Backlight module and display device
By introducing a light diffusion structure and LED chip housing design into the backlight module, the problems of bright spots and uneven brightness were solved, achieving a more uniform light distribution and higher brightness gain, thus improving the display effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HEFEI BOE OPTOELECTRONIC TECH CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-06-19
Smart Images
Figure CN224383483U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and more particularly to a backlight module and a display device. Background Technology
[0002] As display products continue to upgrade, the demands for brightness and low power consumption in backlight modules are increasing. To meet these demands, many high-gain backlight materials have emerged on the market, such as high-gain light guide plates, collimating light guide plates, high-gain prisms, and structured under-diffusion. These solutions improve the brightness at the viewing angle by adjusting the light propagation path and narrowing the light viewing angle.
[0003] However, these technologies have also had new effects on backlight modules, particularly exacerbating the hotspot problem in backlight modules and affecting the image quality of backlight modules. Utility Model Content
[0004] This application provides a backlight module and a display device to solve or alleviate one or more technical problems in the prior art.
[0005] As one aspect of the embodiments of this application, this application provides a backlight module, which includes:
[0006] The back panel includes a body, a side panel, and a bending section. The bending section connects the body and the side panel, and there is an accommodating space defined between the body, the side panel, and the bending section.
[0007] A light guide plate is positioned on the side of the main body facing the bent section;
[0008] Multiple LEDs are positioned between the light guide plate and the side plate, with the LEDs located within the receiving space;
[0009] The circuit board is located between the LED chip and the body, and the circuit board is electrically connected to the LED chip.
[0010] The light diffusion structure is configured to refract light and is located between the LED and the light guide plate.
[0011] In some embodiments, the light diffusion structure includes a first haze layer and a first adhesive layer. The first haze layer is disposed on the side of the lamp bead adjacent to the light guide plate, and the first adhesive layer is disposed on the side of the first haze layer adjacent to the light guide plate. The light-incident surface of the light guide plate is bonded to the first adhesive layer.
[0012] In some embodiments, a substrate layer is further included, which is disposed on the side of the first haze layer adjacent to the lamp bead.
[0013] In some embodiments, the first adhesive layer is a hot melt adhesive layer.
[0014] In some embodiments, the light diffusion structure further includes a second haze layer disposed on the side of the substrate layer away from the light guide plate.
[0015] In some embodiments, the light diffusion structure includes a substrate layer and a plurality of prisms, wherein the plurality of prisms are disposed on the side of the substrate layer away from the lamp bead, and the prism peaks are disposed facing away from the substrate layer.
[0016] In some embodiments, a beam-splitting layer is further included, which is disposed on the side of the substrate layer adjacent to the lamp beads.
[0017] In some embodiments, the beam splitting layer includes a plurality of quadrangular pyramids disposed on the side of the substrate layer away from the light guide plate, with the peaks of the quadrangular pyramids facing away from the substrate layer.
[0018] In some embodiments, there are multiple light diffusion structures, and each light diffusion structure corresponds to a multiple LED chip. The light diffusion structure is disposed on one side of the corresponding LED chip, a first gap is defined between two adjacent LED chips, and a second gap corresponding to the first gap is defined between two adjacent backlight modules.
[0019] As another aspect of this application, a display device is also provided, which includes a backlight module as described in any of the above.
[0020] The embodiments of this application have the following beneficial effects:
[0021] Based on the aforementioned backlight module and display device, this application, by placing a light diffusion structure between a light guide plate and multiple LED chips, receives the light beams emitted by the LED chips and transmits them to the light-incident surface of the light guide plate. Furthermore, the light beams are refracted as they pass through the light diffusion structure, causing the exit angle of the beam to be greater than the incident angle. This allows the LED beams to enter the light guide plate at a larger angle, thereby uniformly and dispersedly guiding the light emitted by the LED chips into the light guide plate. This reduces the brightness difference between the area directly opposite the LED chip and the area between two adjacent LED chips, improving beam utilization and brightness gain, and preventing the "firefly effect" in the backlight module. Secondly, this application places the LED chips within an accommodating space, thus protecting them.
[0022] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description
[0023] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.
[0024] Figure 1 This diagram illustrates the structure of a backlight module in the relevant technology.
