A high-efficiency GPU chip liquid cooling heat dissipation device

Abstract

The utility model relates to a kind of high-efficiency GPU chip liquid cooling heat sink, comprising: bottom plate;GPU mainboard being located on the bottom plate;Radiator cover plate being located on the GPU mainboard, the radiator cover plate and the GPU mainboard are enclosed to form a heat dissipation space;Radiator cold plate and shunt plate in the heat dissipation space, the radiator cold plate is located on the GPU mainboard, the shunt plate is located on the radiator cold plate;Wherein, the side of the radiator cold plate away from the GPU mainboard is equipped with microstructure rib column;The radiator cover plate is provided with a pair of working medium flow port being located just above the shunt plate, respectively as the working medium inlet and working medium outlet of heat dissipation device.The utility model provides a kind of high-efficiency GPU chip liquid cooling heat sink, the radiator cold plate of the device is equipped with microstructure rib column, by increasing the heat dissipation area and disturbing working medium flow field, improve convective heat transfer coefficient.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically to a high-efficiency liquid cooling heat dissipation device for GPU chips. Background Technology

[0002] The rapid iteration of microelectronics technology has driven the continuous surge in GPU chip performance. With the increasing miniaturization and high-density integration of devices, heat dissipation has become an increasingly serious problem. The significant increase in GPU core power consumption, coupled with the heat accumulation effect brought about by the three-dimensional stacked structure, has resulted in an explosive increase in heat flux density within the chip. Semiconductor components are extremely sensitive to high temperatures; overheating can easily lead to performance degradation or even permanent damage. Therefore, efficient thermal management solutions have become the core key to unleashing the full performance potential of GPUs and ensuring their long-term stable operation and reliability.

[0003] Currently, mainstream GPU cooling solutions are mainly based on the principle of heat conduction, including forced air cooling, heat pipe or vapor chamber conduction, and phase change cooling. However, engineering practice shows that traditional liquid cooling systems have obvious bottlenecks, such as low heat transfer interface efficiency, insufficient working fluid circulation efficiency, and limited heat dissipation capacity. Therefore, developing new composite cooling systems that integrate multiple enhanced heat transfer mechanisms and break through existing heat dissipation limits (such as combining microchannel enhanced convection, high-efficiency phase change and advanced thermal conductive materials) has become an urgent technological breakthrough to solve the heat dissipation challenges of next-generation high-performance GPUs and ensure their stable performance.

[0004] Patent CN118507439A discloses a CPU / GPU phase-change liquid cooling radiator, including an upper cover plate, a baffle plate, a lower cover plate, and a base plate. The baffle plate is pressed between the upper and lower cover plates. The upper cover plate has a pair of working fluid flow ports, serving as the working fluid inlet and outlet of the radiator, respectively. The upper cover plate also has a pair of connecting grooves, each communicating with one of the working fluid flow ports. The baffle plate has a pair of through holes corresponding to the positions of the connecting grooves. The lower cover plate has a through opening in the middle, with the baffle plate located at one end of the through opening, and the base plate connected to the other end of the through opening. The inner wall of the base plate has several raised microstructures, and the outer wall of the base plate is shaped to conform to the heat dissipation surface of the CPU / GPU. The above patent suffers from low heat exchange efficiency and poor heat dissipation effect. Utility Model Content

[0005] To address at least one of the heat dissipation problems of existing chip heat sinks, namely low heat exchange efficiency, poor heat dissipation effect, and unstable operation, this invention provides a high-efficiency liquid cooling device for GPU chips. Compared with the prior art, the flow distribution plate design provided by this invention can help the cooling medium to make more uniform and sufficient contact with the microstructured ribs set on the bottom surface of the cold plate. At the same time, it can allow the cooling medium to flow out of the cold plate cavity through a shorter path, which is equivalent to reducing the thermal resistance in the heat exchange process and achieving high-efficiency heat exchange. In addition, capillary structures can be formed by sintering copper powder particles on the bottom surface of the cold plate and the microstructured ribs. The capillary structure can significantly increase the surface area inside the heat sink and enhance the liquid supply through the capillary effect, thereby enhancing convective heat transfer.

[0006] The objective of this utility model can be achieved through the following technical solutions:

[0007] A high-efficiency liquid cooling device for GPU chips includes a base plate; a GPU motherboard mounted on the base plate; and a heatsink cover plate disposed on the GPU motherboard, wherein the heatsink cover plate and the GPU motherboard together form a heat dissipation space.

[0008] The heat sink and the power distribution plate are located in the heat dissipation space. The heat sink is mounted on the GPU motherboard, and the power distribution plate is mounted on the heat sink.

[0009] The heat sink's cold plate has microstructure ribs on the side facing away from the GPU motherboard.

[0010] The radiator cover is provided with a pair of working fluid flow ports located directly above the flow divider plate, which serve as the working fluid inlet and working fluid outlet of the heat dissipation device, respectively.

[0011] Furthermore, the heat sink plate is covered with a first capillary structure on the side opposite to the GPU motherboard, i.e., on the upper surface of the plate; the first capillary structure has one or more layers.

[0012] When the thickness of the first capillary structure is 0, the surface of the radiator cold plate is a smooth metal surface.

[0013] Furthermore, the microstructure rib is a solid rib covered with a second capillary structure. When the capillary thickness of the second capillary structure accounts for 0%, the microstructure rib is a completely solid rib. When the thickness of the second capillary structure accounts for 100%, the microstructure rib is composed of a completely porous capillary structure.

