Temperature measuring device

Abstract

The utility model provides a kind of temperature measuring device, the top of connecting piece is equipped with first recess, the bottom surface of first recess is equipped with second recess, connecting piece bottom is equipped with the first straight-through passage of intercommunication second recess, optical head includes second straight-through passage inside, first straight-through passage is communicated with second straight-through passage, optical filter preposition device is set in first straight-through passage, in second straight-through passage or be set in the joint of first straight-through passage and second straight-through passage, optical filter device is embedded in second recess, photoelectric detection module bottom is set in first recess from first recess top, photoelectric detection module light receiving surface is set on the emergent light path of optical filter device to receive the light emitted by optical filter device, photoelectric detection module light receiving surface size is greater than or equal to the size of the connecting port of first straight-through passage and second recess, cancels optical fiber and optical cavity, simplifies optical path, can greatly reduce signal loss rate, improves the accuracy of temperature detection.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material manufacturing equipment technology, and in particular to a temperature measuring device. Background Technology

[0002] In the manufacturing process of semiconductor devices, the growth temperature of epitaxial wafers is a key parameter for controlling thin film growth. By monitoring the growth temperature in real time, process parameters can be optimized. Typically, the growth of epitaxial wafers takes place in the reaction chamber of semiconductor material manufacturing equipment and requires strict reaction conditions, such as high vacuum, high temperature, chemically active environments, and high-speed rotation. Therefore, non-contact temperature measurement methods must be used to measure the growth temperature of epitaxial wafers.

[0003] The non-contact measurement method used in existing technology calculates the temperature of the epitaxial wafer surface by measuring radiation in a certain wavelength band and based on the received radiation information. Typically, the reaction chamber of semiconductor material manufacturing equipment has an observation window at the top, and an optical head is located above the observation window to collect the light signal to be measured from the reaction chamber. An optical fiber is used to transmit the light signal collected by the optical head to a photodetector, which is used to detect the intensity of the light signal, thereby obtaining the temperature of the epitaxial wafer surface.

[0004] However, when photodetectors detect the intensity of light signals, they need to filter the signal. Current technology typically places the filter at the front end of the photodetector. Therefore, to provide mounting space for the filter, an optical cavity must be placed at the front end of the photodetector. Since the optical cavity is a volumetric cavity, lenses need to be placed before and after the filter to allow as much light from the optical fiber as possible to pass through it. This method places strict requirements on the optical cavity: the two lenses must be strictly coaxial, and the optical fiber and photodetector must also be coaxial. Furthermore, the focal length and mounting dimensions of the lenses are very demanding, easily leading to high signal loss and inaccurate temperature detection.

[0005] Therefore, it is necessary to provide a new type of temperature measuring device to solve the above-mentioned problems existing in the prior art. Utility Model Content

[0006] The purpose of this invention is to provide a temperature measuring device that simplifies the optical path and avoids inaccurate temperature detection caused by complex optical paths such as optical cavities.

[0007] To achieve the above objectives, the temperature measuring device of this utility model includes an optical head, a pre-filter device, a filter device, a connector, and a photoelectric detection module;

[0008] The top of the connector is provided with a first groove, the bottom surface of the first groove is provided with a second groove, and the bottom of the connector is provided with a first through-type channel communicating with the second groove;

[0009] The optical head includes a built-in second through-type channel;

[0010] The bottom of the connector is connected to the top of the optical head so that the first through-type channel is connected to the second through-type channel;

[0011] The pre-filter device includes a light collimator or a heat-insulating and light-transmitting component. The pre-filter device is fixedly disposed in the first straight-through channel, the second straight-through channel, or at the junction of the first straight-through channel and the second straight-through channel, so as to receive the light entering the optical head and emit corresponding light toward the filter device.

