Display device and electronic device

Abstract

This disclosure relates to display devices and electronic devices. The display device includes: a display panel; a substrate film attached to and protecting the display panel; a cover panel attached to the substrate film via an adhesive layer on one side of the substrate film, the side of the substrate film being opposite to the side of the substrate film to which the display panel is attached; and a printed circuit board (PCB) attached to the cover panel via a PCB adhesive between the PCB and the cover panel, the PCB being electrically connected to the display panel via a flexible printed circuit board (FPCB), wherein, in a plan view, a cut-line area is formed around the area of ​​the PCB attached to the cover panel, forming an area larger than the area of ​​the PCB attached to the cover panel.

Description

Technical Field

[0001] This disclosure relates to a display device and an electronic device, and more specifically, to a display device and an electronic device wherein a PCB is attached to a cover panel. Background Technology

[0002] Currently known display devices include liquid crystal display (“LCD”) devices, plasma display panel (“PDP”) devices, organic light-emitting diode (“OLED”) display devices, field emission display (“FED”) devices, electrophoretic display devices, etc.

[0003] Such a display device may include a display area that implements an image and receives power from an external power source to display it in the display area, and a pad area that transmits input signals from the display area to the control unit.

[0004] The display area includes intersecting gate lines and data lines, thin-film transistors (“TFTs”) connected to these lines, and an image implementation layer connected to the TFTs. Furthermore, the pad area includes structures in which gate electrodes extending from the gate lines and data electrodes extending from the data lines are stacked, and flexible printed circuit boards can be connected to exchange electrical signals from an external power source and drive circuitry.

[0005] During the manufacturing of such display devices, when product performance checks are performed after the flexible printed circuit boards (PCBs) are connected, defective products may occasionally be found. To address this, a rework process can be performed to remove the connected PCBs, resolve the issue, and then reconnect the PCBs. Utility Model Content

[0006] According to this disclosure, the purpose is to provide a display device structure that can be easily separated from the cover panel without damaging the cover panel when separating the PCB for rework processes.

[0007] The display device according to an embodiment of the present disclosure includes: a display panel; a substrate film attached to and protecting the display panel; a cover panel attached to the substrate film via an adhesive layer on one side of the substrate film, the side of the substrate film being opposite to the side of the substrate film to which the display panel is attached; and a printed circuit board (“PCB”) attached to the cover panel via a PCB adhesive between the printed circuit board (“PCB”) and the cover panel, wherein the printed circuit board is electrically connected to the display panel via a flexible printed circuit board, wherein, in a plan view, a cut-line area is formed around the area of ​​the PCB attached to the cover panel to be formed as a larger area than the area of ​​the PCB attached to the cover panel.

[0008] The cover panel can be formed from an aluminum (Al) film.

[0009] The boundary line of the cutting line area can be formed as a partially cut dashed line.

[0010] The boundary line of the cut line area can extend along the edge of the PCB in the plane of the PCB.

[0011] The cutting line area can be formed to penetrate the cover panel in the direction in which the cover panel is attached to the substrate film.

[0012] In a plan view, the cut line area can be formed as an area that is 4.5 mm to 5.5 mm larger than the area of ​​the PCB attached to the cover panel in all directions.

[0013] An opening can be defined in the adhesive layer in the area corresponding to the cutting line area.

[0014] The openings in the adhesive layer can have dimensions corresponding to the cutting line area.

[0015] The adhesive layer can be formed such that the adhesive is removed in the area corresponding to the cutting line area.

[0016] The area where the adhesive layer is removed can have a size corresponding to the cutting line area.

[0017] PCB adhesive can be removed after the PCB is removed from the cover panel.

[0018] The cut line area may include at least one rework handle that protrudes outward from the boundary line of the cut line area and is provided to remove the PCB from the cover panel.

[0019] Rework handles can be formed at the corners of the cutting line area.

[0020] The reworked handle can be made of the same material as the cover panel.

[0021] An electronic device according to an embodiment of the present disclosure includes: a display device; and a power supply configured to provide power to the display device. The display device includes: a display panel; a substrate film attached to and protecting the display panel; a cover panel attached to the substrate film via an adhesive layer on one side of the substrate film, the side of the substrate film being opposite to the side of the substrate film to which the display panel is attached; and a printed circuit board (“PCB”) attached to the cover panel via a PCB adhesive between the printed circuit board (“PCB”) and the cover panel, wherein the PCB is electrically connected to the display panel via a flexible printed circuit board, wherein, in a plan view, a cut-line area is formed around the area of ​​the PCB attached to the cover panel to be formed as a larger area than the area of ​​the PCB attached to the cover panel.