[0014] Furthermore, the first capillary structure or the second capillary structure is a porous capillary structure;

[0015] The porous capillary structure is constructed by one of the following methods: metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering. The porosity of the porous capillary structure is 10% to 99%, and the thickness at different locations or regions is adjusted according to design requirements.

[0016] Furthermore, the microstructure ribs are disposed on the upper surface of the cold plate, and the shape of the microstructure ribs is selected from one of the following shapes, depending on the applicable situation: rectangular cross-section prism, cone or frustum, trapezoidal prism, cone or frustum, parallelogram prism, cone or frustum, triangular prism, cone or frustum, circular prism, cone or frustum, elliptical prism, cone or frustum, umbrella shape, etc.

[0017] The arrangement of the microstructure ribs can be either straight or staggered, depending on the applicable situation.

[0018] Furthermore, when the shape of the microstructure rib is umbrella-shaped, the umbrella-shaped structure is divided into two parts: a head and a root. The head and the root may be the same or different, and both are selected from one or more of the following: rectangular cross-section prism, rectangular cross-section pyramid, rectangular cross-section frustum, trapezoidal prism, trapezoidal pyramid, trapezoidal frustum, parallelogram prism, parallelogram pyramid, parallelogram frustum, triangular prism, triangular pyramid, triangular frustum, circular prism, circular pyramid, circular frustum, elliptical prism, elliptical pyramid, and elliptical frustum.

[0019] Furthermore, when the shape of the microstructure rib is umbrella-shaped, the circumcenters of the horizontal projection contours of the root and head of the umbrella-shaped structure can be coincident or misaligned according to design requirements; the circumradius of the horizontal projection contour of the root is denoted as R1, the circumradius of the horizontal projection contour of the head is denoted as R2, when the root and head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2, the ratio of the circumradius of the root to the circumradius of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0020] Furthermore, the flow divider plate has a groove on the side near the radiator cold plate, the flow divider plate abuts against the radiator cold plate, and the space formed by the groove and the radiator cold plate constitutes a heat exchange cavity;

[0021] The bottom of the groove is hollow. On the other side of the flow divider plate, there are working fluid inflow chambers and working fluid outflow chambers at opposite ends of the hollow groove bottom. On the other side of the flow divider plate, there are also multiple partitions connected end to end on the hollow groove bottom. Two adjacent partitions or the first and last partitions and the groove wall close to them form a flow channel. The flow channel opening to the working fluid inflow chamber is connected to the working fluid inflow chamber, and the flow channel opening to the working fluid outflow chamber is connected to the working fluid outflow chamber.

[0022] The working fluid flows into the working fluid inlet cavity from the working fluid inlet, flows into the heat exchange cavity through the opening into the working fluid inlet cavity, and then flows into the opening into the working fluid outlet cavity from the heat exchange cavity, gathers into the working fluid outlet cavity, and flows out from the working fluid outlet cavity, forming a heat exchange loop.

[0023] Furthermore, the partition is divided into a multi-segment structure, a sine structure, a cosine structure, a tangent structure, or a cotangent structure;

[0024] When the partition is composed of multiple segments, the partition is divided into three segments: a first partition segment, a second partition segment, and a third partition segment. The first partition segment is denoted as L1, the second partition segment as L2, and the third partition segment as L3. At least one of L1, L2, and L3 is not zero. The included angles formed by any two segments are denoted as α and β, respectively. The distance from the center line of the flow channel to the first partition segment L1 is denoted as W1, the distance from the center line of the flow channel to the third partition segment L3 is denoted as W2, and the wall thickness of the partition is denoted as D.

[0025] Furthermore, when the dimensions of W1 and W2 remain the same, the angles of α and β are both 180 degrees, and the dimension range of L2 is 0 mm, the flow channel shape is rectangular. The rectangular flow channel shape allows the cooling medium to contact the microstructure ribs on the bottom surface of the cold plate more evenly during cooling, resulting in a more uniform temperature distribution of the cold plate.

[0026] Furthermore, when the dimensions of W1 and W2 are different, and the value of W1 is 0 and the value of W2 is greater than 0, when the angles of α and β are both 180 degrees, and the size range of L2 is 0 mm, the flow channel shape is triangular. The triangular flow channel can make the flow rate of the cooling medium into the heat exchange chamber more uniform.

[0027] Furthermore, when the dimensions of W1 and W2 are different and neither is 0, and the value of W1 is less than the value of W2, and the dimensions of L1 are 0mm, the dimensions of L3 are 0mm, and the dimensions of L2 are not 0mm, the shape of the flow channel is trapezoidal. The trapezoidal flow channel can not only make the flow of the cooling medium into the heat exchange chamber more uniform, but also be more suitable for low flow rate conditions.

[0028] Furthermore, when W1 and W2 have different dimensions, and neither of them is 0, and the value of W1 is less than the value of W2, and the dimensions of L1, L2, and L3 are not 0 mm, the shape of the flow channel is convex. The convex flow channel can ensure the uniformity of temperature distribution on the bottom surface of the cold plate, and at the same time, it can adjust the uniformity of the flow rate of the cooling medium.

[0029] Furthermore, when the flow channel structure of the flow divider 3 is a sine or cosine structure, the dimension from the flow channel centerline to the wall centerline is denoted as W3, the wall thickness is D2, the amplitude of the wall centerline of the sine or cosine structure is A, its wavelength is λ, the number of waves is N, and the total length of the flow channel is L. At this time, the flow channel shape is wavy. When heat exchange is carried out, the wavy flow channel can enhance the turbulence effect and improve the local heat exchange capacity.

