An LED package holder and a light emitting device
By designing a specially laid-out LED packaging bracket, the positive and negative electrodes of flip-chip dual chips are arranged side by side in the same direction, solving the problem of chip rotation adjustment in the existing technology and improving production efficiency and yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU JUFEI OPTOELECTRONICS CO LTD
- Filing Date
- 2025-06-19
- Publication Date
- 2026-06-23
AI Technical Summary
In existing flip-chip LED packaging, when two chips are connected in series, the chip or pad needs to be rotated 180°, which increases the die bonding time and error risk, affecting production efficiency and yield.
Design an LED packaging bracket that uses a metal substrate and a resin shell. The pad layout satisfies a specific geometric relationship, so that the positive and negative poles of two LED chips are in the same direction and are set side by side, eliminating the need to adjust the die bonding angle of the second chip.
It improves the production efficiency and yield of flip-chip dual-core tandem packaged products, simplifies the die bonding process, and reduces manufacturing defects.
Smart Images
Figure CN224402031U_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of LED packaging technology, and more particularly to an LED packaging bracket and a light-emitting device. Background Technology
[0002] In flip-chip LED packaging, there is a need for dual-chip series and dual-chip parallel connections. Dual-chip series connection achieves high-voltage LEDs through a package structure that connects two flip-chips in series. Similar pad designs already exist. Figure 1 As shown, the bracket 01 has three pads: the first pad 02, the second pad 03, and the third pad 04. Two flip-chip LEDs are mounted on the pads. The negative terminal of the first chip 05 is electrically connected to the first pad 02, and the positive terminal of the first chip 05 is connected to the third pad 03. The positive terminal of the second chip 06 is connected to the second pad 03, and the negative terminal of the second chip 06 is connected to the third pad 03. The positive terminal of the first chip 05 and the negative terminal of the second chip 06 are connected through the third pad. The electrode mounting directions of the first chip 05 and the second chip 06 are opposite. In the die bonding process (the process of mounting LED chips can be called die bonding), the second chip 06 needs to be rotated 180° before die bonding, or the pads need to be rotated 180° before die bonding. This increases the die bonding operation time and the risk of die bonding direction errors. Summary of the Invention
[0003] To address the problems existing in the prior art, this application provides an LED packaging bracket that can meet the requirements of flip-chip dual-core packaging. At the same time, when two or more chips are arranged side by side, the positive and negative directions of the chips are in the same direction, eliminating the need to adjust the die bonding angle of the second chip, and effectively improving the production efficiency and yield of flip-chip dual-core series packaging products.
[0004] The LED packaging bracket provided in this application includes a metal substrate and a resin housing; the resin housing includes a dam formed on one side of the metal substrate, and a packaging cavity for mounting an LED chip is formed in the middle of the dam; the metal substrate includes a first pad, a second pad, and a third pad that are insulated from each other, the third pad being located between the first pad and the second pad, the front sides of the first pad and the second pad being exposed at the bottom of the packaging cavity, and the back sides of the first pad and the second pad being exposed at the back side of the LED packaging bracket; and satisfies the following conditions: at least two virtual straight lines in a first direction pass sequentially through the first pad, the third pad, and the second pad; at least one virtual straight line in a second direction passes sequentially through the first pad and the third pad; at least one virtual straight line in a second direction passes sequentially through the third pad and the second pad; wherein the first direction and the second direction are perpendicular to each other.
[0005] The present invention also provides a light-emitting device, including the LED bracket described above, and at least two flip-chip LEDs arranged side by side, namely a first LED chip and a second LED chip, wherein the positive and negative electrodes of the first LED chip are electrically connected to the first pad and the third pad of the metal substrate, respectively, and the positive and negative electrodes of the second LED chip are electrically connected to the third pad and the second pad of the metal substrate, respectively. The two ends of the first LED chip and the second LED chip are flush, and the electrodes on the same side have the same polarity.
[0006] The LED bracket provided by the present invention enables two LED chips to be arranged side by side, and eliminates the need to adjust the die bonding angle of the second chip during die bonding, effectively improving the production efficiency and yield of flip-chip dual-core series packaged products. Attached Figure Description
[0007] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0008] Figure 1 This is a schematic diagram of the connection structure between the LED packaging bracket and the LED chip in the prior art.
