A heat dissipation device

Abstract

This application relates to the field of heat dissipation technology for electronic devices, specifically to a heat dissipation device. The heat dissipation device includes a heat sink and a fixing assembly. The heat sink includes a top surface disposed along a first direction and a side surface disposed along a second direction. The side surface is disposed around the outer periphery of the top surface. The heat sink also includes a mounting ramp connecting the top surface and the side surface. The fixing assembly is used for mounting on an electronic device. The fixing assembly includes a connecting portion and a fixing portion connected to each other. The fixing portion is detachably mounted on the side surface. The connecting portion is inclined towards the top surface and abuts against the mounting ramp. In the heat dissipation device of this application, a double connection structure is formed between the fixing assembly and the heat sink, resulting in better connection stability. The mounting ramp acts as a guide, making the installation and removal of the fixing assembly smoother.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and specifically to a heat dissipation device. Background Technology

[0002] Electronic devices such as mobile phones, tablets, and laptops generate a significant amount of heat during operation. If this heat is not dissipated in time, the device temperature will rise. Excessive temperature not only affects the device's performance but may also shorten its lifespan. Existing heat dissipation devices primarily reduce device temperature through heat sinks or active cooling. A heat dissipation device generally includes a heat sink component and a mounting component. The mounting component is used to fix the heat sink component to the electronic device or its casing. In some cases, the heat sink component can also be directly fixed to the electronic device or its casing using methods such as magnetic adhesion.

[0003] However, existing heat dissipation devices still have the following problems. First, depending on the electronic device, users may use the heat sink alone or in combination with a mounting component. In the latter case, frequent installation and removal of the mounting component is required, which is cumbersome and inefficient. Second, the connection between the mounting component and the heat sink is not secure enough. Utility Model Content

[0004] This application primarily addresses the problem of inconvenient installation or disassembly of the fixing components and heat sink parts of the heat dissipation device.

[0005] According to a first aspect, one embodiment provides a heat dissipation device, comprising:

[0006] A heat sink includes a top surface, a mounting ramp, and a side surface. The top surface is disposed along a first direction, the mounting ramp surrounds the top surface and is disposed at an inclination, and the side surface is disposed along a second direction and surrounds the end of the mounting ramp away from the top surface.

[0007] A mounting assembly for mounting on an electronic device, the mounting assembly comprising a connecting part and a fixing part connected to each other, the fixing part being detachably mounted on the side, and the connecting part being inclined toward the top surface and abutting against the mounting slope.

[0008] In some embodiments, the side is provided with a first plug-in structure, and the fixing part is a second plug-in structure, with the first plug-in structure correspondingly plugged into the second plug-in structure.

[0009] In some embodiments, the first insertion structure is an insertion hole, and the second insertion structure is an insertion block. The hole wall of the insertion hole and the outer periphery of the insertion block are provided with a limiting protrusion on one side and a limiting groove adapted to the limiting protrusion on the other side.

[0010] In some embodiments, the wall of the insertion hole is provided with a limiting protrusion. The limiting protrusion is telescopically arranged in a direction perpendicular to the axial direction of the insertion hole. In a first position, the limiting protrusion and the limiting groove are spaced apart in a direction perpendicular to the axial direction of the insertion hole. In a second position, the limiting protrusion is located in the limiting groove.

[0011] In some embodiments, the fixing assembly includes a connector, the connector including the fixing portion and the connecting portion, the fixing assembly further includes a fixing arm, the fixing arm being rotatably connected to the side of the connector away from the heat sink, the fixing arm including a clamping portion for clamping the electronic device.

[0012] In some embodiments, the heat dissipation device further includes an elastic element, which is installed between the fixed arm and the connecting member, and the elastic element is used to drive the clamping part to rotate;

[0013] When the clamping part rotates from the third position to the fourth position under the application of external force, the elastic element undergoes elastic deformation;

[0014] When the external force disappears, the elastic element applies a reset driving force to the clamping part to drive the clamping part to rotate from the fourth position to the third position.

[0015] In some embodiments, the fixed arm is rotatably connected to the connector and has a rotation axis. The fixed arm also includes a pressing part, the pressing part and the connector are located on the same side of the rotation axis, and the clamping part is located on the other side of the rotation axis.

[0016] In some embodiments, the fixed arm is rotatably connected to the connector and has a rotation axis. The fixed arm also includes a pressing part, which is rotatably connected to the clamping part. The pressing part has a working position and a storage position during rotation relative to the clamping part.