[0030] Furthermore, when the flow channel structure of the flow divider 3 is a tangential or co-tangential structure, the dimension from the flow channel centerline to the wall centerline is W4, the wall thickness is D3, the amplitude of the wall centerline of the tangential or co-tangential structure is B, and the total length of the flow channel is L. At this time, the shape of the flow channel is streamlined. The streamlined flow channel is evolved from the convex shape, which not only makes the temperature distribution on the bottom surface of the cold plate more uniform and adjusts the flow uniformity of the cooling working fluid flowing into the heat exchange cavity, but also enhances the smoothness of the flow transition.

[0031] Furthermore, the radiator cold plate is welded to the flow divider plate, and when the flow divider plate is connected to the radiator cover plate by welding or integral molding, welding is preferred.

[0032] Furthermore, when the radiator cold plate, the diffuser plate, and the radiator cover are connected by means of threaded connection, snap-fit, or riveting,

[0033] A first sealing gasket is installed between the radiator cold plate and the flow divider plate;

[0034] A second sealing gasket is installed between the partition of the diversion plate and the microstructure rib to adjust the assembly gap;

[0035] A first sealing gasket is installed between the flow divider plate and the radiator cover plate.

[0036] A second sealing gasket is installed between the radiator cold plate and the radiator cover plate to improve the overall sealing performance of the structure.

[0037] Furthermore, the radiator cover plate is provided with a pair of flow channels, one end of the pair of flow channels is connected to the pair of working fluid flow ports respectively, and the other end is respectively located on the side of the radiator cover plate; the flow channel is provided with a radiator connector at one end on the side of the radiator cover plate, and the radiator connector can be connected to the flow channel by means of threaded connection or welding.

[0038] Compared with the prior art, the present invention has the following advantages:

[0039] (1) This utility model provides a high-efficiency liquid cooling heat dissipation device for GPU chips. The heat sink plate of the device is provided with microstructure ribs, which increases the heat dissipation area and disturbs the working fluid flow field to improve the convective heat transfer coefficient.

[0040] (2) This utility model provides a high-efficiency liquid cooling heat dissipation device for GPU chips. The surface of the microstructure ribs of the device is covered with a porous capillary structure, which can further promote the distribution of working fluid and enhance heat conduction through capillary action.

[0041] (3) This utility model provides a high-efficiency liquid cooling heat dissipation device for GPU chips. The groove of the flow divider plate and the cold plate of the device form a heat exchange cavity. The internal partition forms a variety of flow channels, which can control the flow rate and pressure drop of the working fluid, increase the tortuosity of the flow channel, and improve the heat dissipation uniformity.

[0042] (4) This utility model provides a high-efficiency liquid cooling heat dissipation device for GPU chips. The bottom capillary structure and rib capillary structure of the device can be prepared by processes such as metal powder sintering and metal wire sintering. The porosity and thickness can be adjusted according to the heat dissipation requirements (such as increasing the porosity in high heat density areas), taking into account both heat dissipation efficiency and manufacturing cost.

[0043] (5) This utility model provides a high-efficiency liquid cooling heat dissipation device for GPU chips. When the screw connection is made, a sealing gasket is set between the heat sink cold plate and the flow distribution plate, a sealing gasket is installed between the top of the microstructure rib of the heat sink cold plate and the lower surface of the flow channel of the flow distribution plate, a sealing gasket is set between the heat sink cold plate and the heat sink cover plate, a sealing gasket is set between the flow distribution plate and the heat sink cover plate, and a cover plate working fluid inlet hole and a cover plate working fluid outlet hole are set on the cover plate. This realizes the quick positioning and installation of the connector-cover plate, cover plate-flow distribution plate, cover plate-cold plate and flow distribution plate-cold plate respectively, and provides a guarantee for forming a reliable sealing structure. This is very important for heat dissipation systems that need to prevent the leakage of cooling medium or the entry of air. At the same time, the screw connection can also be easily and quickly disassembled and replaced.

[0044] (6) This utility model provides a high-efficiency liquid cooling heat dissipation device for GPU chips. The device has a flow distribution plate design, which can help the cooling medium to contact the microstructure ribs set on the upper surface of the cold plate more evenly and fully. At the same time, it can allow the cooling medium to flow out of the cold plate cavity through a shorter path, which is equivalent to reducing the thermal resistance in the heat exchange process and achieving high-efficiency heat exchange.

[0045] (7) This utility model provides a high-efficiency liquid cooling heat dissipation device for GPU chips. The upper surface of the cold plate and the microstructure ribs of the device can be sintered with copper powder particles to form capillary structures. The capillary structures can significantly increase the surface area inside the heat sink and enhance the supply of liquid through the capillary effect, thereby strengthening the convective heat transfer. Attached Figure Description

[0046] Figure 1 This is a unfolded view of the overall structure of the radiator of this utility model;

[0047] Figure 2 This is an assembly drawing of the screw-connected radiator of this utility model.

