A server and printed circuit board assembly, packaged chip and circuit board thereof

Abstract

The embodiment of the present application provides a kind of server and its printed circuit board assembly, package chip and circuit board.Therein, printed circuit board assembly includes package chip, circuit board and gasket, package chip is equipped with solder ball;Circuit board is equipped with chip pad, and circuit board and package chip are welded by chip pad and solder ball, so that package chip and circuit board are electrically connected;Gasket is located between package chip and circuit board, and one side is welded to package chip or circuit board.According to the server and its printed circuit board assembly, package chip and circuit board provided by the present application, the occurrence of soldering defects such as continuous soldering or false welding can be reduced, and the reliability of the electrical connection between the package chip and the circuit board can be improved.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a server and its printed circuit board assembly, packaging chips and circuit boards. Background Technology

[0002] With the booming development of cloud computing, artificial intelligence, and data center businesses, servers, as the core computing power carriers, are facing increasingly higher demands for performance density and reliability. In the field of server technology, a stable electrical connection between packaged chips (such as central processing units (CPUs) or socket chips) and printed circuit boards (PCBs) is crucial for achieving high-speed data processing and stable signal transmission.

[0003] In related technologies, such large-size packaged chips are soldered to PCBs using surface mount technology (SMT). However, due to the difference in the coefficient of thermal expansion (CTE) between the chip and the PCB, the chip will undergo severe thermal deformation during the soldering process, causing problems such as solder bridging or cold solder joints, which will affect the reliability of the electrical connection between the packaged chip and the circuit board. Utility Model Content

[0004] This application provides a server and its printed circuit board assembly, chip packaging, and circuit board, which can reduce the occurrence of soldering defects such as bridging or cold solder joints and improve the reliability of the electrical connection between the packaged chip and the circuit board.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, embodiments of this application provide a printed circuit board assembly, including:

[0007] The packaged chip has solder balls.

[0008] The circuit board has chip pads, and the circuit board and the packaged chip are soldered to the chip pads and solder balls to make the packaged chip and the circuit board electrically connected.

[0009] A spacer is located between the packaged chip and the circuit board, and one side of the spacer is soldered to the packaged chip or the circuit board.

[0010] According to the printed circuit board assembly provided in the embodiments of this application, in order to improve the reliability of the electrical connection between the packaged chip and the circuit board, the printed circuit board assembly may include a spacer. The spacer is located between the packaged chip and the circuit board to provide physical support to the area where thermal deformation tends to occur when thermal deformation begins to occur during the soldering process of the packaged chip. In other words, when a part of the packaged chip deforms in a direction closer to or away from the circuit board, the spacer can abut against the packaged chip and the circuit board, thereby suppressing the aforementioned deformation and maintaining the original flatness of the packaged chip as much as possible. At this time, the gap between the chip pad and the solder ball matches the amount of solder paste printed, which helps to reduce the occurrence of soldering defects such as bridging or cold solder joints and improves the reliability of the electrical connection between the packaged chip and the circuit board. In addition, one side of the spacer is soldered to the packaged chip or the circuit board, so even if it is subjected to vibration or other influences, the spacer is not prone to positional displacement, thereby maintaining a stable support effect.

[0011] In one implementation, the spacer includes a spacer body and a solder plating layer, wherein the solder plating layer is disposed on the spacer body for soldering to the surface of a packaged chip or circuit board.

[0012] The gasket body is soldered to the packaged chip or circuit board via a solder plating layer.

[0013] In this embodiment, the solder plating layer forms a strong metallurgical bond during the welding process, ensuring a stable and reliable connection between the gasket and the packaged chip or circuit board, and enhancing the welding strength of the gasket to the surface of the packaged chip or circuit board. Furthermore, by using the solder plating layer to weld the gasket body to the surface of the packaged chip or circuit board, when configuring the structural characteristics of the gasket body, such as high-temperature resistance, rigidity, and chemical stability, there is no need to consider its welding performance. This improves the configuration of the gasket body's structural characteristics, such as structural rigidity, thereby providing better physical support for the packaged chip and maintaining its original flatness.

[0014] In one implementation, the circuit board is used to provide pads at the pad body, and the pad body is soldered to the circuit board via a solder plating layer and the pads.

[0015] In this embodiment, the design makes the soldering between the gasket body and the circuit board more stable and reliable. The gasket body is soldered through a solder plating layer and gasket pads. The gasket pads are designed with soldering requirements in mind, so that the soldering is not affected by the unevenness of the circuit board surface. The gasket pads can better provide the soldering interface and support, thereby effectively improving the quality and stability of the solder joint.

[0016] In one implementation, multiple spacers are evenly distributed between the packaged chip and the circuit board.

[0017] In this embodiment, multiple spacers are evenly distributed between the packaged chip and the circuit board. When the packaged chip is supported by the spacers at a first position, according to the principle of torque balance, the position symmetrical to the spacer will exhibit a deformation trend opposite to that at the first position. Therefore, the spacers at the second position symmetrical to the first position will counteract the deformation trend caused by uneven force, thereby preventing the packaged chip from undergoing negative deformation in the symmetrical area due to localized force, thus improving the structural stability of the packaged chip. Alternatively, the deformation of the packaged chip due to thermal effects is usually uniform. For example, the geometric center of the packaged chip protrudes away from the circuit board, and the degree of protrusion gradually decreases as it approaches the edge of the packaged chip; or the periphery of the packaged chip warps away from the circuit board, and the degree of warping gradually decreases as it approaches the geometric center of the packaged chip. Accordingly, the evenly distributed spacers can provide support for these deformation positions, suppressing the occurrence of deformation. Therefore, evenly distributing the spacers between the packaged chip and the circuit board can effectively maintain the structural stability of the packaged chip, reduce soldering defects such as bridging and cold solder joints, thereby significantly improving the reliability of the electrical connection between the packaged chip and the circuit board. At the same time, uniform stress also reduces the risk of damage to the packaged chip due to stress concentration, and enhances the stability and durability of the printed circuit board assembly and operation.

[0018] In one implementation, on a plane parallel to the side of the circuit board facing the packaged chip, the spacing between the pad and the chip pad or solder ball is greater than or equal to a preset spacing.

