A heat sink for high power computing chips

Abstract

The utility model relates to a kind of radiator for high-power computing chip, comprising: fixed cover plate, shunt plate, heat dissipation cold plate, cover plate top surface is equipped with a pair of working medium flow port, cover plate bottom surface is equipped with cover plate recess between heat dissipation cold plate, shunt plate is equipped in cover plate recess;Shunt plate is equipped with hollow heat exchange recess, and it is also equipped with shunt recess and current collection recess respectively located the opposite ends of heat exchange recess on the same side, heat exchange recess is equipped with several parallel interval arrangement and sequentially head-to-tail connection strip block, the part of adjacent two strip blocks is also connected with heat exchange recess side wall, so that adjacent two strip blocks form the shunt flow channel with opening towards shunt recess, or the current collection flow channel with opening towards current collection recess;Heat dissipation cold plate is arranged with microstructure rib for strengthening heat exchange corresponding with heat exchange recess.Compared with prior art, the utility model is innovated by flow channel optimization and modular structure, solves the problem of traditional heat dissipation technology, such as low efficiency, unstable flow, complex processing, etc., realizes high-efficiency heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, and in particular to a heat sink for high-power computing chips. Background Technology

[0002] High-power computing chips generate a significant amount of heat during operation. If this heat cannot be dissipated effectively and promptly, the chip temperature will rise sharply, affecting its performance stability and lifespan. Traditional heat dissipation technologies, such as air cooling and simple liquid cooling solutions, are insufficient for high power density scenarios, exhibiting problems such as high thermal resistance, low heat dissipation efficiency, and uneven temperature distribution.

[0003] While existing microchannel heat sinks can improve heat dissipation efficiency, their simple flow channel design makes them prone to flow separation and excessive pressure drop, and their complex manufacturing process makes it difficult to balance efficient heat dissipation with structural stability. Therefore, there is a need to develop a new type of heat sink that can achieve a high-efficiency heat dissipation solution with stable flow, low thermal resistance, and simple manufacturing under high pressure differential conditions. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a heat sink for high-power computing chips.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] The technical solution of this utility model is to provide a heat sink for a high-power computing chip, comprising: a fixed cover plate, a current distribution plate, and a heat dissipation plate.

[0007] The top surface of the cover plate is provided with a pair of working fluid flow ports, which serve as the working fluid inlet and working fluid outlet of the radiator, respectively. A cover plate cavity is provided between the bottom surface of the cover plate and the heat dissipation plate as a heat dissipation space, and a flow divider is provided in the cover plate cavity.

[0008] The flow divider plate has a hollowed-out heat exchange cavity, and on the same side, there are also a flow divider cavity and a flow collector cavity located at opposite ends of the heat exchange cavity. The flow divider cavity is connected to the working fluid inlet, and the flow collector cavity is connected to the working fluid outlet.

[0009] The heat exchange cavity is provided with several strips arranged in parallel and spaced apart and connected end to end in sequence. The part of the connection between two adjacent strips is also connected to the side wall of the heat exchange cavity, so that two adjacent strips form a flow channel with the opening facing the flow distribution cavity, or a flow channel with the opening facing the flow collection cavity.

[0010] After the working fluid flows into the diversion cavity through the working fluid inlet, it flows into the heat exchange cavity through the diversion channel to exchange heat, then flows into the collection cavity through the collection channel, and finally flows out through the working fluid outlet.

[0011] The heat dissipation plate is provided with microstructure fins that correspond to the heat exchange cavity and are used to enhance heat exchange.

[0012] In some specific embodiments, the diversion channel and the collection channel are arranged adjacent to each other.

[0013] In some specific embodiments, the structure of the strip includes a multi-segment structure, a tangent structure, a cotangent structure, a sine structure, and a cosine structure.

[0014] In some specific embodiments, when the strip has a multi-segment structure, the strip includes three segments, each with lengths L1, L3, and L2, and at least one of L1, L2, and L3 is not zero. Half the width of the flow channel opening is defined as W1, and half the width of the closed end of the flow channel is defined as W2. The included angles between two adjacent segments are θ1 and θ2, respectively.

[0015] When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure.