[0009] Figure 2.1 This is a schematic diagram of the front structure of the LED packaging bracket provided in Embodiment 1;
[0010] Figure 2.2 This is a schematic diagram of the back structure of an LED packaging bracket in one embodiment;
[0011] Figure 2.3 In one embodiment, Figure 2.1 Schematic diagram of the AA section structure;
[0012] Figure 2.4 In one embodiment, Figure 2.1 Schematic diagram of the AA section structure;
[0013] Figure 2.5 This is a schematic diagram of the back structure of an LED packaging bracket in one embodiment;
[0014] Figure 2.6 This is a schematic diagram of the metal substrate structure of the LED packaging bracket in one embodiment;
[0015] Figure 2.61 This is a schematic diagram of the structure of the first pad in one embodiment;
[0016] Figure 2.62 This is a schematic diagram of the structure of the second pad in one embodiment;
[0017] Figure 2.63 This is a schematic diagram of the structure of the third pad in one embodiment;
[0018] Figure 3 This is a schematic diagram of the structure of a light-emitting device provided in an embodiment. Detailed Implementation
[0019] The embodiments of this application are described in detail below, with examples of the embodiments shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. In the description of this application, "a plurality of" means two or more, and "a plurality of" means two or more, unless otherwise expressly specified.
[0020] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Example 1
[0021] refer to Figure 2.1 , Figure 2.2 , Figure 2.3 and Figure 2.4 As shown, this embodiment provides an LED bracket 10, including a metal substrate 11 and a resin housing 12; the resin housing 12 includes a dam 121 protruding from one side of the metal substrate 11, and a packaging cavity 122 for mounting LED chips is formed in the middle of the dam 121; the metal substrate 11 includes a first pad 111, a second pad 112, and a third pad 113 that are mutually insulated; the third pad 113 is located between the first pad 111 and the second pad 112, and the front sides of the first pad 111 and the second pad 112 are exposed at the bottom of the packaging cavity 122; the back sides of the first pad 111 and the second pad 112 are exposed at the back side of the packaging bracket 10; and the following conditions are met: in a first direction, there are at least two virtual straight lines that pass sequentially through the first pad, the third pad, and the second pad; in a second direction, there is at least one virtual straight line that passes sequentially through the first pad and the third pad; in a second direction, there is at least one virtual straight line that passes sequentially through the third pad and the second pad; wherein, the first direction and the second direction are perpendicular to each other.
[0022] At once Figure 2.1In the embodiment shown, the first direction is the X direction and the second direction is the Y direction; the X direction is perpendicular to the Y direction; in the X direction, there are two virtual straight lines L3 (represented by double-dotted lines in the figure) that pass through the first pad 111, the third pad 113, and the second pad 112 in sequence; in the Y direction, there is a virtual straight line L1 (represented by double-dotted lines in the figure) that passes through the first pad 111 and the third pad 113 in sequence, and there is a virtual straight line L2 (represented by double-dotted lines in the figure) that passes through the third pad 113 and the second pad 112 in sequence.
[0023] refer to Figure 3 As shown, in Figure 2.1 When LED chips are mounted on the LED packaging bracket 10 to form a light-emitting device, the above conditions restrict the first LED chip 21 so that its electrodes can be electrically connected to the first pad 111 and the third pad 113 in the first direction, and the third pad 113 extends to the corresponding position of the first pad 111 in the second direction, so that the electrodes of the second LED chip 22 can be electrically connected to the third pad 113 and the second pad 112, and the positive electrode of the first LED chip 21 and the negative electrode of the second LED chip 22 are electrically connected through the third pad 113, thereby achieving series connection. Figure 3 In the illustrated embodiment, the left sides of both the first LED chip 21 and the second LED chip 22 are negative electrodes, and the right sides are both positive electrodes. In other embodiments, the left sides of both the first LED chip 21 and the second LED chip 22 can also be positive electrodes, and the right sides can both be negative electrodes, with the polarities on the same side of both the first LED chip 21 and the second LED chip 22 being the same. During the manufacturing process, the mounting direction of the second LED chip 22 does not need to be reversed when installing the LED chips (i.e., die bonding), which can improve die bonding efficiency and reduce manufacturing defects. At the same time, the first LED chip 21 and the second LED chip 22 can be arranged side by side, not in a straight line, resulting in more concentrated light emission and better light pattern symmetry. In one embodiment, reference... Figure 2.6 As shown, a first insulating strip 114 is provided between the first pad 111 and the third pad 113, and a second insulating strip 115 is provided between the third pad 113 and the second pad 112. The first insulating strip 114 includes a first portion 114a, a second portion 114b, and a third portion 114c. The first portion 114a and the second portion 114b extend in a second direction and are staggered from each other. The third portion 114c connects the first portion 114a and the second portion 114b. The second insulating strip 115 includes a fourth portion 115a, a fifth portion 115b, and a sixth portion 115c. The fourth portion 115a and the fifth portion 115b extend in a second direction and are staggered from each other. The sixth portion 115c connects the fourth portion 115a and the fifth portion 115b. Figure 2.1As shown, when the resin shell is bonded to the metal substrate, a portion of the resin shell is embedded in the first insulating strip 114 and the second insulating strip 115. The first insulating strip 114 serves to insulate the first pad 111 and the third pad 113, and the first portion 114a and the second portion 114b of the first insulating strip 114 are staggered in the second direction, which can increase the bonding area and bonding force between the resin shell 12 and the metal substrate 11. The second insulating strip 115 serves to insulate the third pad 113 and the second pad 112, and the first portion 115a and the second portion 115b of the second insulating strip 115 are staggered in the second direction, which can increase the bonding area and bonding force between the resin shell 12 and the metal substrate 11.
