An integrated circuit chip manufacturing ion implantation apparatus

Abstract

The utility model relates to integrated circuit chip manufacturing technical field especially, it relates to a kind of integrated circuit chip manufacturing ion implantation equipment, including table body;The surface of the transmission belt is equipped with multiple sets of limiting components, the limiting component includes four symmetrically distributed L-shaped blocks, the L-shaped block is fixedly installed on the surface of transmission belt, and each group of the limiting component is slidably configured with a supporting plate, multiple placing grooves for placing chip are set on the upper surface of the supporting plate.The multiple sets of limiting components on the surface of transmission belt form stable constraint to the supporting plate, ensure its smooth movement with transmission belt and smooth feeding, improve the stability and convenience of conveying, the placing groove on the supporting plate accurately limits chip, avoid chip displacement, tilt or slide due to vibration, speed change during transmission belt operation, ensure that chip is in preset processing position, lay foundation for high-precision ion implantation.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit chip manufacturing technology, and in particular to an ion implantation device for integrated circuit chip manufacturing. Background Technology

[0002] As a core component of the modern electronic information industry, the precision and stability of the manufacturing process of integrated circuit chips directly determine the performance of electronic devices. Ion implantation, as a key step in the manufacturing process of integrated circuit chips, changes the electrical properties of semiconductor materials by implanting specific ions, thereby realizing the customization of circuit functions. With the continuous improvement of chip integration, higher requirements are placed on the automation level, processing precision and stability of ion implantation equipment.

[0003] Chinese patent CN215069875U discloses an ion implantation device for manufacturing integrated circuit chips. By setting a brake pad on the belt, the tray moves in the direction of the brake pad, which prevents the tray from sliding on the belt. By setting a linear ion gun and working in conjunction with the operation of the ion generator, the integrated circuit chip on the tray is ion implanted in one go when it passes under the linear ion gun.

[0004] The tray in the aforementioned patent document only serves a load-bearing function and does not have a chip positioning or limiting mechanism. When the tray moves, the chip is prone to lateral and longitudinal displacement, tilting or even slipping due to equipment vibration and changes in transmission speed. This can lead to a decrease in ion implantation accuracy, affect chip performance or even scrap the entire batch, and may also cause the chip to collide with equipment components, resulting in chip damage and equipment wear, increasing maintenance costs. Utility Model Content

[0005] The purpose of this invention is to address the following shortcomings in the existing technology: the tray in the existing ion implantation equipment only serves as a support and does not have a chip positioning or limiting mechanism. When the tray moves, the chip is prone to lateral and longitudinal displacement, tilting, or even slipping due to equipment vibration and changes in transmission speed. This can lead to a decrease in ion implantation accuracy, affect chip performance, or even scrap the entire batch. It may also cause the chip to collide with equipment components, resulting in chip damage and equipment wear, increasing maintenance costs. Therefore, this invention proposes an ion implantation equipment for integrated circuit chip manufacturing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An ion implantation device for manufacturing integrated circuit chips includes a platform. Two pairs of mounting blocks are fixedly mounted on the upper surface of the platform. A rotating shaft is horizontally rotatably mounted between each pair of mounting blocks. A transmission roller is fixedly sleeved on the rotating shaft. A transmission belt is wound around the two transmission rollers. An operation box is fixedly mounted on the upper surface of the platform through two support plates. The operation box is located above the transmission belt and has an injection mechanism at its bottom. The transmission belt is driven by a drive assembly.

[0008] The transmission belt surface is provided with multiple sets of limiting components. Each limiting component includes four symmetrically distributed L-shaped blocks. The L-shaped blocks are fixedly installed on the surface of the transmission belt. Each set of limiting components has a sliding support plate. The upper surface of the support plate has multiple placement slots for placing chips.

[0009] Preferably, the injection mechanism includes multiple linear ion guns and an ion generator. The ion generator is fixedly installed inside the operation box, and the multiple linear ion guns are all fixedly installed at the bottom of the operation box with their top ends penetrating into the operation box and connected to the ion generator.

[0010] Preferably, an infrared heating plate is fixedly installed at the bottom of the operation box, and the infrared heating plate is located on one side of the multiple linear ion guns.