[0016] When W1 and W2 are not equal and are not zero, and L1 and L2 are both zero, the flow channel is a trapezoidal structure.

[0017] When W2 is 0, the flow channel has a pointed nozzle shape.

[0018] When W2 is 0, and L1 and L2 are both 0, the flow channel has a triangular structure.

[0019] When all parameters are not zero and the included angles θ1 and θ2 are right angles, the flow channel has a convex-like structure.

[0020] When the strip structure is a tangential or cotangential structure, the distance from the center line of the strip to the center line of the flow channel is defined as E, the total length of the flow channel is L4, and the amplitude of the tangential or cotangential structure is A.

[0021] When the block structure is a sine or cosine structure, the distance from the center line of the block to the center line of the flow channel is defined as F, the total length of the flow channel is L5, the amplitude of the sine / cosine is value B, and the wavelength of the sine or cosine is λ.

[0022] In some specific embodiments, a second gasket for sealing is also provided between the diverter plate and the fixed cover plate.

[0023] In some specific embodiments, a first shim for adjusting the assembly gap is provided between the heat exchange cavity of the flow divider plate and the heat dissipation plate.

[0024] In some specific embodiments, the microstructure ribs include a plurality of rib capillary structures, and the thickness ratio of the rib capillary structures is ≥0.

[0025] When the thickness of the capillary structure in the microstructure rib is 0%, the microstructure rib is a completely solid rib.

[0026] When the thickness of the capillary structure in the microstructure rib is 100%, the microstructure rib is composed of a completely porous capillary structure.

[0027] In some specific embodiments, the heat dissipation plate has a multi-layer capillary structure on the side surface where the microstructure ribs are provided, and the number of layers of the capillary structure on the bottom surface of the ribs is ≥0.

[0028] When the number of capillary layers on the bottom surface of the rib is 0, the surface of the heat dissipation plate on the side with the microstructure rib is a smooth surface.

[0029] In some specific embodiments, the connection between the heat dissipation plate, the diversion plate, and the fixed cover plate is by threaded connection, snap-fit, riveting, or welding.

[0030] In some specific embodiments, the radiator further includes a pair of radiator connectors, each connected to a pair of working fluid flow ports.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] (1) The flow distribution channel and flow collection channel of this application can be designed in various shapes, which can guide the fluid to achieve laminar flow transition, effectively reduce the risk of flow separation, and also enable the fluid kinetic energy to be converted smoothly. This design helps to improve the flow stability of the microchannel heat sink under high pressure differential conditions and reduce chip junction temperature fluctuations.

[0033] (2) The flow channel shape can be customized into rectangle, trapezoid, pointed, triangular, convex, tangent / cotangent structure or sine / cosine structure to meet different heat dissipation requirements;

[0034] (3) The proportion and number of capillary structures of the microstructure fins are adjustable, and the phase change heat dissipation capability is enhanced through the porous capillary structure.

[0035] (4) The heat sink of this application reduces the complexity of processing heat dissipation plates, while also making phase change heat dissipation technology more efficient and improving the overall performance of the heat sink. Attached Figure Description

[0036] Figure 1 This is an exploded view of the overall structure of the heat sink welding method according to an embodiment of this application.

[0037] Figure 2 This is a heat sink package diagram of an embodiment of this application.

[0038] Figure 3 This is a schematic diagram of the top surface structure of the heat dissipation plate according to an embodiment of this application.

[0039] Figure 4 This is a schematic diagram of the bottom structure of the heat dissipation plate according to an embodiment of this application.

[0040] Figure 5 This is a schematic diagram of the top surface of the diverter in an embodiment of this application.

[0041] Figure 6 This is a schematic diagram of the structure of the bottom surface of the diverter plate in an embodiment of this application.

[0042] Figure 7 This is a structural schematic diagram of the top surface of the fixed cover plate in an embodiment of this application.

[0043] Figure 8 This is a structural schematic diagram of the bottom surface of the fixed cover plate in an embodiment of this application.

[0044] Figure 9 This is a schematic diagram of the top surface of the first gasket in an embodiment of this application.

[0045] Figure 10 This is a schematic diagram of the structure of the bottom surface of the first gasket in an embodiment of this application.