[0012] The filter device is embedded in the second groove, and the filter device is disposed in the output light path of the filter pre-filter to receive the light emitted by the filter pre-filter;

[0013] The bottom of the photoelectric detection module is located inside the first groove from the top of the first groove. The light-receiving surface of the photoelectric detection module is located on the output light path of the filter device to receive the light emitted by the filter device. The size of the light-receiving surface of the photoelectric detection module is greater than or equal to the size of the connection port between the first through channel and the second groove. The photoelectric detection module is used to convert optical signals into electrical signals.

[0014] The beneficial effects of the temperature measuring device are as follows: the top of the connector is provided with a first groove, the bottom surface of the first groove is provided with a second groove, the filter device is embedded in the second groove, and the bottom of the photoelectric detection module is located in the first groove from the top of the first groove. The optical fiber and optical cavity are eliminated, the optical path is simplified, the signal loss rate is greatly reduced, and the accuracy of temperature detection is improved.

[0015] Optionally, the connector is provided with a first connector, the first through-type channel passes through the first connector, the optical head is provided with a second connector, the second through-type channel passes through the second connector, and the first connector and the second connector are mated together;

[0016] The temperature measuring device also includes a fixing component, which is sleeved at the joint between the first connector and the second connector to enhance the sealing relationship between the first connector and the second connector.

[0017] Optionally, the first connector includes a first annular protrusion surrounding the first through-channel, and the second connector includes a second annular protrusion surrounding the second through-channel;

[0018] The fastener includes an arc-shaped body, two fixing ears, and fastening screws. A third groove is formed on the inner surface of the arc-shaped body. The two fixing ears are respectively set at both ends of the arc-shaped body. Each of the two fixing ears has a fastening screw through hole. The fastening screw is slidably connected to each of the fastening screw through holes to adjust the distance between the two fixing ears. The outer edges of the first annular protrusion and the outer edges of the second annular protrusion are partially embedded in the third groove.

[0019] Optionally, both the first annular protrusion and the second annular protrusion include a mating portion, the mating portion being planar, and the mating portion of the first annular protrusion and the mating portion of the second annular protrusion being fitted together along the axial direction of the connector.

[0020] Optionally, the optical head includes an epitaxial portion and an inner probe portion connected to each other. The cross-section of the inner probe portion is smaller than that of the epitaxial portion. The second through-type channel passes through the epitaxial portion and the inner probe portion. The inner probe portion is used to pass through the semiconductor reaction chamber in a statically sealed manner and extends into the semiconductor reaction chamber to be opposite to the base inside the semiconductor reaction chamber.

[0021] Optionally, the temperature measuring device further includes a support pressure plate, which is disposed around the epitaxial portion and is in contact with and fitted to the outer wall of the top of the semiconductor reaction chamber, for supporting the epitaxial portion with the outer wall of the top of the semiconductor reaction chamber as the force-bearing surface.

[0022] Optionally, the temperature measuring device further includes an air inlet, which communicates with a second through-channel within the epitaxial portion from the sidewall of the epitaxial portion, for providing purge gas to the second through-channel within the epitaxial portion to prevent material in the semiconductor reaction chamber from clogging the optical head.

[0023] Optionally, the air intake includes a connecting pipe, a connecting nut, a first baffle, and a second baffle. One end of the connecting pipe communicates with a second straight-through channel within the extension portion. The first baffle is annular and surrounds the connecting pipe, with the first baffle close to the other end of the connecting pipe. The connecting nut is fitted onto the connecting pipe and is located between the first baffle and the extension portion. The inner diameter of the end of the connecting nut facing the extension portion is smaller than the outer diameter of the first baffle, and the inner diameter of the end of the connecting nut facing the first baffle is larger than the outer diameter of the first baffle. The second baffle surrounds the connecting pipe and is located between the first baffle and the extension portion. The connecting nut is located between the first baffle and the second baffle, and the outer diameter of the second baffle is larger than the inner diameter of the end of the connecting nut facing the extension portion.