[0022] According to embodiments of this disclosure, the PCB can be easily removed from the cover panel during the rework process of the display device.

[0023] In addition, it can prevent damage to the cover panel when removing the PCB.

[0024] In addition, it can improve the operability of rework processes and shorten process time.

[0025] In addition, it can minimize the risk of operator injury during rework. Attached Figure Description

[0026] Figure 1 This is a cross-sectional view of a traditional display device.

[0027] Figure 2 This is a top view of a traditional display device.

[0028] Figure 3 It is a plan view showing the state of a PCB being disassembled during a rework process in a conventional display device.

[0029] Figure 4 This is a plan view of a display device according to an embodiment of the present disclosure.

[0030] Figure 5 This is a plan view showing the state in which the PCB and FPCB are not attached in a display device according to an embodiment of the present disclosure.

[0031] Figure 6 It is along Figure 4 The cross-sectional view taken from line VI-VI.

[0032] Figure 7 This is a plan view showing the state of the PCB being disassembled during a rework process in a display device according to an embodiment of the present disclosure.

[0033] Figure 8 This is a plan view illustrating an embodiment of a display device equipped with a rework handle according to an embodiment of the present disclosure.

[0034] Figure 9 This is a plan view illustrating another embodiment of a display device equipped with a rework handle according to an embodiment of the present disclosure.

[0035] Figure 10 This is a block diagram illustrating an electronic device according to an embodiment. Detailed Implementation

[0036] In the following description, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement the present disclosure. The present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0037] For clarity of this disclosure, parts not related to the description have been omitted, and throughout the specification, the same or similar components are given the same reference numerals.

[0038] Furthermore, for ease of illustration, the dimensions and thicknesses of each component shown in the accompanying drawings are arbitrary, and therefore this disclosure is not necessarily limited to what is shown. In the drawings, thicknesses are magnified to clearly represent the various layers and regions. And in the drawings, the thicknesses of some layers and regions are exaggerated for ease of illustration.

[0039] Furthermore, when a portion of a layer, diaphragm, region, or plate is referred to as being "above" or "on" another portion, this includes not only the case where the portion is "directly above" the other portion, but also the case where another portion exists between the portion and the other portion. In contrast, when an element is referred to as being "directly above" another element, there is no intervening element. Additionally, "above" or "on" a reference portion means located above or below the reference portion, and does not necessarily mean located "above" or "on" the reference portion in a direction opposite to gravity.

[0040] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation on quantity and are intended to include both the singular and the plural. For example, unless the context clearly indicates otherwise, “element” has the same meaning as “at least one element.” “At least one” should not be construed as limiting “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, unless explicitly stated to the contrary, throughout the specification, when a portion is referred to as “comprising” a particular component, this means that said portion may also include other components, rather than excluding other components.

[0041] Figure 1 It is a cross-sectional view of a traditional display device, and Figure 2 This is a top view of a traditional display device. Figure 3 This is a plan view showing the state of a PCB being disassembled during a rework process in a conventional display device. In the following text, reference will be made to... Figures 1 to 3 Describe a conventional display device.

[0042] like Figure 1 and Figure 2As shown, the printed circuit board 5 can be attached to the cover panel 4 using adhesive 6, while the substrate film 2 and the cover panel 4 can be bonded together using adhesive 3. The display panel 1, which is laminated on the substrate film 2, can be connected to the printed circuit board 5 via a flexible printed circuit board (“FPCB”) 7.

[0043] To perform rework, the already connected printed circuit board 5 can be removed. For example... Figure 3 As shown, when separating the printed circuit board 5 from the cover panel 4, separation is not easy due to the strong adhesion of the adhesive 6, and there is a high possibility that the cover panel 4 will be damaged at the area D where the printed circuit board 5 is attached. Furthermore, the pad area or the substrate's stack-up structure may be damaged during the removal of the printed circuit board 5. This hinders the feasibility of rework and causes delays in process time (cycle time).

[0044] In the following text, reference will be made to Figures 4 to 7 A display device according to embodiments of the present disclosure is described.

