A glue-filling mold and packaging device

Abstract

The utility model discloses a kind of glue pouring mould and packaging device, the glue pouring mould is made of flexible material, the glue pouring mould includes bottom plate and fence, the fence is connected at the periphery of the bottom plate, to form forming cavity between the two, the forming cavity is used to place display module and accommodate the packaging glue to be solidified on the surface of the display module.Glue pouring mould is made of flexible material, and packaging glue and glue pouring mould are not bonded connection, so set, when packaging glue is solidified in forming cavity, staff can conveniently dismantle glue pouring mould from display surface, and display module is not easy to damage.

Description

Technical Field

[0001] This utility model relates to the field of display module technology, and in particular to a potting mold and packaging device. Background Technology

[0002] In related technologies, to form a protective layer on the surface of the display module, the display module is typically placed inside the fixture cavity of a metal jig, and then encapsulating adhesive is poured into the fixture cavity. After the encapsulating adhesive solidifies, the operator removes the encapsulated display module from the metal jig. However, when removing the encapsulated display module from the fixture cavity, the operator may apply excessive force, causing damage to the display module. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a potting mold and a packaging device, which facilitates the separation of the packaged display module and ensures the safety of the display module.

[0004] In a first aspect, embodiments of this application provide a potting mold made of a flexible material. The potting mold includes a base plate and a surrounding plate, with the surrounding plate connected around the base plate to form a molding cavity for placing a display module and for accommodating encapsulating adhesive to be solidified on the surface of the display module.

[0005] According to some embodiments of the present invention, the base plate is provided with a support protrusion, which is used to support the display module so that the display module and the base plate form a gap.

[0006] According to some embodiments of the present invention, a plurality of strip-shaped protrusions are arranged side by side on the base plate, the strip-shaped protrusions are used to be inserted into the strip-shaped through holes of the display module, and the support protrusions are located between adjacent strip-shaped protrusions.

[0007] According to some embodiments of the present invention, the supporting protrusion is cylindrical.

[0008] According to some embodiments of the present invention, the supporting protrusion is set lower than the strip protrusion, and the strip protrusion is set lower than the surrounding plate.

[0009] According to some embodiments of the present invention, the potting mold is made of silicone material.

[0010] According to some embodiments of the present invention, the base plate is provided with a relief groove, which is used to accommodate the connector on the back side of the display module.

[0011] According to some embodiments of the present invention, the back of the base plate is provided with a thickened portion, and the clearance groove extends at least partially to the thickened portion.

[0012] According to some embodiments of this utility model, the hardness of the potting mold is set between 50A and 80A.

[0013] Secondly, this application discloses an encapsulation device, including the aforementioned potting mold.

[0014] As can be seen from the above technical solutions, the embodiments of this application have the following advantages: the potting mold is made of flexible material, and the encapsulating glue is not bonded to the potting mold. With this setting, after the encapsulating glue solidifies in the molding cavity, the staff can easily remove the potting mold from the display surface without easily damaging the display module, thus ensuring the safety of the display module. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the display module and the potting mold according to an embodiment of the present utility model;

[0016] Figure 2 for Figure 1 Enlarged schematic diagram of region A in the middle;

[0017] Figure 3 This is a schematic diagram of the back structure of the display module and the potting mold in an embodiment of this utility model.

[0018] The meanings of the reference numerals in the attached figures are as follows:

[0019] Packaging device 10;

[0020] 100. Glue potting mold; 110. Base plate; 120. Enclosure plate; 130. Molding cavity; 140. Strip protrusion; 150. Support protrusion; 160. Thickened part; 161. Relief groove; 200. Display module; 210. LED bead; 220. Strip through hole; 220. Connector; 300. Positioning fixture; 310. Positioning cavity. Detailed Implementation

[0021] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0022] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, up, down, etc., indicating the directional or positional relationship, are based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0024] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0025] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0026] The present invention will now be described in further detail with reference to the accompanying drawings.

