A high-heat-dissipation-efficiency COB display screen packaging structure

Abstract

The utility model discloses a kind of high heat dissipation efficiency COB display screen packaging structure, it is related to COB display screen packaging technical field COB display screen is installed in the inside of outer frame, the side electric connection of COB display screen has, the side screw thread connection of outer frame has bottom frame, the surface screw thread connection of bottom frame has fixed mechanism.The utility model passes through the heat generated by heating module on PCB board and is quickly conducted to entire heat transfer module and is quickly radiated to air through its heat dissipation part, its heat conduction speed is fast, heat dissipation effect is good, avoid the occurrence of the situation that PCB board burns out caused by the temperature of heating module on PCB board sharply rising, in the case of long time work or use environment is bad, improve the service life of COB display screen.

Description

Technical Field

[0001] This utility model relates to the field of COB display packaging technology, specifically to a COB display packaging structure with high heat dissipation efficiency. Background Technology

[0002] This utility model relates to the field of COB display packaging technology, specifically to a COB display packaging structure with high heat dissipation efficiency. In existing COB display packaging structures, the display generates a large amount of heat during operation, especially from the heat-generating modules on the PCB board. If this heat cannot be dissipated effectively and in a timely manner, the PCB board temperature will rise, and in severe cases, it may even burn out the PCB board, thereby affecting the lifespan and performance of the display.

[0003] In existing technologies, heat dissipation components such as heat sinks or fans are typically used to solve heat dissipation problems. However, these heat dissipation methods are often inefficient and cannot meet the heat dissipation requirements of high power density COB displays, especially under conditions of long-term operation or harsh environments. Existing heat dissipation structures often fail to effectively dissipate heat, causing the display temperature to rise, affecting display quality and lifespan.

[0004] Therefore, compared with existing technologies, the combined design of a heat transfer module and a heat dissipation unit achieves rapid heat conduction and dissipation. The heat transfer module is a hollow, sealed aluminum cavity filled with phase change inhibiting material, which effectively absorbs the heat from the heat-generating module and conducts it to the heat dissipation unit. The heat dissipation unit consists of several aluminum heat dissipation fins, increasing the heat dissipation area, improving heat dissipation efficiency, and preventing the display screen's lifespan from being affected under prolonged operation or harsh operating environments. Utility Model Content

[0005] The purpose of this invention is to provide a COB display packaging structure with high heat dissipation efficiency to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0007] A high heat dissipation efficiency COB display packaging structure includes an outer frame, a COB display installed inside the outer frame, a PCB heat dissipation structure electrically connected to one side of the COB display, a bottom frame threaded to one side of the outer frame, a fixing mechanism threaded to the surface of the bottom frame, a dustproof mechanism installed on the surface of the bottom frame, a support frame installed inside the bottom frame, and a fan installed on the surface of the support frame.

[0008] The PCB heat dissipation structure includes a PCB board, on which a heat-generating module is mounted. It also includes a heat transfer module and a heat dissipation part. The four sides of the PCB board are connected to the left half of the outer surface of the heat transfer module, and the heat-generating surface of the heat-generating module is in contact with the left half of the outer surface of the heat transfer module. The heat dissipation part is provided on the right half of the outer surface of the heat transfer module.

[0009] A further improvement of this utility model is that: the heat transfer module is a hollow aluminum sealed cavity, the sealed cavity is filled with a heat transfer medium, the heat transfer medium is a phase change suppression material, the heat dissipation part is an aluminum heat sink, and in order to further improve the heat dissipation efficiency and increase the heat dissipation area, the heat sink is a number of aluminum heat dissipation fins.

[0010] A further improvement of the present invention is that the heat sink is a plurality of aluminum heat sink fins, which are equally spaced and parallelly welded to the right half of the outer surface of the heat transfer module.

[0011] A further improvement of this utility model is that the PCB board is connected to the heat transfer module by bolts around its perimeter, and bolt holes are sequentially provided at corresponding positions around the PCB board and the heat transfer module.

[0012] A further improvement of the present invention is that the fixing mechanism includes a fixing groove, a handle, and a connecting groove. The fixing groove is opened inside the outer frame, and the connecting groove is opened inside the bottom frame. A fixing bolt is threaded inside the fixing groove. A handle is fixedly connected to one end of the fixing bolt. By rotating the handle, the handle 73 drives the fixing bolt to rotate, causing the fixing bolt to disengage from the fixing groove and the bottom frame.

[0013] A further improvement of this utility model is that the dustproof mechanism further includes a baffle, a slot, and a dustproof net; both ends of the dustproof net extend outwards and are provided with locking blocks; the slot is opened on the surface of the bottom frame, and the shape of the slot matches the locking block; the baffle is provided at the edge of the slot opening of each slot, and the baffle is rotatably connected to the bottom frame to lock or unlock the locking block and the slot. The fan is started to dissipate the heat inside the COB display screen. When the dustproof net needs to be removed, the baffle is rotated so that the baffle no longer abuts against the locking block, and the locking block can be released from the slot to unlock, thereby facilitating the cleaning of dust on the dustproof net.