[0045] Figure 4 This is a plan view of a display device according to an embodiment of the present disclosure. Figure 5 This is a plan view showing the state in which the PCB and FPCB are not attached in a display device according to an embodiment of the present disclosure, and Figure 6 It is along Figure 4 The cross-sectional view is taken along line VI-VI. As used herein, the plan view is a view along the thickness direction (z-direction) of the display device (especially the display panel 50).

[0046] Reference Figures 4 to 6 The display device according to embodiments of the present disclosure includes a substrate film 10, a cover panel 20, a display panel 50, and a printed circuit board (“PCB”) 30.

[0047] The display panel 50 is attached to one side of the substrate film 10, and the cover panel 20 is attached to the opposite side of the substrate film 10. The substrate film 10 can be used to stably support the display panel 50 attached to the substrate film 10 and protect the display panel 50 from impacts, etc. In addition, the substrate film 10 can prevent damage to the display device by providing a certain strength and flatness to the display device.

[0048] The substrate film 10 may be made of or include polyester (e.g., polyethylene terephthalate (“PET”) or polyethylene naphthalate (“PEN”)).

[0049] Cover panel 20 is attached to substrate film 10 via an adhesive layer 15 on the opposite side of substrate film 10, which is opposite to the side to which display panel 50 is attached. Cover panel 20 may be made of aluminum (Al) or a film comprising aluminum (Al). Adhesive layer 15 provides a certain adhesive force for laminating cover panel 20 to substrate film 10.

[0050] PCB 30 is attached to cover panel 20 by PCB adhesive 25 between PCB 30 and cover panel 20, and is electrically connected to display panel 50 by flexible printed circuit board (“FPCB”) 35. PCB 30 may be of rigid type, and multiple driving elements (e.g., integrated circuits (“IC”)) and memory for driving display panel 50 may be mounted on PCB 30.

[0051] The flexible printed circuit board 35 is flexible and can be bent when the PCB 30 is placed under the display panel 50. Multiple flexible printed circuit boards 35 can be provided along the longitudinal direction (x-direction) of the PCB 30 and can be connected to the display panel 50 at multiple locations.

[0052] On the cover panel 20, in a plan view, a cut line area 40 may be formed around the area to which the PCB 30 is attached, to form an area larger than the area to which the PCB 30 is attached.

[0053] like Figure 4 and Figure 5 As shown, the boundary line of the cut line area 40 can be formed as a partially cut dashed line. The boundary line of the cut line area 40 can extend along the edge of the PCB 30 in the plane of the PCB 30. This form can be manufactured by laser cutting or pressure cutting.

[0054] like Figure 4 As shown in the diagram, in the plan view, the cut line area 40 can be formed as a larger area than the area to which the PCB 30 is attached. For example, the cut line area 40 can have a boundary line that is approximately 4.5 mm to 5.5 mm larger than the size of the PCB 30 in the x-direction and / or y-direction. This structure allows the PCB 30 to be smoothly attached to and detached from the cover panel 20 while the cut line area 40 remains attached to the PCB 30. The x-direction, y-direction, and z-direction can be perpendicular to each other.

[0055] In addition, such as Figure 6As shown, the cutting line area 40 can be formed to penetrate the cover panel 20. That is, the boundary line of the cutting line area 40 is formed to penetrate the cover panel 20 in the thickness direction (z direction) of the cover panel 20 and extend to the adhesive layer 15 to form a penetration of the adhesive layer 15.

[0056] In an embodiment, in a plan view, an opening (e.g., a through-hole) may be defined in the adhesive layer 15 within the cut-line region 40. The adhesive layer 15 may be manufactured such that a portion of the adhesive layer 15 within the cut-line region 40 in the plan view can be omitted, and then attached to the substrate film 10. The opening in the adhesive layer 15 may have a size corresponding to the cut-line region 40.

[0057] In another embodiment, the adhesive layer 15 may be manufactured in a form in which a portion of the adhesive layer 15 within the cut line region 40 in a plan view may be non-adhesive, and then attached to the substrate film 10. The area of ​​the adhesive layer 15 where the adhesiveness is removed may have dimensions corresponding to the cut line region 40.

[0058] Figure 7 This is a plan view showing the state of the PCB being disassembled during a rework process in a display device according to an embodiment of the present disclosure.

