A printing jig for chip pin electrodes

Abstract

The utility model discloses a kind of printing jigs for chip pin electrode belong to chip pin electrode auxiliary printing equipment technical field, including positioning plate, adhesive tape and cushion material, positioning plate is uniformly arranged with multiple chip porcelain body placement through-hole consistent with the length-width size of chip porcelain body in longitudinal transverse, adhesive tape is bonded in the bottom of positioning plate to limit bonding for the bottom of chip porcelain body, cushion material is provided with consistent square sleeve hole with chip porcelain body.The utility model can limit chip porcelain body, and the adhesive tape set avoids chip falling and after bonding chip, chip is placed more stably, also improve the adsorption area when adsorbing on printing platform, adsorption is more reliable, printing jig is placed more stably, greatly improve printing quality by printing jig, and a large number of chip porcelain body can be arranged to print, printing efficiency is greatly improved, convenient and fast to assemble and disassemble, cushion material is to avoid product height protruding positioning plate too much, leading to printing action is not smooth, affect printing quality.

Description

Technical Field

[0001] This utility model relates to a printing fixture for chip lead electrodes, belonging to the field of chip lead electrode technology. Background Technology

[0002] A certain chip product, such as Figure 1 As shown, its dimensions are 4*4*1.3mm (length x width x height). The chip's lead-out electrodes need to be guided to the top and bottom electrodes via metal electrodes. This means side lead electrodes need to be fabricated on the four sides of the chip, totaling 24 leads (4 sides x 6 leads = 24 leads). See the diagram below. Figure 2 .

[0003] The current side lead electrodes are produced using a silver-plating process. Due to the high requirements for lead size and precision of this chip product, its linewidth is 0.25±0.05mm, significantly smaller than that of conventional products. The typical lead width for conventional products is 0.8±0.15mm. Using this process to produce the above side lead electrodes results in the following quality issues (see below). Figure 3 (Renderings)

[0004] ① The line widths of the pin electrodes on each side are inconsistent, with the line width of the middle electrode being significantly greater than that of the electrodes on both sides.

[0005] ② For the same side lead electrode, the width of the middle part of the line is inconsistent with the width of the beginning and end of the line, and the width of the middle part of the line is significantly greater than the width of the beginning and end of the line.

[0006] ③ For the same side lead electrode, the thickness in the middle of the line is inconsistent with the thickness at the beginning and end of the line, and the thickness in the middle of the line is significantly less than the thickness at the beginning and end of the line.

[0007] In summary, the silver-plating process for producing side lead electrodes results in poor line thickness uniformity, which can easily lead to exposed lead electrodes and even short circuits, failing to meet product quality requirements. When using the printed electrode process to solve the problem, there is no printing fixture that can match the chip ceramic body of this product for use on the printing press. Printing them one by one would be inefficient. Utility Model Content

[0008] The technical problem to be solved by this utility model is to provide a printing fixture for chip pin electrodes, which enables the printing of pin electrodes on the chip ceramic body on a printing press, greatly improving printing efficiency.

[0009] The technical solution adopted by this utility model is as follows: A printing fixture for chip pin electrodes includes a positioning plate, adhesive tape and pad material. The positioning plate has multiple chip ceramic placement through holes that are uniformly arranged in the longitudinal and transverse directions and are consistent with the length and width of the chip ceramic body. The adhesive tape is bonded to the bottom of the positioning plate to limit and bond the bottom of the chip ceramic body. The pad material is provided with square sleeve holes that are consistent with the chip ceramic body.

[0010] Furthermore, the aforementioned padding material uses a 100µm thick plastic sheet, and at least one sheet is used.

