Chuck transfer mechanism

Abstract

This application relates to a chuck handling mechanism, comprising: a multi-axis moving module, a telescopic module, and a chuck positioning structure. The telescopic module is disposed on the moving end of the multi-axis moving module, and the chuck positioning structure is disposed on the output end of the telescopic module. This application uses the chuck positioning structure to fix the chuck, then the multi-axis moving module drives the chuck positioning structure to move to the side of the inlet / outlet end of the test chamber. The telescopic module is then activated to send the chuck into the test chamber and place it on the test platform inside the test chamber to align with the test source meter, facilitating wafer testing via a probe card. During the transfer process, the telescopic module drives the chuck positioning structure, which holds the chuck, to send the chuck into the test chamber. Support plates on both sides provide corresponding support, thereby improving stability during the insertion into the test chamber and preventing problems such as misalignment or structural deformation due to the heavy weight of the chuck, effectively improving overall transfer efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a chuck transport mechanism. Background Technology

[0002] A wafer is an important material in the semiconductor manufacturing process; it is a very thin circular piece. During semiconductor production and processing, wafers in chucks need to be inspected using probe cards. This is typically done by placing the chuck in a high-temperature environment for aging tests and applying high current and high voltage to the probe cards. This high voltage current acts on the wafer to determine the maximum voltage the chip can withstand without breakdown or damage, thus providing a basis for the chip's rated voltage.

[0003] In the existing technology, when it is necessary to perform corresponding aging and functional tests on wafers, the wafers are generally placed in a chuck, and the chuck is sent to the test machine by manual means or by a transfer device to carry out the corresponding test work.

[0004] However, due to the heavy weight of the chuck, manual handling alone places a significant burden on operators and can easily lead to injury. While using a transfer device can reduce the burden of manual handling, the chuck's overall weight and the limited space of the test chamber mean that directly inserting the chuck into the test chamber via the transfer device can cause the front end to bend and deform under stress, affecting subsequent transfer operations. Therefore, traditional transfer devices can only move the chuck to the entrance / exit near the testing machine, and then manually insert it into the test chamber. Although this combination of manual and mechanical transfer effectively saves manpower, the action of moving the chuck into the test chamber still poses a risk of injury to the operator. Utility Model Content

[0005] This application provides a chuck handling mechanism to solve the existing technical problem that the heavy weight of the chuck can easily cause the front end of the transfer device to bend and deform under stress, thereby affecting subsequent transfer and handling operations.

[0006] In a first aspect, this application provides a chuck handling mechanism, comprising: a multi-axis moving module, a telescopic module, and a chuck positioning structure, wherein the telescopic module is disposed on the moving end of the multi-axis moving module, and the chuck positioning structure is disposed on the output end of the telescopic module, wherein:

[0007] Multi-axis motion module, used to drive the telescopic module to move;

[0008] The chuck positioning structure allows for the movable fixation of the chuck.

[0009] The telescopic module is used to send the chuck positioning structure into the test chamber. Support plates are provided on both sides that are in contact with the bottom edge of the chuck positioning structure or the chuck.

[0010] Furthermore, the chuck positioning structure is a gripper cylinder, and the edge of the chuck is provided with clamping holes corresponding to the gripper cylinder.

[0011] Furthermore, the chuck positioning structure is a carrier plate, and the carrier plate is provided with a placement position, in which the chuck is movably positioned.

[0012] Furthermore, the chuck positioning structure is U-shaped, and the placement position is located at the bottom of the slot of the U-shaped structure.

[0013] Furthermore, a pusher cylinder is provided at the end of the carrier plate away from the test cavity, and the output end of the pusher cylinder faces the test cavity.

[0014] Furthermore, the telescopic module includes: a module base plate, a telescopic drive mechanism, and a telescopic transmission mechanism. The telescopic drive mechanism is disposed on one end of the module base plate away from the test cavity. The telescopic transmission mechanism is connected to the output end of the telescopic drive mechanism for transmission. The moving end of the telescopic transmission mechanism is connected to the bottom surface of the chuck positioning structure. The support plates are disposed on both sides of the module base plate.