[0017] In the working position, the pressing part and the connecting part are located on the same side of the rotation axis, and the clamping part is located on the other side of the rotation axis; in the storage position, the pressing part and the clamping part are located on the same side of the rotation axis, and the connecting part is located on the other side of the rotation axis.

[0018] In some embodiments, the pressing part and / or the clamping part are provided with an adsorption member, which is used to adsorb the pressing part into the storage position.

[0019] In some embodiments, the heat sink is further provided with a first conductive structure, a groove is provided on the mounting inclined surface, the first conductive structure is located in the groove, and a clearance hole is provided on the connecting part, with the first conductive structure corresponding to the clearance hole.

[0020] According to the heat dissipation device of the above embodiment, the fixing component includes a fixing part and a connecting part. The fixing part is detachably installed on the side of the heat sink, and the connecting part abuts against the mounting ramp of the heat sink, thus forming a double connection structure between the fixing component and the heat sink. The abutment between the mounting ramp and the connecting part improves the connection stability; at the same time, since the mounting ramp can guide the connecting part, the installation and disassembly process of the fixing component is smoother, and the user only needs to apply force in a specific direction to complete the operation. This structural design ensures both connection strength and ease of operation, effectively solving the problems of inconvenient installation and disassembly of fixing components and unstable connection in the prior art. Attached Figure Description

[0021] Figure 1 This is a perspective view of one embodiment of the heat dissipation device of this application;

[0022] Figure 2 for Figure 1 A partial exploded view of the heat dissipation device in the middle;

[0023] Figure 3 for Figure 1 Top view of the heat dissipation device;

[0024] Figure 4 for Figure 3 Sectional view at point AA;

[0025] Figure 5 for Figure 1 Left view of the central heat dissipation device;

[0026] Figure 6 for Figure 1 A schematic diagram of the structure of the fixing components of the heat dissipation device;

[0027] Figure 7 This is a perspective view of another embodiment of the heat dissipation device of this application;

[0028] Figure 8 for Figure 7 A schematic diagram of the structure of the fixing components of the heat dissipation device;

[0029] Figure 9 for Figure 1 The heat dissipation device is hidden in the lower view of the fixed arm.

[0030] Figure label:

[0031] 100. Heat sink; 110. Housing; 111. Heat dissipation hole; 112. Insertion hole; 1121. Limiting protrusion; 113. Assembly slope; 114. Top surface; 115. Side surface; 120. Heat sink; 130. Fan; 140. Magnetic suction structure; 150. Positioning structure; 160. Second conductive structure; 170. First conductive structure; 180. Thermally conductive silicone; 200. Fixing component; 210. Fixing arm; 211. Clamping part; 212. Pressing part; 220. Connector; 221. Fixing part; 2211. Limiting groove; 222. Connecting part; 2221. Clearance hole; 230. Rotating shaft; 240. Elastic element; 250. Anti-slip pad. Detailed Implementation

[0032] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0033] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0034] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0035] like Figures 1-4 As shown, one embodiment provides a heat dissipation device, including a heat sink 100 and a fixing assembly 200. The heat sink 100 is used to dissipate heat generated by electronic devices. Specifically, the heat sink 100 may have a housing 110, a plurality of heat dissipation holes 111 are provided on the housing 110, and heat sinks 120 and fans 130 are provided inside the housing 110.

[0036] The housing 110 of the heat sink 100 may include a top surface 114, a mounting ramp 113, and a side surface 115. For example... Figure 2 As shown, the top surface 114 is arranged along a first direction, and the mounting slope 113 surrounds the top surface 114 and is inclined. The side surface 115 is arranged along a second direction and surrounds the end of the mounting slope 113 away from the top surface 114. The side surface 115 of the housing 110 may also be provided with a first insertion structure, which may be an insertion hole 112. Both the insertion hole 112 and the mounting slope 113 are used to connect and fix the assembly 200. The mounting slope 113 serves as a guide when installing or removing the fixing assembly 200.

[0037] The fixing component 200 is used for mounting on an electronic device. The fixing component 200 includes a fixing part 221 and a connecting part 222 connected to each other. The fixing part 221 is detachably mounted on the side 115, and the connecting part 222 is inclined towards the top surface 114 and abuts against the mounting inclined surface 113. Specifically, the fixing component 200 includes a fixing arm 210 and a connector 220. The connector 220 has the fixing part 221 and the connecting part 222. The fixing arm 210 is connected to the heat sink 100 through the connector 220 and is used to fix the heat sink 100 to the electronic device or the electronic device housing, such as a mobile phone or a mobile phone housing. The fixing method between the fixing arm 210 and the electronic device can be clamping. Specifically, two fixing components 200 can be provided, with the two fixing components 200 located on both sides of the electronic device, so that the electronic device can be clamped and fixed by the fixing arms 210 on both sides. In other embodiments, the connection method between the fixing component 200 and the electronic device can also be snap-fit.