[0019] In this embodiment, during the soldering process of the gasket, the solder plating or solder melts and flows without flowing to the surrounding chip pads or solder balls; during the formation of the solder joint, even if the solder plating or solder flows slightly due to high temperature, it will not flow to the surrounding chip pads or solder balls. Therefore, the distance between the gasket and the chip pads or solder balls is greater than or equal to a preset distance, ensuring that it does not affect the surrounding structure, thereby guaranteeing the performance of the printed circuit board assembly.

[0020] In one implementation, the preset spacing is configured as: the pad spacing between adjacent chip pads on a plane parallel to the side surface of the circuit board facing the packaged chip.

[0021] In this embodiment, the preset spacing is configured as the pad spacing, which ensures that the pads do not affect the surrounding solder joints. Furthermore, obtaining this preset spacing through separate testing eliminates the need for such testing, simplifying the design process and reducing manufacturing costs.

[0022] In one implementation, on a plane parallel to the side surface of the circuit board facing the packaged chip, the side length or diameter of the spacer is greater than or equal to the height dimension of the spacer.

[0023] In this embodiment, it can be ensured that the gasket has sufficient stability during the mounting process and is not easily tipped over.

[0024] Secondly, embodiments of this application provide a packaged chip, comprising:

[0025] First impression;

[0026] Solder balls are placed on the first surface;

[0027] A gasket, along with the solder ball, is placed on the first surface, and the stiffness of the gasket is configured to be higher than that of the solder ball.

[0028] According to the embodiments of this application, the packaged chip includes a gasket to provide physical support to the area where thermal deformation tends to occur when thermal deformation begins to occur during the soldering process of the packaged chip, thereby suppressing the aforementioned deformation, helping to reduce the occurrence of soldering defects such as bridging or cold solder joints, and improving the reliability of the electrical connection between the packaged chip and the circuit board.

[0029] In one implementation, the height dimension of the solder ball is a first height, and the height dimension of the gasket is configured to be 0.3 times to 0.9 times the first height.

[0030] In this embodiment, the height of the solder ball is a first height, and the height of the spacer is configured to be 0.3 to 0.9 times the first height. This ensures that after the solder ball collapses, the spacer abuts against the packaged chip and the circuit board, preventing damage to the surface of the packaged chip or the circuit board. Furthermore, the spacer's height is configured to support the packaged chip, adjusting the solder joint height between the packaged chip and the circuit board. This prevents excessive collapse of the solder ball under the weight of the packaged chip, thus improving the reliability of the solder joint formation.

[0031] Thirdly, embodiments of this application provide a circuit board, including:

[0032] Second side;

[0033] Chip pads are located on the second surface;

[0034] A spacer, along with the chip pad, is placed on the second surface, and the spacer's stiffness is configured to be higher than that of the chip pad.

[0035] According to the embodiments of this application, the circuit board includes a gasket to provide physical support for the packaged chip when thermal deformation begins to occur during the chip soldering process, thereby suppressing the aforementioned deformation of the packaged chip, helping to reduce the occurrence of soldering defects such as bridging or cold solder joints, and improving the reliability of the electrical connection between the packaged chip and the circuit board.

[0036] Fourthly, embodiments of this application provide a server, including the aforementioned printed circuit board assembly, or packaged chip, or circuit board.

[0037] The server provided according to the embodiments of this application includes a gasket to provide physical support for the packaged chip when thermal deformation begins to occur during the chip soldering process, thereby suppressing the aforementioned deformation of the packaged chip, helping to reduce the occurrence of soldering defects such as bridging or cold solder joints, and improving the reliability of the electrical connection between the packaged chip and the circuit board. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the structure of a server provided in an embodiment of this application;

[0039] Figure 2 yes Figure 1 A perspective view of the printed circuit board assembly in the server shown.

[0040] Figure 3 yes Figure 2 A schematic diagram of the printed circuit board assembly from another angle;

[0041] Figure 4 for Figure 3 The diagram shows a schematic of the chip package structure in the printed circuit board assembly.

[0042] Figure 5 for Figure 3 The diagram shows a partial structural diagram of the printed circuit board during assembly.

[0043] Figure 6 This is a schematic diagram of the structure of a spacer in a printed circuit board assembly provided in an embodiment of this application;

[0044] Figure 7 yes Figure 1 This is a schematic diagram of another perspective structure of the printed circuit board assembly in the server shown.

[0045] Figure 8 yes Figure 1 This is a schematic diagram of another perspective structure of the printed circuit board assembly in the server shown.

[0046] Figure 9 yes Figure 1 This is a schematic diagram of another perspective structure of the printed circuit board assembly in the server shown.

[0047] Figure 10 for Figure 2 A schematic diagram of the printed circuit board assembly from another angle;

[0048] Figure 11 for Figure 8 or Figure 9 A schematic diagram of the printed circuit board assembly from another angle;

[0049] Figure 12 for Figure 2 An enlarged structural diagram of point A in the diagram is shown.

[0050] Figure 13 for Figure 8 A magnified structural diagram of point B in the diagram.

[0051] Explanation of reference numerals in the attached figures:

[0052] 1000 - Server; 100 - Packaged chip; 200 - Circuit board; 300 - Gasket;

[0053] 101-Solder ball; 201-Chip pad; 120-Solder joint; 11-First top surface; 12-First bottom surface; 21-Second top surface; 22-Second bottom surface; 301-Pad body; 302-Solder plating layer; 202-Pad pad; 311-First pad; 312-Second pad; 111-First area; 112-Second area; 1111-Blank area; d1-Pad spacing; h1-First height dimension; h2-Second height dimension; m1-First side length; m2-Second side length; m3-Diameter. Detailed Implementation

[0054] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. To facilitate a clear description of the technical solutions of the embodiments of this application, the use of terms such as "first," "second," etc., in the embodiments of this application is for illustrative purposes and to distinguish the objects being described. There is no particular order between them, nor does it indicate a specific limitation on the number of devices in the embodiments of this application, and they do not constitute any limitation on the embodiments of this application.

[0055] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.

[0056] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0057] In the description of this application, it should be understood that the terms "upper," "lower," "horizontal," "bottom," "inner," and "outer" (if any) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In this application, unless otherwise expressly specified and limited, "upper" or "lower" of the first feature and the second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0058] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities at the point of connection are not connected through a transitional structure, but are simply linked together to form a whole. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0059] In this application, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0060] Figure 1 This is a schematic diagram of the structure of a server provided in an embodiment of this application. With the booming development of cloud computing, artificial intelligence and data center services, the performance density and reliability requirements of the server 1000, as the core computing power carrier, are constantly increasing.

