Integrated flexible substrate ultra-thin touch screen module

Abstract

The utility model relates to touch -sensitive screen technical field, concretely is a kind of integrated flexible substrate ultrathin touch screen module group, including flexible substrate, the upper surface of flexible substrate is equipped with touch sensing layer, the side of touch sensing layer away from flexible substrate is equipped with buffer support layer, the buffer support layer is equipped with multiple array distribution's buffer recess, the conductive circuit layer is embedded in the buffer recess, the side of conductive circuit layer away from buffer support layer is adhered with surface protective film by optical adhesive layer, and the edge area of the flexible substrate is equipped with structure reinforcing layer, the structure reinforcing layer covers touch sensing layer edge and with buffer support layer partially overlap.This integrated flexible substrate ultrathin touch screen module realizes overall light and thin and high integration, improves bending durability and structural stability, and with good flexibility and reliability, applicable to the application requirement of new generation flexible electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of touch screen technology, specifically to an integrated flexible substrate ultra-thin touch screen module. Background Technology

[0002] As electronic devices become thinner and more portable, touchscreens, as a crucial component of human-computer interaction, face increasingly stringent requirements in their structural design and material selection. In recent years, flexible substrate materials have been widely used in the manufacture of touchscreen modules due to their excellent flexibility, thinness, and bendability.

[0003] In existing flexible substrate touch screen modules, the touch sensing layer and the display module are usually assembled independently, resulting in a large overall thickness, which affects the design of thinner and lighter products. Furthermore, the bonding structure between the touch sensing layer and the flexible substrate is not stable enough. Under repeated bending or external force, interlayer peeling or circuit breakage can easily occur, which affects touch performance and service life. At the same time, the module lacks effective structural support and protective layer design, making it susceptible to mechanical stress during production, assembly and use, which can lead to decreased touch accuracy or functional failure. Utility Model Content

[0004] The purpose of this utility model is to provide an integrated flexible substrate ultra-thin touch screen module to solve the problems mentioned in the background art, such as large thickness, unstable interlayer connection, poor bending performance, and easy circuit breakage and decreased touch performance caused by unreasonable structural design of current touch screen modules.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an integrated flexible substrate ultra-thin touch screen module, comprising a flexible substrate, a touch sensing layer on the upper surface of the flexible substrate, a buffer support layer on the side of the touch sensing layer away from the flexible substrate, a plurality of buffer grooves arranged in an array within the buffer support layer, a conductive circuit layer embedded in the buffer grooves, a surface protective film bonded to the side of the conductive circuit layer away from the buffer support layer by an optical adhesive layer, and a structural reinforcement layer provided at the edge region of the flexible substrate, the structural reinforcement layer covering the edge of the touch sensing layer and partially overlapping with the buffer support layer.

[0006] Preferably, the flexible substrate is a polyimide film material, and the inner surface of the flexible substrate is provided with a printed circuit interface, and the touch sensing layer is directly formed on the surface of the flexible substrate by screen printing process.

[0007] Preferably, the buffer support layer is made of thermoplastic polyurethane material, and the buffer groove is a hemispherical structure with its opening facing upward on the outer surface of the buffer support layer.

[0008] Preferably, the conductive circuit layer is composed of a flexible printed circuit, with its circuit portion embedded in a buffer groove and attached to its inner wall. The ends of the conductive circuit layer are electrically connected to the printed circuit interface on the flexible substrate through metal conductive posts.

[0009] Preferably, the structural reinforcement layer is a ring structure composed of epoxy resin and glass fiber composite material, and the inner edge of the structural reinforcement layer is provided with a stepped transition structure, which forms a stepped overlap with the edge portion of the buffer support layer.

[0010] Preferably, the surface protective film is a hardened PET film, with an anti-fingerprint coating on the side away from the optical adhesive layer, and the optical adhesive layer is an OCA optically transparent adhesive with a thickness of 0.02mm-0.05mm.

[0011] Compared with existing technologies, the beneficial effects of this utility model are as follows: This integrated flexible substrate ultra-thin touch screen module achieves overall thinness and high integration, improves bending durability and structural stability, and has good flexibility and reliability, making it suitable for the application requirements of next-generation flexible electronic devices. The integrated flexible substrate ultra-thin touch screen module enhances the stability of the circuit layout through the embedded design of the buffer groove and conductive circuit layer. The stepped overlap design of the structural reinforcement layer and the buffer support layer improves the stress resistance of the edge area, preventing interlayer peeling and deformation. Combined with the high adhesion strength and light transmittance of the optical adhesive layer and the surface protective film, it further ensures touch accuracy and appearance quality. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of an integrated flexible substrate ultrathin touch screen module structure according to the present invention;

[0013] Figure 2 This is a schematic diagram of the outer surface structure of the buffer support layer of an integrated flexible substrate ultra-thin touch screen module according to this utility model;

[0014] Figure 3 This is a schematic diagram of the inner surface structure of the flexible substrate of an integrated flexible substrate ultra-thin touch screen module according to the present invention.