[0038] The fixing part 221 can be a second plug-in structure adapted to the first plug-in structure, such as a plug-in block. The fixing part 221 is assembled in the plug-in hole 112, and the connecting part 222 abuts against the mounting inclined surface 113. The specific shape of the fixing part 221 can be cylindrical, prismatic, etc., as long as it matches the shape of the plug-in hole 112. For a connector 220, two fixing parts 221 can be provided, and the two fixing parts 221 are arranged at intervals, which makes the connection with the heat sink 100 more secure. In other embodiments, the number of fixing parts 221 can also be one, three, etc.

[0039] During the insertion of the fixing part 221 into the insertion hole 112, the connecting part 222 slides along the mounting slope 113 and finally abuts against the mounting slope 113, with the direction of the abutting force perpendicular to the mounting slope 113. The abutment between the mounting slope 113 and the connecting part 222 improves the stability of the connection; at the same time, since the mounting slope 113 and the insertion hole 112 form an acute angle, it can play a guiding role, making the installation and disassembly process of the fixing component 200 smoother, and the user only needs to apply force in a specific direction to complete the operation. In other embodiments, the fixing part can also be an insertion hole, and correspondingly, an insertion block is provided on the side 115 of the heat sink housing.

[0040] The fixing part 221 is inserted into the insertion hole 112 of the heat sink 100, and the connecting part 222 abuts against the mounting slope 113 of the heat sink 100, thus forming a double connection structure between the fixing component 200 and the heat sink 100. This structural design ensures both connection strength and ease of operation, effectively solving the problems of inconvenient installation and disassembly of the fixing component 200 and unstable connection in the prior art. Users can easily install or remove the fixing component 200 according to their needs.

[0041] In some embodiments, such as Figure 2 , Figure 4 As shown, the wall of the insertion hole 112 is provided with a limiting protrusion 1121. Specifically, an assembly hole is provided inside the insertion hole 112, and the limiting protrusion 1121 is located inside the assembly hole. A limiting groove 2211 that matches the limiting protrusion 1121 is provided on the outer periphery of the fixing part 221. The limiting protrusion 1121 is telescopically oriented in a direction perpendicular to the axial direction of the insertion hole 112. In the first position, the limiting protrusion 1121 and the limiting groove 2211 are spaced apart in a direction perpendicular to the axial direction of the insertion hole 112. In the second position, the limiting protrusion 1121 is located within the limiting groove 2211.

[0042] When the fixing part 221 is inserted into the insertion hole 112, the limiting protrusion 1121 can slide into the limiting groove 2211 to fix the fixing part 221 in the insertion hole 112. When the fixing part 221 is pulled out, the limiting protrusion 1121 can spring back and slide out of the limiting groove 2211. The limiting structure can improve the connection between the connector 220 and the heat sink 100, and at the same time, during the installation of the fixing component 200, the limiting structure can also provide the user with a tactile feel that the installation is in place.

[0043] The insertion hole 112 can be provided on the housing 110 of the heat sink 100. Correspondingly, the limiting protrusion 1121 can be connected to the housing 110 of the heat sink 100 through an elastic element, so that it can extend and retract in a direction perpendicular to the axial direction of the insertion hole 112. The elastic element can be a spring or other structure capable of elastic deformation. Specifically, the limiting protrusion 1121 can be formed by a ball mounted on the housing 110 of the heat sink 100. The structure of the ball is prior art and will not be described in detail here. Alternatively, the limiting protrusion 1121 itself is elastic, in which case it is not necessary to provide an additional elastic element.

[0044] In other embodiments, the wall of the insertion hole 112 is provided with a limiting groove 2211, and the outer periphery of the fixing part 221 is provided with a matching limiting protrusion 1121. The shape and number of the limiting protrusion 1121 and the limiting groove 2211 are not limited here, as long as the limiting effect between the fixing part 221 and the insertion hole 112 can be achieved.

[0045] In some embodiments, such as Figure 2 , Figure 6 As shown, the fixed arm 210 is rotatably connected to the connecting member 220 and has a rotation axis. The fixed arm 210 includes a clamping part 211 and a pressing part 212. The pressing part 212 and the connecting part 222 are located on the same side of the rotation axis, and the clamping part 211 is located on the other side of the rotation axis. An elastic member 240 is also provided between the fixed arm 210 and the connecting member 220. The elastic member 240 is used to drive the clamping part 211 to rotate.