[0015] Furthermore, a buffer mechanism is provided on the moving end of the telescopic transmission mechanism. The buffer mechanism includes: a connecting base plate, a buffer guide rail, a buffer slider, a buffer seat, and a fixed seat. The connecting base plate is disposed on the moving end of the telescopic transmission mechanism. The buffer guide rail is distributed on the connecting base plate along the direction of movement of the moving end of the telescopic transmission mechanism. The buffer slider is mounted on the buffer guide rail and is connected to the bottom of the buffer seat. The fixed seat is disposed on the end of the connecting base plate away from the test cavity. A buffer reset component is provided between the fixed seat and the buffer seat. The buffer seat is connected to the bottom surface of the chuck positioning structure.

[0016] Furthermore, a guiding mechanism is provided on the outer side of the supporting plate. The guiding mechanism includes a guide strip, a guide wheel, and a guide block. The guide strip is provided on the outer side of the supporting plate. The guide wheel is equidistantly distributed on the guide strip. The guide block is provided on the end of the guide strip facing the test cavity. The inner side of the end of the guide block facing the test cavity is an inclined surface. The straight section of the inner side of the guide block is spatially tangent to the cylindrical surface of the guide wheel.

[0017] Furthermore, the multi-axis moving module includes: a linear moving module and a lifting module, wherein the lifting module is disposed on the moving end of the linear moving module and the telescopic module is disposed on the moving end of the lifting module.

[0018] Furthermore, the multi-axis moving module also includes a rotating module, which is disposed on the moving end of the lifting module, and the telescopic module is disposed on the moving end of the rotating module.

[0019] The technical solutions provided in this application have the following advantages compared with the prior art:

[0020] This application uses a chuck positioning structure to fix the chuck. Then, a multi-axis moving module drives a telescopic module and the chuck positioning structure to move to the side of the inlet / outlet end of the test chamber. The telescopic module is then activated to send the chuck into the test chamber and place it on the test platform inside the test chamber to align with the test source meter, facilitating the testing of the wafer in the chuck via the test platform. During the transfer and transportation process, the telescopic module drives the chuck positioning structure containing the chuck to send the chuck into the test chamber, with corresponding support provided by the support plates on both sides. This improves the stability during the process of sending the chuck into the test chamber and avoids problems such as misalignment or structural deformation caused by the weight of the chuck, effectively improving the overall transfer and transportation efficiency. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0024] Figure 1 This is a schematic diagram of a chuck transport mechanism provided in an embodiment of this application.

[0025] Figure 2 This is a schematic diagram of the telescopic module.

[0026] Figure 3 This is a schematic diagram of an embodiment without a chuck.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Multi-axis moving module; 11. Linear moving module; 12. Lifting module; 13. Rotating module; 2. Telescopic module; 21. Support plate; 22. Module base plate; 23. Telescopic drive mechanism; 24. Telescopic transmission mechanism; 25. Buffer mechanism; 251. Connecting base plate; 252. Buffer guide rail; 253. Buffer slider; 254. Buffer seat; 255. Fixed seat; 256. Buffer reset component; 26. Guide mechanism; 261. Guide bar; 262. Guide wheel; 263. Guide block; 3. Chuck positioning structure; 4. Chuck. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0031] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0032] To address the existing technical problem that the heavy weight of the chuck can easily cause the front end of the transfer device to bend and deform under stress, thus affecting subsequent transfer and handling operations, this application provides a chuck handling mechanism that can provide corresponding support through the support plates on both sides, thereby improving the stability during the process of sending it into the test cavity, avoiding problems such as misalignment or structural deformation caused by the heavy weight of the chuck, and effectively improving the overall transfer and transportation efficiency.