[0015] In the figure: 1. Flexible substrate; 11. Printed circuit interface; 2. Touch sensing layer; 3. Buffer support layer; 31. Buffer groove; 4. Conductive circuit layer; 5. Optical adhesive layer; 6. Surface protective film; 61. Anti-fingerprint coating; 7. Structural reinforcement layer; 8. Metal conductive post. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-3This utility model provides a technical solution: an integrated flexible substrate ultra-thin touch screen module, including a flexible substrate 1, a touch sensing layer 2 on the upper surface of the flexible substrate 1, a buffer support layer 3 on the side of the touch sensing layer 2 away from the flexible substrate 1, a plurality of buffer grooves 31 arranged in an array in the buffer support layer 3, a conductive circuit layer 4 embedded in the buffer grooves 31, a surface protective film 6 bonded to the side of the conductive circuit layer 4 away from the buffer support layer 3 by an optical adhesive layer 5, and a structural reinforcement layer 7 on the edge region of the flexible substrate 1, the structural reinforcement layer 7 covering the edge of the touch sensing layer 2 and partially overlapping with the buffer support layer 3. This structure of the flexible substrate 1 provides a basic support platform, enabling the touch sensing layer to... 2. It can be formed directly on its upper surface, ensuring a tight fit between the two and reducing the thickness increase caused by independent assembly. The buffer support layer 3 and its multiple arrayed buffer grooves 31 not only provide embedding positions for the conductive circuit layer 4, but also enhance the stability and bending resistance of the overall structure through this embedding method, effectively avoiding interlayer peeling or circuit breakage that may occur when repeatedly bent or subjected to external forces. The tight bonding between the conductive circuit layer 4 and the inner wall of the buffer groove 31, together with the bonding and fixation of the surface protective film 6 by the optical adhesive layer 5, constitute an overall structure that has both high flexibility and maintains good touch performance. In addition, the structural reinforcement layer 7 covers the touch sensing. Layer 2 overlaps with the edge of the buffer support layer 3, further enhancing the mechanical strength and stress resistance of the entire touchscreen module. This prevents touch accuracy degradation or functional failure due to mechanical stress during production, assembly, and use. This multi-layer composite design solves the problems of unstable interlayer connections, large overall thickness, and susceptibility to mechanical stress in existing flexible substrate touchscreen modules. It achieves a thinner and lighter design while improving module reliability and lifespan, making it particularly suitable for next-generation flexible electronic devices requiring frequent bending. Furthermore, a thermally conductive adhesive layer is provided between the buffer support layer 3 and the conductive circuit layer 4 to improve the module's heat dissipation performance under high-frequency touch operation. To prevent material aging or signal drift caused by localized temperature rise, the flexible substrate 1 is made of polyimide film material, and a printed circuit interface 11 is provided on the inner surface of the flexible substrate 1. Two printed circuit interfaces 11 are symmetrically arranged. The touch sensing layer 2 is directly formed on the surface of the flexible substrate 1 through screen printing. This structure of the flexible substrate 1 gives the module excellent flexibility and durability. The setting of the printed circuit interface 11 improves the connection efficiency and stability between the module and the external circuit. The touch sensing layer 2 is directly formed on the surface of the flexible substrate 1 through screen printing, realizing integrated manufacturing, eliminating the traditional bonding process, enhancing the interlayer bonding force, and enabling the module to maintain structural integrity and stable touch performance even when repeatedly bent or subjected to external force. The buffer support layer 3 is made of thermoplastic polyurethane material, and the buffer groove 31 is a hemispherical structure with its opening facing upward on the outer surface of the buffer support layer 3.The buffer support layer 3 of this structure has good elasticity and resilience. When the module is subjected to external forces, it can effectively absorb impact and disperse stress, improving the overall structural stability and fatigue resistance. The buffer groove 31 not only provides a structurally compatible embedding space for the conductive circuit layer 4, but also enhances deformation compatibility with its arc-shaped contour. It effectively alleviates the stress concentration borne by the conductive circuit layer 4 when bent or compressed, preventing circuit breakage or interlayer delamination due to excessive stretching or compression of the material. The conductive circuit layer 4 is composed of flexible printed circuits, and its circuit portion is embedded in the buffer groove 31 and adheres to its inner wall. The circuit ends are electrically connected to the printed circuit interface 11 on the flexible substrate 1 via metal conductive posts 8. This structure allows the circuit to distribute stress under external force by relying on the hemispherical structure of the buffer groove 31, avoiding circuit breakage caused by bending or stretching. The printed circuit interface 11 ensures the stability of signal transmission. Furthermore, the circuit of the conductive circuit layer 4 is printed with silver nanowire material or graphene conductive ink, which has higher conductivity and flexibility, further improving touch response speed and bending durability. The structural reinforcement layer 7 is a ring structure composed of epoxy resin and glass fiber composite material. The inner edge of the flexible substrate 1 has a stepped transition structure, which overlaps with the edge of the buffer support layer 3 in a stepped manner. This structural reinforcement layer 7 provides excellent mechanical strength and stability, effectively enhancing the overall bending and tensile resistance of the edge area of ​​the flexible substrate 1. Furthermore, the stepped transition structure on the inner edge of the structural reinforcement layer 7 not only achieves a smooth transition between multi-layered structures and reduces stress concentration points, but also improves interlayer bonding by increasing the contact area, preventing interlayer delamination during repeated bending or exposure to external forces. Simultaneously, the surface of the structural reinforcement layer 7 is coated with a moisture-proof layer to enhance the mold's stability. To ensure stability and lifespan in high-humidity environments, the surface protective film 6 is a hardened PET film. An anti-fingerprint coating 61 is provided on the side away from the optical adhesive layer 5. The optical adhesive layer 5 is an OCA optically transparent adhesive with a thickness of 0.02mm-0.05mm. This structure of the surface protective film 6 provides excellent wear resistance and light transmittance, ensuring the touchscreen maintains clear display and touch sensitivity during long-term use. The anti-fingerprint coating 61 effectively reduces fingerprint and oil residue, improving the user's cleaning experience and visual clarity. The high light transmittance of the optical adhesive layer 5 reduces light loss and reflection, enhancing the display effect.

