A double-sided laminating device for a circuit board

Abstract

This utility model relates to the field of circuit board processing technology, specifically a double-sided bonding device for circuit boards. It includes an operating table and a conveyor table, a rotating table, a front bonding component, and a frame mounted on the operating table. The frame is equipped with loading and unloading devices. The device is characterized by: the frame also housing a back bonding component and two sets of pressure bonding components; and a clamping station is mounted on the rotating table. This double-sided bonding device, through the cooperation of the front bonding component and one set of pressure bonding components, applies adhesive tape to the circuit board, allowing a portion to extend out. Then, the rotating table rotates to the back bonding component. A lifting component lowers a baffle to a certain height, and then the top pushes out, allowing the tape to adhere to the ground. Simultaneously, a pushing component moves a top plate and a top block. The top block pushes an L-shaped plate, and the top plate adheres the tape to the bottom of the circuit board. Thus, double-sided bonding can be completed on a single machine without flipping or moving the circuit board, effectively improving continuity and production line efficiency.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a double-sided bonding device for circuit boards. Background Technology

[0002] In the field of electronics manufacturing, circuit boards are core components of various electronic devices, and the precision of their manufacturing directly affects the performance and quality of the products. Among them, the adhesive application process is a key link in the circuit board production process, undertaking important functions such as version or batch marking, assisting production management, quality traceability, and product identification. Through precise adhesive application, production personnel can quickly and accurately label and classify circuit boards, ensuring the efficient operation of the production process.

[0003] However, traditional circuit board adhesive application technology has significant limitations. Currently, most equipment can only complete the tape application on one side of the circuit board. If the tape application needs to be performed on the other side of the circuit board, the circuit board that has been applied on one side must be flipped over and then reapplied. This process not only seriously reduces the continuity of the production process and greatly extends the production cycle, making it difficult to improve production efficiency, but also causes irreversible damage to the circuit board during the disassembly and flipping process, thereby increasing production costs and affecting product yield. Utility Model Content

[0004] To achieve the above objectives, this utility model provides the following technical solution: a double-sided bonding device for circuit boards, comprising an operating table and a conveyor table, a rotating table, a front bonding component, and a frame mounted on the operating table, wherein the frame is equipped with a loading and unloading device, characterized in that: the frame is also equipped with a back bonding component and two sets of pressure bonding components, and a clamping station is mounted on the rotating table;

[0005] The clamping station includes a clamping table and a base plate. The bottom of the clamping table is slidably connected to multiple sets of L-shaped plates, and an elastic component fixed to the L-shaped plates is installed inside. A baffle that is in contact with the L-shaped plates is slidably connected to the base plate. A lifting component that drives the baffle to rise and fall is also installed on the rotating table.

[0006] The backing assembly includes a support plate and a lower top. A pusher is installed on the support plate. Multiple top plates are fixed on the top surface of the pusher. The head end of the top plate protrudes upward and forms a slope. A top block is fixed at the bottom of the top plate. The top block is L-shaped.

[0007] Furthermore, the lower top includes an ejector cylinder fixed to the frame, and the ejector end of the ejector cylinder is fixed with an ejector plate opposite to the baffle.

[0008] Furthermore, the pushing part includes a slide plate slidably connected to the support plate, and a pushing cylinder installed at the bottom. The piston rod of the pushing cylinder is fixed to a connecting plate fixed to the bottom of the slide plate. An opening is provided on the support plate, and the connecting plate is located in the opening.

[0009] Furthermore, the elastic component includes multiple side posts that are fixed to the corresponding L-shaped plates and are limited to passing through the clamping platform, with an inner spring located inside the clamping platform sleeved on the outer side of the side posts.

[0010] Furthermore, the lifting assembly includes a limiting post that is inserted through the base plate. The top of the limiting post is fixed to the bottom of the baffle. An outer spring is sleeved on the outside of the limiting post, and the baffle slides with the base plate. A rectangular opening is provided on the base plate. A protruding plate that passes through the rectangular opening is fixed on one side of the baffle. A lifting cylinder is installed on the table surface of the operating platform. A lifting plate located above the protruding plate is fixed at the top end of the lifting cylinder.

[0011] Furthermore, the pressure bonding assembly includes a lower top cylinder fixed inside and outside the frame, and a pressure plate is fixed to the top end of the lower top cylinder.

[0012] Furthermore, the piston rod of the lower cylinder is fixed to a lower plate, and two sets of columns, both fixed to the pressure plate, are inserted through the upper limit of the lower plate. A buffer spring located between the lower plate and the pressure plate is sleeved on the outer side of the columns.