[0048] Figure 3 This is a cross-sectional view of the overall structure of the radiator of this utility model;

[0049] Figure 4 This is a schematic diagram of the structure of the upper surface of the heat sink cold plate of this utility model;

[0050] Figure 5 This is a schematic diagram of the structure of the lower surface of the heat sink cold plate of this utility model;

[0051] Figure 6 This is a schematic diagram of the upper surface structure of the heat sink distributor plate of this utility model;

[0052] Figure 7 This is a schematic diagram of the structure of the lower surface of the heat sink distributor plate of this utility model;

[0053] Figure 8 This is a structural schematic diagram of a side sectional view of the heat sink distributor plate of this utility model;

[0054] Figure 9 This is a schematic diagram of the upper surface structure of the radiator cover plate of this utility model;

[0055] Figure 10 This is a schematic diagram of the lower surface of the radiator cover of this utility model;

[0056] Figure 11 This is a schematic diagram of the structure of the upper surface of the GPU motherboard heat sink of this utility model;

[0057] Figure 12 This is a schematic diagram of the structure of the lower surface of the GPU motherboard heat sink of this utility model;

[0058] Figure 13 This is a schematic diagram of the structure of the upper surface of the radiator base plate of this utility model;

[0059] Figure 14 This is a schematic diagram of the structure of the lower surface of the radiator base plate of this utility model;

[0060] Figure 15 This is a schematic diagram of the structure of the radiator connector of this utility model;

[0061] Figure 16 This is a schematic diagram of the structure of the first sealing gasket of the radiator according to this utility model;

[0062] Figure 17 This is a schematic diagram of the structure of the second sealing gasket of the radiator according to this utility model;

[0063] Figure 18 A schematic diagram of the flow channel design of the flow divider of this utility model;

[0064] Figure 19 A schematic diagram illustrating the shape characteristics of the microstructure ribs of this utility model;

[0065] Figure 20 This is a schematic diagram of the structure of the heat sink cold plate of the straight-row rectangular rib column of this utility model;

[0066] Figure 21 This is a schematic diagram of the structure of the heat sink cold plate of the straight-line triangular ribbed column of this utility model;

[0067] Figure 22 This is a schematic diagram showing the dimensions of the umbrella-shaped microribbed column structure on the upper surface of the cold plate of this utility model.

[0068] Figure 23 This is a schematic diagram of the capillary structure of the cold plate of this utility model;

[0069] Numbering on the map:

[0070] 1-Cool plate of radiator; 11-First countersunk hole of cold plate; 12-Second countersunk hole of cold plate; 13-Upper surface of cold plate; 14-Microstructure rib; 15-Bottom surface of cold plate;

[0071] 3-Radiator manifold; 31-First mating surface on manifold; 32-Upper surface groove of manifold; 33-Counterhead hole of manifold; 34-Working fluid inlet cavity; 35-Working fluid inlet channel; 36-Working fluid outlet channel; 37-Working fluid outlet cavity; 38-Blind hole of manifold; 39-Lower first mating surface of manifold; 310-Lower surface groove of manifold; 311-Lower second mating surface of manifold; 312-Lower wall of manifold channel;

[0072] 5-Radiator cover plate; 51-First threaded hole of cover plate; 52-Lower groove of cover plate; 53-Second mating surface of cover plate; 54-Second threaded hole of cover plate; 55-Working fluid inlet of cover plate; 56-Working fluid outlet of cover plate; 57-First mating surface of cover plate; 58-Bottom surface of cover plate; 59-Third threaded hole of cover plate; 510-Rib plate; 511-Top plate of cover plate; 512-Ventilation slot; 513-Side of cover plate;

[0073] 6-Radiator connector structure; 61-Connector channel; 62-Connector bottom surface; 63-Connector structure.

[0074] 9-Heater GPU motherboard structure; 91-Motherboard through holes; 92-Motherboard upper surface; 93-Peripheral modules; 94-GPU core; 95-Connection structure; 96-Motherboard lower surface;

[0075] 10-Radiator base plate structure: 101-Upper surface of base plate; 102-Counterhole of base plate; 103-Lower surface of base plate. Detailed Implementation

[0076] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0077] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0078] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0079] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0080] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, when describing pipelines, the terms "connected" and "linked" in this utility model have the meaning of establishing conductivity. The specific meaning needs to be understood in conjunction with the context.

[0081] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0082] To address at least one of the heat dissipation problems of existing chip heat sinks, namely low heat exchange efficiency, poor heat dissipation effect, and unstable operation, this utility model provides a high-efficiency liquid cooling device for GPU chips, the specific structure of which is described below. Figure 1-3 It includes a base plate 10, a GPU motherboard 9, a heatsink cover 5, a heatsink plate 1, and a distribution plate 3;

[0083] The GPU motherboard 9 is mounted on the base plate 10; the heat sink cover 5 is mounted on the GPU motherboard 9, and the heat sink cover 5 and the GPU motherboard 9 together form a heat dissipation space.

[0084] The heat sink 1 and the heatsink 3 are located within the heat dissipation space. The heat sink 1 is mounted on the GPU motherboard 9, and the heatsink 3 is mounted on the heat sink 1.

[0085] The heat sink 1 has microstructure ribs 14 on the side opposite to the GPU motherboard 9.

[0086] The radiator cover plate 5 is provided with a pair of working fluid flow ports located directly above the flow divider plate 3, which serve as the working fluid inlet 55 and the working fluid outlet 56 of the heat dissipation device, respectively.

[0087] In one embodiment of the present invention, the flow divider 3 is provided with a groove on the side near the radiator cold plate 1, the flow divider 3 abuts against the radiator cold plate 1, and the space formed by the groove and the radiator cold plate 1 constitutes a heat exchange cavity 16.

[0088] The bottom of the groove is hollow. On the other side of the flow divider 3, a working fluid inflow cavity 34 and a working fluid outflow cavity 37 are provided opposite to each other at both ends of the hollow groove bottom. On the other side of the flow divider 3, multiple partitions connected end to end are also provided on the hollow groove bottom. Two adjacent partitions or the first and last partitions and the groove wall close to them form a flow channel. The flow channel opening to the working fluid inflow cavity 34 is connected to the working fluid inflow cavity 34, and the flow channel opening to the working fluid outflow cavity 37 is connected to the working fluid outflow cavity 37.