[0061] Figure 2 yes Figure 1 The diagram shows a perspective view of the printed circuit board assembly in the server. Figure 2 As shown, a printed circuit board assembly (PCBA) includes a packaged chip 100 and a circuit board 200. A stable electrical connection between the packaged chip 100 and the circuit board 200 is the key to achieving high-speed data processing and stable signal transmission.

[0062] In some embodiments, the packaged chip 100 may be a central processing unit (CPU) or a socket chip for network communication.

[0063] In some examples, the socket chip can be a controller chip, a system-on-chip (SoC) chip, a transmission control protocol / internet protocol (TCP / IP) acceleration chip, etc. This application does not limit the specific type of socket chip.

[0064] In some examples, circuit board 200 can be a printed circuit board (PCB).

[0065] In some examples, circuit board 200 can be an integrated circuit board.

[0066] It should be noted that the printed circuit board or integrated circuit board is only shown as some examples of circuit board 200, and the embodiments of this application do not limit the type of circuit board.

[0067] Figure 3 yes Figure 2 This is a schematic diagram of the printed circuit board assembly from another angle. (See diagram below.) Figure 3 As shown, in some embodiments, the packaged chip 100 is provided with solder balls 101, and the circuit board 200 is provided with chip pads 201. The circuit board 200 and the packaged chip 100 are soldered to the chip pads 201 and solder balls 101, thereby electrically connecting the packaged chip 100 and the circuit board 200. In other words, a solder joint 120 is formed between the chip pads 201 and the solder balls 101 (see...). Figure 2 This allows the packaged chip 100 to form an electrical connection with the circuit board 200. Accordingly, the packaged chip 100 interacts with other components in the server 1000 through the circuit board 200 to realize various functions of the server 1000.

[0068] In some examples, during the soldering process between the circuit board 200 and the packaged chip 100 via chip pads 201 and solder balls 101, solder paste is printed onto the surface of the chip pads 201 facing the solder balls 101 at a certain height using a solder stencil. After aligning the circuit board 200 and the packaged chip 100, they are placed in a reflow oven. Under the high temperature of the reflow oven, the solder paste printed on the chip pads 201 melts, forming liquid solder. This liquid solder flows and fills the gaps between the chip pads 201 and the solder balls 101. As the temperature gradually decreases, the liquid solder re-solidifies, forming solder joints 120 corresponding to the chip pads 201 and the solder balls 101, thereby establishing an electrical and mechanical connection between the circuit board 200 and the packaged chip 100.

[0069] To improve the reliability of the electrical connection between the packaged chip 100 and the circuit board 200, in some embodiments, the printed circuit board assembly further includes a spacer 300. The spacer 300 is located between the packaged chip 100 and the circuit board 200, and one side of the spacer 300 is soldered to the packaged chip 100 or the circuit board 200. Therefore, during the soldering process between the circuit board 200 and the packaged chip 100 via the chip pads 201 and solder balls 101, the packaged chip 100 is prone to thermal deformation due to thermal effects. The spacer 300 can provide physical support for the packaged chip 100, preventing thermal deformation, reducing soldering defects such as bridging or cold solder joints, and improving the reliability of the electrical connection between the packaged chip 100 and the circuit board 200.

[0070] Solder bridging can be understood as follows: at the thermal deformation point of the packaged chip 100, the height distance between the chip pad 201 and the corresponding solder ball 101 decreases or even becomes compressed, causing liquid solder to flow to the surrounding area and the liquid solder of adjacent solder joints 120 to stick together. Correspondingly, solder bridging can lead to short circuits between adjacent solder joints 120, resulting in signal crosstalk, power short circuits, and functional logic errors of the packaged chip 100, affecting the printed circuit board assembly and even the performance of the server 1000. Cold solder joints can be understood as follows: at the thermal deformation point of the packaged chip 100, the height distance between the chip pad 201 and the corresponding solder ball 101 increases, and the liquid solder is insufficient to fill the gap between the chip pad 201 and the solder ball 101, resulting in poor contact of the solder joints 120. Correspondingly, cold solder joints can lead to signal transmission delays or interruptions, unstable power connections, and other problems, affecting the printed circuit board assembly and even the performance of the server 1000.

[0071] It should be noted that when the packaged chip 100 is small, such as within 28mm*28mm, thermal deformation has little impact on its stability when soldered to the circuit board 200. However, when the packaged chip 100 is large, such as 60mm*60mm or larger, thermal deformation has a more significant impact on its stability when soldered to the circuit board 200, which can greatly affect the printed circuit board assembly and even the performance of the server 1000.

[0072] In some embodiments, the pad 300 is soldered together with the solder ball 101 to the side surface of the package chip 100 facing the circuit board 200.

[0073] In some embodiments, the packaged chip 100 includes a first surface, solder balls 101, and a spacer 300. The solder balls 101 are disposed on the first surface; the spacer 300 is disposed on the first surface together with the solder balls 101, and the stiffness of the spacer 300 is configured to be higher than that of the solder balls 101. Thus, the packaged chip 100 includes the spacer 300 to provide physical support to areas prone to thermal deformation when thermal deformation begins to occur during the soldering process of the packaged chip 100, thereby suppressing the aforementioned deformation. This helps reduce the occurrence of soldering defects such as bridging or cold solder joints, and improves the reliability of the electrical connection between the packaged chip 100 and the circuit board 200.

[0074] Figure 4 for Figure 3 The diagram shows a schematic of the chip package structure during printed circuit board assembly. (Combined with...) Figure 4 As shown, in some examples, the packaged chip 100 includes a first top surface 11 and a first bottom surface 12 disposed opposite to each other. The first top surface 11 is used to protect the packaged chip 100 from physical damage, and the first bottom surface 12 is used to connect to the circuit board 200 to realize the transmission of power, signal and ground. Accordingly, the first surface of the packaged chip 100 described above can be either the first top surface 11 or the first bottom surface 12.

[0075] In some examples, if the packaged chip 100 is mounted upright on the circuit board 200, the spacer 300 and the solder ball 101 are soldered together to the first bottom surface 12 of the circuit board 200 facing the packaged chip 100. If the packaged chip 100 is mounted backwards on the circuit board 200, the spacer 300 and the solder ball 101 are soldered together to the first top surface 11 of the circuit board 200 facing the packaged chip 100.