[0033] Please see Figure 1 , Figure 2 ,as well as Figure 3 This application provides a chuck handling mechanism, including: a multi-axis moving module 1, a telescopic module 2, and a chuck positioning structure 3. The telescopic module 2 is disposed on the moving end of the multi-axis moving module 1, and the chuck positioning structure 3 is disposed on the output end of the telescopic module 2, wherein:

[0034] Multi-axis moving module 1 is used to drive telescopic module 2 to move;

[0035] The chuck positioning structure 3 is used to fix the chuck 4 in a movable manner.

[0036] The telescopic module 2 is used to send the chuck positioning structure 3 into the test chamber, and has support plates 21 on both sides that are in contact with the bottom edge of the chuck positioning structure 3 or the chuck 4.

[0037] Before transfer and handling, the chuck positioning structure 3 on the telescopic module 2 is transported to the loading station of the chuck 4 via the multi-axis moving module 1, so that the chuck 4 can be placed in the corresponding position of the chuck positioning structure 3 and fixed by the chuck positioning structure 3. At this time, the chuck 4 contains the wafer to be tested, and a probe card is set in the chuck 4. The probe card contacts the wafer and makes an electrical connection with the wafer through the probes on the probe card. Then, the multi-axis moving module 1 drives the telescopic module 2 and the chuck positioning structure 3 to move to the side of the entrance and exit end of the test cavity, so that the height position of the chuck 4 corresponds to the entrance and exit end of the test cavity. The telescopic module 2 is activated, transporting the chuck positioning structure 3 towards the test cavity, thereby sending the chuck 4 into the test cavity. The chuck positioning structure 3 places the chuck 4 on the test table in the test cavity and aligns it with the test source meter, so that the test table can complete the testing of the wafer in the chuck 4.

[0038] In some embodiments, the chuck positioning structure 3 is a gripper cylinder, and the edge of the chuck 4 is provided with clamping holes corresponding to the gripper cylinder. In some optional embodiments, a gripper cylinder is used as the chuck positioning structure 3. When the gripper cylinder is activated, the two front grippers retract inward, thereby embedding the front end of the grippers into the clamping holes to clamp and fix the chuck 4. At the same time, when placing the chuck 4, the bottom edges on both sides of the chuck 4 contact the support plate 21, thereby providing support for the chuck 4. As a result, during the process of sending the chuck 4 into the test chamber by the telescopic module 2, the support plate 21 ensures that the chuck 4 is always kept at the height position corresponding to the test chamber. This avoids the chuck 4 being too heavy and tilting forward before being sent into the test chamber, thus affecting the sending effect, or the telescopic module 2 being too heavy and bending and deforming due to the low strength of the front end of the telescopic module 2 during the forward transport of the chuck 4. This effectively ensures the stability of the transfer and transport process.

[0039] In some embodiments, the chuck positioning structure 3 is a carrier plate with placement positions, and the chuck 4 is movably disposed in the placement positions. As another optional embodiment, a carrier plate is used as the chuck positioning structure 3, and corresponding placement positions are provided on the chuck positioning structure 3 to facilitate the placement and fixation of the chuck 4 in the placement positions of the chuck positioning structure 3. In this embodiment, the bottom edges on both sides of the carrier plate contact the supporting upright plate 21, thereby providing support for the carrier plate through the supporting upright plate 21. Then, the carrier plate is moved by the telescopic module 2 to send the chuck 4 into the test chamber, allowing the chuck 4 to move onto the test stage. The chuck 4 is then detached from the placement positions on the carrier plate, leaving the chuck 4 on the test stage for testing of the wafer in the chuck 4. After the chuck 4 is detached from the carrier plate, the carrier plate is removed from the test chamber by the telescopic module 2 to facilitate the transfer and transportation of other chucks 4.

[0040] In some embodiments, the chuck positioning structure 3 is U-shaped, and the placement position is located at the bottom of the slot of the U-shaped structure.

[0041] The U-shaped carrier plate chuck positioning structure 3 can, after the telescopic module 2 drives the chuck positioning structure 3 to send the chuck 4 into the test chamber, and when the telescopic module 2 drives the chuck positioning structure 3 to move outward, the chuck 4 gradually separates from the chuck positioning structure 3 through the opening of the U-shaped structure, thus achieving the effect of leaving the chuck 4 in the test chamber and connecting it with the test stage.