[0027] Please see Figures 1 to 2 This invention provides a potting mold 100 made of flexible material. The potting mold 100 includes a base plate 110 and a surrounding plate 120. The surrounding plate 120 is connected to the perimeter of the base plate 110 to form a molding cavity 130 for placing a display module 200 and for accommodating encapsulating adhesive to be solidified on the surface of the display module 200.

[0028] In practical applications, the potting mold 100 typically requires a matching positioning fixture 300, which has a positioning cavity for placing the potting mold 100. Specifically, the potting mold 100 is placed in the positioning cavity of the positioning fixture 300, and the display module 200 is placed in the molding cavity 130 of the potting mold 100. After the display module 200 is placed in the molding cavity 130, the operator pours encapsulating adhesive into the molding cavity 130 again. The encapsulating adhesive needs to submerge the upper surface of the display module 200 and the pins of the LED beads 210, and may partially or not submerge the surface of the LED beads 210. After the encapsulating adhesive solidifies, it completes the encapsulation of the display module 200, thus obtaining the desired display module 200. Then, the operator removes the encapsulated display module 200 from the potting mold 100.

[0029] Understandably, the potting mold 100 is made of a flexible material, and the encapsulating adhesive is not bonded to the potting mold 100. This design allows for easy removal of the potting mold 100 from the display module 200 after the encapsulating adhesive has solidified in the molding cavity 130, minimizing the risk of damage to the display module 200. The positioning fixture 300 can be made of a material with a certain degree of hardness. When the potting mold 100 is placed in the positioning cavity, the positioning fixture 300 can maintain the shape of the potting mold 100, thus ensuring that the display module 200 can be placed flat within the molding cavity 130. Therefore, the encapsulating adhesive can be cured flatly on both sides of the display module 200, resulting in a relatively flat display module 200 after encapsulation.

[0030] In some embodiments, please refer to Figures 1 to 2 The bottom of the molding cavity 130 is provided with a support protrusion 150, which is cylindrical, but not limited to a cylindrical shape. The height of the support protrusion 150 is set between 3mm and 20mm, depending on the actual required encapsulation thickness. The support protrusion 150 is used to support the display module 200, so that a gap is formed between the display module 200 and the bottom of the molding cavity 130.

[0031] This configuration, through the support protrusion 150, supports the display module 200 upwards when it is placed in the molding cavity 130, thus maintaining a certain distance between the display module 200 and the bottom of the molding cavity 130. This prevents some of the encapsulating adhesive from being squeezed onto the upper side of the display module 200 when it is placed in the molding cavity 130. Therefore, the lower side of the display module 200 has a sufficient amount of encapsulating adhesive to form a sufficiently thick encapsulating adhesive layer, thereby effectively encapsulating the back side of the display module 200.

[0032] In some embodiments, please refer to Figures 1 to 2 The bottom of the molding cavity 130 has multiple strip-shaped protrusions 140 arranged in parallel, i.e., the strip-shaped protrusions 140 are arranged in parallel. The strip-shaped protrusions 140 are used to insert into the strip-shaped through holes 220 of the display module 200, and the support protrusions 150 are located between adjacent strip-shaped protrusions 140. Specifically, the display module 200 has strip-shaped through holes 220 arranged in parallel. When the display module 200 is placed in the molding cavity 130, the strip-shaped protrusions 140 fill the strip-shaped through holes 220. With this arrangement, the encapsulating adhesive will not fill the strip-shaped through holes 220 when it solidifies, so that the display module 200 retains the original strip-shaped through holes 220 for use as a transparent display module 200.

[0033] In some embodiments, please refer to Figures 1 to 2 The potting mold 100 is made of silicone material. It is understood that by using silicone, the potting mold 100 possesses a certain degree of elasticity and hardness, making it less prone to breakage and able to withstand certain pressure and impact forces, thus reducing the likelihood of damage from external forces in practical applications. Furthermore, silicone remains stable over a wide temperature range, generally allowing for long-term use from -40℃ to 230℃, and can withstand even higher temperatures for short periods.

[0034] Furthermore, the encapsulating adhesive is made of epoxy resin, and the potting mold 100 is made of silicone material; the two do not adhere to each other and can solidify naturally. When the encapsulating adhesive is in a cured state, the display module 200 can be easily separated from the potting mold 100.