[0024] In one embodiment, the width of the first insulating strip 114 is 0.15mm to 0.3mm; the width of the second insulating strip is 0.15mm to 0.3mm. The width of the insulating strip must ensure the insulation effect while not being too wide, otherwise it will reduce the contact area between the LED chip electrode and the pad. In this application, the width of the insulating strip is 0.15mm to 0.3mm, which ensures both the insulation effect and sufficient contact area between the LED chip electrode and the pad.
[0025] In one embodiment, reference is made to... Figure 2.2 and Figure 2.3 As shown, the back side of the third pad 113 is covered by the resin housing 12, and the back side of the LED package bracket 10 is not exposed. (Reference) Figure 3 As shown, the third pad 113 is only used to connect the positive terminal of the first LED chip 21 and the negative terminal of the second LED chip 22. The third pad 113 does not need to be directly connected to an external power supply; therefore, the back side of the third pad 113 does not need to be exposed on the back side of the LED package bracket 10. The back sides of the first pad 111 and the second pad 112 are exposed on the back side of the LED package bracket 10 as electrical connection terminals connected to an external power supply. Since the back side of the third pad 113 is not exposed on the back side of the LED package bracket 10, the risk of short circuit between the third pad 113 and the first pad 111 or the second pad 112 can be avoided. On the back side of the LED package bracket 10, there is a large insulation distance between the first pad 111 and the second pad 112, which also reduces the risk of short circuit when soldering to external circuits.
[0026] In one embodiment, reference is made to... Figure 2.4 and Figure 2.5 The back side of the third pad 113 is also exposed on the back side of the LED package bracket 10. The front side of the third pad 113 is electrically connected to the LED chip. The heat generated by the LED chip during operation can be dissipated through the back side of the third pad 113, which helps to extend the life of the LED package.
[0027] Since the main function of the third pad 113 is to connect the first LED chip and the second LED chip, and the first pad 111 and the second pad 112, in addition to being electrically connected to the LED chip, also need to be connected to the external circuit as conductive terminals, the area of the third pad 113 should be minimized within the limited space to leave enough space for the first pad 111 and the second pad 112. Therefore, in this embodiment, it is preferable that the first pad 111 and the second pad 112 have the same area on the front side of the metal substrate, while the area of the third pad 113 is minimized.
[0028] In one embodiment, the first pad 111 and the second pad 112 are rotationally symmetrical about the center point of the LED package holder 10. This simplifies the design of the metal substrate and ensures good light pattern symmetry of the light-emitting device after the LED chip is packaged on the LED package holder to form a light-emitting device.
[0029] In one embodiment, reference is made to... Figure 2.62 The third pad 113 includes a first portion 113a and a second portion 113b, and a connecting portion 113c connecting the first portion 113a and the second portion 113b. The first portion 113a and the second portion 113b are staggered, and the connecting portion 113c is connected to the closest position between the first portion 113a and the second portion 113b. (Reference) Figure 2.61 and Figure 2.63 and combined Figure 2.6 The first pad 111 has a first notch 111a, and the first portion 113a of the third pad 113 is at least partially embedded in the first notch 111a; the second pad 112 has a second notch 112a, and the second portion 113b of the third pad 113 is at least partially embedded in the second notch 112a. (Reference) Figure 3 The first portion 113a of the third pad 113 receives the positive electrode of the first LED chip 21, and the second portion 113b receives the negative electrode of the second LED chip 22. The connecting portion 113c mainly serves to electrically connect the first portion 113a and the second portion 113b. Therefore, on the front side of the metal substrate 11, it is preferable that the areas of the first portion 113a and the second portion 113b are equal and larger than the area of the connecting portion 113. The first portion 113a is embedded in the first notch 111a, so that the left end of the second LED chip 22 can be flush with the left end of the first LED chip 21; the second portion 113b is embedded in the second notch 112a, so that the right end of the second LED chip 22 can be flush with the right end of the first LED chip 21; thereby realizing the two LED chips are arranged side by side (i.e., the electrodes on the same side of the two LED chips are the same, and the ends are aligned). During die bonding, it is not necessary to reverse the orientation of the second LED chip 22 or the LED package bracket 10.