[0024] Optionally, the light collimator includes a lens, and the heat-insulating and light-transmitting element includes a transparent quartz sheet.

[0025] Optionally, the size of the light-receiving surface of the photoelectric detection module is greater than or equal to the size of the light-emitting surface of the filter device. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the temperature measuring device of this utility model;

[0027] Figure 2 This is a schematic diagram of the connector structure in some embodiments of the present invention;

[0028] Figure 3 For some embodiments of this utility model Figure 1 A bottom view of the photoelectric detection module shown;

[0029] Figure 4 For some embodiments of this utility model Figure 1 A schematic diagram of the explosion in part a;

[0030] Figure 5 For some embodiments of this utility model Figure 1 Enlarged schematic diagram of part b in the middle. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0032] To address the problems existing in the prior art, embodiments of this utility model provide a temperature measuring device that simplifies the optical path and reduces the problems caused by complex optical paths such as optical cavities and multiple lenses that lead to inaccurate temperature detection.

[0033] Reference Figure 1 , Figure 2 and Figure 3The temperature measuring device includes an optical head 1, a pre-filter device 112, a filter device 25, a connector 2, and a photoelectric detection module 3. The connector 2 has a first groove 21 on its top and a second groove 22 on its bottom surface. The bottom of the connector 2 has a first through-channel 27 communicating with the second groove 22. The optical head 1 includes an internal second through-channel 12. The bottom of the connector 2 is connected to the top of the optical head 1, allowing the first through-channel 27 and the second through-channel 12 to communicate. The pre-filter device 112 includes a collimator or a heat-insulating and light-transmitting element. The pre-filter device 112 is disposed within the first through-channel 27, the second through-channel 12, or at the junction of the first through-channel 27 and the second through-channel 12. The optical head 1 receives light entering the optical head 1 and emits corresponding light towards the filter device 25, while blocking the first through channel 27 or the second through channel 12. The filter device 25 is embedded in the second groove 22 and is located on the output light path of the filter pre-device 112 to receive the light emitted by the filter pre-device 112. The bottom of the photoelectric detection module 3 is located in the first groove 21 from the top of the first groove 21. The light-receiving surface 33 of the photoelectric detection module 3 is located on the output light path of the filter device 25 to receive the light emitted by the filter device 25. The size of the light-receiving surface 33 of the photoelectric detection module 3 is greater than or equal to the size of the connection between the first through channel 27 and the second groove 22. The photoelectric detection module 3 is used to convert optical signals into electrical signals.

[0034] In the prior art, in order to transmit optical information to the photoelectric detection module 3, a flexible optical information transmission channel, such as an optical fiber and an optical cavity, is usually set between the optical head 1 and the photoelectric detection module 3. This requires the installation of lenses in the optical head 1 to focus the diverging light. Then the light passes through the optical fiber, and then through two lenses and a filter device 25 installed in the optical cavity to collimate, filter and focus the light in sequence before finally entering the optical detection module 3. This setup involves many components and has high requirements for the coaxiality of the components. It is easy for the coaxiality of the lenses, filter devices 25, photoelectric detection module 3 and optical head 1 to be poor, resulting in a high optical signal loss rate and low detection efficiency.

[0035] In this application, a first groove 21 is provided on the top surface of the connector 2, and a second groove 22 is provided on the bottom surface of the first groove 21. The filter device 25 is embedded in the second groove 22. The bottom of the connector 2 is provided with a first through channel 27 that connects to the second groove 22. The optical head includes a built-in second through channel 12. The bottom of the connector 2 is connected to the top of the optical head 1, so that the first through channel 27 and the second through channel 12 are connected. This eliminates the flexible optical information transmission channel, optical cavity, and excessive lenses in the prior art, simplifies the optical path, reduces the excessively long optical propagation path and the loss of optical signal by the lenses, and eliminates the need to adjust the flexible optical information transmission channel and the coaxiality between several lenses. This is beneficial to ensure that as much light as possible entering the second through channel 12 can pass through the first through channel 27 to be filtered by the filter device 25, so that as much light as possible can be received by the photoelectric detection module, reducing the optical signal loss rate and improving the accuracy of temperature detection.

