A membrane switch structure for enhancing the bending performance of a circuit out pin

Abstract

The utility model provides a kind of thin film switch structure of enhanced line out PIN bending performance, by being provided with the multilayer composite buffer assembly of first buffer layer, reinforcing support layer and second buffer layer in the out PIN terminal bending area, and cooperate stress dispersion groove, round corner terminal and conductive shielding layer etc. design, significantly improve the bending resistance of line, solve the problem such as insufficient foam buffer effect, signal susceptible to interference in the prior art. The structure is suitable for household appliance thin film switch, with the advantages of convenient assembly, high durability, signal stability etc.

Description

Technical Field

[0001] This utility model relates to the field of membrane switch technology, specifically to a membrane switch design that enhances the resistance to breakage at the bending points of the circuit through structural optimization, and is suitable for membrane switch scenarios such as home appliances and electronic devices that require frequent bending. Background Technology

[0002] Membrane switches are widely used in the control panels of home appliances (such as microwave ovens, washing machines, and air conditioners) due to their thinness, wear resistance, and low cost. In practical applications, the pins of the membrane switch circuit often break due to repeated bending during product assembly and use (such as opening and closing the panel and adjusting the circuit layout), leading to circuit breaks and equipment failure.

[0003] The current common solution is to attach single-sided adhesive foam (such as 04 / 0.3mm foam used in existing technology) to the bend of the PIN, but it has the following drawbacks:

[0004] Limited cushioning effect: The thickness and shape of a single foam are difficult to adapt to complex bending angles, and the problem of stress concentration has not been fundamentally solved;

[0005] Insufficient adhesive stability: Traditional single-sided adhesive is prone to falling off or losing its stickiness after repeated bending, leading to structural failure;

[0006] Limited applicability: Fixed-size foam cannot meet the personalized needs of circuit boards of different specifications.

[0007] Signal transmission risk: The potential interference of foam to line signals has not been considered, which may affect the stability of high-frequency signals.

[0008] Therefore, in view of the shortcomings of the existing technology, it is necessary to design a membrane switch structure that enhances the bending performance of the line output pin in order to solve the above problems. Utility Model Content

[0009] To address the shortcomings of existing technologies, this utility model provides a membrane switch structure that enhances the bending resistance of the output pin. Through multi-layer composite buffering, stress dispersion design, and modular adaptation, it significantly improves the bending resistance of the output pin while ensuring ease of assembly and signal transmission stability.

[0010] To achieve the above and other related objectives, the technical solution provided by this utility model is: a membrane switch structure for enhancing the bending performance of the output PIN, comprising a membrane substrate, conductive lines disposed on the membrane substrate, and an output PIN terminal. The bending area of ​​the output PIN terminal is provided with a multi-layer composite buffer assembly, the multi-layer composite buffer assembly comprising a first buffer layer, a reinforcing support layer, and a second buffer layer sequentially bonded together; the first buffer layer is fixedly connected to the membrane substrate, and the second buffer layer is bonded to the horizontal section of the output PIN terminal; the reinforcing support layer is a mesh-like fiber reinforcement structure.

[0011] The preferred technical solution is as follows: the first buffer layer is an arc-shaped foam layer made of acrylic foam material, and a self-adhesive layer is provided on the bottom surface.

[0012] The preferred technical solution is that the arc direction of the arc-shaped foam layer is consistent with the bending direction of the PIN terminal, and its width is greater than the width of the PIN terminal.

[0013] The preferred technical solution is that the second buffer layer is a wavy silicone layer with an anti-slip texture on the surface.

[0014] The preferred technical solution is that the mesh structure of the reinforcing support layer is woven from glass fiber or carbon fiber, and the mesh lines form a 45° angle with the bending direction of the output PIN terminal.

[0015] A preferred technical solution is that a stress dispersion groove is provided on the thin film substrate at the position corresponding to the multilayer composite buffer assembly, and the stress dispersion groove is an annular groove.

[0016] The preferred technical solution is that the bend of the output PIN terminal is provided with a rounded corner transition structure.

[0017] The preferred technical solution is that the multi-layer composite buffer assembly is provided with tearable positioning adhesive strips on both sides for quick alignment during assembly.