[0011] Preferably, the drive assembly includes a stepper motor fixedly mounted on the surface of one of the mounting blocks, the output shaft of the stepper motor passing through the mounting block and fixedly connected to one of the rotating shafts.

[0012] Preferably, the L-shaped block has a horizontal opening on its surface, and the front and rear surfaces of the tray have sliding openings. Each sliding opening consists of two first horizontal openings, two oblique openings, and a second horizontal opening. The two oblique openings are connected to the second horizontal openings and are symmetrically arranged. The two first horizontal openings are connected to the two oblique openings and are located above the second horizontal openings. The positions of the first horizontal openings and the openings correspond. Fixed plates are symmetrically fixedly installed on the upper surface of the platform. Sliding rods are fixedly installed on the sides of the two fixed plates that are close to each other. The two sliding rods are on the same horizontal line as the openings.

[0013] Preferably, the surface of the slide bar, the wall of the through-hole, and the wall of the slide opening are all coated with a smooth coating, which is polytetrafluoroethylene.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] The multiple sets of limiting components on the surface of the transmission belt consist of four symmetrically distributed L-shaped blocks, which can form a stable constraint on the pallet. This ensures that the pallet moves smoothly with the transmission belt and allows for smooth sliding of the pallet during loading and unloading, improving the stability and convenience of the conveying process. The placement slots on the pallet can precisely limit the chip, effectively preventing the chip from shifting laterally or longitudinally, tilting, or slipping due to vibration or speed changes during the operation of the transmission belt. This ensures that the chip is always in the preset processing position, providing a foundation for the high-precision implementation of subsequent ion implantation. Attached Figure Description

[0016] Figure 1 This is a frontal perspective view of an ion implantation device for manufacturing integrated circuit chips according to the present invention.

[0017] Figure 2 This is a three-dimensional back view of an ion implantation device for integrated circuit chip manufacturing proposed in this utility model.

[0018] Figure 3 This is a partial three-dimensional structural diagram of the transmission belt in this utility model;

[0019] Figure 4 This is a partial structural diagram of the pallet in this utility model;

[0020] Figure 5 for Figure 2 Enlarged view of the structure at point A in the middle.

[0021] In the diagram: 1. Platform, 2. Slide rod, 3. Transmission roller, 4. Transmission belt, 5. Control box, 6. L-shaped block, 7. Pallet, 8. Placement slot, 9. Linear ion gun, 10. Infrared heating plate, 11. Stepper motor, 12. Through port, 13. First horizontal port, 14. Slanted port, 15. Second horizontal port. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] The terms used in this utility model, such as "upper", "lower", "left", "right", "middle" and "one", are only for clarity of description and are not intended to limit the scope of implementation of this utility model. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered as within the scope of implementation of this utility model.

[0024] Reference Figures 1-2An ion implantation device for manufacturing integrated circuit chips includes a platform 1. Two pairs of mounting blocks are fixedly mounted on the upper surface of the platform 1. A rotating shaft is horizontally rotatably mounted between each pair of mounting blocks. A transmission roller 3 is fixedly sleeved on the rotating shaft. A transmission belt 4 is wound around the two transmission rollers 3. An operation box 5 is fixedly mounted on the upper surface of the platform 1 through two support plates. The operation box 5 is located above the transmission belt 4 and has an injection mechanism at its bottom. The transmission belt 4 is driven by a drive assembly. The drive assembly includes a stepper motor 11 fixedly mounted on the surface of one of the mounting blocks. The output shaft of the stepper motor 11 passes through the mounting block and is fixedly connected to one of the rotating shafts.

[0025] Reference Figure 3 The transmission belt 4 has multiple sets of limiting components on its surface. The limiting components include four symmetrically distributed L-shaped blocks 6. The L-shaped blocks 6 are fixedly installed on the surface of the transmission belt 4. Each set of limiting components has a sliding support plate 7. The upper surface of the support plate 7 has multiple placement slots 8 for placing chips.