[0089] The working fluid flows into the working fluid inlet cavity 34 from the working fluid inlet, flows into the heat exchange cavity 16 through the opening of the working fluid inlet cavity 34, and then flows into the opening of the working fluid outlet cavity 37 from the heat exchange cavity 16, gathers into the working fluid outlet cavity 37, and flows out from the working fluid outlet cavity, forming a heat exchange loop.

[0090] In one embodiment of this utility model, when the radiator cold plate 1, the diversion plate 3, and the radiator cover plate 5 are connected by means of threaded connection, snap fastening, or riveting,

[0091] A first sealing gasket 2 is installed between the radiator cold plate 1 and the flow divider 3;

[0092] A second sealing gasket 7 is installed between the partition of the diversion plate 3 and the microstructure rib 14 to adjust the assembly gap;

[0093] A first sealing gasket 4 is installed between the flow divider 3 and the radiator cover 5.

[0094] A second sealing gasket 8 is installed between the radiator cold plate 1 and the radiator cover plate 5 to improve the sealing performance of the entire structure.

[0095] In one embodiment of the present invention, a pair of flow channels are provided inside the radiator cover plate 5. One end of the pair of flow channels is connected to the pair of working fluid flow ports, and the other end is respectively provided on the side of the radiator cover plate 5. A radiator connector 6 is provided at one end of the flow channel on the side of the radiator cover plate 5. The radiator connector 6 can be connected to the flow channel by means of threaded connection or welding.

[0096] Specifically, the flow divider 3 has a first contact surface 39, a groove 310 on the lower surface of the flow divider 3, and a second contact surface 311 on the side near the radiator cold plate 1. A first sealing gasket 2 is placed in the groove 310 on the lower surface of the flow divider to ensure the reliability and sealing of the threaded connection, thereby forming a heat exchange cavity 16. At the same time, the flow divider 3 also has a lower wall surface 312 of the flow channel on the side near the radiator cold plate 1, and a second sealing gasket 7 is provided between it and the microstructure rib 14 to adjust the assembly gap and seal, and to ensure the stability and reliability of the structure.

[0097] The diverter plate 3 is connected to the radiator cover plate 5 by threads. The diverter plate 3 has an upper surface groove 32 on the side near the radiator cover plate 5. A first sealing gasket 4 is placed in the upper surface groove 32 to ensure the sealing reliability of the structure when the threaded connection is made.

[0098] The radiator cover plate 5 is connected to the radiator cold plate 1 by a threaded connection. A groove 52 is provided on the radiator cover plate 5 to accommodate the second sealing gasket 8, thereby ensuring the reliability of the seal between the radiator cover plate 5 and the radiator cold plate 1. The cavity formed by the second mating surface 53 under the radiator cover plate 5 and the inner wall surface of the cover plate is used to install the diverter plate 3 and the radiator cold plate 1, so that the bottom surface 58 of the cover plate and the bottom surface 15 of the cold plate of the radiator cold plate 1 are on the same plane. The radiator cover plate 5 is connected to the radiator cold plate 1 and the diverter plate 3 by a threaded connection. The side 513 of the radiator cover plate 5 is provided with a working fluid inlet 55 and a working fluid outlet 56 for connecting the radiator connector 6.

[0099] The GPU motherboard 9 is installed and fixed between the heatsink cover plate 5 and the base plate 10 by screw connection. The GPU motherboard 9 has a connection structure 95 for inserting into the host's graphics card slot to obtain specific signals. The GPU core 94 on the top surface 92 of the motherboard is tightly attached to the bottom surface 15 of the cold plate by applying thermal conductive material. The peripheral module 93 on the top surface 92 of the motherboard is tightly attached to the bottom surface 58 of the cover plate by applying thermal conductive material. The GPU core 94 and the peripheral module 93 are changed according to the graphics card motherboard model.

[0100] The base plate 10 is provided with a base plate countersunk hole 102, which is connected to the motherboard through hole 91 on the lower surface 96 of the motherboard by means of screws, and is installed and fixed to the GPU motherboard 9 and the cover plate 5.

[0101] Please see Figure 4-5 In one embodiment of the present invention, a microstructure rib 14 perpendicular to the bottom surface is provided on the upper surface 13 of the radiator cold plate 1. At the same time, a first countersunk hole 11 and a second countersunk hole 12 are provided on the upper surface 13 of the cold plate, which are respectively used to connect with the radiator cover plate 5 and the diverter plate 3.

[0102] Please see Figure 6-8 In one embodiment of this utility model, the flow divider 3 is provided with an upper surface groove 32 for placing a first sealing gasket 4; a lower surface groove 310 for placing a first sealing gasket 2; a lower wall surface 312 for the flow channel of the flow divider to cooperate with the top surface of the microstructure rib 14 of the cold plate 1 to place a second sealing gasket 7; a countersunk hole 33 for cooperating with the second threaded hole 54 of the cover plate of the radiator cover plate 5 for screw connection; and a blind hole 38 for cooperating with the first countersunk hole 11 of the cold plate of the radiator cold plate 1 for screw connection.

[0103] Please see Figure 9-10 In one embodiment of this utility model, the heat sink cover 5 is provided with a cover plate groove 52 for placing the second sealing gasket 8; the working fluid inlet 55 and the working fluid outlet 56 of the cover plate are connected to the heat sink connector 6 by threaded connection; the first threaded hole 51 of the cover plate is connected to the second countersunk hole 12 of the cold plate of the heat sink 1 by thread; the third threaded hole 59 of the cover plate 5 corresponds one-to-one with the motherboard through hole 91 on the motherboard 9 and the bottom plate through hole 102 of the base plate 10, and is connected and fixed by screw connection. The third threaded hole 59 of the cover plate and the bottom plate through hole 102 are adapted to the position of the motherboard through hole 91 corresponding to the graphics card motherboard model.

