An optical module

Abstract

The embodiment of the application provides a kind of optical module, it is related to optical communication technical field.Light module includes circuit board, optical assembly and optical fiber.Circuit board has opposite first surface and second surface, and opposite first end and second end;Circuit board is equipped with through hole passing through first surface and second surface;Optical assembly is located in the second surface of circuit board, in the side of through hole opposite from first end;Optical fiber is located on the first surface of circuit board, one end of optical fiber extends out of the first end of circuit board, the other end is arranged in through hole and is coupled to optical assembly;The first surface side of circuit board is equipped with recess, recess is located below optical fiber, and recess extends from the edge of through hole to first end to avoid optical fiber, so that optical fiber is laid more gently, avoid optical fiber and circuit board excessive interference and be damaged by the edge of circuit board.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] In recent years, the global cloud computing data center market has continued to expand, and the construction of 5G telecommunications networks has been fully launched. The market has increasingly higher requirements for the speed of high-speed optical modules, such as 800G, 1.6T, and even 3.2T.

[0003] Because optical modules are subject to industry standards, their packaging size must also meet standard requirements and cannot be arbitrarily increased or decreased. Therefore, with the continuous iteration and upgrading of optical communication technology, the performance of optical communication products is not simply a matter of doubling the numerical value. After entering the 800G and 1.6T stages, in addition to the increase in speed, it also includes an increase in the number of channels and optical fibers brought about by the high speed. More channels and optical fibers need to be packaged into standard-limited housings. The internal space of the housing is limited, and the size of the PCBA (Printed Circuit Board Assembly) inside the housing is also limited.

[0004] Space is limited on a PCBA. As the number of channels increases, arranging optical components such as transmitters and receivers on the same side will affect high-frequency performance, and the single-channel rate cannot meet the requirements. Moreover, such a layout results in extremely limited space on one side of the circuit board. To make full use of the layout space on the circuit board, optical components can be arranged on both surfaces of the circuit board, making full use of the space on both sides of the circuit board, while reducing the density of high-speed lines on one side to improve high-frequency performance.

[0005] Therefore, the optical fiber transmitting the optical signal also needs to be coupled to the corresponding optical components on both sides of the circuit board. One side of the fiber needs to pass through from one side of the circuit board to the other side to connect to the port of the housing. The fiber is susceptible to problems such as light loss or damage due to the influence of the circuit board. Utility Model Content

[0006] The purpose of this application is to provide an optical module to solve the technical problems in the prior art, such as optical fibers being easily affected by circuit boards, resulting in light loss or damage.

[0007] To achieve the above objectives, the embodiments of this application adopt the following technical solutions.

[0008] This application provides an optical module, including a circuit board, optical components, and optical fiber;

[0009] The circuit board has opposing first and second surfaces, as well as opposing first and second ends; the circuit board is provided with through holes penetrating the first and second surfaces;

[0010] The optical component is disposed on the second surface of the circuit board, located on the side of the through hole that is relatively far away from the first end;

[0011] The optical fiber is disposed on the first surface, with one end of the optical fiber extending out of the first end of the circuit board and the other end passing through the through hole and coupled to the optical component.

[0012] The first surface side is provided with a groove, the groove is located below the optical fiber, and the groove extends from the edge of the through hole toward the first end to avoid the optical fiber.

[0013] Optionally, the depth of the groove is less than or equal to 1 / 2 times the thickness of the circuit board, and greater than or equal to 1 / 3 times the thickness of the circuit board.

[0014] Optionally, the bottom surface of the groove is inclined relative to the first surface, and the depth of the groove gradually decreases from one end connected to the through hole toward the opposite end.

[0015] Optionally, the groove extends through the through hole and the end face of the first end.

[0016] Optionally, the first edge of the groove opposite to the through hole is chamfered;

[0017] And / or the edge of the first end of the circuit board adjacent to the first surface is chamfered.

[0018] Optionally, the second edge of the groove facing the through hole is chamfered.

[0019] Optionally, the chamfer dimension is less than or equal to C0.4mm and greater than or equal to C0.2mm.

[0020] Optionally, an adhesive is provided at the chamfer to secure the optical fiber.

[0021] Optionally, the groove is provided with an adhesive to secure the optical fiber.

[0022] Optionally, the number of optical fibers is multiple, and each optical fiber includes a multi-fiber connector, through which the multiple optical fibers are coupled to the optical component;

[0023] The through-hole includes a first region and a second region that are connected to each other. The multi-fiber connector is located in the first region, and the second region is used to avoid the fiber.