[0026] When using this integrated circuit chip manufacturing ion implantation equipment, the connection status of each component of the equipment must first be checked to ensure that the transmission belt 4 and transmission roller 3 are tightly fitted, the L-shaped blocks 6 are firmly fixed, and the tray 7 can slide smoothly within the limiting components. Then, the integrated circuit chip to be processed is placed into the placement groove 8 on the upper surface of the tray 7. The size of the placement groove 8 matches the chip, which can directly limit the lateral and longitudinal movement of the chip and prevent the chip from shifting during subsequent transportation. At the same time, the tray 7 with a placement groove 8 that matches the chip size can be replaced according to the size of the chip to be processed. Then, the tray 7 is placed in the four L-shaped blocks 6. The four sides of the tray 7 are fitted with the inner sides of the four symmetrically distributed L-shaped blocks 6. The L-shaped blocks 6 form a circumferential limit on the tray 7 to prevent the tray 7 from shifting on the transmission belt 4. Under the action of its own weight, the lower surface of the tray 7 will abut against the surface of the transmission belt 4.

[0027] After the device is started, the stepper motor 11 in the drive assembly starts to work. Its output shaft drives the rotating shaft fixedly connected to it to rotate. The rotating shaft synchronously drives the transmission roller 3 to rotate, thereby causing the transmission belt 4 wound on the two transmission rollers 3 to run in a preset direction.

[0028] As the conveyor belt 4 rotates, the tray 7 is transported to the bottom of the operating box 5. When the tray 7 reaches the bottom of the injection mechanism, the stepper motor 11 can pause operation according to the preset program (or maintain low and uniform speed operation). The injection mechanism starts to work and performs ion implantation on the chip in the placement slot 8 on the tray 7. After the implantation is completed, the stepper motor 11 continues to drive the conveyor belt 4 to sequentially put the trays 7 with unprocessed chips into the bottom of the operating box 5 to achieve continuous processing. The operator can remove the tray 7 that has been removed from the bottom of the operating box 5 from the limiting component, and then take out the processed chip from the multiple placement slots 8 on the surface of the tray 7.

[0029] Throughout the process, the precise control of the stepper motor 11 ensures the conveying accuracy of the transmission belt 4. Combined with the chip positioning limit of the placement slot 8 and the constraint of the L-shaped block 6 on the tray 7, the displacement problem caused by vibration and speed change during chip movement is effectively avoided, ensuring the accuracy and stability of ion implantation.

[0030] Reference Figure 1 The injection mechanism includes multiple linear ion guns 9 and an ion generator. The ion generator is fixedly installed inside the operation box 5. The multiple linear ion guns 9 are all fixedly installed at the bottom of the operation box 5 and their top ends are all inserted into the operation box 5 and connected to the ion generator.

[0031] When the tray 7 containing the chip enters the preset injection area below the operation box 5 under the drive of the conveyor belt 4, the ion generator inside the operation box 5 is activated. The ion generator generates a specific type and dose of ion beam (such as boron ions, phosphorus ions, etc., the specific type can be adjusted by the equipment control system according to the chip process requirements) through a preset program, and delivers the ion beam to multiple linear ion guns 9 connected to it.

[0032] Multiple linear ion guns 9 are fixedly installed in an array at the bottom of the operation box 5. Their arrangement spacing corresponds one-to-one with the distribution position of the slots 8 on the tray 7. After the ion beam enters the linear ion gun 9, it is accelerated to the preset energy by the accelerating electric field. The energy parameters can be adjusted by the control system to meet the ion implantation requirements at different depths. Finally, the ion beam is shot vertically from the nozzle of the linear ion gun 9 to the chip on the tray 7 below.

[0033] Since the beam coverage of the linear ion gun 9 is a linear region and is perfectly aligned with the chip in the placement slot 8, when the tray 7 passes through the injection area at a constant speed with the conveyor belt 4, the ion beam emitted by the linear ion gun 9 can cover the preset injection area of ​​the chip in one go. Ion implantation of the entire chip can be completed without additional movement of the gun body. At the same time, the conveyor belt 4 driven by the stepper motor 11 can precisely control the moving speed of the tray 7 to ensure uniform ion implantation dose and coordinated matching of speed and ion beam intensity, which is guaranteed by the preset parameters of the control system.