[0104] Please see Figure 11-12In one embodiment of this utility model, the GPU motherboard 9 is provided with a motherboard through hole 91 for connecting to the base plate 10 and the heat sink cover 5 with screws. At the same time, a peripheral module 93 and a GPU core 94 are provided on the upper surface 92 of the GPU motherboard. The motherboard 9 is inserted into the graphics card slot through the connection structure 95, and the lower surface 96 of the motherboard is in contact with the base plate 10.

[0105] Please see Figure 13-14 In one embodiment of this utility model, the base plate 10 is provided with a base plate countersunk hole 102, which is installed and fixed to the GPU motherboard 9 and the cover plate 5 by means of screw connection.

[0106] Please see Figure 15 In one embodiment of this utility model, the radiator 6 is provided with a connector channel 61, a connector bottom surface 62 and a connector structure 63. The radiator connector 6 is connected to the cover plate 5 by screws. The connector channel 61 is connected to the working fluid inflow cavity 35 of the diverter plate.

[0107] Please see Figure 16-17 In one embodiment of this utility model, the first sealing gasket 4 is used for sealing the connection between the radiator cover plate 5 and the flow divider plate 3; the second sealing gasket 7 is placed between the lower wall surface 312 of the flow divider plate 3 and the top surface of the microstructure rib 14 of the cold plate 1, both of which are used to ensure the reliability of the seal.

[0108] Please see Figure 18 In one embodiment of this utility model, the partition is divided into a multi-segment structure, a sine structure, a cosine structure, a tangent structure, or a cotangent structure;

[0109] In one embodiment of this utility model, when the partition is composed of multiple segments, the partition is divided into three segments: a first partition segment, a second partition segment, and a third partition segment. The first partition segment is denoted as L1, the second partition segment as L2, and the third partition segment as L3. At least one of L1, L2, and L3 is not zero. The included angles formed by any two segments are denoted as α and β, respectively. The distance from the center line of the flow channel to the first partition segment L1 is denoted as W1, the distance from the center line of the flow channel to the third partition segment L3 is denoted as W2, and the wall thickness of the partition is denoted as D.

[0110] In one embodiment of this utility model, when the dimensions of W1 and W2 are always the same, the angles of α and β are both 180 degrees, and the dimension range of L2 is 0 mm, the flow channel shape is rectangular. The rectangular flow channel shape allows the cooling medium to contact the microstructure ribs on the bottom surface of the cold plate more evenly during cooling, resulting in a more uniform temperature distribution of the cold plate.

[0111] In one embodiment of this utility model, when the dimensions of W1 and W2 are different, and the value of W1 is 0 and the value of W2 is greater than 0, when the angles of α and β are both 180 degrees, and the size range of L2 is 0 mm, the flow channel shape is triangular. The triangular flow channel can make the flow rate of the cooling working fluid into the heat exchange chamber more uniform.

[0112] In one embodiment of this utility model, when the dimensions of W1 and W2 are different and neither is 0, and the value of W1 is less than the value of W2, and at the same time the dimensions of L1 are 0mm, the dimensions of L3 are 0mm, and the dimensions of L2 are not 0mm, the shape of the flow channel is trapezoidal. The trapezoidal flow channel can not only make the flow rate of the cooling working fluid into the heat exchange chamber more uniform, but also be more suitable for low flow rate conditions.

[0113] In one embodiment of this utility model, when the dimensions of W1 and W2 are different, and neither of them is 0, and the value of W1 is less than the value of W2, and the dimensions of L1, L2, and L3 are not 0 mm, the shape of the flow channel is convex. The convex flow channel can ensure the uniformity of temperature distribution on the bottom surface of the cold plate, and at the same time, it can adjust the uniformity of the flow rate of the cooling medium.

[0114] In one embodiment of this utility model, when the flow channel structure of the flow divider 3 is a sine or cosine structure, the dimension from the flow channel centerline to the wall centerline is denoted as W3, the wall thickness is D2, the amplitude of the wall centerline of the sine or cosine structure is A, its wavelength is λ, the number of waves is N, and the total length of the flow channel is L. At this time, the flow channel shape is wavy. When the wavy flow channel is used for heat exchange, it can enhance the turbulence effect and improve the local heat exchange capacity.

[0115] In one embodiment of this utility model, when the flow channel structure of the flow divider plate 3 is a tangential or co-tangential structure, the dimension from the center line of the flow channel to the center line of the wall is W4, the thickness of the wall is D3, the amplitude of the center line of the wall of the tangential or co-tangential structure is B, and the total length of the flow channel is L. At this time, the shape of the flow channel is streamlined. The streamlined flow channel is evolved from the convex shape, which can not only make the temperature distribution on the bottom surface of the cold plate more uniform and adjust the flow uniformity of the cooling working fluid flowing into the heat exchange cavity, but also enhance the smoothness of the flow transition.

[0116] Please see Figure 19-22 In one embodiment of this utility model, the microstructure rib 14 is disposed on the upper surface 13 of the cold plate. The shape of the microstructure rib 14 is selected from rectangular cross-section prism, cone or frustum, trapezoidal prism, cone or frustum, parallelogram prism, cone or frustum, triangular prism, cone or frustum, circular prism, cone or frustum, elliptical prism, cone or frustum, umbrella shape, etc., depending on the applicable situation.