[0024] Optionally, the optical component includes a photonic integrated chip, and the optical module further includes a light source component; the light source component is located in the first region, and the light source component and the multi-fiber connector are arranged side by side and both are coupled to the photonic integrated chip.

[0025] Compared with the prior art, this application has the following advantages:

[0026] In the optical module, the optical fiber is placed on the first surface of the circuit board. One end of the optical fiber extends out of the first end of the circuit board to connect to the optical port, and the other end passes through the through hole and is coupled to the optical component located on the second surface. This makes full use of both sides of the circuit board. In addition, a groove is set on the first surface side of the circuit board to avoid the optical fiber, making the optical fiber laying smoother and avoiding excessive interference between the optical fiber and the circuit board and damage to the edges of the circuit board. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of an optical module provided in one embodiment of this application;

[0029] Figure 2 A schematic diagram showing the positional relationship between the first surface of the circuit board inside the optical module and the optical fiber, provided in an embodiment of this application;

[0030] Figure 3 A schematic diagram showing the positional relationship between the second surface of the circuit board inside the optical module and the optical fiber, provided in an embodiment of this application;

[0031] Figure 4 This is a schematic diagram of a circuit board structure provided in an embodiment of this application;

[0032] Figure 5 This is a schematic diagram of the internal structure of an optical module provided in another embodiment of this application;

[0033] Figure 6 This is a schematic diagram of a circuit board recess structure provided in an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 101 Casing

[0036] 102 Circuit Board

[0037] 1021 First Surface

[0038] 1022 Second Surface

[0039] 1023 First End

[0040] 1024 Second End

[0041] 1025 First chamfer

[0042] 1026 Second chamfer

[0043] 103 Fiber Optics

[0044] 1031 Adhesive

[0045] 104 Grooves

[0046] 1041 First Edge

[0047] 1042 Second Edge

[0048] 105 Golden Finger

[0049] 106 Ethernet port

[0050] 107mm optical port

[0051] 1071 Fiber Optic Connector

[0052] 108 Multi-fiber Connectors

[0053] 111 Light Source Assembly

[0054] 112 Optical Components

[0055] 120 through hole

[0056] 121 First District

[0057] 122 Second Area Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0059] The described embodiments are some, but not all, of the embodiments of this application. The components of the embodiments of this application described in the accompanying drawings can generally be arranged and designed in various different configurations.

[0060] Therefore, the following detailed description of embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the present application.

[0061] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0062] In the description of this application, it should be noted that:

[0063] Relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations;

[0064] "Connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0065] like Figures 1-3 As shown, this application provides an optical module, including a housing 101, a circuit board 102, an optical component 112 and an optical fiber 103, wherein the circuit board 102, the optical component 112 and the optical fiber 103 are disposed inside the housing 101.

[0066] The circuit board 102 has opposing first surfaces 1021 and second surfaces 1022, and opposing first ends 1023 and second ends 1024. Figure 2 For example, the right end of the circuit board is the second end 1024, the left end is the first end 1023, and the upward-facing surface is the first surface 1021. Figure 2 and 3 As shown, the circuit board 102 also has a through hole 120 penetrating the first surface 1021 and the second surface 1022. The aforementioned optical component is disposed on the second surface 1022 of the circuit board 102, located on the side of the through hole 120 that is relatively far away from the first end 1023 of the circuit board 102. The optical fiber 103 is disposed on the first surface 1021 of the circuit board 102, with one end of the optical fiber 103 extending out of the first end 1023 of the circuit board 102, and the other end passing through the through hole 120 and coupled to the optical component.

[0067] In this embodiment, a groove 104 is also provided on the first surface 1021 side of the circuit board 102. The groove 104 is located below the optical fiber 103 and extends from the edge of the through hole 120 to the first end 1023 of the circuit board 102 to avoid the optical fiber 103, so that the optical fiber 103 is laid more smoothly and avoids excessive interference between the optical fiber 103 and the circuit board 102 and damage to the edges of the circuit board 102.

[0068] In the embodiments provided in this application, such as Figure 1The second end 1024 of the circuit board 102 has gold fingers 105 on both sides, located at the electrical port 106 of the housing 101. The gold fingers 105 cooperate with the electrical port 106 of the housing 101 to form a pluggable electrical interface for electrical connection with devices such as switches and servers. Therefore, the height position of the gold fingers 105 at the electrical port 106 of the housing 101 needs to meet the requirements of a pluggable electrical interface. This results in a smaller gap between the second surface 1022 of the circuit board 102 and the housing 101 on that side, while there is a larger space between the first surface 1021 and the housing 101. If the optical fiber 103 coupled to the optical component of the second surface 1022 is directly located on the second surface 1022 of the circuit board 102, it will be more restricted by the circuit board 102 and cannot be well connected to the optical port 107 of the housing 101.