[0018] Working principle: When using this integrated flexible substrate ultra-thin touch screen module, the printed circuit interface 11 on the flexible substrate 1 is first electrically connected to the external control circuit. Then, the touch sensing layer 2 collects the user's touch operation signal through its internal sensing unit. The touch signal is transmitted through the lines in the conductive line layer 4. The lines are electrically connected to the printed circuit interface 11 through the metal conductive post 8. The conductive line layer 4 is embedded in the buffer groove 31 of the buffer support layer 3. After the signal is stably transmitted in the conductive line layer 4, when it passes through the area of ​​the structural reinforcement layer 7, the stepped transition structure at its edge forms a stepped overlap with the buffer support layer 3 to ensure the continuity of the signal path. Then, the signal is transmitted to the surface protective film 6 through the optical adhesive layer 5. When the user performs a touch operation on the anti-fingerprint coating 61 side of the surface protective film 6, the signal is synchronously fed back to the control system, thereby completing a series of tasks.

[0019] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated flexible substrate ultrathin touch screen module, comprising a flexible substrate (1), characterized in that: The upper surface of the flexible substrate (1) is provided with a touch sensing layer (2). A buffer support layer (3) is provided on the side of the touch sensing layer (2) away from the flexible substrate (1). A plurality of buffer grooves (31) are provided in the buffer support layer (3) in an array. A conductive circuit layer (4) is embedded in the buffer groove (31). A surface protective film (6) is bonded to the side of the conductive circuit layer (4) away from the buffer support layer (3) by an optical adhesive layer (5). A structural reinforcement layer (7) is provided in the edge area of ​​the flexible substrate (1). The structural reinforcement layer (7) covers the edge of the touch sensing layer (2) and partially overlaps with the buffer support layer (3).

2. The integrated flexible substrate ultra-thin touch screen module according to claim 1, characterized in that: The flexible substrate (1) is a polyimide film material, and the inner surface of the flexible substrate (1) is provided with a printed circuit interface (11), and the touch sensing layer (2) is directly formed on the surface of the flexible substrate (1) by screen printing process.

3. The integrated flexible substrate ultra-thin touch screen module according to claim 1, characterized in that: The buffer support layer (3) is made of thermoplastic polyurethane material, and the buffer groove (31) is a hemispherical structure with its opening facing upward on the outer surface of the buffer support layer (3).

4. The integrated flexible substrate ultra-thin touch screen module according to claim 1, characterized in that: The conductive circuit layer (4) is composed of a flexible printed circuit, and its circuit part is embedded in the buffer groove (31) and attached to its inner wall. The end of the circuit of the conductive circuit layer (4) is electrically connected to the printed circuit interface (11) on the flexible substrate (1) through the metal conductive post (8).

5. The integrated flexible substrate ultra-thin touch screen module according to claim 1, characterized in that: The structural reinforcement layer (7) is a ring structure composed of epoxy resin and glass fiber composite material, and the inner edge of the structural reinforcement layer (7) is provided with a stepped transition structure, which forms a stepped overlap with the edge of the buffer support layer (3).

6. The integrated flexible substrate ultra-thin touch screen module according to claim 1, characterized in that: The surface protective film (6) is a hardened PET film, and an anti-fingerprint coating (61) is provided on the side away from the optical adhesive layer (5). The optical adhesive layer (5) is an OCA optical transparent adhesive with a thickness of 0.02mm-0.05mm.

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