[0014] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0015] 1. This utility model provides a COB display packaging structure with high heat dissipation efficiency. The heat generated by the heat-generating module on the PCB board is quickly conducted to the entire heat transfer module and then quickly dissipated into the air through the heat dissipation part on it. Its heat conduction speed is fast and the heat dissipation effect is good, avoiding the situation where the temperature of the heat-generating module on the PCB board rises sharply and the PCB board burns out. It improves the service life of the COB display screen under long-term operation or harsh environment.

[0016] 2. This utility model provides a COB display packaging structure with high heat dissipation efficiency. The fan is started to dissipate the heat inside the COB display. When the dust filter needs to be removed, the baffle is rotated so that the baffle no longer abuts against the locking block. The locking block can be released from the slot to unlock, thereby facilitating the cleaning of dust on the dust filter and allowing the fan to effectively carry away the heat inside the display. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the fixing mechanism of this utility model;

[0019] Figure 3 This is a schematic diagram of the PCB heat dissipation structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the cross-sectional view of the PCB heat dissipation structure of this utility model;

[0021] Figure 5 This is a cross-sectional structural diagram of the fixing mechanism of this utility model.

[0022] In the diagram: 1. Outer frame; 2. COB display screen; 3. PCB heat dissipation structure; 30. Heat transfer module; 31. Heat dissipation part; 32. PCB board; 34. Bolt; 35. Heating module; 36. Heat transfer medium; 4. Support frame; 5. Fan; 6. Bottom frame; 7. Fixing mechanism; 70. Connecting groove; 71. Fixing bolt; 72. Fixing groove; 73. Handle; 8. Dustproof mechanism; 80. Dustproof net; 81. Card slot; 82. Card block; 83. Baffle. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to embodiments:

[0024] Example 1

[0025] like Figure 1-5As shown, this utility model provides a high heat dissipation efficiency COB display packaging structure, including an outer frame 1, a COB display 2 installed inside the outer frame 1, a PCB heat dissipation structure 3 electrically connected to one side of the COB display 2, a bottom frame 6 threadedly connected to one side of the outer frame 1, a fixing mechanism 7 threadedly connected to the surface of the bottom frame 6, a dustproof mechanism 8 installed on the surface of the bottom frame 6, a support frame 4 installed inside the bottom frame 6, and a fan 5 installed on the surface of the support frame 4.

[0026] The PCB heat dissipation structure 3 includes a PCB board 32, on which a heat-generating module 35 is mounted. It also includes a heat transfer module 30 and a heat dissipation part 31. The four sides of the PCB board 32 are connected to the left half of the outer surface of the heat transfer module 30, and the heat-generating surface of the heat-generating module 35 is in close contact with the left half of the outer surface of the heat transfer module 30. The heat dissipation part 31 is provided on the right half of the outer surface of the heat transfer module 30. The heat transfer module 30 is a hollow aluminum sealed cavity, which is filled with a heat transfer medium 36, which is a phase change suppression material. The heat dissipation part 31 is an aluminum heat sink, which consists of several aluminum heat dissipation fins. Several heat dissipation fins are equally spaced and parallelly welded to the right half of the outer surface of the heat transfer module 30. The four sides of the PCB board 32 are connected to the heat transfer module 30 by bolts 34.

[0027] Specifically, to ensure efficient heat conduction from the heating module 35 on the PCB board 32 and to maintain a low temperature in the portion of the heat transfer module 30 in contact with the heating module 35 on the PCB board 32, the heat transfer medium 36 is preferably a phase change suppressing material. The phase change suppressing material is a semi-liquid gel. When heated, the boiling phenomenon is suppressed, resulting in highly efficient heat transfer; that is, the temperature at the far end of the heat source is higher than that near the heat source. Simultaneously, heat is transferred from the heated end to the far end at an exceptionally high rate, keeping the heated end at a low temperature. To further improve heat dissipation efficiency and increase the heat dissipation area, the heat sink consists of several aluminum heat dissipation fins, which are equally spaced and parallelly welded to the right half of the outer surface of the heat transfer module 30. Bolt holes are sequentially provided around the perimeter of the PCB board 32 and at corresponding positions on the heat transfer module 30, and the two are fixedly connected by bolts 34 inserted into the bolt holes. Of course, the connection between the PCB board 32 and the heating module 35 is not limited to bolt 34 fixing; a spacer connection can also be used.

[0028] Example 2

[0029] like Figure 1-5As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the fixing mechanism 7 includes a fixing groove 72, a handle 73, and a connecting groove 70. The fixing groove 72 is opened inside the outer frame 1, and the connecting groove 70 is opened inside the bottom frame 6. A fixing bolt 71 is threaded inside the fixing groove 72, and a handle 73 is fixedly connected to one end of the fixing bolt 71. The dustproof mechanism 8 also includes a baffle 83, a slot 81, and a dustproof net 80. Both ends of the dustproof net 80 extend outward and are provided with a locking block 82. The slot 81 is opened on the surface of the bottom frame 6, and the shape of the slot 81 matches the locking block 82. A baffle 83 is provided at the edge of the slot of each slot 81. The baffle 83 is rotatably connected to the bottom frame 6 to lock or unlock the locking block 82 and the slot 81.