[0117] The arrangement of the microstructure ribs 14 can be either straight or staggered, depending on the applicable situation.

[0118] In one embodiment of this utility model, when the microstructure rib 14 has an umbrella-shaped shape, the umbrella-shaped structure is divided into two parts: a head and a root. The head and the root may be the same or different, and are selected from one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, and elliptical frustum.

[0119] In one embodiment of this utility model, when the shape of the microstructure rib 14 is umbrella-shaped, the circumcenters of the horizontal projection contours of the root and head of the umbrella-shaped structure can be coincident or misaligned according to design requirements; the circumradius of the horizontal projection contour of the root is denoted as R1, the circumradius of the horizontal projection contour of the head is denoted as R2, when the root and head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2, the ratio of the circumradius of the root to the circumradius of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0120] Please see Figure 23 In one embodiment of the present invention, the heat sink 1 is covered with a first capillary structure 131 on the side opposite to the GPU motherboard 9, i.e., on the upper surface 13 of the heat sink 1; the first capillary structure 131 has one or more layers.

[0121] When the thickness of the first capillary structure 131 is 0, the surface of the heat sink cold plate 1 is a smooth metal surface.

[0122] In one embodiment of the present invention, the microstructure rib 14 is a solid rib covered with a second capillary structure 141. When the capillary thickness of the second capillary structure 141 accounts for 0%, the microstructure rib 14 is a completely solid rib; when the thickness of the second capillary structure 141 accounts for 100%, the microstructure rib 14 is composed of a completely porous capillary structure.

[0123] In one embodiment of this utility model, the first capillary structure 131 or the second capillary structure 141 is a porous capillary structure.

[0124] The porous capillary structure is constructed by one of the following methods: metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering. The porosity of the porous capillary structure is 10% to 99%, and the thickness at different locations or regions is adjusted according to design requirements.

[0125] In one embodiment of this utility model, the materials of the heat sink cold plate 1, the flow distribution plate 3, the heat sink cover plate 5, the heat sink connector 6, the GPU motherboard 9 and the base plate 10 are selected from one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic or glass.

[0126] In one embodiment of this utility model, the first sealing gasket 2 and the second sealing gasket 8 are made of rubber, silicone, fluororubber or plastic, and the first sealing gasket 4 and the second sealing gasket 7 are made of stainless steel, copper, iron, rubber, silicone, fluororubber or plastic.

[0127] In one embodiment of this utility model, the cooling medium of the heat dissipation device is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, transformer oil, or fluorinated liquid.

[0128] In one embodiment of this utility model, a thermally conductive medium is filled between the heat sink cold plate 1 and the chip surface. This application does not limit the type of thermally conductive medium; for example, the thermally conductive medium is thermal grease or liquid metal. When the thermally conductive medium is liquid metal, a protective design is provided around the chip to prevent liquid metal leakage from damaging the motherboard.

[0129] The basic application principle of the heat dissipation device provided by this utility model is as follows:

[0130] The low-temperature cooling medium flows into the working fluid inlet cavity 34 from the working fluid inlet, flows into the heat exchange cavity 16 through the working fluid inlet channel 35 which opens into the working fluid inlet cavity 34, and then flows from the heat exchange cavity 16 into the working fluid outlet channel 36 which opens into the working fluid outlet cavity 37, collects in the working fluid outlet cavity 37, and flows out from the working fluid outlet, forming a heat exchange loop.

[0131] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A high-efficiency liquid cooling device for GPU chips, characterized in that, include: Base plate (10); A GPU motherboard (9) is mounted on the base plate (10); A heat sink cover (5) is provided on the GPU motherboard (9), and the heat sink cover (5) and the GPU motherboard (9) together form a heat dissipation space; The heat sink (1) and the distribution plate (3) are located in the heat dissipation space. The heat sink (1) is located on the GPU motherboard (9), and the distribution plate (3) is located on the heat sink (1). Among them, the heat sink cold plate (1) is provided with microstructure ribs (14) on the side away from the GPU motherboard (9); The radiator cover (5) is provided with a pair of working fluid flow ports located directly above the flow divider (3), which serve as the working fluid inlet (55) and working fluid outlet (56) of the heat dissipation device, respectively.

2. The high-efficiency liquid cooling device for GPU chips according to claim 1, characterized in that, The heat sink plate (1) is covered with a first capillary structure (131) on the side opposite to the GPU motherboard (9); the first capillary structure (131) has one or more layers; When the thickness of the first capillary structure (131) is 0, the surface of the radiator cold plate (1) is a smooth metal surface.

3. The high-efficiency liquid cooling device for GPU chips according to claim 1, characterized in that, The microstructure rib (14) is a solid rib covered with a second capillary structure (141). When the capillary thickness of the second capillary structure (141) is 0%, the microstructure rib (14) is a completely solid rib. When the thickness of the second capillary structure (141) is 100%, the microstructure rib (14) is composed of a completely porous capillary structure.

4. A high-efficiency liquid cooling device for GPU chips according to claim 2 or 3, characterized in that, The first capillary structure (131) or the second capillary structure (141) is a porous capillary structure; The porous capillary structure is formed by sintering metal powder, sintering metal wire, or sintering a mixture of metal powder and metal wire, and the porosity of the porous capillary structure is 10% to 99%.

5. The high-efficiency liquid cooling device for GPU chips according to claim 1, characterized in that, The microstructure rib (14) is disposed on the upper surface (13) of the cold plate. The shape of the microstructure rib (14) is selected from one of the following shapes: rectangular cross-section prism, cone or frustum, trapezoidal prism, cone or frustum, parallelogram prism, cone or frustum, triangular prism, cone or frustum, circular prism, cone or frustum, elliptical prism, cone or frustum, umbrella shape, etc. The microstructure ribs (14) are arranged in a straight line or staggered pattern.