[0046] Figure 11 This is a schematic diagram of the top surface of the second gasket in an embodiment of this application.

[0047] Figure 12 This is a schematic diagram of the structure of the bottom surface of the second gasket in an embodiment of this application.

[0048] Figure 13 This is a schematic diagram of the structure of the heat sink connector according to an embodiment of this application.

[0049] Figure 14 This is a schematic diagram of the splitting / collecting structure in an embodiment of this application.

[0050] Figure 15 This is a schematic diagram of the capillary structure of the heat dissipation plate of this application.

[0051] Figure 16 This is a cross-sectional view of the overall structure of the heat sink according to an embodiment of this application.

[0052] Figure 17 This is a structural diagram of the heat sink connector thread method according to an embodiment of this application.

[0053] The diagram is labeled as follows:

[0054] 1-Cooling plate; 101-Top surface of cooling plate; 102-Bottom surface of cooling plate; 12-Microstructure rib; 13-First countersunk through hole of cooling plate; 14-Second countersunk through hole of cooling plate; 111-Capillary structure of rib; 112-Capillary structure of bottom surface of rib.

[0055] 2-Diverter plate; 21-Diverter cavity; 22-Collector cavity; 23-Diverter channel; 24-Collector channel; 25-Transition zone; 26-Diverter plate countersunk through hole; 27-Diverter plate threaded hole; 28-Diverter plate sealing groove; 29-Heat exchange cavity; 201-Diverter plate top surface; 202-Diverter plate bottom surface.

[0056] 3-Fixed cover plate; 31-Working fluid flow port; 32-Fixed mounting hole; 33-Cover plate cavity; 34-First screw hole of cover plate; 35-Second screw hole of cover plate; 36-Sealing groove of cover plate; 301-Top surface of cover plate; 302-Bottom surface of cover plate.

[0057] 4-Radiator connector; 41-Connector structure; 42-Bottom structure.

[0058] 5-First washer.

[0059] 6-Second washer.

[0060] 7-First gasket; 71-Gasket fluid channel; 701-Top surface of first gasket; 702-Bottom surface of first gasket.

[0061] 8-Second gasket; 81-Second gasket through hole; 82-Second gasket threaded through hole; 801-Second gasket top surface; 802-Second gasket bottom surface.

[0062] 9 - First screw.

[0063] 10 - Second screw.

[0064] 11 - Third screw.

[0065] 100 - Heat exchange chamber.

[0066] 230 - shunt cavity.

[0067] 240 - manifold. Detailed Implementation

[0068] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. This embodiment is based on the technical solution of the present invention and provides detailed implementation methods and specific operating procedures; however, the scope of protection of the present invention is not limited to the following embodiments.

[0069] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0070] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0071] In the following embodiments, unless otherwise specified, the functional components or structures are conventional components or structures used in the art to achieve the corresponding functions.

[0072] Example 1

[0073] like Figures 1-2 As shown in Figure 16, a heat sink for a high-power computing chip includes: a fixed cover plate 3, a shunt plate 2, a heat dissipation plate 1, and a heat sink connector 4.

[0074] like Figures 7-8 As shown in Figures 11 and 12, a pair of working fluid flow ports 31 are provided on the top surface 301 of the fixed cover plate, which serve as the working fluid inlet and working fluid outlet of the radiator, respectively. A cover plate cavity 33 is provided between the bottom surface 302 of the cover plate and the heat dissipation plate 1 as a heat dissipation space. A flow divider 2 is provided in the cover plate cavity 33.

[0075] The fixed cover plate 3 and the heat dissipation plate 1 are connected by screws. The bottom surface 302 of the cover plate has a cover plate sealing groove 36 for installing and fixing the first washer 5. The fixed cover plate 3 and the heat dissipation plate 1 are sealed by the first washer 5. The bottom surface 34 of the cover plate has a cover plate first threaded hole 37, which corresponds to the first countersunk through hole 13 of the heat dissipation plate 1. The fixed cover plate 3 and the heat dissipation plate 1 are tightly fixed together by the first screw 9.

[0076] The fixed cover plate 3 is provided with fixed mounting holes 32 so that the bottom surface 102 of the heat dissipation plate is tightly attached to the chip through the connection structure.