[0018] A preferred technical solution is that a conductive shielding layer is provided below the thin film substrate, and the conductive shielding layer is a copper-plated polyester film.

[0019] The preferred technical solution is as follows: the membrane switch structure further includes a modular buffer support, which is connected to the membrane substrate by a snap fastener, and has an arc-shaped slot inside that is adapted to the multi-layer composite buffer assembly, and the slot is filled with elastic sponge.

[0020] Due to the application of the above technical solution, the beneficial effects of this utility model are as follows:

[0021] 1. Multi-layer composite buffer: The curved foam layer (first buffer layer) absorbs bending stress, the grid fiber reinforcement layer (reinforcing support layer) disperses stress, and the wave-shaped silicone layer (second buffer layer) buffers vibration, forming a three-dimensional stress buffer system.

[0022] 2. Stress dispersion design: The annular stress dispersion groove reduces local strain on the substrate, the rounded corner terminals reduce stress concentration, and the combination with the 45° grid support layer improves the uniformity of stress distribution at the bending part.

[0023] 3. Ease of assembly: The self-adhesive layer and the peelable positioning strip enable quick positioning and pasting; the modular buffer support supports standardized replacement and is compatible with different models of membrane switches.

[0024] 4. Signal stability: The conductive shielding layer isolates electromagnetic interference, and the wavy silicone layer uses a low dielectric constant material to ensure that the high-frequency signal transmission loss is <5%. Attached Figure Description

[0025] Figure 1 This is a cross-sectional schematic diagram of the membrane switch structure involved in this utility model. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0027] Please see Figure 1 It should be noted that in the description of this utility model, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. These terms are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. The terms "horizontal," "vertical," and "suspended," etc., do not indicate that the component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0028] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] Example:

[0030] like Figure 1 As shown, according to an overall technical concept of this utility model, a membrane switch structure for enhancing the bending performance of the output PIN is provided, including a membrane substrate 1, a conductive line 2 disposed on the membrane substrate 1, and an output PIN terminal 3. A multi-layer composite buffer assembly 4 is disposed in the bending area of ​​the output PIN terminal 3. The multi-layer composite buffer assembly 4 includes a first buffer layer 41, a reinforcing support layer 42, and a second buffer layer 43 sequentially bonded together. The first buffer layer 41 is fixedly connected to the membrane substrate 1, and the second buffer layer 43 is bonded to the horizontal section of the output PIN terminal 3. The reinforcing support layer 42 is a mesh-like fiber reinforcement structure.

[0031] like Figure 1 As shown, in an exemplary embodiment of this utility model, the first buffer layer 41 is an arc-shaped foam layer made of acrylic foam material, with a self-adhesive layer on the bottom surface. The arc direction of the arc-shaped foam layer is consistent with the bending direction of the output PIN terminal 3, and its width is greater than the width of the output PIN terminal 3.

[0032] like Figure 1 As shown, in an exemplary embodiment of this utility model, the second buffer layer 43 is a wavy silicone layer with an anti-slip texture on its surface to prevent the PIN terminal 3 from slipping on its surface.

[0033] like Figure 1 As shown, in an exemplary embodiment of this invention, the mesh structure of the reinforcing support layer 42 is woven from glass fiber or carbon fiber, and the mesh lines form a 45° angle with the bending direction of the output PIN terminal 3. This improves the uniformity of stress distribution in the horizontal section of the output PIN terminal by 60%.

[0034] The curved foam layer (first buffer layer 41) absorbs bending stress, the grid fiber reinforcement layer (reinforcement support layer 42) disperses stress, and the wavy silicone layer (second buffer layer 43) buffers vibration, forming a three-dimensional stress buffer system that increases the number of bending cycles to more than 50,000 (the traditional solution is only 10,000).

[0035] like Figure 1As shown, in an exemplary embodiment of this utility model, a stress dispersion groove 11 is provided on the thin film substrate 1 at the position corresponding to the multilayer composite buffer assembly 4, and the stress dispersion groove 11 is an annular groove.

[0036] like Figure 1 As shown, in an exemplary embodiment of this utility model, the bend of the PIN terminal 3 is provided with a rounded corner transition structure.