[0036] Secondly, in this application, the photoelectric detection module 3 is disposed at the bottom of the first groove 21 from the top of the first groove 21, and the light-receiving surface 33 of the photoelectric detection module 3 is disposed on the output light path of the filter device 25 to receive the light emitted by the filter device 25. The size of the light-receiving surface 33 of the photoelectric detection module 3 is greater than or equal to the size of the connection between the first through channel 27 and the second groove 22, so that the light after the action of the filter device 25 can be efficiently received by the photoelectric detection module 3, which greatly reduces the loss of light signal and improves the detection efficiency.

[0037] In some embodiments, the pre-filter device includes a light collimator to adjust the angle of light so that the light emitted by the light collimator is as perpendicular as possible to the incident light surface of the filter device, thereby improving the filtering accuracy of the filter device.

[0038] In some specific embodiments, the light collimator includes a lens.

[0039] In some other embodiments, the pre-filter device includes a heat-insulating and light-transmitting element to prevent the first and second straight-through channels from transmitting light to the photoelectric detection module, thereby avoiding the impact of high temperature on the photoelectric detection module.

[0040] In some specific embodiments, the heat-insulating and light-transmitting element includes a transparent quartz sheet. The transparent quartz sheet has high light transmittance, which does not affect the propagation and detection of radiated light, and it also has high heat insulation properties, preventing the high temperature within the semiconductor reaction chamber from being transmitted to the photoelectric detection module through the first and second through-channels, thus avoiding the impact of high temperature on the photoelectric detection module.

[0041] In some embodiments, the photoelectric detection module is a photoelectric detector, and the electrical signal output by the photoelectric detection module is an analog signal.

[0042] In some embodiments, reference is made to Figure 1 The temperature measuring device further includes a conversion unit 4 and a data processing unit 5. The conversion unit 4 is a data acquisition card (DAQ) connected to the photoelectric detection module 3 via a BNC signal line and a power line, used to convert the analog signal into a digital signal. The data processing unit 5 is a personal computer (PC) connected to the conversion unit 4, used to analyze the digital signal to generate temperature data.

[0043] In some embodiments, reference is made to Figure 1 , Figure 2 and Figure 3 The size of the light-receiving surface 33 of the photoelectric detection module 3 is greater than or equal to the size of the light-emitting surface of the filter device 25, so that the light emitted from the filter device 25 can be received by the photoelectric detection module 3 as much as possible, thereby reducing the loss of optical signal and improving detection efficiency.

[0044] In some specific embodiments, reference is made to Figure 2 The first groove 21 is a rectangular groove, and the bottom surface of the first groove 21 is provided with a first screw hole 23 and a second screw hole 24. The first screw hole 23 is located on the left side of the second groove 22, and the second screw hole 24 is located on the right side of the second groove 22.

[0045] In some specific embodiments, reference is made to Figure 2 and Figure 3 The bottom of the photoelectric detection module 3 is rectangular and its size is adapted to the size of the first groove 21. The bottom of the photoelectric detection module 3 is provided with a third screw hole 31 and a fourth screw hole 32. After the photoelectric detection module 3 is embedded in the first groove 21, the position of the third screw hole 31 corresponds to the position of the first screw hole 23, and the position of the fourth screw hole 32 corresponds to the position of the second screw hole 24. A first screw passes through the third screw hole 31 and the first screw hole 23 in sequence, and a second screw passes through the fourth screw hole 32 and the second screw hole 24 in sequence to fix the photoelectric detection module 3 to the connector 2.