[0077] The fixed cover plate 3 and the diverter plate 2 are connected by screws. The diverter plate 2 has a countersunk through hole 2, which corresponds to the second threaded hole 35 of the fixed cover plate 3, and is fixedly connected by a third screw 11. The diverter plate 2 and the fixed cover plate 3 are also sealed by a second gasket 8.

[0078] The fixed cover plate 3 is connected to the radiator connector 4 by welding. The top surface 301 of the cover plate is provided with a working fluid flow port 31 for connecting the radiator connector 4.

[0079] like Figures 5-6 As shown, the flow divider 2 has a hollowed-out heat exchange cavity 29, and on the same side, there are also a flow divider cavity 21 and a flow collector cavity 22 located at opposite ends of the heat exchange cavity 29. The flow divider cavity 21 is connected to the working fluid inlet, and the flow collector cavity 22 is connected to the working fluid outlet. The flow divider cavity 21 is connected to the bottom surface 302 of the cover plate by screws to form a flow divider cavity 230, and the flow collector cavity 22 is connected to the bottom surface 302 of the cover plate by screws to form a flow collector cavity 240. The heat exchange cavity 29 is connected to the top surface 101 of the heat dissipation plate by screws to form a heat exchange cavity 100.

[0080] The heat exchange cavity 29 is provided with several strips arranged in parallel and connected end to end in sequence. The part of the connection between two adjacent strips is also connected to the side wall of the heat exchange cavity 29, so that two adjacent strips form a flow channel 23 with the opening facing the flow distribution cavity 21, or a flow channel 24 with the opening facing the flow collection cavity 22.

[0081] After the working fluid flows into the diversion cavity 21 through the working fluid inlet, it flows into the heat exchange cavity 29 through the diversion channel 23 to exchange heat, then flows into the collection cavity 22 through the collection channel 24, and finally flows out through the working fluid outlet.

[0082] The cooling medium is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, transformer oil, or fluorinated liquids.

[0083] like Figures 3-4 As shown, the heat dissipation plate 1 has microstructure fins 12 arranged on it, corresponding to the heat exchange cavity 29 and used to enhance heat exchange. The bottom surface 102 of the heat dissipation plate is the heat exchange surface that contacts the chip.

[0084] like Figures 3-6 As shown in Figures 9 and 10, the assembly between the flow divider 2 and the heat dissipation plate 1 is further characterized by: a first gasket 7 for adjusting the assembly gap between the heat exchange cavity 29 and the heat dissipation plate 1, ensuring structural stability. The bottom surface 202 of the flow divider is provided with a flow divider sealing groove 28 for installing and fixing the second washer 6, and sealing is achieved through the second washer 6. The heat dissipation plate 1 is provided with a second countersunk through hole 14, corresponding to the flow divider threaded hole 27 provided on the flow divider 2, and the flow divider 2 and the heat dissipation plate 1 are fixedly connected by a second screw 10.

[0085] like Figure 13 As shown, the radiator connector 4 is provided with a connector structure 41 and a bottom structure 42 for pipe connection and connector installation, respectively. The radiator connector 4 is used for the input and output of cooling working fluid.

[0086] like Figure 5 , 14 As shown, in one embodiment of this utility model, the diversion channel and the collection channel are arranged adjacent to each other.

[0087] The structure of strips includes multi-segment structure, tangent structure, cotangent structure, sine structure, and cosine structure.

[0088] When the strip has a multi-segment structure, the strip includes three segments, the lengths of each segment are L1, L3 and L2 respectively, and at least one of L1, L2 and L3 is not zero. Half of the width of the flow channel opening is defined as W1, half of the width of the closed end of the flow channel is defined as W2, the included angles between two adjacent segments are θ1 and θ2 respectively, and the width of the strip is D1.

[0089] When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure.

[0090] When W1 and W2 are not equal and are not zero, and L1 and L2 are both zero, the flow channel is a trapezoidal structure.

[0091] When W2 is 0, the flow channel has a pointed nozzle shape.

[0092] When W2 is 0, and L1 and L2 are both 0, the flow channel has a triangular structure.