[0025] Figure 2 A schematic diagram of the backlight module structure of the first solution in the related technology is shown;
[0026] Figure 3 A schematic diagram of the backlight module structure of the second solution in the related technology is shown;
[0027] Figure 4 A schematic diagram of the structure of a backlight module according to an embodiment of this application is shown;
[0028] Figure 5 A schematic diagram of the structure of a backlight module according to an embodiment of this application is shown;
[0029] Figure 6 A schematic diagram of the light diffusion structure according to an embodiment of this application is shown;
[0030] Figure 7 This diagram illustrates the initial state of a light diffusion structure according to another embodiment of the present application.
[0031] Figure 8 A schematic diagram of a light diffusion structure according to another embodiment of this application is shown;
[0032] Figure 9 A schematic diagram of a light diffusion structure according to another embodiment of this application is shown.
[0033] Explanation of reference numerals in the attached figures:
[0034] Related technologies:
[0035] 1' Backlight module;
[0036] 10', LED bead; 100', first gap;
[0037] 20', Light guide plate;
[0038] 30', Microstructure.
[0039] This application:
[0040] 10. Backlight module; 100. Substrate layer; 200. Light diffusion structure; 210. First haze layer; 220. First adhesive layer; 230. Second haze layer; 240. Prism; 250. Beam splitter layer; 251. Quadrilateral pyramid; 300. Second gap; 400. Release layer; 500. Back plate; 510. Body; 520. Side plate; 530. Bending section; 540. Accommodation space; 600. Circuit board;
[0041] 20. Light guide plate;
[0042] 30. LED bead; 31. First gap. Detailed Implementation
[0043] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.
[0044] Figure 1 This diagram shows a structural schematic of the backlight module 1' in the related technology. Figure 2 This diagram shows a structural schematic of the backlight module 1' of the first solution in the related technology. Figure 3 This diagram illustrates the structure of the backlight module 1' in the second embodiment of the related technology. (See attached diagram) Figures 1 to 3 In related technologies, the backlight module 1' includes multiple LED beads 10', which are arranged at intervals to form light strips. However, since there is a first gap 100' between two adjacent LED beads 10', and the LED beads 10' emit light in a fan-shaped manner with a certain light emission angle, the light source energy is mainly concentrated in front of the LED beads 10'. The first gap 100' between two adjacent LED beads 10' has a light source energy blind zone, that is, there is a bright spot near the front of the LED beads 10' and a dark band, which causes the backlight module 1' to exhibit a "bright and dark" light phenomenon, resulting in the backlight module 1' producing a firefly phenomenon (hotspot). The following two solutions are generally used in related technologies to solve the firefly phenomenon.
[0045] See Figure 2In the first approach, microstructures 30' are fabricated on the light-incident surface of the light guide plate 20', such as R-angle microstructures 30' and V-shaped microstructures 30'. The light beam emitted by the LED bead 10' is refracted when passing through the microstructures 30', thereby increasing the exit angle of the light beam and thus improving the brightness of the first gap 100' between two adjacent LED beads 10'. However, the first approach has significant limitations in terms of manufacturing process. When the light-incident surface of the light guide plate 20' is provided with a microlens array, due to process limitations, it is impossible to fabricate microstructures on the light-incident surface of the light guide plate 20'.
[0046] See Figure 3 In the second approach, brightness uniformity is improved by adjusting the dot distribution on the lower surface of the light guide plate 20' (LGP). Specifically, the dot density in front of the LED beads 10' is reduced, while the dot density in the first gap 100' between the LED beads 10' is increased. This reduces the brightness in front of the LED beads 10' and increases the brightness in the first gap 100' between the LED beads 10', thereby mitigating the hotspot effect. However, the effectiveness of this second approach is limited; for high-collimation backlight systems, this method alone cannot completely eliminate the hotspot effect.
[0047] Figure 4 This diagram shows a structural schematic of a backlight module according to an embodiment of the present application. Figure 5 This diagram shows a structural schematic of a backlight module 10 according to an embodiment of the present application. Figure 6 A schematic diagram of the light diffusion structure 200 according to an embodiment of this application is shown. See also: Figure 5 and Figure 6 This application provides a backlight module 10, which includes a backplate 500, a circuit board 600, a light guide plate 20, a plurality of LED beads 30, and a light diffusion structure 200. The light diffusion structure 200 is disposed on one side of the LED beads 30, and the light guide plate 20 is disposed on the side of the light diffusion structure 200 away from the LED beads 30. The light diffusion structure 200 is configured to refract light, that is, the light diffusion structure 200 is configured to refract the light beam so that the exit angle is greater than the incident angle, and to scatter the light beam.