6. The high-efficiency liquid cooling device for GPU chips according to claim 5, characterized in that, When the shape of the microstructure rib (14) is umbrella-shaped, the umbrella structure is divided into two parts: a head and a root. The head and the root may be the same or different, and both are selected from one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, and elliptical frustum. When the shape of the microstructure rib (14) is umbrella-shaped, the circumcenter of the horizontal projection profile of the root of the umbrella structure coincides with or is misaligned with the circumcenter of the horizontal projection profile of the head; the circumcenter radius of the horizontal projection profile of the root is denoted as R1, the circumcenter radius of the horizontal projection profile of the head is denoted as R2, when the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2, and the ratio of the circumcenter radius of the root to the circumcenter radius of the head is 0.1 to 10.

7. The high-efficiency liquid cooling device for GPU chips according to claim 1, characterized in that, The flow divider (3) has a groove on one side near the radiator cold plate (1), the flow divider (3) abuts against the radiator cold plate (1), and the space formed by the groove and the radiator cold plate (1) constitutes a heat exchange chamber (16). The bottom of the groove is hollow. On the other side of the flow divider (3), there are working fluid inflow chamber (34) and working fluid outflow chamber (37) at opposite ends of the hollow bottom. On the other side of the flow divider (3), there are also multiple partitions connected end to end on the hollow bottom. Two adjacent partitions or the first and last partitions and the groove wall close to them form a flow channel. The flow channel opening to the working fluid inflow chamber (34) is the working fluid inflow channel (35) which is connected to the working fluid inflow chamber (34). The flow channel opening to the working fluid outflow chamber (37) is the working fluid outflow channel (36) which is connected to the working fluid outflow chamber (37). The working fluid flows into the working fluid inlet cavity (34) from the working fluid inlet, flows into the heat exchange cavity (16) through the opening into the working fluid inlet cavity (34), and then flows into the opening into the working fluid outlet cavity (37) from the heat exchange cavity (16), gathers into the working fluid outlet cavity (37), and flows out from the working fluid outlet cavity, forming a heat exchange loop.

8. The high-efficiency liquid cooling device for GPU chips according to claim 7, characterized in that, The partition is divided into multi-segment structure, sine structure, cosine structure, tangent structure or cotangent structure; When the partition is composed of multiple segments, the partition is divided into three segments: the first partition segment, the second partition segment, and the third partition segment. The first partition segment is denoted as L1, the second partition segment as L2, and the third partition segment as L3. At least one of L1, L2, and L3 is not zero. The included angles formed by any two segments are denoted as α and β, respectively. The distance from the center line of the flow channel to the first partition segment (L1) is denoted as W1, the distance from the center line of the flow channel to the third partition segment (L3) is denoted as W2, and the wall thickness of the partition is denoted as D. When the dimensions of W1 and W2 remain the same, the angles of α and β are both 180 degrees, and the dimension of L2 is 0 mm, the flow channel shape is rectangular. When the dimensions of W1 and W2 are different, and the value of W1 is 0 and the value of W2 is greater than 0, when the angles of α and β are both 180 degrees, and the dimension range of L2 is 0 mm, the flow channel shape is triangular. When the dimensions of W1 and W2 are different and neither is 0, and the value of W1 is less than the value of W2, and the dimensions of L1 and L3 are both 0 mm, and the dimension of L2 is not 0 mm, the shape of the flow channel is trapezoidal. When W1 and W2 have different dimensions, neither of them is 0, and the value of W1 is less than the value of W2, and the dimensions of L1, L2, and L3 are not 0 mm, the shape of the flow channel is convex. When the flow channel structure of the flow divider (3) is a sine or cosine structure, the dimension from the flow channel centerline to the wall centerline is denoted as W3, the wall thickness is denoted as D2, the amplitude of the wall centerline of the sine or cosine structure is A, its wavelength is λ, the number of waves is N, the total length of the flow channel is L, and the flow channel shape is wavy. When the flow channel structure of the flow divider (3) is a tangential or co-tangential structure, the dimension from the flow channel centerline to the wall centerline is W4, the wall thickness is D3, the amplitude of the wall centerline of the tangential or co-tangential structure is B, the total length of the flow channel is L, and the shape of the flow channel is streamlined.

9. The high-efficiency liquid cooling device for GPU chips according to claim 1, characterized in that, The radiator cold plate (1) is welded to the flow divider plate (3), and the flow divider plate (3) is connected to the radiator cover plate (5) by welding or integral molding. When the radiator cold plate (1), the flow divider plate (3), and the radiator cover plate (5) are connected by means of threaded connection, snap fastening, or riveting, A first sealing gasket (2) is installed between the radiator cold plate (1) and the flow distribution plate (3); A second sealing gasket (7) is installed between the partition of the diversion plate (3) and the microstructure rib (14) to adjust the assembly gap; A first sealing gasket (4) is installed between the flow divider plate (3) and the radiator cover plate (5). A second sealing gasket (8) is installed between the radiator cold plate (1) and the radiator cover plate (5).

10. The high-efficiency liquid cooling device for GPU chips according to claim 1, characterized in that, The radiator cover (5) is provided with a pair of flow channels. One end of the pair of flow channels is connected to the pair of working fluid flow ports, and the other end is provided on the side (513) of the radiator cover (5). A radiator connector (6) is provided at one end of the flow channel on the side (513) of the radiator cover (5).

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