[0076] It should be noted that, Figure 4 The structure shown is merely an example of the packaged chip 100 and does not constitute a limitation on the packaged chip 100 provided in the embodiments of this application.

[0077] In some embodiments, the pad 300 is soldered together with the chip pad 201 to the side surface of the circuit board 200 facing the packaged chip 100.

[0078] In some embodiments, the circuit board 200 includes a second surface, chip pads 201, and a spacer 300. The chip pads 201 are disposed on the second surface; the spacer 300 is disposed on the second surface together with the chip pads 201, and the stiffness of the spacer 300 is configured to be higher than that of the chip pads 201. Thus, the circuit board 200 includes the spacer 300 to provide physical support for the packaged chip 100 when thermal deformation begins to occur during the soldering process, thereby suppressing the aforementioned deformation of the packaged chip. This helps to reduce the occurrence of soldering defects such as bridging or cold solder joints, and improves the reliability of the electrical connection between the packaged chip 100 and the circuit board 200.

[0079] Figure 5 for Figure 3 The diagram shows a partial structural schematic of the printed circuit board during assembly. (Combined with...) Figure 5 As shown, in some examples, the circuit board 200 includes a second top surface 21 and a second bottom surface 22 disposed opposite to each other. The second top surface 21 is mainly used for mounting components and laying out circuits, such as mounting packaged chips 100, capacitors, resistors, and inductors. The second bottom surface 22 is mainly used for electromagnetic shielding and laying out circuits. The circuitry on the second top surface 21 is used to connect different components together to form a complete electrical path. The circuitry on the second bottom surface 22 mainly includes guiding signal lines from the second top surface 21 to the second bottom surface 22, as well as auxiliary circuitry. Accordingly, the second surface of the circuit board 200 can be either the second top surface 21 or the second bottom surface 22.

[0080] In some examples, the spacer 300 is soldered together with the chip pad 201 to the surface of the second top surface 21 of the circuit board 200 facing away from the second bottom surface 22. Correspondingly, the package chip 100 is soldered to the surface of the second top surface 21 of the circuit board 200 facing away from the second bottom surface 22.

[0081] This application provides a printed circuit board assembly. To improve the reliability of the electrical connection between the packaged chip 100 and the circuit board 200, the printed circuit board assembly may include a spacer 300 located between the packaged chip 100 and the circuit board 200. The spacer 300 provides physical support to the area where thermal deformation tends to occur during the soldering process of the packaged chip 100 (deformation towards or away from the circuit board 200). In other words, when a portion of the packaged chip 100 deforms towards or away from the circuit board 200, the spacer 300 can abut against the packaged chip 100 and the circuit board 200, thereby suppressing the aforementioned deformation and maintaining the original flatness of the packaged chip 100 as much as possible. At this time, the gap between the chip pad 201 and the solder ball 101 matches the amount of printed solder paste, which helps reduce soldering defects such as bridging or cold solder joints, and improves the reliability of the electrical connection between the packaged chip 100 and the circuit board 200. In addition, one side of the pad 300 is soldered to the packaged chip 100 or the circuit board 200. Even if it is subjected to vibration or other influences, the pad 300 is not prone to positional displacement, thus maintaining a stable support effect.

[0082] Figure 6 This is a schematic diagram of the structure of a spacer in a printed circuit board assembly provided in an embodiment of this application. (In conjunction with...) Figure 6 In some embodiments, the gasket 300 includes a gasket body 301 and a solder plating layer 302. The solder plating layer 302 is disposed on the gasket body 301 for soldering to the surface of the packaged chip 100 or the circuit board 200. The gasket body 301 is soldered to the packaged chip 100 or the circuit board 200 through the solder plating layer 302.

[0083] In this embodiment, the solder plating layer 302 forms a strong metallurgical bond during the welding process, ensuring a stable and reliable connection between the gasket 300 and the packaged chip 100 or circuit board 200, and enhancing the welding strength of the gasket 300 to the surface of the packaged chip 100 or circuit board 200. Furthermore, by using the solder plating layer 302 to weld the gasket body 301 to the surface of the packaged chip 100 or circuit board 200, when configuring the structural characteristics of the gasket body 301, such as high-temperature resistance, rigidity, and chemical stability, there is no need to consider its welding performance. This improves the configuration of the structural characteristics of the gasket body 301, such as structural rigidity, thereby providing better physical support for the packaged chip 100 and maintaining its original flatness. The flatness of the packaged chip 100 is referenced to... Figure 4 The flatness of the packaged chip 100 can be understood as the flatness of the packaged chip 100 on the reference plane x, which is parallel to the plane containing the first top surface 11 or the first bottom surface 12.

[0084] In some embodiments, the solder plating layer 302 may cover the surface of the pad body 301 for connection to the packaged chip 100 or the circuit board 200.

[0085] In some embodiments, a gap is maintained between the edge of the solder plating layer 302 and the edge of the gasket body 301 on the reference plane x, thereby preventing the solder plating layer 302 from flowing to other areas during the soldering process and affecting the electrical connection of other components. Importantly, the aforementioned gap between the two can be appropriately increased, provided that the gasket body 301 can be stably soldered to the packaged chip 100 or circuit board 200 through the solder plating layer 302.

[0086] In some embodiments, the gasket body 301 can be made of high-temperature resistant plastic materials such as aluminum alloy, synthetic stone, titanium alloy, polycarbonate PCB, liquid crystal polymer (LCP), and polyamide (PA). Correspondingly, since the server 1000 operates at high temperatures, the gasket body 301, due to its high-temperature resistance, will not melt and affect other components on the circuit board 200, thus ensuring safety.

[0087] In some embodiments, the solder plating layer 302 can be made of immersion tin (Imm-Sn), immersion silver (Imm-Ag), electroless nickel immersion gold (ENIG), electroless nickel immersion tin (NiSn), etc. The material of the solder plating layer 302 is not limited in the embodiments of this application.

[0088] In some embodiments, the outline shape of the pad body 301 on the reference plane x (which can be understood as the extension surface of the package chip 100) can be: circular, square, rectangular or other shapes (examples will be given below), which can be determined according to the layout of components on the circuit board 200 and the regional layout of the package chip 100. This application embodiment does not limit the outline shape.