[0048] In this embodiment, the backplate 500 includes a body 510, a side plate 520, and a bent section 530. The bent section 530 connects the body 510 and the side plate 520, and a receiving space 540 is defined between the body 510, the side plate 520, and the bent section 530. A light guide plate 20 is disposed on the side of the body 510 facing the bent section 530. A plurality of LEDs 30 are disposed between the light guide plate 20 and the side plate 520, and the LEDs 30 are located within the receiving space 540. A circuit board 600 is disposed between the LEDs 30 and the body 510, and the circuit board 600 is electrically connected to the LEDs 30. A light diffusion structure 200 is disposed between the LEDs 30 and the light guide plate 20.
[0049] In some examples, the circuit board 600 is bonded to the body 510, thereby enabling the body 510 to provide support for the circuit board 600 and the LED 30.
[0050] In this embodiment of the application, a first gap 31 is defined between two adjacent LED beads 30. The light source energy is mainly concentrated in front of the LED beads 30. There is a light source energy blind zone between two adjacent LED beads 30, that is, there is a bright spot near the front of the LED beads 30 and a dark band between two adjacent LED beads 30. This causes the backlight module 10 to form a light phenomenon of "bright and dark", which causes the backlight module 10 to produce a firefly phenomenon (hotspot phenomenon).
[0051] According to an embodiment of this application, by placing a light diffusion structure 200 between the light guide plate 20 and multiple LED beads 30, the light diffusion structure 200 receives the light beams emitted by the multiple LED beads 30 and transmits the light beams to the light incident surface of the light guide plate 20. Furthermore, the light beams are refracted as they pass through the light diffusion structure 200, so that the exit angle of the light beams at the light diffusion structure 200 is greater than the incident angle. This allows the light beams from the LED beads 30 to enter the light guide plate 20 at a larger angle, thereby uniformly and dispersedly guiding the light emitted by the LED beads 30 into the light guide plate 20. This reduces the brightness difference between the area directly opposite the LED bead 30 and the area between two adjacent LED beads 30, improving beam utilization and brightness gain, and preventing the backlight module 10 from exhibiting a "firefly" effect. Secondly, this application places the LED beads 30 within the receiving space 540, thus protecting the LED beads 30. Furthermore, the light diffusion structure 200 is also located within the accommodating space 540. This arrangement prevents the light diffusion structure 200 from being blocked by the bending section 530, thus preventing light leakage from the light diffusion structure 200.
[0052] In some embodiments, see Figure 5 and Figure 6The light diffusion structure 200 includes a first haze layer 210 and a first adhesive layer 220. The first haze layer 210 is disposed on the side of the lamp bead 30 adjacent to the light guide plate 20, and the first adhesive layer 220 is disposed on the side of the first haze layer 210 adjacent to the light guide plate 20. The light incident surface of the light guide plate 20 is bonded to the first adhesive layer 220.
[0053] In some examples, the haze layer can be an optical film with a certain degree of haze. When the light beam emitted from the LED 30 enters the first haze layer 210, the light beam emitted from the LED 30 is scattered by the first haze layer 210 because the first haze layer 210 has a haze, for example, the haze of the first haze layer 210 is greater than or equal to 70% (for example, the haze of the haze layer can be 70%, 72%, 74%, 76%, 78%, 80%, 82%, 84%, 86%, 88%, 90%, 92%, 94%, 96%, 98%, 99%, 100%, etc.). This disperses the light emitted by the LED 30 into the light guide plate 20 in a uniform and dispersed manner, thereby avoiding the firefly phenomenon in the backlight module 10.
[0054] According to the embodiments of this application, by providing a first adhesive layer 220 between the first haze layer 210 and the light guide plate 20, the first haze layer 210 and the light guide plate 20 can be bonded together, thereby avoiding the situation where there is a gap between the first haze layer 210 and the light guide plate 20 after the first haze layer 210 is provided. This ensures that there are no more specular reflection beams between the first haze layer 210 and the light guide plate 20, thereby making the display image of the backlight module 10 clearer.