[0042] In some embodiments, a pusher cylinder is provided at the end of the carrier plate away from the test chamber, with the output end of the pusher cylinder facing the test chamber. The output end of the pusher cylinder makes movable contact with the edge of the chuck 4. Due to the limited internal space of the test chamber, it is difficult to directly move the chuck 4 to the position corresponding to the test stage via the carrier plate, and it is also inconvenient to detach the chuck 4 from the carrier plate. By using a pusher cylinder, when the telescopic module 2 moves the carrier plate into the test chamber and reaches its limit position, the pusher cylinder is activated, and the piston rod of the pusher cylinder pushes the chuck 4 away from its placement position, causing the chuck 4 to separate from the carrier plate along the opening direction of the U-shaped structure.

[0043] In some embodiments, the telescopic module 2 includes: a module base plate 22, a telescopic drive mechanism 23, and a telescopic transmission mechanism 24. The telescopic drive mechanism 23 is disposed on one end of the module base plate 22 away from the test cavity. The telescopic transmission mechanism 24 is connected to the output end of the telescopic drive mechanism 23 for transmission. The moving end of the telescopic transmission mechanism 24 is connected to the bottom surface of the chuck positioning structure 3. The support plate 21 is disposed on both sides of the module base plate 22.

[0044] In the embodiments provided in this application, the telescopic transmission mechanism 24 adopts a lead screw transmission mechanism, and the telescopic drive mechanism 23 adopts a servo motor. The servo motor drives the lead screw of the lead screw transmission mechanism to rotate, thereby driving the lead screw slider sleeved on the lead screw to reciprocate along the lead screw. The lead screw slider is connected to the bottom surface of the chuck positioning structure 3, so that the rotation of the lead screw drives the lead screw slider to drive the chuck positioning structure 3 to translate.

[0045] During operation, the servo motor of the telescopic drive mechanism 23 is activated, driving the lead screw of the telescopic transmission mechanism 24 to rotate. This causes the lead screw slider mounted on the lead screw to translate along the direction of the lead screw, thereby moving the chuck positioning structure 3 and feeding the chuck 4 onto the chuck positioning structure 3 into the test chamber. Reversing the activation of the telescopic drive mechanism 23 causes the lead screw to rotate in the opposite direction, thereby moving the chuck positioning structure 3 away from the test chamber via the lead screw slider, thus separating the chuck positioning structure 3 from the chuck 4.

[0046] In some embodiments, a buffer mechanism 25 is provided on the moving end of the telescopic transmission mechanism 24. The buffer mechanism 25 includes: a connecting base plate 251, a buffer guide rail 252, a buffer slider 253, a buffer seat 254, and a fixed seat 255. The connecting base plate 251 is disposed on the moving end of the telescopic transmission mechanism 24. The buffer guide rail 252 is distributed on the connecting base plate 251 along the direction of movement of the moving end of the telescopic transmission mechanism 24. The buffer slider 253 is mounted on the buffer guide rail 252 and is connected to the bottom of the buffer seat 254. The fixed seat 255 is disposed on the connecting base plate 251 at the end away from the test cavity. A buffer reset member 256 is provided between the fixed seat 255 and the buffer seat 254. The buffer seat 254 is connected to the bottom surface of the chuck positioning structure 3. In the embodiments provided in this application, the buffer reset member 256 is a spring.