[0013] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0014] The double-sided bonding device for this circuit board uses a front bonding component and a set of pressure bonding components to apply adhesive tape to the circuit board, allowing a portion to extend out. Then, the device is rotated by a turntable to the back bonding component. A lifting component lowers a baffle to a certain height, and then the top pushes out to allow the tape to adhere to the ground. At the same time, a pushing component moves a top plate and a top block. The top block pushes an L-shaped plate, and the top plate adheres the tape to the bottom of the circuit board. Thus, double-sided bonding can be completed on a single machine without flipping or moving the circuit board, thereby effectively improving continuity and production line efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a three-dimensional schematic diagram of the clamping station connection structure in this utility model;

[0017] Figure 3 This utility model Figure 2 A three-dimensional diagram of the right side;

[0018] Figure 4 This utility model Figure 3A three-dimensional structural schematic diagram of the right-side cross-section;

[0019] Figure 5 This is a three-dimensional structural diagram of the back-attachment component of this utility model;

[0020] Figure 6 This utility model Figure 5 A rear-view 3D structural diagram;

[0021] Figure 7 This is a three-dimensional structural schematic diagram of the pressure adhesive assembly in this utility model;

[0022] Figure 8 This utility model Figure 6 A three-dimensional schematic diagram of the connection structure of the top plate.

[0023] In the diagram: 1. Operating table; 2. Conveying table; 3. Adhesive pressing assembly; 31. Lower lifting cylinder; 32. Lower top plate; 33. Column; 34. Pressure plate; 35. Buffer spring; 4. Front adhesive assembly; 5. Back adhesive assembly; 52. Support plate; 53. Pushing cylinder; 54. Slide plate; 55. Top plate; 56. Top block; 57. Ejection cylinder; 58. Ejection plate; 59. Connecting plate; 6. Clamping station; 61. Clamping table; 62. Limiting column; 63. Inner spring; 66. Side column; 67. Outer spring; 68. Base plate; 69. Baffle; 610. L-shaped plate; 611. Protruding plate; 612. Lifting cylinder; 613. Lifting plate; 7. Loading and unloading device; 8. Frame; 9. Rotating table. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-7 This embodiment of a double-sided bonding device for a circuit board includes an operating table 1, on which a conveyor table 2, a rotating table 9, and a frame 8 spanning the conveyor table 2 and the rotating table 9 are mounted, as well as a front bonding component 4 located around the rotating table 9. The frame 8 is equipped with a loading and unloading device 7, two sets of adhesive pressing components 3, and a back bonding component 5. The rotating table 9 is equipped with four sets of clamping stations 6, and the two sets of adhesive pressing components 3 are located at the front bonding component 4 and the back bonding component 5, respectively, and are located above the corresponding clamping stations 6.

[0026] In the above structure, the circuit board is loaded by a conveyor and loading / unloading device, clamped and positioned by a clamping station, and then rotated by a rotating table to the front bonding component to work with the pressure bonding component to apply the tape. The rotating table then rotates to the back bonding component, and the back bonding component, together with the pressure bonding component and the clamping station, applies the remaining tape to the back of the circuit board.

[0027] like Figure 2-4 The clamping station 6 includes a clamping plate 61 mounted on a rotating table 9 and a base plate 68 fixed to the bottom of the rotating table 9. Four sets of L-shaped plates 610 slide on the bottom of the clamping plate 61, and a side post 66 fixed to the L-shaped plates 610 is provided on the back side for limiting. An inner spring 63 located inside the clamping plate 61 is sleeved on the outside of the side post 66. A rectangular opening is provided on the base plate 68, and a baffle 69 is slidably connected to the outside of the base plate 68. A protruding plate 611 passing through the rectangular opening is fixed on the back of the baffle 69. A limiting post 62 is provided on the upper limit of the base plate 68. The top of the limiting post 62 is fixed to the bottom of the baffle 69, and an outer spring 67 is sleeved on the outside of the limiting post 62. A lifting cylinder 612 is installed on the operating table 1, and a lifting plate 613 located above the protruding plate 611 is fixed to the piston rod of the lifting cylinder 612.