[0055] In some embodiments, the first haze layer 210 can be fabricated using a particle coating process or a UV embossing process. In some examples, the first haze layer 210 can be fabricated using a particle coating process, where optical particles are first dispersed in a specific solvent or adhesive to form a uniform coating liquid. This coating liquid is then uniformly applied to the surface of the substrate using a coating device. Finally, the coating layer is stably adhered to the substrate by methods such as drying or UV curing, thus forming the first haze layer 210. The type and concentration of optical particles in this process can be adjusted as needed to control the diffusion effect and optical performance. In other examples, the first haze layer 210 can be fabricated using a UV embossing process, where a layer of liquid UV-curable adhesive is first uniformly coated onto the substrate surface. Then, a mold with a microstructure pattern is pressed onto the UV-curable adhesive to form the desired microstructure. UV light irradiation is then used to rapidly cure and set the UV-curable adhesive. Finally, the mold is removed, and the microstructure pattern is transferred to the substrate surface. It is understood that not all examples are limited to this, and the embodiments of this application do not limit the processing technology of the first haze layer 210.
[0056] In some embodiments, the backlight module 10 further includes a substrate layer 100 disposed on one side of the plurality of LED beads 30, and the substrate layer 100 is disposed on the side of the first haze layer 210 adjacent to the LED beads 30.
[0057] In some embodiments, the first adhesive layer 220 is a hot melt adhesive layer.
[0058] According to the embodiments of this application, in the production process of the backlight module 10, a hot melt adhesive layer is first applied to one side of the first haze layer 210. Then, the hot melt adhesive layer is bonded to the light guide plate 20. Finally, the hot melt adhesive layer is melted by high-temperature heating, so that the light guide plate 20 and the first haze layer 210 are tightly bonded together by the melted hot melt adhesive layer. This arrangement ensures a tight bond between the light guide plate 20 and the first haze layer 210 during the production process by melting the hot melt adhesive layer through high-temperature heating. Furthermore, using a hot melt adhesive bonding method simplifies the production process, avoids unnecessary adhesive treatment and drying time, and improves production efficiency.
[0059] Figure 7 This diagram illustrates the initial state of a light diffusion structure 200 according to another embodiment of this application. In some embodiments, see [link to relevant documentation]. Figure 7 A release layer 400 is provided on the side of the light diffusion structure 200 away from the light guide plate 20, and a substrate layer 100 is provided on the side of the release layer 400 away from the light guide plate 20.
[0060] In this embodiment, the processing of the light diffusion structure 200 involves first coating a release material onto the substrate layer 100 to form a release layer 400. Then, a light diffusion structure 200 is formed on one side of the release layer 400 using a particle coating process or an ultraviolet embossing process. Finally, a hot melt adhesive layer is coated on one side of the light diffusion structure 200 to form the initial state of the light diffusion structure 200. During the installation of the light diffusion structure 200 between the light guide plate 20 and the LED bead 30, the hot melt adhesive layer of the initial state of the light diffusion structure 200 is first bonded to the light guide plate 20. Then, the hot melt adhesive layer is melted by high-temperature heating, allowing the light guide plate 20 and the light diffusion structure 200 to adhere tightly through the melted hot melt adhesive layer. Finally, the substrate and release layer 400 are removed so that the light diffusion structure 200 faces the LED bead 30.
[0061] Figure 8 This diagram illustrates a light diffusion structure 200 according to another embodiment of the present application. In other embodiments, see [link to other embodiments]. Figure 8 The light diffusion structure 200 also includes a second haze layer 230, which is disposed on the side of the substrate layer 100 away from the light guide plate 20.