[0046] The clamping part 211 can be understood as a clamping structure on the fixing arm 210. The fixing assembly 200 may also include an anti-slip pad 250, which is fixed to the clamping part 211. The surface of the anti-slip pad 250 may have an uneven structure to increase the friction between the clamping part 211 and the electronic device, making the connection between the fixing arm 210 and the electronic device more secure. The bottom surface of the clamping part 211 may form a support surface, which provides support when a heat dissipation device is placed.

[0047] The fixed arm 210 and the connector 220 can be connected by the pivot 230. Since the pressing part 212 and the clamping part 211 are located on both sides of the rotation axis, when the user uses it, he only needs to press the pressing part 212 on both sides of the heat sink 100 to open the clamping part 211, thereby clamping the electronic device or the electronic device shell.

[0048] The elastic element 240 can be a torsion spring. The connecting member 220 has a protruding mounting shaft, and the rotating shaft 230 passes through the mounting shaft. The mounting shaft is connected to the opening of the fixing arm 210. The middle part of the torsion spring is fitted onto the mounting shaft. One end of the torsion spring is inserted into the fixing hole on the fixing part 221, and the other end of the torsion spring is engaged in the fixing groove of the fixing arm 210. When the clamping part 211 rotates from the third position to the fourth position under the application of external force, the elastic element 240 undergoes elastic deformation. When the external force disappears, the elastic element 240 applies a reset driving force to the clamping part 211 to drive the clamping part 211 to rotate from the fourth position to the third position. Specifically, the third position is the original position of the clamping part 211. At this time, an external force is applied to the pressing part 212, and the clamping part 211 rotates outward counterclockwise to expand. When rotated to the fourth position, it can clamp onto the electronic device or the electronic device housing. After the heat dissipation device 100 is removed from the electronic device or the electronic device housing, the elastic member 240 can apply a reset driving force to the clamping part 211, causing the clamping part 211 to rotate inward and reset to the third position. In other embodiments, the elastic member 240 can also be a tension spring or other structures capable of elastic deformation.

[0049] In some embodiments, such as Figure 7 and Figure 8 As shown, the pressing part 212 is rotatably connected to the clamping part 211, and the pressing part 212 has a working position and a storage position during rotation relative to the clamping part 211. In the working position, the pressing part 212 and the connecting part 222 are located on the same side of the rotation axis, and the clamping part 211 is located on the other side of the rotation axis; in the storage position, the pressing part 212 and the clamping part 211 are located on the same side of the rotation axis, and the connecting part is located on the other side of the rotation axis.

[0050] Figure 8 The pressing part 212 shown is in the retracted position. When the user needs to attach or detach the electronic device, they only need to flip the pressing part 212 upwards and then press the pressing part 212 to open the clamping part 211. When the pressing part 212 is in the retracted position, the space occupied by the fixing component 200 can be reduced, thereby reducing the space occupied by the entire heat dissipation device.

[0051] An adsorption member (not shown in the figure) may also be provided between the pressing part 212 and the clamping part 211. The adsorption member is used to adsorb the pressing part 212 into the storage position. Specifically, the adsorption member can be a magnetic structure 140 or an adhesive structure. Alternatively, a snap-fit ​​structure may be provided between the pressing part 212 and the clamping part 211.

[0052] In other embodiments, the pressing part 212 and the clamping part 211 can also be an integral structure. The integral structure has higher structural strength and is also easier to process and assemble.

[0053] In some embodiments, such as Figure 9 As shown, the heat sink 100, which is attached to one side of the electronic device, is provided with a magnetic attraction structure 140 and a positioning structure 150, with the positioning structure 150 located on the outer periphery of the magnetic attraction structure 140. Specifically, the outermost side of the heat sink 100 near the electronic device is provided with a thermally conductive material, such as thermally conductive silicone 180, which is used to promptly transfer the heat of the electronic device to the heat sink 120. The inner side of the thermally conductive silicone 180 may be provided with a magnetic attraction structure 140, which can be a permanent magnet to facilitate the attraction of the electronic device.

[0054] The positioning structure 150 can be a positioning protrusion. Setting the positioning protrusion can position it with the electronic device or the electronic device housing, further increasing the firmness of the connection between the heat dissipation device and it.

