanism (4) is provided inside the positioning groove (21) and above the surface of the test needle plate (22).

2. The two-series single BGA test fixture according to claim 1, characterized in that: The auxiliary clamping mechanism (4) includes a reference rod (41) fixedly connected to the top of the corner of the test needle plate (22). Two support blocks (42) are symmetrically fixedly connected to the side wall of the positioning groove (21). A rectangular groove (43) is opened on the inner side wall of each of the two support blocks (42). A slider (11) is slidably connected inside each of the two rectangular grooves (43). A clamping plate (44) is fixedly connected between the side walls of the two sliders (11). An elastic element (45) is also fixedly connected to the outer wall of the side of the two sliders (11) away from the clamping plate (44). The end of the elastic element (45) away from the clamping plate (44) is fixedly connected to the inner side wall of the rectangular groove (43). The support blocks (42), rectangular grooves (43), clamping plates (44), sliders (11) and elastic elements (45) are arranged in two sets in the clockwise direction inside the positioning groove (21).

3. The two-series single BGA test fixture according to claim 1, characterized in that: The bottom of the cover plate (3) is fixedly connected to a pressure block (51), and the outline size of the pressure block (51) is adapted to the outline size of the positioning groove (21).

4. The two-series single BGA test fixture according to claim 3, characterized in that: The outer wall of the end of the cover plate (3) is fixedly connected to a first connecting block (52), and the bottom of both ends of the first connecting block (52) is provided with inclined grooves (53).

5. The two-series single BGA test fixture according to claim 4, characterized in that: The outer wall of the test fixture body (2) is fixedly connected to the first connecting block (52) at the corresponding position of the second connecting block (61). A magnet (62) is fixedly connected inside the second connecting block (61), and the top of the magnet (62) is magnetically attracted to the bottom of the first connecting block (52).

6. The two-series single BGA test fixture according to claim 5, characterized in that: The inner walls of the two ends of the second connecting block (61) are symmetrically provided with through grooves (63), and each of the two through grooves (63) is hinged with a lifting rod (64), and each of the two lifting rods (64) is fitted with a torsion spring at the hinge point.

7. The two-series single BGA test fixture according to claim 6, characterized in that: The ends of the two lifting rods (64) near the magnet (62) are located below the end of the first connecting block (52), and the outer walls of the ends of the two lifting rods (64) away from the magnet (62) are fixedly connected with anti-slip sleeves (7).

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