[0046] In some embodiments, reference is made to Figure 1 and Figure 2The connector 2 has a first connector 26 at its bottom, and a first through-channel 27 passes through the first connector 26. The optical head 1 has a second connector 11, and a second through-channel 12 passes through the second connector 11. The first connector 26 and the second connector 11 are mated together. The temperature measuring device also includes a fixing member 13, which is sleeved on the mating point of the first connector 26 and the second connector 11 to strengthen the sealing relationship between the first connector 26 and the second connector 11. The first connector 26 and the second connector 11 facilitate the connection between the connector 2 and the optical head 1, avoiding the limitation of the shape of the connector 2 and the optical head 1 that prevents them from being connected to each other. They also enable the second straight channel 12 and the first straight channel 27 to be connected without interruption, preventing the gas in the reaction chamber of the semiconductor manufacturing equipment from leaking into the atmosphere through the gap between the second straight channel 12 and the first straight channel 27. This helps to improve the accuracy of temperature detection. In addition, the fixing member 13 can make the connection between the first connector 26 and the second connector 11 more secure.

[0047] In some embodiments, reference is made to Figure 1 and Figure 4 The first connector 26 includes a first annular protrusion 261 surrounding the first through channel 27, and the second connector 11 includes a second annular protrusion 111 surrounding the second through channel 12. The fixing member 13 includes an arc-shaped body 131, two fixing ears 132, and fastening screws. A third groove 134 is formed on the inner surface of the arc-shaped body 131. The two fixing ears 132 are respectively disposed at both ends of the arc-shaped body 131. Each of the two fixing ears 132 has a fastening screw through hole 135. The fastening screw is slidably connected to each of the fastening screw through holes 135 to adjust the distance between the two fixing ears 132. The outer edges of the first annular protrusion 261 and the outer edges of the second annular protrusion 111 are partially embedded in the third groove 134. The distance between the two fixing ears 132 can be adjusted by sliding the fastening screws with the fastening screw through holes 135, so that the perimeter of the area enclosed by the arc-shaped body 131 is reduced, thereby locking and sealing the first annular protrusion 261 and the second annular protrusion 111 embedded in the third groove 134.

[0048] In some embodiments, reference is made to Figure 4 The thickness of both the first annular protrusion 261 and the second annular protrusion 111 gradually increases from the outer edge to the inner edge.

[0049] In some embodiments, reference is made to Figure 4Both the first annular protrusion 261 and the second annular protrusion 111 include a mating portion. The mating portion is planar, and the mating portions of the first annular protrusion 261 and the second annular protrusion 111 are fitted together along the axial direction of the connector, so that the mating points of the first connector 26 and the second connector 11 can fit tightly together, thereby ensuring uninterrupted communication between the second through channel 12 and the first through channel 27, and preventing gas in the reaction chamber of the semiconductor manufacturing equipment from leaking into the atmosphere through the gap between the first annular protrusion 261 and the second annular protrusion 111.

[0050] In some embodiments, the first annular protrusion 261 and the second annular protrusion 111 further include an inclined portion that connects with the mating portion. The inclined portion is flared, and the flared mouth has a large opening and a small opening. The mating portion is connected to the edge of the large opening of the inclined portion. The thickness at the connection between the mating portion and the edge of the large opening of the inclined portion is small, so as to partially fit into the third groove 134.

[0051] In some embodiments, reference is made to Figure 4 The fastening screw includes a fastening bolt 1331 and a fastening nut 1332. When the fastening nut 1332 or the fastening bolt 1331 is rotated, the fastening nut 1332 and the fastening bolt 1331 will squeeze the two fixing ears 132 to shorten the distance between the two fixing ears 132. At the same time, the arc-shaped body 131 will be squeezed towards the center of the arc-shaped body 131, that is, the perimeter of the area enclosed by the arc-shaped body 131 becomes smaller. The third groove 134 will squeeze the inclined portion of the first annular protrusion 261 and the inclined portion of the second annular protrusion 111, thereby making the mating portion of the first annular protrusion 261 and the mating portion of the second annular protrusion 111 as close as possible to achieve a locking seal between the first annular protrusion 261 and the second annular protrusion 111.