[0030] In one embodiment, the resin housing 12 is made of EMC, SMC, PCT, or PPA resin. Example 2
[0031] refer to Figure 3 As shown, this embodiment provides a light-emitting device 20, including the light-emitting device provided in Embodiment 1, and further including at least two flip-chip LEDs arranged side by side, namely a first LED chip 21 and a second LED chip 22. The positive and negative electrodes of the first LED chip 21 are electrically connected to the first pad 111 and the third pad 113 of the metal substrate 11, respectively. The positive and negative electrodes of the second LED chip 22 are electrically connected to the third pad 113 and the second pad 112 of the same substrate, respectively. The two ends of the first LED chip 21 and the second LED chip 22 are flush, and the electrodes on the same side have the same polarity. The positive electrode of the first LED chip 21 is electrically connected to the negative electrode of the second LED chip 22 through the third pad 113, thereby achieving a series connection of the two chips. When installing the LED chips, it is not necessary to reverse the mounting direction of the second LED chip 22, which can improve efficiency and reduce manufacturing defects.
[0032] In this embodiment, the two LED chips are rectangular in shape, with their length direction arranged along the first direction (X direction). In the second direction (Y direction), the two LED chips are centered and aligned within the encapsulation cavity. The two LED chips are equidistantly arranged within the encapsulation cavity along the second direction, with the first LED chip 21 located at 1 / 3 of the Y-direction of the encapsulation cavity and the second LED chip 22 located at 2 / 3 of the Y-direction of the encapsulation cavity. This arrangement ensures that the light pattern of the light-emitting device has good symmetry and uniformity.
[0033] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. An LED packaging bracket, characterized in that: The device includes a metal substrate and a resin housing. The resin housing includes a dam protruding from one side of the metal substrate, with a packaging cavity for mounting an LED chip formed in the middle of the dam. The metal substrate includes a first pad, a second pad, and a third pad that are mutually insulated. The third pad is located between the first pad and the second pad. The front sides of the first pad and the second pad are exposed at the bottom of the packaging cavity, and the back sides of the first pad and the second pad are exposed at the back side of the LED packaging bracket. The device satisfies the following conditions: at least two virtual straight lines in a first direction pass sequentially through the first pad, the third pad, and the second pad; at least one virtual straight line in a second direction passes sequentially through the first pad and the third pad; and at least one virtual straight line in a second direction passes sequentially through the third pad and the second pad; wherein the first direction and the second direction are perpendicular to each other.
2. The LED packaging bracket according to claim 1, characterized in that: A first insulating strip is provided between the first pad and the third pad, and a second insulating strip is provided between the third pad and the second pad; the first insulating strip includes a first part, a second part and a third part, the first part and the second part extend in a second direction and are staggered from each other, and the third part is connected between the first part and the second part; the second insulating strip includes a fourth part, a fifth part and a sixth part, the fourth part and the fifth part extend in a second direction and are staggered from each other, and the sixth part is connected between the fourth part and the fifth part.
3. The LED packaging bracket according to claim 2, characterized in that: The width of the first insulating tape is 0.15mm to 0.3mm; the width of the second insulating tape is 0.15mm to 0.3mm.
4. The LED packaging bracket according to claim 1, characterized in that: The back of the third pad is covered by the resin housing, and the back of the LED package bracket is not exposed.
5. The LED packaging bracket according to claim 1, characterized in that: The back side of the third pad is also exposed on the back side of the LED package bracket.
6. The LED packaging bracket according to claim 1, characterized in that: On the front side of the metal substrate, the first and second pads have the same area, while the third pad has the smallest area.
7. The LED packaging bracket according to claim 1, characterized in that: The first and second pads are rotationally symmetrical about the center point of the LED package bracket.
8. The LED packaging bracket according to claim 1, characterized in that: The third pad includes a first portion and a second portion, and a connecting portion connecting the first portion and the second portion, wherein the first portion and the second portion are offset from each other, and the connecting portion is connected to the closest position of the first portion and the second portion; the first pad has a first notch, and the first portion of the third pad is at least partially embedded in the first notch; the second pad has a second notch, and the second portion of the third pad is at least partially embedded in the second notch; on the front side of the metal substrate, the areas of the first portion and the second portion of the third pad are equal and larger than the area of the connecting portion 113.
9. The LED packaging bracket according to claim 1, characterized in that: The resin shell is made of EMC, SMC, PCT, or PPA resin.
10. A light-emitting device, characterized in that: The LED packaging bracket according to any one of claims 1 to 9 further includes at least two flip-chip LEDs arranged side by side, namely a first LED chip and a second LED chip, wherein the positive and negative electrodes of the first LED chip are electrically connected to the first pad and the third pad of the metal substrate, respectively, and the positive and negative electrodes of the second LED chip are electrically connected to the third pad and the second pad of the metal substrate, respectively. The two ends of the first LED chip and the second LED chip are flush, and the electrodes on the same side have the same polarity.