[0028] The circuit board is clamped and fixed by a clamping platform. Then, the lifting cylinder drives the lifting plate to move, thereby pressing down the protruding plate. This causes the baffle to move down and compress the outer spring. When the protruding plate is no longer under pressure, the elasticity of the outer spring will cause the baffle to return to its original position, exposing part of the L-shaped plate. This makes it easier for the backing assembly to bend the tape and stick it to the side. At the same time, pushing the L-shaped plate compresses the inner spring, exposing part of the bottom of the circuit board. Therefore, the backing assembly can also stick the tape to the bottom of the circuit board. After the tape is stuck, when the L-shaped plate is no longer under pressure, the elasticity of the inner spring will cause the L-shaped plate to return to its original position, thus playing an auxiliary role in backing.

[0029] like Figure 5 , 6 The backing assembly 5 includes a support plate 52 fixed inside the frame 8 and an ejector cylinder 57 mounted above the support plate 52. The piston rod of the ejector cylinder 57 is fixed to an ejector plate 58 opposite to one of the baffles 69. A slide plate 54 slides on the top of the support plate 52. A top plate 55 is fixed on the top of the slide plate 54. A top block 56 is fixed on the bottom of the top plate 55. A push cylinder 53 is installed on the bottom of the support plate 52. An opening is provided on the back of the support plate 52. A connecting plate 59 located in the opening and fixed to the slide plate 54 is fixed on the piston rod of the push cylinder 53. A convex edge is formed at the top of the head end of the top plate 55. A slope is formed on the convex edge. The top block 56 is L-shaped, and the protruding end is longer than the head end of the slide plate 54.

[0030] After the baffle moves down, the ejector cylinder moves the ejector plate down, pressing the excess tape down to adhere to the edge of the circuit board. Then, the cylinder pushes the slide plate out through the connecting plate. First, the top block pushes the L-shaped plate, exposing a part of the bottom of the circuit board. The tape is then adhered to the bottom of the circuit board through the protruding edge on the top plate, thus completing the adhesion of both sides.

[0031] like Figure 7 The adhesive pressing assembly 3 includes a lower-top cylinder 31 fixed to the inner and outer walls of the frame 8. A lower-top plate 32 is fixed to the piston rod of the lower-top cylinder 31. Two sets of uprights 33 are mounted on the lower-top plate 32, and a pressure plate 34 is fixed between the bottoms of the two sets of uprights 33. A buffer spring 35 is mounted on the outer side of the uprights 33. The two pressure plates are located at the positions of the front-facing and back-facing components, respectively, and are also located above two of the clamping stations. The lower-top cylinder sequentially pushes the lower-top plates out, causing them to adhere to the circuit board. This allows for a tighter bond between the adhesive tape and the circuit board. Simultaneously, the pressure between the lower-top plate and the pressure plate cushions the pressure of the buffer spring, preventing damage to the circuit board from excessive downward pressure.

[0032] The working principle of the above embodiments is as follows:

[0033] The conveyor table is responsible for transporting the circuit boards to be processed to the designated position, providing a material flow channel for loading. The loading and unloading device picks up the circuit boards on the conveyor table and transfers them to the clamping station of the rotating table, realizing automated loading. After bonding, the finished product can also be moved away from the clamping station. The clamping station fixes the circuit board to ensure stable position during bonding. The specific actions are as follows:

[0034] Initial state: The inner spring is in its natural extended state, causing the L-shaped plate to adhere to the bottom of the circuit board; the outer spring extends naturally, causing the baffle to be in a high position, blocking one side of the L-shaped plate and adhering to one side of the circuit board for limitation; the rotating table drives the clamping station to rotate, moving the fixed circuit board to the corresponding position of the front-mounting assembly; the front-mounting assembly applies tape to the front of the circuit board; the pressing assembly is located above the clamping station corresponding to the front-mounting assembly, completing the compaction of the front-mounting tape; the lower top cylinder drives the lower top plate to move downward, causing the column and pressure plate to move closer to the circuit board, pressing... After the board contacts the tape, the lower top plate continues to move downwards and compresses the buffer spring. The spring force buffers the pressure, preventing damage to the circuit board and ensuring a tight fit between the tape and the front side. The rotating table continues to rotate, transferring the circuit board with the front side bonded to the corresponding position on the back bonding assembly. The back bonding assembly, clamping station, and pressure bonding assembly work together to complete the back and edge bonding. The lifting cylinder on the operating table activates, driving the lifting plate downwards and pressing down the protruding plate on the bottom plate. The protruding plate moves the baffle downwards, compressing the outer spring and exposing part of the L-shaped plate, allowing the tape to be bent to the desired position. The sides of the circuit board are attached; the push cylinder drives the slide plate to slide along the support plate through the connecting plate. The slide plate drives the top plate and top block to move forward. The L-shaped protrusion of the top block extends beyond the head end of the slide plate. First, it pushes the L-shaped plate backward to compress the inner spring, exposing the bottom of the circuit board. The convex edge of the top plate head moves forward with the slide plate, using the slope to guide the tape to smoothly transition to the bottom of the circuit board, completing the adhesion of the back tape. The protruding design of the L-shaped top block ensures accurate pushing, and the convex edge slope ensures smooth tape adhesion. At the same time, when the top block pushes the L-shaped plate, the L-shaped plate compresses the inner spring and moves backward. The bottom edge of the circuit board is exposed, making it easier to attach the tape to the back side. The adhesive pressing assembly is located above the clamping station corresponding to the back adhesive assembly, and its operation is the same as the front adhesive pressing: the lower cylinder drives the pressure plate to move down, and the pressure is buffered by the buffer spring to press the tape on the back and sides firmly to ensure a firm bond. The rotary table continues to rotate, moving the circuit board with double-sided bonding to the unloading position, where it is removed by the loading and unloading device. At the same time, the new clamping station receives the next circuit board to be processed, and the cycle begins again, thereby improving the continuity of processing and increasing efficiency.