[0047] When the telescopic module 2 drives the chuck positioning structure 3 to send the chuck 4 into the test chamber, the size of the chuck positioning structure 3 or the chuck 4 may cause collisions or compression between them and the inner wall of the test chamber, leading to damage to the chuck 4, the chuck positioning structure 3, or the test chamber. In the embodiment provided in this application, a buffer mechanism 25 is provided on the moving end of the telescopic module 2. When the chuck positioning structure 3 or the chuck 4 comes into contact with the inner wall of the test chamber, if the telescopic module 2 continues to drive the chuck positioning structure 3 forward, it will push the buffer slider 253 along the buffer guide rail 252 toward the fixed seat 255, causing the spring between the buffer seat 254 and the fixed seat 255 to compress. This disperses the external force applied to the chuck positioning structure 3 or the chuck 4, achieving a buffering effect and preventing rigid collisions between the chuck positioning structure 3 or the chuck 4 and the inner wall of the test chamber, effectively improving the safety of the overall structure. Meanwhile, when the external force applied to the chuck 4 or the chuck positioning structure 3 is removed, the buffer seat 254 is reset under the elastic action of the spring to meet the requirements of normal chuck 4 transfer and placement.

[0048] In some embodiments, a guide mechanism 26 is provided on the outer side of the support plate 21. The guide mechanism 26 includes a guide bar 261, guide wheels 262, and guide blocks 263. The guide bar 261 is disposed on the outer side of the support plate 21, the guide wheels 262 are equidistantly distributed on the guide bar 261, and the guide blocks 263 are disposed on the end of the guide bar 261 facing the test cavity. The inner side of the end of the guide block 263 facing the test cavity is inclined, and the straight section of the inner side of the guide block 263 is spatially tangent to the cylindrical surface of the guide wheel 262. When the telescopic module 2 moves the chuck positioning structure 3 or the chuck 4, both sides of the chuck positioning structure 3 or the chuck 4 contact the guide wheels 262 of the guide mechanisms 26 on both sides, providing a guiding effect for the feeding of the chuck 4 through the guide wheels 262. This ensures that the chuck 4 maintains a stable feeding position during the transportation process of the telescopic module 2, ensuring the connection effect between the chuck 4 and the test table.

[0049] After the wafer testing is completed via the probe card, the telescopic module 2 restarts, sending the chuck positioning structure 3 into the test chamber and fixing the chuck 4 before removing it from the test chamber. During the removal process, the inclined surfaces of the guide blocks 263 on both sides provide guidance for the chuck 4 or the chuck positioning structure 3, allowing the chuck 4 to stably enter the telescopic module 2, avoiding collisions or misalignment, effectively improving the stability during the transfer process, and ensuring a constant position for each delivery and insertion.

[0050] In some embodiments, the multi-axis moving module 1 includes a linear moving module 11 and a lifting module 12. The lifting module 12 is disposed on the moving end of the linear moving module 11, and the telescopic module 2 is disposed on the moving end of the lifting module 12. The linear moving module 11 can move the telescopic module 2 to the side of the corresponding test chamber, and the lifting module 12 can adjust the height position so that the height position of the chuck 4 on the chuck positioning structure 3 corresponds to the inlet and outlet height of the test chamber, thus meeting the transfer and transportation requirements of the chuck 4.

[0051] In some embodiments, the multi-axis moving module 1 further includes a rotating module 13, which is disposed on the moving end of the lifting module 12, and the telescopic module 2 is disposed on the moving end of the rotating module 13.

[0052] Testing wafers using probe cards is time-consuming, typically taking several hours to several days, resulting in a long overall processing and testing time. To improve overall processing and testing efficiency, multiple testing machines can be installed within the movement range of the multi-axis moving module 1. Since this arrangement causes the inlet and outlet directions of the testing chamber to be perpendicular to the feeding direction of the linear moving module 11, a rotating module 13 is installed at the moving end of the lifting module 12 to change the feeding direction of the telescopic module 2, facilitating the insertion of the chuck 4 into the testing chamber for the corresponding testing operations.

[0053] This application uses a chuck positioning structure 3 to fix the chuck 4. Then, the multi-axis moving module 1 drives the telescopic module 2 and the chuck positioning structure 3 to move to the side of the inlet / outlet end of the test chamber. The telescopic module 2 is activated to send the chuck 4 into the test chamber and place the chuck 4 on the test table inside the test chamber to align with the test source table, so that the wafer in the chuck 4 can be tested through the test table. During the transfer and transportation process, the telescopic module 2 drives the chuck positioning structure 3, which holds the chuck 4, to send the chuck 4 into the test chamber. The support plates 21 on both sides provide corresponding support, thereby improving the stability during the process of sending the chuck 4 into the test chamber and avoiding problems such as misalignment or structural deformation caused by the weight of the chuck 4, effectively improving the overall transfer and transportation efficiency.