[0089] To ensure the support performance of the spacer 300, in some embodiments, the height tolerance of the spacer 300 is configured to be less than or equal to 0.05 mm. This improves the support accuracy of the spacer 300 for the packaged chip 100 and prevents deformation of the packaged chip 100 due to inconsistent heights of the spacer 300, which would affect the working performance of the packaged chip 100. The height of the spacer body 301 is the dimension of the spacer body 301 along the direction in which the packaged chip 100 and the circuit board 200 are positioned relative to each other. In other words, the direction in which the packaged chip 100 and the circuit board 200 are positioned relative to each other is the height direction h.

[0090] It should be noted that if the height tolerance of the spacer 300 is configured to be greater than 0.05 mm, such as 0.06 mm or 0.07 mm, it may reduce the flatness of the spacer 300, affecting the working performance of the packaged chip 100. Therefore, the height tolerance of the spacer 300 is configured to be less than or equal to 0.05 mm, such as 0.05, 0.03 mm, 0.02 mm or other values. This application embodiment does not limit the specific parameters of the height tolerance.

[0091] In some embodiments, the height tolerance of the gasket 300 is configured to be less than or equal to 0.03 mm, such as 0.03 mm, 0.02 mm or other values. The embodiments of this application do not limit the specific parameters of the height tolerance.

[0092] In the case where the spacer 300 is soldered to the circuit board 200, to facilitate the soldering process, in some embodiments, the circuit board 200 is provided with a spacer pad 202 at the location where the spacer body 301 is soldered (see...). Figure 3 or Figure 5 The gasket body 301 is soldered to the circuit board 200 via the solder plating layer 302 and the gasket pad 202.

[0093] In some embodiments, the circuit board 200 is specifically provided with pad 202 at the location where the pad body 301 is soldered (see...). Figure 3 or Figure 5This design makes the soldering between the gasket body 301 and the circuit board 200 more stable and reliable. The gasket body 301 is soldered through the solder plating layer 302 and the gasket pad 202. The gasket pad 202 is designed with soldering requirements in mind, so that the soldering is not affected by the unevenness of the circuit board 200 surface. The gasket pad 202 can better provide the soldering interface and support, thereby effectively improving the quality and stability of the solder joint.

[0094] In some embodiments, the pad body 301 is soldered to the packaged chip 100 or circuit board 200 via the solder plating layer 302. This can be achieved by printing solder paste onto the surface of the chip pad 201 facing the solder ball 101 and the surface of the pad pad 202 facing away from the circuit board 200 using a solder stencil. The pad body 301 is then mounted onto the circuit board 200 using a pick-and-place machine. The height of the solder stencil determines the height of the printed solder paste. Therefore, mounting the pad body 301 onto the circuit board 200 or packaged chip 100 can be achieved using standard surface mount technology (SMT) processes, without the need for special processes or equipment, supporting mass production and saving manufacturing costs.

[0095] In some examples, the stencil height (the dimension of the stencil along the height direction h) at chip pad 201 and pad pad 202 is the same to simplify the size design of the solder stencil.

[0096] In some examples, the height of the first stencil at the pad 202 is less than the height of the second stencil at the chip pad 201 to prevent the solder plating 302 from flowing from the pad 202 to other locations and affecting other components after melting. For example, if the height of the second stencil is 0.12 mm, then the height of the first stencil can be configured to 0.1 mm, 0.09 mm, or other values. This application embodiment does not limit the specific value of the first stencil height.

[0097] It should be noted that, compared to the electrical connection established at the solder joint 120 between the packaged chip 100 and the circuit board 200, the spacer body 301 and the circuit board 200 are soldered through the spacer pad 202 and the solder plating layer 302 to provide physical support for the packaged chip 100. It can be seen that the soldering stability requirement between the spacer body 301 and the circuit board 200 is lower than that at the solder joint 120. Therefore, configuring the height of the first stencil to be smaller than the height of the second stencil, that is, the solder paste at the spacer pad 202 is less than the solder paste at the chip pad 201, can meet the soldering stability requirement of providing physical support for the packaged chip 100.

[0098] In order to reduce the deformation of the packaged chip 100 and maintain its original shape, in some embodiments, there are multiple spacers 300, and the multiple spacers 300 are evenly distributed between the packaged chip 100 and the circuit board 200.

[0099] The uniform distribution can be understood as follows: in the direction of the reference plane x, the package chip 100 has a geometric center, and the multiple spacers 300 are uniformly distributed about this geometric center. For example, the multiple spacers 300 are symmetrically distributed about this geometric center, and the multiple spacers 300 are distributed at positions equidistant from this geometric center.

[0100] The printed circuit board assembly provided in this application embodiment involves uniformly distributing multiple spacers 300 between the packaged chip 100 and the circuit board 200. On one hand, when the packaged chip 100 is subjected to the supporting force of the spacer 300 at a first position, according to the principle of torque balance, the position symmetrical to the spacer 300 will exhibit a deformation trend opposite to that at the first position. Therefore, the spacer 300 at the second position symmetrical to the first position will counteract the deformation trend caused by uneven force, thereby preventing the packaged chip 100 from undergoing negative deformation in the symmetrical region due to localized force, thus improving the structural stability of the packaged chip 100. On the other hand, the deformation of the packaged chip 100 due to thermal effects is usually uniform. For example, the geometric center of the packaged chip 100 protrudes away from the circuit board 200, and the degree of protrusion gradually decreases as it approaches the edge of the packaged chip 100; or the periphery of the packaged chip 100 warps away from the circuit board 200, and the degree of warping gradually decreases as it approaches the geometric center of the packaged chip 100. Correspondingly, the uniformly distributed spacers 300 can provide support for these deformed locations, suppressing deformation. Therefore, uniformly distributing the spacers 300 between the packaged chip 100 and the circuit board 200 can effectively maintain the structural stability of the packaged chip 100, reduce soldering defects such as bridging and cold solder joints, thereby significantly improving the reliability of the electrical connection between the packaged chip 100 and the circuit board 200. At the same time, uniform force also reduces the risk of damage to the packaged chip 100 due to stress concentration, enhancing the stability and durability of printed circuit board assembly and even the operation of the server 1000.

[0101] Figure 7 yes Figure 1 This is a schematic diagram of another perspective structure of the printed circuit board assembly in the server shown. (See diagram below.) Figure 7As shown, in some embodiments, the plurality of pads 300 include a first pad 311 and a second pad 312; the packaged chip 100 and the circuit board 200 include a first region 111 and a second region 112, the second region 112 being located around the first region 111, and the first region 111 being used to accommodate chip pads 201 and solder balls 101; the first pad 311 is located in the first region 111, and one side is soldered to the packaged chip 100 or the circuit board 200; the second pad 312 is located in the second region 112, and one side is soldered to the packaged chip 100 or the circuit board 200.