[0093] When all parameters are not zero and the included angles θ1 and θ2 are right angles, the flow channel has a convex-like structure.

[0094] When the strip structure is a tangent structure or a cotangent structure, the distance from the center line of the strip (the y-axis in the diagram) to the center line of the flow channel is defined as E, the total length of the flow channel is L4, the amplitude of the tangent or cotangent is A, and the strip width is D2.

[0095] When the strip structure is a sine or cosine structure, the distance from the strip centerline (x-axis in the diagram) to the flow channel centerline is defined as F, the total flow channel length is L5, the amplitude of the sine / cosine is value B, the wavelength of the sine or cosine is λ, and the strip width is D3.

[0096] like Figure 15 As shown, in one embodiment of this utility model, the microstructure rib 12 includes a plurality of rib capillary structures 111, and the thickness ratio of the rib capillary structures 111 is ≥0; when the thickness ratio of the rib capillary structures 111 in the microstructure rib 12 is 0%, the microstructure rib 12 is a completely solid rib; when the thickness ratio of the rib capillary structures 111 in the microstructure rib 12 is 100%, the microstructure rib 12 is composed of a completely porous capillary structure.

[0097] The heat dissipation plate 1 has a multi-layer capillary structure 112 on the side surface where the microstructure ribs 12 are provided, and the number of layers of the capillary structure 112 on the bottom surface of the ribs is ≥0; when the number of layers of the capillary structure 112 on the bottom surface of the ribs is 0, the side surface of the heat dissipation plate 1 where the microstructure ribs 12 are provided is a smooth surface.

[0098] Both the rib capillary structure 111 and the rib bottom capillary structure 112 are porous capillary structures. The porous capillary structure is formed by one of the following methods: metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering.

[0099] The materials of the heat dissipation plate 1, the distribution plate 2, the fixing cover plate 3, and the heat sink connector 4 are selected from one or more of the following: copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic, or glass; the first gasket 5 and the second gasket 6 are selected from one or more of the following: rubber, silicone, fluororubber, resin, or plastic; the first gasket 7 and the second gasket 8 are selected from one or more of the following: rubber, silicone, fluororubber, resin, plastic, copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic, or glass.

[0100] The basic application principle of the heat sink provided in this embodiment is as follows: the low-temperature cooling medium enters the distribution cavity 21 through the heat sink connector 4 on one side, enters the heat exchange cavity 100 along the distribution channel 23, takes away the heat conducted from the high-temperature chip to the heat sink plate 1, and enters the distribution cavity 22 along the collection channel 24, and finally is discharged to the external circulation pipeline through the heat sink connector 4 on the other side.

[0101] Example 2:

[0102] like Figure 17 As shown, the difference between this embodiment and Embodiment 1 is that the radiator connector 4 and the fixed cover plate 3 are connected by a threaded connection, and the working fluid flow ports 31 are all threaded holes. The radiator connector 4 is selected from one of the following: a standard threaded quick-connect fitting, a pagoda fitting, a quick-stop fitting, or a compression fitting. The purpose of this is that the threaded connection can be repeatedly disassembled and reassembled, facilitating maintenance or replacement, and allowing for adjustment of angle or position, adapting to different pipeline layouts, reducing assembly errors, and improving the compatibility and overall adaptability of the heat dissipation system.

[0103] The above description of the embodiments is provided to enable those skilled in the art to understand and use the utility model. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present utility model is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present utility model without departing from its scope should be within the protection scope of the present utility model.