[0069] In this embodiment, optical fiber 103 is disposed on the first surface 1021 of circuit board 102. One end of optical fiber 103 extends out of the first end 1023 of circuit board 102 to connect to the optical port 107 of housing 101, and the other end passes through through hole 120 and is coupled to optical component 112 located on second surface 1022. Figure 2 and 3 As shown, in this embodiment, a fiber optic connector 1071 is provided at the optical port 107 of the housing. One end of the optical fiber 103 is disposed inside the fiber optic connector 1071 to connect with an external optical fiber through the fiber optic connector 1071. Furthermore, the optical module of this application is not limited to the fiber optic connector shown in the figure; the type and number of fiber optic connectors can be set according to actual needs. In some other embodiments, the optical module can also be a plug for an active optical cable, with the optical fiber extending from the optical port 107 of the housing to the outside of the optical module.

[0070] In this embodiment, such as Figure 5 As shown, the optical assembly includes a multi-channel optical path, and correspondingly, there are multiple optical fibers 103. Each optical fiber 103 includes a multi-fiber connector 108, through which the multiple optical fibers 103 are coupled to the optical assembly. Figure 4 The aforementioned through hole 120 includes a first region 121 and a second region 122 that are connected, combined with Figure 5 The multi-fiber connector 108 is located in the first region 121, and the second region 122 is used to avoid the fiber 103. The multi-fiber connector 108 can be a fiber array (FA) as shown in the figure, or a multi-fiber push-on (MPO) connector.

[0071] In some embodiments, the first region 121 of the via is also used to mount other components. For example, when the optical component includes a photonic integrated chip, the optical module also includes a light source component. Figure 5As shown, the light source assembly 111 can be disposed in the first region 121 of the aforementioned through-hole. The light source assembly 111 and the multi-fiber connector 108 are arranged side by side and are both coupled to the photonic integrated chip.

[0072] Therefore, in this embodiment, the first region 121 of the through-hole extends in the width direction of the circuit board 102 to accommodate the multi-fiber connector 108 and the light source assembly 111 side by side. The second region 122 of the through-hole extends in the length direction of the circuit board 102 to avoid the optical fiber 103. Thus, the first region 121 and the second region 122 form an L-shaped through-hole or a T-shaped through-hole. The length direction of the circuit board 102 refers to the direction of extension between the first end 1023 and the second end 1024 of the circuit board 102, and the width direction refers to the direction perpendicular to the length direction in the plane of the circuit board 102.

[0073] In some other embodiments, the shape of the through hole 120 can be designed according to actual needs. For example, the first region 121 and the second region 122 can be connected to form a large rectangular through hole.

[0074] In this embodiment, the groove 104 is a rectangle parallel to the length direction of the circuit board 102. In other embodiments, the groove 104 can also be adjusted according to the direction of the extension of the optical fiber 103, for example, it can be inclined relative to the length direction of the circuit board 102, or it can be trapezoidal, conical, or other polygonal.

[0075] In this embodiment, the bottom surface of the groove 104 is parallel to the surface of the circuit board 102. The groove 104 can be manufactured by fixed-depth slotting, such as by thinning through controlled-depth milling.

[0076] In other embodiments, the bottom surface of the groove 104 may also be inclined relative to the first surface 1021 of the circuit board 102, and the depth of the groove 104 gradually decreases from one end of the through hole toward the opposite end until it is flush with the first surface 1021 of the circuit board 102. The optical fiber 103 may extend along the bottom surface of the groove 104 and be gradually raised to connect to the optical port 107 of the housing, thereby avoiding interference with the edges of the circuit board 102.

[0077] In this embodiment, the depth of the groove 104 is less than or equal to half the thickness of the circuit board 102. Maintaining a certain thickness of circuit board 102 beneath the groove 104 ensures the structural strength of the circuit board 102 and prevents it from becoming too thin and prone to breakage or other damage.

[0078] In addition, the depth of the groove 104 is preferably greater than or equal to 1 / 3 of the thickness of the circuit board 102. A groove 104 with a certain depth can provide more space for the arrangement of the optical fiber 103, making the optical fiber 103 laid more smoothly and avoiding excessive interference between the optical fiber 103 and the circuit board 102 and damage to the edges of the circuit board 102.