[0052] In some embodiments, the temperature measuring device further includes a sealing ring disposed between the mating portions of the first annular protrusion and the second annular protrusion, further achieving a seal between the mating portions of the first and second annular protrusions, and preventing gas in the reaction chamber of the semiconductor manufacturing equipment from leaking into the atmosphere through the gap between the first and second annular protrusions. The sealing ring is a metal O-ring.

[0053] In some embodiments, reference is made to Figure 1The gas inlet device 7 forms the upper sidewall of the semiconductor reaction chamber 6. The semiconductor reaction chamber 6 is equipped with a rotary drive device 8, a rotary shaft 9, a base 10, and a heating device 101. The rotary drive device 8 is disposed on the inner bottom surface of the semiconductor reaction chamber 6. One end of the rotary shaft 9 is connected to the rotary drive device 8, and the other end of the rotary shaft 9 is connected to the bottom surface of the base 10. The heating device 101 is disposed on the bottom surface of the base 10, and the top surface of the base 10 is used to support the wafer 102. The gas inlet device 7 is used to introduce source gases, etc. The rotary drive device 8 is used to drive the base 10 to rotate via the rotary shaft 9, and the heating device 101 is used to heat the base 10.

[0054] In some embodiments, reference is made to Figure 1 The optical head 1 includes an epitaxial portion 14 and an inner probe portion 15 connected to each other. The cross-section of the inner probe portion 15 is smaller than that of the epitaxial portion 14. The second through-type channel 12 passes through the epitaxial portion 14 and the inner probe portion 15. The inner probe portion 15 is used to pass through the semiconductor reaction chamber 6 in a statically sealed manner and extends into the semiconductor reaction chamber 6 to be opposite to the base 10 inside the semiconductor reaction chamber 6. This can ensure sealing while also improving the accuracy of temperature detection.

[0055] In some embodiments, reference is made to Figure 1 The epitaxial portion 14 supports the connector 2 and the photoelectric detection module 3. Therefore, the epitaxial portion 14 has a larger cross-section than the inner probe portion 15 to prevent deformation due to excessive stress. The inner probe portion 15 has a smaller cross-section than the epitaxial portion 14. The inner probe portion 15 passes through the air intake device 7 and extends into the semiconductor reaction chamber 6, which greatly reduces the impact of the inner probe portion 15 on the air intake device 7, minimizing its influence and avoiding disruption to the growth environment within the semiconductor reaction chamber 6, such as pressure. The inner probe portion 15 extending into the semiconductor reaction chamber 6 reduces the distance to the object under test, making it easier to obtain more specific wavelengths of radiation required for testing, and reducing scattering to some extent, thus improving the accuracy of temperature detection.

[0056] In some embodiments, reference is made to Figure 1The temperature measuring device further includes a support pressure plate 16, which surrounds the epitaxial portion 14 and is in contact with the outer wall of the top of the semiconductor reaction chamber 6. The support pressure plate 16 is used to support the epitaxial portion 14 and its connected components using the outer wall of the top of the semiconductor reaction chamber 6 as the force-bearing surface. The bottom surface of the support pressure plate 16 contacts the outer wall of the top of the air intake device 7. The support pressure plate 16 can disperse the pressure exerted by the epitaxial portion on the outer wall of the top of the semiconductor reaction chamber 6, preventing excessive pressure concentration that could damage the outer wall of the top of the semiconductor reaction chamber 6.

[0057] In some embodiments, the temperature measuring device further includes an air inlet, which communicates with a second through-channel within the epitaxial portion from the sidewall of the epitaxial portion, for providing purge gas to the second through-channel within the epitaxial portion to prevent material in the semiconductor reaction chamber from clogging the optical head. The mounting position of the pre-filter device must not obstruct the communication between the air inlet and the semiconductor reaction chamber.