[0062] According to the embodiments of this application, the second haze layer 230 is directly opposite the LED bead 30, and the first haze layer 210 is directly opposite the light guide plate 20. The setting of the second haze layer 230 can adjust the direction of the light beam emitted by the LED bead 30, so that the angle of the light beam is adjusted once before entering the first haze layer 210, so that the exit angle of the light beam after passing through the second haze layer 230 is greater than the incident angle, thereby causing the light beam to be dispersed by the second haze layer 230 before entering the first haze layer 210. With this setting, the setting of the second haze layer 230 and the first haze layer 210 can make the light beam point at a larger angle, so that the light beam emitted by the LED bead 30 can be guided more evenly and dispersedly into the light guide plate 20 after passing through the light diffusion structure 200. This is beneficial to improving the optical performance of the backlight module 10, making the light beam output by the backlight module 10 softer and more uniform, reducing glare and eye irritation, and providing users with a more comfortable visual experience.
[0063] Figure 9 The diagram shows a light diffusion structure 200 according to another embodiment of the present application. In some other embodiments, the light diffusion structure 200 includes a substrate layer 100 and a plurality of prisms 240. The plurality of prisms 240 are disposed on the side of the substrate layer 100 adjacent to the light guide plate 20. The prism peaks of the prisms 240 are disposed away from the substrate layer 100. The prisms 240 can refract and reflect the light beam so that the propagation direction can be adjusted by the light diffusion structure 200 to make the light beam more uniformly distributed.
[0064] According to the embodiments of this application, unlike the above embodiments, this application uses multiple prisms 240 instead of the first haze layer 210. The arrangement of multiple prisms 240 can change the direction of the light beam. The prisms 240 can receive the light beams emitted by multiple LEDs 30 and transmit the light beams into the light-incident surface of the light guide plate 20. When the light beam passes through the prisms 240, it refracts the light beam so that the exit angle of the light beam passing through the prisms 240 is greater than the incident angle. This allows the light beam to be dispersed by the light diffusion structure 200 before entering the light guide plate 20, thereby reducing the brightness difference between the area directly opposite the LED 30 and the area between two adjacent LEDs 30, improving the beam utilization and brightness gain, and avoiding the firefly phenomenon in the backlight module 10. Secondly, the size and arrangement of the prisms 240 can be adjusted according to actual needs, making it easier to meet different application scenarios with different optical design requirements. For example, the size and arrangement of the prisms 240 can be adjusted according to the spacing between the LEDs 30 to expand the beam diffusion angle, reduce the concentrated brightness of the beam, and achieve a better light output effect.
[0065] In some embodiments, see Figure 9This application also includes a beam splitting layer 250, which is disposed on the side of the substrate layer 100 away from the light guide plate 20. The beam splitting layer 250 can split a beam of light emitted by the lamp bead 30 into multiple beams, so that the beams passing through the beam splitting layer 250 can be dispersed and enter the prism body 240, thereby making the beam distribution more uniform and reducing the light spot and brightness unevenness of the backlight module 10.
[0066] According to the embodiments of this application, the beam splitter 250 can split a beam of light emitted by the LED 30 into multiple beams, so that the beams passing through the beam splitter 250 can enter the prism body 240 more dispersedly, thereby making the beam distribution more uniform and reducing the light spot and brightness unevenness of the backlight module 10. The prism body 240 is used to make the beam entering the prism body 240 more uniform and dispersed, that is, to make the beam have a larger pointing angle. With this configuration, the beam splitter 250 can split a beam of light emitted by the LED 30 into multiple beams entering the prism body 240, and the prism body 240 can point the dispersed multiple beams at a larger angle, so that the beam of light emitted by the LED 30 can be more uniformly and dispersedly guided into the light guide plate 20 after passing through the light diffusion structure 200. This is beneficial to improving the optical performance of the backlight module 10, making the beam output by the backlight module 10 softer and more uniform, reducing glare and eye strain, and providing users with a more comfortable visual experience.
[0067] In some embodiments, see Figure 9 The beam splitting layer 250 includes multiple quadrangular pyramids 251, which are disposed on the side of the substrate layer 100 away from the light guide plate 20. The peaks of the quadrangular pyramids 251 are facing away from the substrate layer 100. This arrangement enables the beam to be dispersed and reflected multiple times, allowing the light emitted by the lamp bead 30 to be split into multiple beams. This allows the beams passing through the beam splitting layer 250 to enter the prism body 240 more dispersedly, resulting in a more uniform beam distribution. This reduces the light spot and brightness unevenness of the backlight module 10, prevents direct strong light from entering the line of sight, thereby reducing glare and improving visual comfort.