[0030] Specifically, the fan 5 is started to dissipate the heat inside the COB display screen 2. When the dust filter 80 needs to be removed, the baffle 83 is rotated so that the baffle 83 no longer abuts against the card block 82, and the card block 82 can be disengaged from the card slot 81 to unlock.

[0031] When it is necessary to disassemble the bottom frame 6, by rotating the handle 73, the handle 73 drives the fixing bolt 71 to rotate, so that the fixing bolt 71 disengages from the fixing groove 72 and the bottom frame 6, thereby separating the bottom frame 6 from the outer frame 1.

[0032] The working principle of this high heat dissipation COB display packaging structure will be explained in detail below.

[0033] like Figure 1-5 As shown, in order to efficiently conduct the heat generated by the heating module 35 on the PCB board 32 and keep the portion of the heat transfer module 30 in contact with the heating module 35 on the PCB board 32 at a low temperature, the heat transfer medium 36 is preferably a phase change suppressing material. The phase change suppressing material is a semi-liquid gel. When heated, the boiling phenomenon of the phase change suppressing material is suppressed, thus exhibiting a highly efficient heat transfer phenomenon, that is, the temperature at the far end of the heat source is higher than that at the near end of the heat source; at the same time, the heat is transferred from the heated end to the far end at an unusually high rate, while keeping the heated end at a low temperature. In order to further improve the heat dissipation efficiency and increase the heat dissipation area, the heat sink is a number of aluminum heat dissipation fins, which are equally spaced and parallelly welded to the right half of the outer surface of the heat transfer module 30. Bolt holes are provided around the perimeter of the PCB board 32 and at corresponding positions on the heat transfer module 30, and the two are fixedly connected by bolts 34 inserted into the bolt holes. Of course, the connection between the PCB board 32 and the heating module 35 is not limited to the bolt 34 fixed connection. It can also be connected by spacer columns. The fan 5 is started to dissipate the heat inside the COB display screen 2. When the dust filter 80 needs to be removed, the baffle 83 is rotated so that the baffle 83 no longer abuts against the card block 82. The card block 82 can be released from the card slot 81 to unlock.

[0034] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A high heat dissipation efficiency COB display packaging structure, comprising an outer frame (1), characterized in that: A COB display screen (2) is installed inside the outer frame (1). A PCB heat dissipation structure (3) is electrically connected to one side of the COB display screen (2). A bottom frame (6) is threaded to one side of the outer frame (1). A fixing mechanism (7) is threaded to the surface of the bottom frame (6). A dustproof mechanism (8) is installed on the surface of the bottom frame (6). A support frame (4) is installed inside the bottom frame (6). A fan (5) is installed on the surface of the support frame (4). The PCB heat dissipation structure (3) includes a PCB board (32), on which a heat-generating module (35) is mounted. The structure is characterized by further including a heat transfer module (30) and a heat dissipation part (31). The periphery of the PCB board (32) is connected to the left half of the outer surface of the heat transfer module (30), and the heat-generating surface of the heat-generating module (35) is in contact with the left half of the outer surface of the heat transfer module (30). The heat dissipation part (31) is disposed on the right half of the outer surface of the heat transfer module (30).

2. The high heat dissipation efficiency COB display packaging structure according to claim 1, characterized in that: The heat transfer module (30) is a hollow aluminum sealed cavity, which is filled with a heat transfer medium (36). The heat transfer medium (36) is a phase change suppression material, and the heat dissipation part (31) is an aluminum heat sink.

3. The high heat dissipation efficiency COB display packaging structure according to claim 2, characterized in that: The heat sink consists of several aluminum heat dissipation fins, which are welded parallel to each other at equal intervals on the right half of the outer surface of the heat transfer module.

4. The high heat dissipation efficiency COB display packaging structure according to claim 2, characterized in that: The PCB board (32) is connected to the heat transfer module (30) around its perimeter by bolts (34).

5. The high heat dissipation efficiency COB display packaging structure according to claim 1, characterized in that: The fixing mechanism (7) includes a fixing groove (72), a handle (73) and a connecting groove (70). The fixing groove (72) is opened inside the outer frame (1), and the connecting groove (70) is opened inside the bottom frame (6). The fixing groove (72) is threaded with a fixing bolt (71), and one end of the fixing bolt (71) is fixedly connected to the handle (73).

6. The high heat dissipation efficiency COB display packaging structure according to claim 1, characterized in that: The dustproof mechanism (8) also includes a baffle (83), a slot (81), and a dustproof net (80); both ends of the dustproof net (80) extend outward and are provided with a locking block (82); the slot (81) is opened on the surface of the bottom frame (6), and the shape of the slot (81) matches the locking block (82); the edge of the slot (81) is provided with the baffle (83), and the baffle (83) is rotatably connected to the bottom frame (6) to lock or unlock the locking block (82) and the slot (81).

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