[0037] The annular groove 11 reduces local strain on the thin film substrate 1, the rounded corners of the PIN terminal 3 reduce stress concentration, and the 45° reinforced support layer 42 improves the uniformity of stress distribution at the bending point by 60%.

[0038] like Figure 1 As shown, in an exemplary embodiment of this utility model, the multi-layer composite buffer assembly 4 is provided with tearable positioning adhesive strips on both sides for quick alignment during assembly.

[0039] like Figure 1 As shown, in an exemplary embodiment of this utility model, a conductive shielding layer 5 is provided below the thin film substrate 1, and the conductive shielding layer 5 is a copper-plated polyester film.

[0040] The conductive shielding layer 5 isolates electromagnetic interference, and the corrugated silicone layer (second buffer layer 43) uses a low dielectric constant material (ε≤3.0) to ensure that the high-frequency signal transmission loss is <5%.

[0041] like Figure 1 As shown, in an exemplary embodiment of this utility model, the membrane switch structure further includes a modular buffer support 6. The buffer support 6 is connected to the membrane substrate 1 by a snap fastener and has a slot 61 inside that is adapted to the multilayer composite buffer assembly 4. The slot 61 is filled with elastic sponge 7.

[0042] Therefore, this utility model has the following advantages:

[0043] This invention provides a membrane switch structure that enhances the bending performance of circuits. By incorporating a multi-layer composite buffer assembly consisting of a first buffer layer, a reinforcing support layer, and a second buffer layer in the bending area of ​​the PIN terminal, and combining this with stress dispersion grooves, rounded corner terminals, and a conductive shielding layer, the circuit's bending resistance is significantly improved. This solves problems such as insufficient foam buffering effect and susceptibility to signal interference in existing technologies. This structure is suitable for membrane switches in household appliances and offers advantages such as convenient assembly, high durability, and stable signal.

[0044] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A membrane switch structure for enhancing the bending performance of the output pin, comprising a thin film substrate, conductive lines disposed on the thin film substrate, and output pin terminals, characterized in that: The bending area of ​​the PIN terminal is provided with a multi-layer composite buffer assembly, which includes a first buffer layer, a reinforcing support layer and a second buffer layer that are sequentially bonded together; the first buffer layer is fixedly connected to the thin film substrate, and the second buffer layer is bonded to the horizontal section of the PIN terminal; the reinforcing support layer is a mesh-like fiber reinforcement structure.

2. The membrane switch structure for enhancing the bending performance of the lead pin according to claim 1, characterized in that: The first buffer layer is an arc-shaped foam layer made of acrylic foam material, with a self-adhesive layer on the bottom surface.

3. The membrane switch structure of claim 2, wherein: The arcuate direction of the arc-shaped foam layer is consistent with the bending direction of the PIN terminal, and its width is greater than the width of the PIN terminal.

4. The membrane switch structure of claim 1, wherein: The second buffer layer is a wavy silicone layer with an anti-slip texture on its surface.

5. A membrane switch structure for enhancing the bending performance of the lead pin according to claim 1, characterized in that: The mesh structure of the reinforcing support layer is woven from glass fiber or carbon fiber, and the mesh lines form a 45° angle with the bending direction of the output PIN terminal.

6. The membrane switch structure of claim 1, wherein: The thin film substrate is provided with stress dispersion grooves at the positions corresponding to the multilayer composite buffer assembly, and the stress dispersion grooves are annular grooves.

7. The membrane switch structure of claim 1, wherein: The bend of the PIN terminal is provided with a rounded corner transition structure.

8. The membrane switch structure of claim 1, wherein: The multi-layer composite buffer assembly has tear-off positioning strips on both sides for quick alignment during assembly.

9. The membrane switch structure of claim 1, wherein: A conductive shielding layer is provided below the thin film substrate, and the conductive shielding layer is a copper-plated polyester film.

10. The membrane switch structure of claim 1, wherein: The membrane switch structure also includes a modular buffer support, which is connected to the membrane substrate by a snap fastener. The buffer support has an arc-shaped slot inside that is adapted to the multi-layer composite buffer assembly, and the slot is filled with elastic sponge.

Images