[0034] Once the tray 7 has completely passed through the injection area, the ion generator pauses ion output, and the linear ion gun 9 stops firing, waiting for the next tray 7 to enter the injection area before repeating the above process to achieve continuous batch ion implantation operations.

[0035] Reference Figure 2 An infrared heating plate 10 is fixedly installed at the bottom of the operation box 5, and the infrared heating plate 10 is located on one side of the multiple linear ion guns 9.

[0036] When the chip, after ion implantation by the linear ion gun 9, is conveyed by the conveyor belt 4 along the tray 7 to the area directly below the infrared heating plate 10, the infrared heating plate 10 is activated, emitting infrared rays of a specific wavelength to heat the chip. The heating temperature and duration can be preset according to the chip process requirements and controlled by the equipment control system. The chip rapidly heats up under infrared radiation, completing the annealing process, restoring the crystal structure and activating the electrical properties. After the tray 7 leaves the heating area, the infrared heating plate 10 remains in standby mode, repeating the heating process after the next batch of chips enters, thus realizing continuous ion implantation and annealing, and improving the speed of integrated circuit chip manufacturing.

[0037] Reference Figures 4-5 The L-shaped block 6 has a horizontal opening 12 on its surface. The front and rear surfaces of the support plate 7 have sliding openings. The sliding openings are composed of two first horizontal openings 13, two oblique openings 14 and a second horizontal opening 15. The two oblique openings 14 are connected to the second horizontal openings 15 and are symmetrically arranged. The two first horizontal openings 13 are connected to the two oblique openings 14 respectively and are located above the second horizontal openings 15. The positions of the first horizontal openings 13 and the openings 12 correspond. Fixed plates are symmetrically fixedly installed on the upper surface of the platform 1. Sliding rods 2 are fixedly installed on the side of the two fixed plates that are close to each other. The two sliding rods 2 are on the same horizontal line as the openings 12.

[0038] When the tray 7 moves along the direction of rotation with the conveyor belt 4, its lower surface is in close contact with the surface of the conveyor belt 4. At this time, the sliding openings on the front and rear surfaces of the tray 7 are in the initial position and have not contacted the sliding rod 2. When the chip in the slot 8 on the tray 7 completes the ion implantation and annealing process and continues to move with the conveyor belt 4 to the preset material picking area, the sliding rod 2 on the upper surface of the platform 1 first passes through the through-hole 12 on the surface of the L-shaped block 6. Since the through-hole 12 corresponds to the position of the first horizontal opening 13 and the sliding rod 2 and the through-hole 12 are on the same horizontal line, the sliding rod 2 will enter the first horizontal opening 13 of the tray 7.

[0039] As the drive belt 4 continues to drive, the pallet 7 continues to move, and the slide rod 2 slides along the first horizontal opening 13 to the entrance of the inclined opening 14. Since the inclined opening 14 is set at an angle upward and is connected to the second horizontal opening 15, the slide rod 2 will generate an upward lifting force on the pallet 7 under the guidance of the inclined opening 14. During this process, the pallet 7 is gradually lifted, and its lower surface separates from the surface of the drive belt 4 and is no longer driven by the friction of the drive belt 4.

[0040] When the slide bar 2 slides to the connection between the inclined opening 14 and the second horizontal opening 15, the support plate 7 has completely moved up to the height of being separated from the transmission belt 4. At this time, the support plate 7 maintains a stable position only through the cooperation between the slide bar 2 and the sliding opening.

[0041] Previously, when picking up the pallet 7, since the pallet 7 was in contact with the transmission belt 4, there was no space for the palm to pick it up at the bottom. It was necessary to push the side wall of the pallet 7 to move it up gradually until it was separated from the transmission belt 4 before it could be picked up by hand. The process was cumbersome and laborious. In the current structure, the pallet 7 can move up automatically through the cooperation of the sliding rod 2 and the sliding mouth. After the lower surface is completely separated from the transmission belt 4, the bottom forms a sufficient operating space. The operator can directly hold the bottom of the pallet 7 or hold the sides to easily take it out from the limiting component without additional force to push it, which greatly simplifies the material picking process.