[0035] Furthermore, the hardness of the potting mold 100200 is set between 50A and 80A. For example, the hardness of the potting mold 100 is set at 50A, 55A, 60A, 65A, 70A, 75A, or 80A. It is understood that a suitable hardness setting for the potting mold 100 is one where the hardness is less than or equal to 80A. This setting provides the potting mold 100 with a certain degree of flexibility, allowing workers to easily remove the display module 200 from its molding cavity 130 using its deformability. Alternatively, a hardness greater than or equal to 50A provides the potting mold 100 with sufficient rigidity to support the encapsulating adhesive and the display module 200, thereby ensuring a relatively smooth encapsulating adhesive layer solidifies on both sides of the display module 200.

[0036] In some embodiments, please refer to Figures 1 to 3The base plate 110 is provided with a thickened part 160, and the bottom of the molding cavity 130 is provided with a relief groove 161 located in the thickened part 160. When the display module 200 is placed in the molding cavity 130, the relief groove 161 is used to accommodate the connector 220 on the back of the display module 200.

[0037] It is understood that the base plate 110 is provided with a thickened portion 160, the bottom of the molding fixture is provided with a relief groove 161 located in the thickened portion 160, and the back of the circuit board is provided with a connector 220 embedded in the relief groove 161. It is understood that, through the thickened portion 160, the potting mold 100 can provide a relief groove 161 of sufficient depth to accommodate the connector 220; simultaneously, the connector 220 being located within the relief groove 161 effectively prevents encapsulating adhesive from entering the connector 220.

[0038] This application discloses an encapsulation device 10, which includes the aforementioned potting mold 100.

[0039] Understandably, please refer to Figure 1 and Figure 3 The encapsulation device 10 includes the aforementioned potting mold 100 and positioning fixture 300. The potting mold 100 is made of a flexible material, and the encapsulating adhesive is not bonded to it. This design allows for easy removal of the potting mold 100 from the display module 200 after the encapsulating adhesive has solidified in the molding cavity 130, minimizing the risk of damage to the display module 200. The positioning fixture 300 can be made of a material with a certain degree of hardness. When the potting mold 100 is placed in the positioning cavity, the positioning fixture 300 maintains the shape of the potting mold 100, thus ensuring that the display module 200 can be placed flat within the molding cavity 130. Therefore, the encapsulating adhesive can be cured flatly on both sides of the display module 200, resulting in a relatively flat encapsulated display module 200.

[0040] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A dispensing mold, characterized in that, The potting mold is made of a flexible material and includes a base plate and a surrounding plate. The surrounding plate is connected around the base plate to form a molding cavity between the two. The molding cavity is used to place the display module and to contain the encapsulating adhesive to be solidified on the surface of the display module.

2. The dispensing mold according to claim 1, characterized in that, The base plate is provided with a support protrusion, which is used to support the display module so that the display module and the base plate are spaced apart.

3. The dispensing mold according to claim 2, characterized in that, The base plate has multiple strip-shaped protrusions arranged side by side. The strip-shaped protrusions are used to be inserted into the strip-shaped through holes of the display module, and the support protrusions are located between adjacent strip-shaped protrusions.

4. The potting mold according to claim 2, characterized in that, The support protrusion is cylindrical in shape.

5. The dispensing mold according to claim 3, characterized in that, The supporting protrusion is positioned lower than the strip protrusion, and the strip protrusion is positioned lower than the surrounding panel.

6. The dispensing mold according to claim 1, characterized in that, The potting mold is made of silicone material.

7. The potting mold according to claim 1, characterized in that, The base plate is provided with a relief groove, which is used to accommodate the connector on the back side of the display module.

8. The potting mold according to claim 7, characterized in that, The back of the base plate is provided with a thickened portion, and the clearance groove extends at least partially to the thickened portion.

9. The potting mold according to any one of claims 1 to 8, characterized in that, The hardness of the potting mold is set between 50A and 80A.

10. A packaging device, characterized in that, The potting mold includes any one of claims 1 to 9.

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