[0068] In some examples, the quadrangular pyramid 251 is a concave quadrangular pyramid 251, thereby improving the dispersion and reflection effects of the beam-splitting layer 250.
[0069] In some embodiments, see Figure 7 There are multiple light diffusion structures 200, and each light diffusion structure 200 corresponds to a multiple LED bead 30. The light diffusion structure 200 is disposed on one side of the corresponding LED bead 30. A first gap 31 is defined between two adjacent LED beads 30, and a second gap 300 corresponding to the first gap 31 is defined between two adjacent light diffusion structures 200.
[0070] According to the embodiments of this application, on the one hand, by disposing the light diffusion structure 200 between the light guide plate 20 and the plurality of LED beads 30, the light diffusion structure 200 receives the light beams emitted by the plurality of LED beads 30 and transmits the light beams to the light incident surface of the light guide plate 20. Furthermore, the light beams are refracted as they pass through the light diffusion structure 200, so that the exit angle of the light beams at the light diffusion structure 200 is greater than the incident angle. This allows the light beams from the LED beads 30 to enter the light guide plate 20 at a larger angle, thereby uniformly and dispersedly guiding the light emitted by the LED beads 30 into the light guide plate 20. This reduces the brightness difference between the area directly opposite the LED beads 30 and the area between two adjacent LED beads 30, improving beam utilization and brightness gain, and preventing the backlight module 10 from exhibiting a "firefly" effect. On the other hand, the provision of the second gap 300 in this application reduces the amount of material used in the substrate layer 100 and the light diffusion layer in the backlight module 10, which helps to reduce production costs.
[0071] In another aspect, this application also provides a display device including a backlight module 10 as described in any of the preceding embodiments. Thus, the display device possesses all the features and advantages of the aforementioned backlight module 10, which will not be repeated here.
[0072] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0073] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0074] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0075] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0076] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.
[0077] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A backlight module, characterized in that, include: The back panel includes a body, a side panel, and a bending section, wherein the bending section connects the body and the side panel, and an accommodating space is defined between the body, the side panel, and the bending section; A light guide plate is disposed on the side of the body facing the bent section; Multiple LED beads are disposed between the light guide plate and the side plate, and the LED beads are located within the receiving space; A circuit board is disposed between the LED bead and the body, and the circuit board is electrically connected to the LED bead. A light diffusion structure is configured to refract light and is disposed between the LED and the light guide plate.
2. The backlight module of claim 1, wherein, The light diffusion structure includes a first haze layer and a first adhesive layer. The first haze layer is disposed on the side of the lamp bead adjacent to the light guide plate, and the first adhesive layer is disposed on the side of the first haze layer adjacent to the light guide plate. The light incident surface of the light guide plate is bonded to the first adhesive layer.
3. The backlight module according to claim 2, characterized in that, It also includes a substrate layer, which is disposed on the side of the first haze layer adjacent to the lamp bead.
4. The backlight module according to claim 2, characterized in that, The first adhesive layer is a hot melt adhesive layer.
5. The backlight module according to claim 3, characterized in that, The light diffusion structure further includes a second haze layer, which is disposed on the side of the substrate layer away from the light guide plate.
6. The backlight module according to claim 1, characterized in that, The light diffusion structure includes a substrate layer and a plurality of prisms. The plurality of prisms are disposed on the side of the substrate layer away from the lamp bead, and the prism peaks are disposed facing away from the substrate layer.
7. The backlight module according to claim 6, characterized in that, It also includes a beam-splitting layer, which is disposed on the side of the substrate layer adjacent to the lamp bead.
8. The backlight module according to claim 7, characterized in that, The beam splitting layer includes a plurality of quadrangular pyramids, which are disposed on the side of the substrate layer away from the light guide plate, with the peaks of the quadrangular pyramids facing away from the substrate layer.
9. The backlight module according to claim 1, characterized in that, The number of light diffusion structures is multiple, and each of the multiple light diffusion structures corresponds to one of the multiple LED beads. The light diffusion structure is disposed on one side of the corresponding LED bead. A first gap is defined between two adjacent LED beads, and a second gap corresponding to the first gap is defined between two adjacent backlight modules.
10. A display device, characterized in that, Includes the backlight module as described in any one of claims 1 to 9.