[0011] The beneficial effects of this utility model are as follows: Compared with the prior art, this utility model places the chip ceramic body into the chip ceramic body placement through hole for positioning, and provides adhesive tape at the bottom to prevent the chip from falling off. After the chip is attached, the chip placement is more stable. The adhesive tape arrangement also increases the adsorption area on the printing table, making adsorption more reliable and the printing fixture placement more stable. Through the printing fixture, the printing quality is greatly improved, and a large number of chip ceramic bodies can be arranged for printing, greatly improving the printing efficiency. Assembly and disassembly are convenient and quick. The padding material is to avoid the product height protruding too much from the positioning plate, which would cause the printing action to be unsmooth and affect the printing quality. Attached Figure Description

[0012] Figure 1 This is a traditional chip diagram without side pin electrodes;

[0013] Figure 2 This is a diagram showing the side pin electrodes of the chip;

[0014] Figure 3 This is an image showing the effect of the side lead electrodes produced using the silver plating process;

[0015] Figure 4 This is a schematic diagram of the printing fixture structure;

[0016] Figure 5 This is a top view of the positioning plate.

[0017] Figure 6 yes Figure 5 Enlarged structural diagram of section A in the middle;

[0018] Figure 7 This is a top view of the padding material structure;

[0019] Figure 8 This is a rendering of the side lead electrodes produced using a silver plating process. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] Example 1: As Figure 4-6As shown, the printing fixture for chip pin electrodes includes a positioning plate 1, adhesive tape 2, and pad material 3. The positioning plate 1 has multiple chip placement through holes 5 evenly arranged longitudinally and laterally, which are consistent with the length and width dimensions of the chip ceramic body 4. The adhesive tape 2 is adhered to the bottom of the positioning plate 1 to limit and adhere the bottom of the chip ceramic body 4. The pad material 3 is provided with square sleeve holes 6 that are consistent with the chip placement through holes 5. The chip ceramic body is placed into the chip placement through holes for limiting and positioning. The adhesive tape at the bottom prevents the chip from falling off and makes the chip placement more stable after adhesion. The adhesive tape arrangement also increases the adsorption area on the printing table, making adsorption more reliable and the printing fixture placement more stable. The printing fixture greatly improves the printing quality and can arrange a large number of chip ceramic bodies for printing, greatly improving printing efficiency. Assembly and disassembly are convenient and quick. The pad material is to prevent the product height from protruding too much from the positioning plate, which would cause the printing action to be unsmooth and affect the printing quality.

[0022] The padding material 3 is made of 100um thick plastic paper. At least one sheet should be used, and multiple sheets may be used depending on the required thickness.

[0023] The chip ceramic body placement through-hole 5 has rectangular notches 501 on the left and right sides to facilitate the removal and handling of the chip ceramic body and avoid damage to the chip. The corner of the rectangular notch 501 is provided with a process arc hole 502 to facilitate processing and avoid stress damage.

[0024] When using the printing fixture, attach tape 2 to the positioning plate 1, fill all the chip ceramic placement holes 5 of the positioning plate 1 with chip ceramic body 4 and keep them adhered to tape 2, then place the pad material 3 of the set thickness on the top surface of the positioning plate 1 and ensure that the square sleeve hole 6 fits onto the chip ceramic body 4. After positioning the chip ceramic body 4, place the printing fixture on the breathable paper 8 attached to the printing plate 7 of the printing machine, control the adsorption force on the printing plate 7 (vacuum adsorption platform, which can fix the printing fixture) to fix the printing fixture on the printing plate 7, and perform the corresponding printing.

[0025] Example 1: As Figure 2-8 As shown, a method for fabricating high-precision chip pin electrodes is described. The method involves printing the side pin electrodes of the chip ceramic body using screen printing. A high-precision printing machine is used, with a matching printing fixture to fix the product position on the printing table. The side pin electrode pattern of the chip is prepared on film, and after exposure, it is transferred to a nylon screen covered with photosensitive emulsion. The nylon screen used is 300 nylon screen. The printing GAP value is controlled at 0.5mm-3mm; the printing squeegee pressure is 0.05MPa-0.20MPa; and the squeegee stepping speed is 0.01m / s-0.10m / s. The designed chip side pin pattern is printed on the side of the chip ceramic body. The length and width dimensions are controlled within ±20um, and the printing thickness is controlled within ±3um, meeting the product's appearance engineering standards. This completes the printing of four side pin electrodes.