[0102] The printed circuit board assembly provided in this application embodiment, by placing a first pad 311 in the first region 111 and a second pad 312 in the second region 112, helps improve the structural stability of the packaged chip 100 throughout the soldering process. Specifically, the process of forming a solder joint 120 between the chip pad 201 and the solder ball 101 includes a reflow soldering stage and a cooling stage. During the reflow soldering stage, the packaged chip 100 tends to bulge away from the circuit board 200, that is, its geometric center moves away from the circuit board 200, and gradually approaches the surface of the circuit board 200 as it gets closer to the edge of the packaged chip 100. At this time, the second pad 312 provides support for the second region 112 near the edge of the packaged chip 100, suppressing deformation of the packaged chip 100. During the cooling phase, the packaged chip 100 tends to bulge towards the circuit board 200, meaning the geometric center of the packaged chip 100 moves closer to the circuit board 200 and gradually moves away from the surface of the circuit board 200 as it approaches the edge of the packaged chip 100. The first pad 311 provides support for the first region 111 near the geometric center of the packaged chip 100, thereby suppressing deformation of the packaged chip 100. Thus, throughout the entire soldering phase, regardless of the deformation trend of the packaged chip 100, the first pad 311 or the second pad 312 at the corresponding position will provide support, thereby maintaining the structural stability of the packaged chip 100.

[0103] In some embodiments, the first pad 311 and the second pad 312 are both soldered to the surface of the packaged chip 100 near the circuit board 200. By directly fixing the pads 300 (the first pad 311 and the second pad 312) to the surface of the packaged chip 100, the pads 300 and the packaged chip 100 form a rigid whole, which can avoid damage to the support effect due to minor displacement between the circuit board 200 and the pads 300.

[0104] In some embodiments, both the first pad 311 and the second pad 312 are soldered to the surface of the circuit board 200 near the packaged chip 100. Using the circuit board 200 as a carrier for the pads 300 enhances support stability through its rigid structure. For example, during the cooling phase, the first pad 311, being tightly fixed to the circuit board 200, provides a more stable reverse support force, preventing deformation of the packaged chip 100.

[0105] In some embodiments, a first spacer 311 is soldered to the surface of the packaged chip 100 near the circuit board 200; a second spacer 312 is soldered to the surface of the circuit board 200 near the packaged chip 100. Alternatively, the first spacer 311 is soldered to the surface of the circuit board 200 near the packaged chip 100; and the second spacer 312 is soldered to the surface of the packaged chip 100 near the circuit board 200. The first spacer 311 can quickly respond to the deformation trend of the first region of the packaged chip 100, and the second spacer 312 can provide stronger constraint on the edge of the packaged chip 100. In high-temperature operating environments, this effectively disperses the internal stress of the packaged chip 100, reduces fatigue damage to the solder joints 120 caused by uneven stress, and improves the performance of the printed circuit board assembly and the server 1000.

[0106] In other embodiments of this application, the printed circuit board assembly may also provide only the first pad 311 or only the second pad 312 according to the thermal deformation characteristics of different types of packaged chips 100, so as to improve the space utilization of packaged chips 100 or circuit boards 200.

[0107] like Figure 2 As shown, in some embodiments, the printed circuit board assembly can symmetrically distribute a plurality of second pads 312 in the second region 112, that is, in the direction of the reference plane x, the plurality of second pads 312 are centrally symmetrical about the geometric center of the package chip 100.

[0108] exist Figure 2 In the example, there are four second pads 312. The four second pads 312 are distributed in the second area 112 and will not affect the setting of solder balls 101 and chip pads 201, thus reducing the impact on the layout of components on the circuit board 200 and packaged chip 100.

[0109] Figure 8 yes Figure 1 This is another perspective view of the printed circuit board assembly in the server shown. (See diagram below.) Figure 8 As shown, in some embodiments, the printed circuit board assembly can symmetrically distribute a plurality of first pads 311 in a first region 111, that is, in the direction of the reference plane x, the plurality of first pads 311 are centrally symmetrical about the geometric center of the package chip 100.

[0110] exist Figure 8In the example, there are four first pads 311, which are distributed in the first region 111 and can provide support for the first region 111 of the packaged chip 100, thereby improving the structural stability of the packaged chip 100.

[0111] In some examples, the outline of the first pad 311 can be circular. Since the distance from any point on a circle to the center is equal, the area of ​​the first pad 311 on the reference plane x is larger while ensuring the gap between the first pad 311 and the solder joint 120 on the reference plane x. This reduces the difficulty of soldering the first pad 311 to the circuit board 200 or the packaged chip 100.

[0112] In some embodiments, solder balls 101 are not provided at the first pad 311 corresponding to the package chip 100, so that the first pad 311 can directly abut against the package chip 100, avoiding the adverse effect of the melting of the solder balls 101 on the supporting force of the pad.

[0113] Figure 9 yes Figure 1 This is another perspective view of the printed circuit board assembly in the server shown. (See diagram below.) Figure 9 As shown, in some embodiments, the first region 111 includes a dummy area 1111, where no solder joints 120 are provided. The first pad 311 is located within the dummy area 1111, eliminating the need to occupy the area surrounding the circuit board 200 or the packaged chip 100 to set the pad 300. This improves the space utilization of the packaged chip 100 and the circuit board 200, thereby improving the space utilization of the printed circuit board assembly and the server 1000.

[0114] exist Figure 9 In the example, there are 24 first pads 311, with two first pads 311 distributed in the first region 111, which can provide support for the first region 111 of the packaged chip 100 and improve the structural stability of the packaged chip 100.

[0115] In some examples, the first pad 311 can be elongated. Based on the principle that contact area is positively correlated with support stability, the elongated first pad 311 can improve its ability to provide support for the packaged chip 100, thereby improving the structural stability of the packaged chip 100.

[0116] Accordingly, the stencil size at the first pad 311 is also smaller than the stencil size at the chip pad 201, so that the solder (such as solder paste) printed to the first pad 311 is less than the solder paste printed to the chip pad 201.