[0058] In some embodiments, reference is made to Figure 5 The air intake includes a connecting pipe 171, a connecting nut 172, a first baffle 173, and a second baffle 174. One end of the connecting pipe 171 communicates with a second straight-through channel 12 within the extension portion 14. The first baffle 173 is annular and surrounds the connecting pipe 171, with the first baffle 173 close to the other end of the connecting pipe 171. The connecting nut 172 is fitted onto the connecting pipe 171 and is located between the first baffle 173 and the extension portion 14. The inner diameter of the end of the connecting nut 172 facing the extension 14 is smaller than the outer diameter of the first baffle 173. The inner diameter of the end of the connecting nut 172 facing the first baffle 173 is larger than the outer diameter of the first baffle 173. The second baffle ring 174 is wound around the connecting pipe 171 and is located between the first baffle 173 and the extension 14. The connecting nut 172 is located between the first baffle 173 and the second baffle 174, and the outer diameter of the second baffle 174 is larger than the inner diameter of the end of the connecting nut 172 facing the extension 14.

[0059] In this application, the outer diameter of the second baffle 174 is larger than the inner diameter of the end of the connecting nut 172 facing the extension 14, preventing the connecting nut 172 from sliding further toward the extension 14 via the second baffle 174, thus limiting the sliding range of the connecting nut 172 on the connecting tube 171. The inner diameter of the end of the connecting nut 172 facing the first baffle 173 is larger than the outer diameter of the first baffle 173, allowing the connecting nut 172 to fit over the outside of the first baffle 173. However, the inner diameter of the end of the connecting nut 172 facing the extension 14 is smaller than the outer diameter of the first baffle 173, thus the first baffle 173 acts as a barrier, preventing the connecting nut from falling off the connecting tube 171.

[0060] In some embodiments, reference is made to Figure 5 The other end of the connecting pipe 171 is used to connect to the air intake pipe 175. The outer wall of the connection between the air intake pipe 175 and the connecting pipe 171 has an external thread 176, and the inner wall of the connecting nut 172 has an internal thread. The portion of the connecting nut 172 is fitted over the air intake pipe 175, and the external thread 176 is threadedly connected to the connecting nut 172. The inner diameter of the end of the connecting nut 172 facing the extension 14 is smaller than the outer diameter of the first baffle 173. When the connecting nut 172 moves toward the other end of the connecting pipe 171, it applies pressure to the first baffle 173, which is then transmitted to the connecting pipe 171, causing the other end of the connecting pipe 171 to connect with the air intake pipe 175. This compression prevents air leakage at the connection between the other end of the connecting pipe 171 and the air intake pipe 175.

[0061] In this application, nitrogen gas can be supplied to the second through-channel 12 through the air inlet. By purging the second through-channel 12 with nitrogen gas, the reactants in the semiconductor reaction chamber can be prevented from blocking the second through-channel 12, thus avoiding affecting the propagation and detection of light.

[0062] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A temperature measuring device, characterized in that, Includes an optical head, a pre-filter device, a filter device, connectors, and a photoelectric detection module; The top of the connector is provided with a first groove, the bottom surface of the first groove is provided with a second groove, and the bottom of the connector is provided with a first through-type channel communicating with the second groove; The optical head includes a built-in second through-type channel; The bottom of the connector is connected to the top of the optical head so that the first through-type channel is connected to the second through-type channel; The pre-filter device includes a light collimator or a heat-insulating and light-transmitting component. The pre-filter device is fixedly disposed in the first straight-through channel, the second straight-through channel, or at the junction of the first straight-through channel and the second straight-through channel, so as to receive the light entering the optical head and emit corresponding light toward the filter device. The filter device is embedded in the second groove, and the filter device is disposed in the output light path of the filter pre-filter to receive the light emitted by the filter pre-filter; The bottom of the photoelectric detection module is located inside the first groove from the top of the first groove. The light-receiving surface of the photoelectric detection module is located on the output light path of the filter device to receive the light emitted by the filter device. The size of the light-receiving surface of the photoelectric detection module is greater than or equal to the size of the connection port between the first through channel and the second groove. The photoelectric detection module is used to convert optical signals into electrical signals.