Claims

1. A heat sink for a high power computing chip, characterized by, include: Fixed cover plate (3), flow divider plate (2), heat dissipation plate (1), The top surface (301) of the cover plate is provided with a pair of working fluid flow ports (31), which serve as the working fluid inlet and working fluid outlet of the radiator, respectively. A cover plate cavity (33) is provided between the bottom surface (302) of the cover plate and the heat dissipation plate (1) as a heat dissipation space. A flow divider plate (2) is provided in the cover plate cavity (33). The flow divider plate (2) has a hollowed-out heat exchange cavity (29), and on the same side, there are also a flow divider cavity (21) and a flow collector cavity (22) located at opposite ends of the heat exchange cavity (29). The flow divider cavity (21) is connected to the working fluid inlet, and the flow collector cavity (22) is connected to the working fluid outlet. The heat exchange cavity (29) is provided with several strips arranged in parallel and connected end to end in sequence. The part of the connection between two adjacent strips is also connected to the side wall of the heat exchange cavity (29), so that two adjacent strips form a flow channel (23) with the opening facing the flow distribution cavity (21), or a flow distribution channel (24) with the opening facing the flow collection cavity (22). After the working fluid flows into the diversion cavity (21) through the working fluid inlet, it flows into the heat exchange cavity (29) through the diversion channel (23) to exchange heat, and then flows into the collection cavity (22) through the collection channel (24), and finally flows out through the working fluid outlet. The heat dissipation plate (1) is provided with microstructure ribs (12) that correspond to the heat exchange cavity (29) and are used to enhance heat exchange.

2. The heat sink for a high-power computing chip according to claim 1, characterized in that, The diversion channel (23) and the collection channel (24) are arranged adjacent to each other.

3. The heat sink for a high-power computing chip according to claim 1, characterized in that, The structure of the strip includes multi-segment structure, tangent structure, cotangent structure, sine structure, and cosine structure.

4. The heat sink for a high-power computing chip according to claim 3, characterized in that, When the strip has a multi-segment structure, the strip consists of three segments, each with lengths L1, L3, and L2, respectively, and at least one of L1, L2, and L3 is not zero. Half the width of the flow channel opening is defined as W1, and half the width of the closed end of the flow channel is defined as W2. The included angles between two adjacent segments are θ1 and θ2, respectively. When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure. When W1 and W2 are not equal and are not zero, and L1 and L2 are both zero, the flow channel is a trapezoidal structure. When W2 is 0, the flow channel has a pointed nozzle shape. When W2 is 0, and L1 and L2 are both 0, the flow channel has a triangular structure. When all parameters are not zero and the included angles θ1 and θ2 are right angles, the flow channel has a convex-like structure. When the strip structure is a tangential or cotangential structure, the distance from the center line of the strip to the center line of the flow channel is defined as E, the total length of the flow channel is L4, and the amplitude of the tangential or cotangential structure is A. When the block structure is a sine or cosine structure, the distance from the center line of the block to the center line of the flow channel is defined as F, the total length of the flow channel is L5, the amplitude of the sine / cosine is value B, and the wavelength of the sine or cosine is λ.

5. The heat sink for a high-power computing chip according to claim 1, characterized in that, A second gasket (8) for sealing is also provided between the diverter plate (2) and the fixed cover plate (3).

6. The heat sink for a high-power computing chip according to claim 1, characterized in that, A first gasket (7) for adjusting the assembly gap is also provided between the heat exchange cavity (29) of the flow divider (2) and the heat dissipation plate (1).

7. The heat sink for a high-power computing chip according to claim 1, characterized in that, The microstructure rib (12) includes a plurality of rib capillary structures (111), and the thickness ratio of the rib capillary structures (111) is ≥0. When the thickness ratio of the capillary structure (111) in the microstructure rib (12) is 0%, the microstructure rib (12) is a completely solid rib. When the thickness of the capillary structure (111) in the microstructure rib (12) is 100%, the microstructure rib (12) is composed of a completely porous capillary structure.

8. The heat sink for a high-power computing chip according to claim 1, characterized in that, The heat dissipation plate (1) has a multi-layer rib bottom capillary structure (112) on one side surface with microstructure ribs (12), and the number of layers of the rib bottom capillary structure (112) is ≥0. When the number of layers of capillary structure (112) on the bottom surface of the rib is 0, the surface of the heat dissipation plate (1) on the side with microstructure rib (12) is a smooth surface.

9. The heat sink for a high-power computing chip according to claim 1, characterized in that, The connection between the heat dissipation plate (1), the diversion plate (2), and the fixed cover plate (3) is by threaded connection, snap fastening, riveting, or welding.

10. The heat sink for a high-power computing chip according to claim 1, characterized in that, The radiator also includes a pair of radiator connectors (4), which are respectively connected to a pair of working fluid flow ports (31).

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