[0117] In order to prevent the spacer 300 (first spacer 311 or second spacer 312) from affecting the surrounding solder joints 120, in some embodiments, on the plane parallel to the side surface of the circuit board 200 facing the packaged chip 100 (which can be understood as reference plane x), the distance between the spacer 300 and the chip pad 201 or solder ball 101 is greater than or equal to a preset distance.

[0118] The preset spacing can be determined based on actual testing to ensure that the solder plating layer 302 or solder at the gasket 300 does not flow to the surrounding solder joints 120, thus ensuring the safety of the circuit formed at the solder joints 120. This application embodiment does not impose specific limitations on the value of the preset spacing.

[0119] Through the above scheme, during the soldering process of the spacer 300, the solder plating layer 302 or solder melts and flows without flowing to the surrounding chip pads 201 or solder balls 101; during the formation of the solder joint 120, even if the solder plating layer 302 or solder flows slightly due to high temperature, it will not flow to the surrounding chip pads 201 or solder balls 101. Therefore, the distance between the spacer 300 and the chip pads 201 or solder balls 101 is greater than or equal to the preset distance, ensuring that it does not affect the surrounding structure, thereby guaranteeing the performance of the printed circuit board assembly and the server 1000.

[0120] For ease of manufacturing, in some embodiments, the preset spacing is configured as follows: on the side surface of the circuit board 200 facing the packaged chip 100, on a plane parallel to the surface (which can be understood as reference plane x), the pad spacing d1 between adjacent chip pads 201 (see...) Figure 12 or Figure 13 To maintain the space utilization of the circuit board 200 or the packaged chip 100.

[0121] In some embodiments, the pad spacing d1 can be 0.2mm, 0.3mm, 0.4mm or other values. This application does not limit the specific value of the pad spacing d1.

[0122] It should be noted that the pad spacing d1 of the chip pad 201 is determined based on the premise that adjacent solder joints 120 are not affected. Therefore, configuring the preset spacing as the pad spacing d1 ensures that the pad 300 does not affect the surrounding solder joints 120. At the same time, there is no need to test and obtain this preset spacing separately, which simplifies the design process and reduces manufacturing costs.

[0123] In some embodiments, such as Figure 2 or Figure 8As shown, the first pad 311 is positioned at the original solder joint 120. To prevent the first pad 311 from affecting the surrounding solder joints 120, the outline dimension of the first pad 311 on the reference plane x can be configured to be smaller than the outline dimension of the chip pad 201 on the reference plane x. In this way, the distance between the first pad 311 and the chip pad 201 or solder ball 101 is necessarily smaller than the distance between the chip pads 201, thereby achieving a distance greater than a preset distance between the first pad 311 and the chip pad 201 or solder ball 101.

[0124] Accordingly, the stencil size at the first pad 311 is also smaller than the stencil size at the chip pad 201, so that the solder (such as solder paste) printed to the first pad 311 is less than the solder paste printed to the chip pad 201.

[0125] Figure 10 for Figure 2 The schematic diagram of the printed circuit board assembly from another angle shows the relationship between the second pad 312 and the solder ball 101. Figure 11 for Figure 8 or Figure 9 The schematic diagram of the printed circuit board assembly from another angle shows the relationship between the first pad 311 and the solder ball 101. It should be noted that... Figure 10 and Figure 11 The drawing of chip pad 201 and pad 202 is omitted. To facilitate the distinction between the height dimensions of solder ball 101 and pad 300, the height dimension of solder ball 101 is referred to as the first height dimension h1, and the height dimension of pad 300 is referred to as the second height dimension h2.

[0126] like Figure 10 and Figure 11 As shown, since the solder ball 101 will collapse to a certain extent during the formation of the solder joint 120, that is, the distance between the packaged chip 100 and the circuit board 200 facing each other will decrease, in order to avoid the spacer 300 excessively compressing the surface of the packaged chip 100 or the circuit board 200, in some embodiments, before the solder ball 101 is soldered to the chip pad 201, the first height dimension h1 of the solder ball 101 is the first height, and the second height dimension h2 of the spacer 300 is configured as: 0.3 times the first height to 0.9 times the first height (inclusive of the two extreme values), so that after the solder ball 101 collapses, the spacer 300 abuts between the packaged chip 100 and the circuit board 200, ensuring that the spacer 300 will not damage the surface of the packaged chip 100 or the circuit board 200.

[0127] In addition, the second height dimension h2 is configured to be 0.3 times to 0.9 times the first height, supporting the packaged chip 100 to adjust the height of the solder joint between the packaged chip 100 and the circuit board 200, avoiding reliability problems caused by excessive collapse of the solder ball 101 under the gravity of the packaged chip 100, and improving the reliability of forming the solder joint 120.

[0128] It should be noted that if the second height dimension h2 is configured to be less than 0.3 times the first height, the spacer 300 may not be able to effectively abut against the packaged chip 100 and the circuit board 200, thus failing to provide support for the packaged chip 100. Conversely, if the second height dimension h2 is configured to be greater than 0.9 times the first height, the spacer 300 may damage the surface of the packaged chip 100 or the circuit board 200 due to excessive compression, thereby affecting the stability and reliability of the entire package structure. Therefore, configuring the second height dimension h2 to be between 0.3 and 0.9 times the first height ensures that the spacer 300 can effectively abut against the packaged chip 100 to provide support after the solder ball 101 collapses, without damaging the surface of the packaged chip 100 or the circuit board 200.

[0129] It is easy to understand that, based on the collapse characteristics of solder ball 101, the first height dimension h1 of solder ball 101 before collapse in the finished server 1000 can be inferred.

[0130] In some embodiments, the second height dimension h2 can be 0.3 times the first height, 0.56 times the first height, 0.9 times the first height, or the first height. This application does not impose specific limitations on the value of the second height dimension h2.

[0131] In some examples, the second height dimension h2 can be configured to be 0.5 times to 0.8 times the first height (inclusive), further reducing the potential risk of damage to the surface of the packaged chip 100 or circuit board 200 by the spacer 300, while ensuring sufficient support force. It is understood that in applications, the specific value of the second height dimension h2 can be flexibly selected based on factors such as the structural characteristics of the packaged chip 100 and circuit board 200, the degree of collapse of the solder balls 101, and the required support force.