[0042] The surface of the slide rod 2, the wall of the through 12, and the wall of the slide are all coated with a smooth coating. The smooth coating is polytetrafluoroethylene (PTFE). PTFE can reduce the friction between the surface of the slide rod 2 and the contact surfaces of the through 12 and the wall of the slide, thus preventing the slide rod 2 from getting stuck.

[0043] In this invention, the multiple sets of limiting components on the surface of the transmission belt 4 consist of four symmetrically distributed L-shaped blocks 6, which can form a stable constraint on the pallet 7. This ensures that the pallet 7 moves smoothly with the transmission belt 4 and allows for smooth sliding of the pallet 7 during loading and unloading, improving the stability and convenience of the conveying process. Through the placement groove 8 opened on the pallet 7, the chip can be precisely positioned, effectively preventing the chip from shifting laterally or longitudinally, tilting, or slipping due to vibration, speed changes, etc. during the operation of the transmission belt 4. This ensures that the chip is always in the preset processing position, providing a foundation for the high-precision implementation of subsequent ion implantation.

[0044] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "connection", "linking", "fixing", etc., should be interpreted broadly.

[0045] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An integrated circuit chip manufacturing ion implantation apparatus comprising a table body (1), characterized in that Two pairs of mounting blocks are fixedly installed on the upper surface of the platform (1). A rotating shaft is horizontally rotatably installed between each pair of mounting blocks. A transmission roller (3) is fixedly sleeved on the rotating shaft. A transmission belt (4) is wound on the two transmission rollers (3). An operation box (5) is fixedly installed on the upper surface of the platform (1) through two support plates. The operation box (5) is located above the transmission belt (4) and has an injection mechanism at the bottom. The transmission belt (4) is provided with driving force for operation through a drive assembly. The transmission belt (4) has multiple sets of limiting components on its surface. The limiting components include four L-shaped blocks (6) that are symmetrically distributed. The L-shaped blocks (6) are fixedly installed on the surface of the transmission belt (4). Each set of limiting components has a sliding tray (7) inside it. The upper surface of the tray (7) has multiple placement slots (8) for placing chips.

2. An integrated circuit chip manufacturing ion implantation apparatus according to claim 1, wherein The injection mechanism includes multiple linear ion guns (9) and an ion generator. The ion generator is fixedly installed inside the operation box (5). The multiple linear ion guns (9) are all fixedly installed at the bottom of the operation box (5) and their top ends are all inserted into the operation box (5) and connected to the ion generator.

3. An integrated circuit chip manufacturing ion implantation apparatus according to claim 2, wherein An infrared heating plate (10) is fixedly installed at the bottom of the operation box (5), and the infrared heating plate (10) is located on one side of multiple linear ion guns (9).

4. The integrated circuit chip manufacturing ion implantation apparatus according to claim 1, wherein The drive assembly includes a stepper motor (11) fixedly mounted on the surface of one of the mounting blocks, the output shaft of the stepper motor (11) passing through the mounting block and fixedly connected to one of the rotating shafts.

5. The integrated circuit chip manufacturing ion implantation apparatus according to claim 1, wherein The L-shaped block (6) has a horizontal opening (12) on its surface. The front and rear surfaces of the support plate (7) have sliding openings. The sliding opening consists of two first horizontal openings (13), two oblique openings (14), and a second horizontal opening (15). The two oblique openings (14) are connected to the second horizontal openings (15) and are symmetrically arranged. The two first horizontal openings (13) are connected to the two oblique openings (14) respectively and are located above the second horizontal openings (15). The positions of the first horizontal openings (13) and the openings (12) correspond. The upper surface of the platform (1) is symmetrically fixed with fixed plates. The sides of the two fixed plates that are close to each other are fixed with sliding rods (2). The two sliding rods (2) are on the same horizontal line as the openings (12).

6. An integrated circuit chip manufacturing ion implantation apparatus according to claim 5, wherein The surface of the slide bar (2), the wall of the opening (12) and the wall of the slide are all coated with a smooth coating, which is polytetrafluoroethylene.

Images