An LED wafer polishing device
By automatically adjusting the height of the inner and outer toothed columns using a hollow shaft, a pressing component, and a transmission component, the problems of reduced accuracy and vibration caused by manual adjustment in existing technologies are solved, achieving higher grinding accuracy and equipment stability.
CN224407246UActive Publication Date: 2026-06-26SHENZHEN OULAI MICROELECTRONICS TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN OULAI MICROELECTRONICS TECHNOLOGY CO LTD
- Filing Date
- 2025-08-01
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
The existing double-sided grinding device cannot automatically adjust the wear between the planetary wheel and the internal and external gear rings, resulting in reduced equipment accuracy and vibration, requiring manual judgment and adjustment.
Method used
It employs a hollow shaft, a pressing component, and a transmission component. The height of the internal and external gear columns is automatically adjusted to avoid manual intervention, and the adjustment force is reduced by a counterweight component.
Benefits of technology
It achieves automatic adjustment of the height of the internal and external toothed columns, improving grinding accuracy and equipment stability, and reducing the load on the upper drive device.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224407246U_ABST
Abstract
The utility model discloses a kind of LED wafer grinding devices, it relates to the technical field of grinding and polishing, the LED wafer grinding device, including fuselage, lower mill disc is installed on the fuselage, the inner side of lower mill disc is equipped with inner tooth column, the outer side of lower mill disc is equipped with outer tooth column, further include: wandering star wheel, the wandering star wheel is located on lower mill disc, and the two sides of wandering star wheel are engaged with inner tooth column and outer tooth column respectively;First support disc, the first support disc is located below lower mill disc, the inner tooth column is fixed on the surface of first support disc, and first support disc can be moved in vertical direction;Hollow shaft, the hollow shaft is located above first support disc, hollow shaft has circumferential degree of freedom.The utility model, by setting hollow shaft, lower pressing assembly and transmission assembly, so that the lifting of each upper mill disc will change the height of inner tooth column and outer tooth column, without manually observing the wear degree of inner tooth column and manually adjusting, without additionally setting extra driving device.
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