[0035] The entire workflow is now complete, and anything not described in detail in this specification is existing technology known to those skilled in the art.

[0036] It should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A double-sided bonding device for circuit boards, comprising an operating table (1) and a conveyor table (2), a rotating table (9), a bonding assembly (4), and a frame (8) mounted on the operating table (1), wherein a loading and unloading device (7) is mounted on the frame (8), characterized in that: The frame (8) is also equipped with a backing assembly (5) and two sets of pressure bonding assemblies (3), and a clamping station (6) is installed on the rotating table (9); The clamping station (6) includes a clamping table (61) and a base plate (68). The bottom of the clamping table (61) is slidably connected to multiple sets of L-shaped plates (610), and an elastic component fixed to the L-shaped plates (610) is installed inside. A baffle (69) that is in contact with the L-shaped plates (610) is slidably connected on the base plate (68). A lifting component that drives the baffle (69) to rise and fall is also installed on the rotating table (9). The backing assembly (5) includes a support plate (52) and a lower top. A pusher is installed on the support plate (52). Multiple top plates (55) are fixed on the top surface of the pusher. The head end of the top plate (55) protrudes upward and forms a slope. A top block (56) is fixed at the bottom of the top plate (55). The top block (56) is L-shaped.

2. The double-sided bonding device for a circuit board according to claim 1, characterized in that: The lower top includes an ejector cylinder (57) fixed on the frame (8), and the ejector end of the ejector cylinder (57) is fixed with an ejector plate (58) opposite to the baffle (69).

3. The double-sided bonding device for a circuit board according to claim 2, characterized in that: The pushing part includes a slide plate (54) slidably connected to the support plate (52) and a pushing cylinder (53) installed at the bottom. The piston rod of the pushing cylinder (53) is fixed with a connecting plate (59) fixed to the bottom of the slide plate (54). The support plate (52) has an opening, and the connecting plate (59) is located in the opening.

4. The double-sided bonding device for a circuit board according to claim 1, characterized in that: The elastic component includes a plurality of side posts (66) that are fixed to the corresponding L-shaped plates (610) and are limited to the clamping platform (61). An inner spring (63) located inside the clamping platform (61) is sleeved on the outside of the side posts (66).

5. The double-sided bonding device for a circuit board according to claim 4, characterized in that: The lifting assembly includes a limiting post (62) that is inserted through the base plate (68). The top of the limiting post (62) is fixed to the bottom of the baffle (69). An outer spring (67) is sleeved on the outside of the limiting post (62). The baffle (69) slides with the base plate (68). A rectangular opening is provided on the base plate (68). A protruding plate (611) that passes through the rectangular opening is fixed on one side of the baffle (69). A lifting cylinder (612) is installed on the table surface of the operating platform (1). A lifting plate (613) located above the protruding plate (611) is fixed at the ejector end of the lifting cylinder (612).

6. The double-sided bonding device for a circuit board according to claim 1, characterized in that: The pressure bonding assembly (3) includes a lower top cylinder (31) fixed on the inner and outer sides of the frame (8), and a pressure plate (34) is fixed at the top end of the lower top cylinder (31).

7. A double-sided bonding device for a circuit board according to claim 6, characterized in that: The piston rod of the lower cylinder (31) is fixed to the lower plate (32). The lower plate (32) is provided with two sets of columns (33) that are fixed to the pressure plate (34). The outer side of the column (33) is fitted with a buffer spring (35) located between the lower plate (32) and the pressure plate (34).

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