[0055] like Figure 5 As shown, the heat sink 100 may also be provided with a first conductive structure 170. Specifically, a groove is provided on the mounting slope 113, and the first conductive structure 170 is located in the groove. The connecting portion 222 is provided with a clearance hole 2221, and the first conductive structure 170 is provided corresponding to the clearance hole 2221. The clearance hole 2221 is provided to avoid wires connected to the first conductive structure 170. The first conductive structure 170 can be in various forms, such as a USB (Universal Serial Bus) Type-A interface or a USB Type-C interface. The first conductive structure 170 can be used to supply power to the heat sink 100 or to charge the battery inside the heat sink 100. In this embodiment, one side of the heat sink 100 is provided with a USB Type-A interface, and the other side is provided with a USB Type-C interface.

[0056] In some embodiments, such as Figure 9 As shown, the heat sink 100 is attached to one side of the electronic device and has a second conductive structure 160. The second conductive structure 160 includes multiple conductive contacts and can be used to supply power to the heat sink 100. With the second conductive structure 160 installed, the heat sink can operate without an external power supply, making it more convenient for users.

[0057] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A heat dissipation device, characterized in that, include: A heat sink includes a top surface, a mounting ramp, and a side surface. The top surface is disposed along a first direction, the mounting ramp surrounds the top surface and is disposed at an inclination, and the side surface is disposed along a second direction and surrounds the end of the mounting ramp away from the top surface. A mounting assembly for mounting on an electronic device, the mounting assembly comprising a connecting part and a fixing part connected to each other, the fixing part being detachably mounted on the side, and the connecting part being inclined toward the top surface and abutting against the mounting slope.

2. The heat dissipation device according to claim 1, characterized in that, The side is provided with a first plug-in structure, and the fixing part is a second plug-in structure, with the first plug-in structure correspondingly plugged into the second plug-in structure.

3. The heat dissipation device according to claim 2, characterized in that, The first insertion structure is an insertion hole, and the second insertion structure is an insertion block. The wall of the insertion hole and the outer periphery of the insertion block are provided with a limiting protrusion on one side and a limiting groove that matches the limiting protrusion on the other side.

4. The heat dissipation device according to claim 3, characterized in that, The wall of the insertion hole is provided with a limiting protrusion. The limiting protrusion is telescopically arranged in a direction perpendicular to the axial direction of the insertion hole. When the limiting protrusion is in the first position, the limiting protrusion and the limiting groove are spaced apart in a direction perpendicular to the axial direction of the insertion hole. When the limiting protrusion is in the second position, the limiting protrusion is located in the limiting groove.

5. The heat dissipation device according to claim 1, characterized in that, The fixing assembly includes a connector, which includes the fixing part and the connecting part. The fixing assembly also includes a fixing arm, which is rotatably connected to the side of the connector away from the heat sink. The fixing arm includes a clamping part for clamping the electronic device.

6. The heat dissipation device according to claim 5, characterized in that, The heat dissipation device also includes an elastic element, which is installed between the fixed arm and the connecting member, and is used to drive the clamping part to rotate; When the clamping part rotates from the third position to the fourth position under the application of external force, the elastic element undergoes elastic deformation; When the external force disappears, the elastic element applies a reset driving force to the clamping part to drive the clamping part to rotate from the fourth position to the third position.

7. The heat dissipation device according to claim 5, characterized in that, The fixed arm is rotatably connected to the connecting member and has a rotation axis. The fixed arm also includes a pressing part. The pressing part and the connecting part are located on the same side of the rotation axis, and the clamping part is located on the other side of the rotation axis.

8. The heat dissipation device according to claim 5, characterized in that, The fixed arm is rotatably connected to the connector and has a rotation axis. The fixed arm also includes a pressing part, which is rotatably connected to the clamping part. The pressing part has a working position and a storage position during the rotation of the pressing part relative to the clamping part. In the working position, the pressing part and the connecting part are located on the same side of the rotation axis, and the clamping part is located on the other side of the rotation axis; in the storage position, the pressing part and the clamping part are located on the same side of the rotation axis, and the connecting part is located on the other side of the rotation axis.

9. The heat dissipation device according to claim 8, characterized in that, The pressing part and / or the clamping part are provided with an adsorption member, which is used to adsorb the pressing part at the storage position.

10. The heat dissipation device according to any one of claims 1-9, characterized in that, The heat sink is further provided with a first conductive structure, and a groove is provided on the mounting inclined surface. The first conductive structure is located in the groove, and the connecting part is provided with a clearance hole. The first conductive structure is provided in correspondence with the clearance hole.

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