2. The temperature measuring device according to claim 1, characterized in that, The connector has a first connector at its bottom, through which a first through-type channel passes. The optical head has a second connector, through which a second through-type channel passes. The first connector and the second connector are mated together. The temperature measuring device also includes a fixing component, which is sleeved at the joint between the first connector and the second connector to enhance the sealing relationship between the first connector and the second connector.

3. The temperature measuring device according to claim 2, characterized in that, The first connector includes a first annular protrusion surrounding the first through-type channel, and the second connector includes a second annular protrusion surrounding the second through-type channel; The fastener includes an arc-shaped body, two fixing ears, and fastening screws. A third groove is formed on the inner surface of the arc-shaped body. The two fixing ears are respectively set at both ends of the arc-shaped body. Each of the two fixing ears has a fastening screw through hole. The fastening screw is slidably connected to each of the fastening screw through holes to adjust the distance between the two fixing ears. The outer edges of the first annular protrusion and the outer edges of the second annular protrusion are both embedded in the third groove.

4. The temperature measuring device according to claim 3, characterized in that, Both the first annular protrusion and the second annular protrusion include a mating portion, which is planar. The mating portions of the first annular protrusion and the second annular protrusion are fitted together along the axial direction of the connector.

5. The temperature measuring device according to claim 1, characterized in that, The optical head includes an epitaxial portion and an inner probe portion connected to each other. The cross-section of the inner probe portion is smaller than that of the epitaxial portion. A second through-type channel passes through the epitaxial portion and the inner probe portion. The inner probe portion is used to pass through the semiconductor reaction chamber in a statically sealed manner and extends into the semiconductor reaction chamber to be opposite to the base inside the semiconductor reaction chamber.

6. The temperature measuring device according to claim 5, characterized in that, It also includes a support pressure plate, which is arranged around the epitaxial portion and is in contact with and fitted to the outer wall of the top of the semiconductor reaction chamber, for supporting the epitaxial portion with the outer wall of the top of the semiconductor reaction chamber as the force-bearing surface.

7. The temperature measuring device according to claim 5, characterized in that, It also includes an air inlet, which is connected from the side wall of the epitaxial portion to a second through-channel within the epitaxial portion, for providing purge gas to the second through-channel within the epitaxial portion to prevent material in the semiconductor reaction chamber from clogging the optical head.

8. The temperature measuring device according to claim 7, characterized in that, The air intake includes a connecting pipe, a connecting nut, a first baffle, and a second baffle. One end of the connecting pipe communicates with a second straight-through channel within the extension portion. The first baffle is annular and surrounds the connecting pipe, with the first baffle close to the other end of the connecting pipe. The connecting nut is fitted onto the connecting pipe and is located between the first baffle and the extension portion. The inner diameter of the end of the connecting nut facing the extension portion is smaller than the outer diameter of the first baffle, and the inner diameter of the end of the connecting nut facing the first baffle is larger than the outer diameter of the first baffle. The second baffle surrounds the connecting pipe and is located between the first baffle and the extension portion. The connecting nut is located between the first baffle and the second baffle, and the outer diameter of the second baffle is larger than the inner diameter of the end of the connecting nut facing the extension portion.

9. The temperature measuring device according to claim 1, characterized in that, The light collimator includes a lens, and the heat-insulating and light-transmitting element includes a transparent quartz sheet.

10. The temperature measuring device according to claim 1, characterized in that, The size of the light-receiving surface of the photoelectric detection module is greater than or equal to the size of the light-emitting surface of the filter device.

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