[0132] In order to prevent the spacer 300 (first spacer 311 or second spacer 312) from tipping over during the mounting process, in some embodiments, on the plane (which can be understood as reference plane x) parallel to the side surface of the circuit board 200 facing the packaged chip 100, the side length or diameter of the spacer 300 is greater than or equal to the height dimension of the spacer 300, that is, the second height dimension h2.

[0133] The above solution ensures that the gasket 300 has sufficient stability during the mounting process and is not easily tipped over. In application, the side length or diameter of the gasket 300 can be flexibly determined according to factors such as the specific dimensions and structural characteristics of the packaged chip 100 and the circuit board 200, as well as the required support force, to meet actual application needs.

[0134] Figure 12 for Figure 2 A magnified structural diagram of point A in the diagram. (See diagram below.) Figure 12 As shown, in some embodiments, the outline shape of the gasket 300 (second gasket 312) is rectangular, and the rectangular gasket 300 has a first side length m1 and a second side length m2. Then, the first side length m1 and the second side length m2 are respectively greater than the second height dimension h2.

[0135] Figure 13 for Figure 8 A magnified structural diagram of point B in the diagram. (See diagram below.) Figure 13 As shown, in some embodiments, the outline shape of the gasket 300 (first gasket 311) is circular, and the circular gasket 300 has a diameter m3, which is greater than the second height dimension h2.

[0136] It is understandable that since the second height dimension h2 is greater than or equal to the preset spacing, the side length or diameter of the pad 300 is greater than or equal to the preset spacing.

[0137] In some examples, the preset spacing can be 0.2mm.

[0138] Based on the same concept, this application also provides a packaged chip 100, including a first top surface 11 and a first bottom surface 12 disposed opposite to each other, solder balls 101 and a spacer 300. The solder balls 101 are disposed on the side surface of the first top surface 11 or the first bottom surface 12 facing away from each other; the spacer 300 is disposed together with the solder balls 101 on the first top surface 11 or the first bottom surface 12, and the stiffness of the spacer 300 is configured to be higher than that of the solder balls 101, so as to support the packaged chip 100 when the solder balls 101 collapse.

[0139] It should be noted that the packaged chip 100 corresponds to the aforementioned printed circuit board assembly concept and has the same technical effects as the aforementioned printed circuit board assembly. Technical features and implementation methods not described in this embodiment can be referred to the aforementioned printed circuit board assembly technical solution, and will not be repeated here.

[0140] Based on the same concept, this application embodiment also provides a circuit board 200, including a second top surface 21 and a second bottom surface 22 disposed opposite to each other, a chip pad 201 and a spacer 300. The chip pad 201 is disposed on the side surface of the second top surface 21 facing away from the second bottom surface 22; the spacer 300 is disposed together with the chip pad 201 on the second top surface 21, and the stiffness of the spacer 300 is configured to be higher than that of the chip pad 201, so as to support the packaged chip 100.

[0141] It should be noted that the circuit board 200 corresponds to the aforementioned printed circuit board assembly concept and has the same technical effects as the aforementioned printed circuit board assembly. Technical features and implementation methods not described in this embodiment can be referred to the aforementioned printed circuit board assembly technical solution, and will not be repeated here.

[0142] Based on the same concept, this application also provides a server 1000, including a printed circuit board assembly or packaged chip 100 or circuit board 200 of any of the foregoing embodiments.

[0143] It should be noted that the server 1000 corresponds to the aforementioned printed circuit board assembly concept and has the same technical effects as the aforementioned printed circuit board assembly. Technical features and implementation methods not described in this embodiment can be referred to the aforementioned printed circuit board assembly technical solution, and will not be repeated here.

[0144] The embodiments described above are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made based on the technical solution of this application should be included within the scope of protection of this application.

Claims

1. A printed circuit board assembly, characterized in that, include: The packaged chip has solder balls. The circuit board has chip pads, and the circuit board and the packaged chip are soldered to the solder balls through the chip pads, so that the packaged chip and the circuit board are electrically connected. A spacer, the spacer being located between the packaged chip and the circuit board, with one side soldered to the packaged chip or the circuit board.

2. The printed circuit board assembly according to claim 1, characterized in that, The gasket includes a gasket body and a solder plating layer, wherein the solder plating layer is disposed on the gasket body for soldering to the surface of the packaged chip or the circuit board; The gasket body is soldered to the packaged chip or the circuit board through the solder plating layer.

3. The printed circuit board assembly according to claim 2, characterized in that, The circuit board is used to solder the spacer body, which has a spacer pad. The spacer body is soldered to the circuit board through the solder plating layer and the spacer pad.

4. The printed circuit board assembly according to claim 1, characterized in that, There are multiple spacers, and the multiple spacers are evenly distributed between the packaged chip and the circuit board.

5. The printed circuit board assembly according to claim 4, characterized in that, The plurality of spacers include a first spacer and a second spacer; the packaged chip and the circuit board include a first region and a second region, the second region being located around the first region, and the first region being used to accommodate the chip pads and the solder balls; The first pad is located in the first region, and one side is soldered to the packaged chip or the circuit board; The second pad is located in the second region and has one side soldered to the packaged chip or the circuit board.

6. The printed circuit board assembly according to any one of claims 1 to 5, characterized in that, On a plane parallel to the side surface of the circuit board facing the packaged chip, the distance between the pad and the chip pad or the solder ball is greater than or equal to a preset distance.

7. The printed circuit board assembly according to claim 6, characterized in that, The preset spacing is configured as: the spacing between adjacent chip pads on a plane parallel to the side surface of the circuit board facing the packaged chip.

8. The printed circuit board assembly according to claim 7, characterized in that, On a plane parallel to the side surface of the circuit board facing the packaged chip, the side length or diameter of the spacer is greater than or equal to the height of the spacer.

9. A packaged chip, characterized in that, include: First impression; Solder balls are disposed on the first surface; A gasket, together with the solder ball, is disposed on the first surface, and the stiffness of the gasket is configured to be higher than that of the solder ball.

10. The packaged chip according to claim 9, characterized in that, The height of the solder ball is a first height, and the height of the gasket is configured to be 0.3 times to 0.9 times the first height.

11. A circuit board, characterized in that, include: Second side; Chip pads are located on the second side; A spacer, together with the chip pad, is disposed on the second surface, and the stiffness of the spacer is configured to be higher than that of the chip pad.

12. A server, characterized in that, It includes a printed circuit board assembly according to any one of claims 1 to 8, or a packaged chip according to claim 9 or 10, or a circuit board according to claim 11.

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