[0059] Reference Figure 7 When the PCB 30 is removed from the substrate film 10 for rework, the PCB 30 is removed simultaneously with a portion of the cover panel 20 attached within the cut line area 40. This portion of the cover panel 20 within the boundary line of the cut line area 40 is easily separated from the cover panel 20 by appropriate force, and this portion of the cover panel 20, together with the PCB 30, is removed by PCB adhesive 25 (see...). Figure 6 They are bonded and disassembled simultaneously. At this time, the boundary line of the cut line area 40 can be broken by a force less than the adhesive force of the PCB adhesive 25.

[0060] In an embodiment, adhesive layer 15 (see...) Figure 6 The adhesive layer 15 can be formed such that a portion of it within the cut-line area 40 in the planar view is removed. In this embodiment, when the portion of the PCB 30 and the cover panel 20 within the cut-line area 40 is separated together from the substrate film 10, the portion of the PCB 30 and the cover panel 20 can be easily removed without any resistance because a portion of the adhesive layer 15 within the cut-line area 40 in the planar view is removed. In another embodiment, in which the portion of the adhesive layer 15 within the cut-line area 40 in the planar view is not adhesive, the portion of the PCB 30 and the cover panel 20 can be easily separated without resistance from the adhesive force of the adhesive layer 15.

[0061] The adhesive layer 15 in the above form can be manufactured in such a way that the adhesive layer 15 is removed in the cutting line area 40 and then attached to form on the substrate film 10, or the adhesive layer 15 in the above form can be manufactured in such a way that the adhesiveness is removed in the cutting line area 40 and then attached to form on the substrate film 10.

[0062] After the PCB 30 is removed from the cover panel 20, the PCB adhesive 25 between the PCB 30 and the cover panel 20 can be easily removed by the operator's hand or tweezers.

[0063] Figure 8 This is a plan view illustrating an embodiment of a display device equipped with a rework handle according to an embodiment of the present disclosure, and Figure 9 This is a plan view illustrating another embodiment of a display device equipped with a rework handle according to an embodiment of the present disclosure.

[0064] Reference Figure 8 The rework handle 45 can be provided at the boundary line of the cut line area 40 and protrude outward from the boundary line of the cut line area 40. The rework handle 45 can be integrally formed with the cover panel 20 and can be formed of the same material as the cover panel 20.

[0065] Furthermore, the rework handle 45 can be formed at the corner of the dicing area 40, and can be formed to protrude toward the opposite side of the flexible printed circuit board 35. Additionally, the rework handle 45 can be formed continuously with the boundary line of the dicing area 40.

[0066] Reference Figure 9 Rework handles 47 and 49 can be formed in multiples. Rework handles 47 and 49 can be formed at the corners of the cut line area 40 to protrude toward the opposite side of the flexible printed circuit board 35, and can be formed in the cut line area 40 at two corners of the PCB 30.

[0067] Figure 8 and Figure 9 The rework handles 45, 47, and 49 shown are designed to lift off the surface of the cover panel 20, allowing the PCB 30 to be easily removed from the cover panel 20 by using the operator's hand or the like to grasp and lift the rework handles 45, 47, and 49.

[0068] Thus, according to embodiments of this disclosure, the PCB can be easily removed from the cover panel during the rework process of the display device.

[0069] In addition, it can prevent damage to the cover panel when removing the PCB.

[0070] In addition, it can improve the operability of rework processes and shorten process time.

[0071] In addition, it can minimize the risk of operator injury during rework.

[0072] Figure 10 This is a block diagram illustrating an electronic device according to an embodiment.

[0073] Reference Figure 10 In an embodiment, the electronic device 1000 may include a processor 1010, a memory device 1020, a storage device 1030, an input / output (“I / O”) device 1040, a power supply 1050, and a display device 1060. Here, the display device 1060 may correspond to... Figures 4 to 9 The electronic device 1000 may also include multiple ports for communicating with a video card, sound card, memory card, or Universal Serial Bus (“USB”) device. In one embodiment, the electronic device 1000 may be implemented as a television set. In another embodiment, the electronic device 1000 may be implemented as a smartphone. However, the embodiments are not limited thereto; in another embodiment, the electronic device 1000 may be implemented as a cellular phone, video phone, smart tablet, smartwatch, tablet PC (“PC”), car navigation system, computer monitor, laptop computer, or head-mounted display (“HMD”), etc.