[0079] In this embodiment, the groove 104 passes through the through hole 120 and the end face of the first end 1023 of the circuit board 102. In other embodiments, the groove 104 may not extend to the first end 1023 of the circuit board 102, as long as its length can avoid the optical fiber 103 and reduce interference with the optical fiber 103.

[0080] Combination Figure 5 , Figure 6 As shown, in this embodiment, the edge of the first end 1023 of the circuit board adjacent to its first surface 1021 may be provided with a first chamfer 1025, and the second edge 1042 of the end of the groove 104 facing the through hole 102 may also be provided with a second chamfer 1026. In some other embodiments, a third chamfer may also be provided on the first edge 1041 of the end of the groove 104 away from the through hole 120. The chamfers are provided to reduce the sharp edges of the circuit board, thereby further preventing damage to the optical fiber.

[0081] In this embodiment, the chamfer size is greater than or equal to C0.2 mm and less than or equal to C0.4 mm. A larger chamfer provides a smoother transition for the optical fiber 103, better preventing damage to the optical fiber 103 from sharp edges. A smaller chamfer avoids problems such as edge damage or deformation of the circuit board due to excessive chamfering. In other embodiments, the chamfer size can also be adjusted according to the actual thickness of the circuit board, and is not limited to the above-mentioned size.

[0082] like Figure 5 In this embodiment, an adhesive 1031 can be provided in the groove to fix the optical fiber 103. The adhesive 1031 can be located at the second edge 1042 or at the first edge 1041. Alternatively, the adhesive can be provided at the chamfer at any of the above locations to fix the optical fiber, or adhesive can be provided at multiple chamfers to fix the optical fiber. The adhesive can be a sticky material such as glue or tape. Fixing the optical fiber with adhesive can avoid friction and wear of the optical fiber 103 at the edges and corners caused by factors such as shaking or vibration of the optical fiber 103. It can also prevent the pulling force on the optical fiber from being transmitted to the multi-core fiber connector, thus avoiding the problem of the multi-core fiber connector and optical components being misaligned. Therefore, the reliability of the product can be further improved.

[0083] The apparatus and system embodiments described above are merely illustrative. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement these embodiments without any creative effort.

[0084] The above are merely preferred embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An optical module, characterized in that, Includes circuit boards, optical components, and optical fibers; The circuit board has opposing first and second surfaces, as well as opposing first and second ends; the circuit board is provided with through holes penetrating the first and second surfaces; The optical component is disposed on the second surface of the circuit board, located on the side of the through hole that is relatively far away from the first end; The optical fiber is disposed on the first surface, with one end of the optical fiber extending out of the first end of the circuit board and the other end passing through the through hole and coupled to the optical component. The first surface side is provided with a groove, the groove is located below the optical fiber, and the groove extends from the edge of the through hole toward the first end to avoid the optical fiber.

2. The optical module as described in claim 1, characterized in that, The depth of the groove is less than or equal to 1 / 2 the thickness of the circuit board, and greater than or equal to 1 / 3 the thickness of the circuit board.

3. The optical module as described in claim 1, characterized in that, The bottom surface of the groove is inclined relative to the first surface, and the depth of the groove gradually decreases from one end connected to the through hole toward the opposite end.

4. The optical module as described in claim 1, characterized in that, The groove extends through the through hole and the end face of the first end.

5. The optical module as described in claim 1, characterized in that, The first edge of the groove opposite to the through hole is chamfered; And / or the edge of the first end of the circuit board adjacent to the first surface is chamfered.

6. The optical module as described in claim 1, characterized in that, The second edge of the groove facing the through hole has a chamfer.

7. The optical module as described in claim 5 or 6, characterized in that, The chamfer dimension is less than or equal to C0.4mm and greater than or equal to C0.2mm.

8. The optical module as described in claim 5 or 6, characterized in that, The chamfered area is provided with adhesive to secure the optical fiber.

9. The optical module as described in claim 1, characterized in that, The groove is provided with adhesive to fix the optical fiber.

10. The optical module as described in claim 1, characterized in that, The number of optical fibers is multiple, and each optical fiber includes a multi-fiber connector. The multiple optical fibers are coupled to the optical component through the multi-fiber connector. The through-hole includes a first region and a second region that are connected to each other. The multi-fiber connector is located in the first region, and the second region is used to avoid the fiber.

11. The optical module as described in claim 10, characterized in that, The optical component includes a photonic integrated chip, and the optical module further includes a light source component; the light source component is located in the first region, and the light source component and the multi-fiber connector are arranged side by side and are all coupled to the photonic integrated chip.

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