[0054] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0055] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0056] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0057] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0058] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0059] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0060] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0061] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chuck transport mechanism, characterized in that, include: The system includes a multi-axis moving module, a telescopic module, and a chuck positioning structure. The telescopic module is mounted on the moving end of the multi-axis moving module, and the chuck positioning structure is mounted on the output end of the telescopic module. Multi-axis motion module, used to drive the telescopic module to move; The chuck positioning structure allows for the movable fixation of the chuck. The telescopic module is used to send the chuck positioning structure into the test chamber. Support plates are provided on both sides that are in contact with the bottom edge of the chuck positioning structure or the chuck.

2. The chuck transport mechanism according to claim 1, characterized in that, The chuck positioning structure is a gripper cylinder, and the edge of the chuck is provided with clamping holes corresponding to the gripper cylinder.

3. The chuck transport mechanism according to claim 1, characterized in that, The chuck positioning structure is a carrier plate, and the carrier plate is provided with a placement position, in which the chuck is movably positioned.

4. The chuck transport mechanism according to claim 3, characterized in that, The chuck positioning structure is U-shaped, and the placement position is located at the bottom of the slot of the U-shaped structure.

5. The chuck transport mechanism according to claim 4, characterized in that, A pusher cylinder is provided at the end of the carrier plate away from the test chamber, and the output end of the pusher cylinder faces the test chamber.

6. The chuck transport mechanism according to claim 1, characterized in that, The telescopic module includes: a module base plate, a telescopic drive mechanism, and a telescopic transmission mechanism. The telescopic drive mechanism is located at one end of the module base plate away from the test cavity. The telescopic transmission mechanism is connected to the output end of the telescopic drive mechanism for transmission. The moving end of the telescopic transmission mechanism is connected to the bottom surface of the chuck positioning structure. The support plates are located on both sides of the module base plate.

7. The chuck transport mechanism according to claim 6, characterized in that, A buffer mechanism is provided on the moving end of the telescopic transmission mechanism. The buffer mechanism includes a connecting base plate, a buffer guide rail, a buffer slider, a buffer seat, and a fixed seat. The connecting base plate is provided on the moving end of the telescopic transmission mechanism. The buffer guide rail is distributed on the connecting base plate along the direction of movement of the moving end of the telescopic transmission mechanism. The buffer slider is mounted on the buffer guide rail and is connected to the bottom of the buffer seat. The fixed seat is provided on the end of the connecting base plate away from the test cavity. A buffer reset component is provided between the fixed seat and the buffer seat. The buffer seat is connected to the bottom surface of the chuck positioning structure.

8. The chuck transport mechanism according to any one of claims 1 to 7, characterized in that, A guiding mechanism is provided on the outer side of the supporting plate. The guiding mechanism includes a guide strip, a guide wheel, and a guide block. The guide strip is provided on the outer side of the supporting plate. The guide wheel is equidistantly distributed on the guide strip. The guide block is provided on the end of the guide strip facing the test cavity. The inner side of the end of the guide block facing the test cavity is an inclined surface. The straight section of the inner side of the guide block is spatially tangent to the cylindrical surface of the guide wheel.

9. The chuck transport mechanism according to claim 1, characterized in that, The multi-axis moving module includes a linear moving module and a lifting module, wherein the lifting module is disposed on the moving end of the linear moving module and the telescopic module is disposed on the moving end of the lifting module.

10. The chuck transport mechanism according to claim 9, characterized in that, The multi-axis moving module also includes a rotating module, which is disposed on the moving end of the lifting module, and the telescopic module is disposed on the moving end of the rotating module.

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