[0074] Processor 1010 can perform various computing functions. In embodiments, processor 1010 may be a microprocessor, a central processing unit (“CPU”), or an application processor (“AP”), etc. Processor 1010 may be coupled to other components via address buses, control buses, or data buses, etc. In embodiments, processor 1010 may be coupled to an expansion bus such as a peripheral component interconnect (“PCI”) bus.

[0075] The memory device 1020 can store data for the operation of the electronic device 1000. In embodiments, the memory device 1020 may include at least one non-volatile memory device such as an erasable programmable read-only memory (“EPROM”) device, an electrically erasable programmable read-only memory (“EEPROM”) device, a flash memory device, a phase-change random access memory (“PRAM”) device, a resistive random access memory (“RRAM”) device, a nanofloating gate memory (“NFGM”) device, a polymer random access memory (“PoRAM”) device, a magnetic random access memory (“MRAM”) device, or a ferroelectric random access memory (“FRAM”) device, and / or at least one volatile memory device such as a dynamic random access memory (“DRAM”) device, a static random access memory (“SRAM”) device, or a mobile DRAM device.

[0076] In an embodiment, storage device 1030 may include a solid-state drive (“SSD”) device, a hard disk drive (“HDD”) device, or a read-only optical disc (“CD-ROM”) device, etc. In an embodiment, I / O device 1040 may include input devices such as a keyboard, keypad, mouse device, touchpad, or touch screen, and output devices such as a printer or speaker.

[0077] Power supply 1050 can provide power for the operation of electronic device 1000. Power supply 1050 can also provide power to display device 1060. Display device 1060 can be coupled to other components via a bus or other communication link. In an embodiment, display device 1060 may be included in I / O device 1040.

[0078] Although embodiments of the present disclosure have been described in detail above, the scope of the disclosure is not limited thereto, and various modifications and improvements are possible by those skilled in the art using the basic concept of the disclosure as defined in the appended claims.

Claims

1. A display device, characterized in that, The display device includes: Display panel; A substrate film is attached to the display panel and protects the display panel. A cover panel is attached to the substrate film via an adhesive layer on one side of the substrate film, the side of the substrate film being opposite to the side of the substrate film to which the display panel is attached; and A printed circuit board is attached to the cover panel by a printed circuit board adhesive between the printed circuit board and the cover panel, and the printed circuit board is electrically connected to the display panel via a flexible printed circuit board. In the plan view, the cutting line area is formed around the area where the printed circuit board is attached to the cover panel, and is formed to be a larger area than the area where the printed circuit board is attached to the cover panel.

2. The display device according to claim 1, characterized in that: The cover panel is formed of aluminum film.

3. The display device according to claim 1, characterized in that: The boundary line of the cutting line area is formed as a partially cut dashed line.

4. The display device according to claim 1, characterized in that: The boundary line of the cut line area extends along the edge of the printed circuit board in the plane of the printed circuit board.

5. The display device according to claim 1, characterized in that: The cutting line area is formed to penetrate the cover panel in the direction in which the cover panel is attached to the substrate film.

6. The display device according to claim 1, characterized in that: In the plan view, the cut line area is formed as an area that is 4.5 mm to 5.5 mm larger than the area where the printed circuit board is attached to the cover panel in all directions.

7. The display device according to claim 1, characterized in that: An opening is defined in the adhesive layer in the area corresponding to the cutting line area.

8. The display device according to claim 1, characterized in that: The adhesive layer is formed such that adhesion is removed in the area corresponding to the cutting line area.

9. The display device according to claim 1, characterized in that: The cut line area includes at least one rework handle that protrudes outward from the boundary line of the cut line area and is provided for removing the printed circuit board from the cover panel.

10. An electronic device, characterized in that, The electronic device includes: Display device; and The power supply is configured to provide power to the display device. The display device includes: Display panel; A substrate film is attached to the display panel and protects the display panel. A cover panel is attached to the substrate film via an adhesive layer on one side of the substrate film, the side of the substrate film being opposite to the side of the substrate film to which the display panel is attached; and A printed circuit board is attached to the cover panel by a printed circuit board adhesive between the printed circuit board and the cover panel, and the printed circuit board is electrically connected to the display panel via a flexible printed circuit board. In the plan view, the cutting line area is formed around the area where the printed circuit board is attached to the cover panel, and is formed to be a larger area than the area where the printed circuit board is attached to the cover panel.

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