[0026] By replacing the silver plating process with a printed electrode process, and through the creation of corresponding fixtures and the use of high-precision printing equipment, high-precision lead electrodes can be produced. The improved process results in side lead electrodes with better line thickness uniformity, prevents exposed lead electrodes, effectively avoids short circuits, and meets product quality requirements. (See below.) Figure 8 The effect shown is compared to the silver plating process. Figure 3 The improved pin electrode performance is of better quality. The pin electrode size accuracy can be controlled within ±20um, and the printing thickness can be controlled within ±3um, which fully meets the product quality engineering standards.

[0027] The printing fixture includes a positioning plate 1, adhesive tape 2, and padding material 3. The positioning plate 1 has multiple chip placement through holes 5, which are uniformly arranged longitudinally and laterally, with dimensions consistent with the length and width of the chip ceramic body 4. The adhesive tape 2 is bonded to the bottom of the positioning plate 1 to limit and bond the bottom of the chip ceramic body 4. The padding material 3 has square sleeve holes 6, which are consistent with the chip ceramic body 4. The square sleeve holes are tightly fitted onto the chip ceramic body, and the chip ceramic body is placed into the chip placement through holes for limiting and binding. The adhesive tape at the bottom prevents the chip from falling off and makes the chip placement more stable after bonding. The adhesive tape arrangement also increases the adsorption area on the printing table, making adsorption more reliable and the printing fixture placement more stable. The printing fixture greatly improves the printing quality and can accommodate a large number of chip ceramic bodies for printing, greatly improving printing efficiency. It is also convenient and quick to assemble and disassemble. The padding material is to prevent the product height from protruding too much from the positioning plate, which would cause printing motion to be unsmooth and affect printing quality.

[0028] The padding material 3 is made of 100um thick plastic paper. At least one sheet should be used, and multiple sheets may be used depending on the required thickness.

[0029] The chip ceramic body placement through-hole 5 has rectangular notches 501 on the left and right sides to facilitate the removal and handling of the chip ceramic body and avoid damage to the chip. The corner of the rectangular notch 501 is provided with a process arc hole 502 to facilitate processing and avoid stress damage.

[0030] When using the printing fixture, attach tape 2 to the positioning plate 1, fill all the chip ceramic placement holes 5 of the positioning plate 1 with chip ceramic body 4 and keep them adhered to tape 2, then place the pad material 3 of the set thickness on the top surface of the positioning plate 1 and ensure that the square sleeve hole 6 fits onto the chip ceramic body 4. After positioning the chip ceramic body 4, place the printing fixture on the breathable paper 8 attached to the printing plate 7 of the printing machine, control the adsorption force on the printing plate 7 (vacuum adsorption platform, which can fix the printing fixture) to fix the printing fixture on the printing plate 7, and perform the corresponding printing.

[0031] The fabrication steps for applying chip electrodes to a chip are as follows:

[0032] S1. Ingredients: Select K7 material with a dielectric constant of 7 for the product. Ball mill the powder to the set particle size.

[0033] S2, Casting: The ball-milled ingredients are prepared into a slurry, and casting technology is used to obtain high-precision green ceramic tapes of different thicknesses (the key film thickness is 44μm);

[0034] S3. Cutting: Cut the green ceramic strip into strips of a set size (usually 6 inches) and various thicknesses.

[0035] S4. Opening: Opening holes in the green ceramic strip where holes are required.

[0036] S5. Printing: The printing method is screen printing. The design graphic is prepared on film, exposed and transferred to a 400-mesh and 500-mesh steel wire mesh covered with photosensitive emulsion to form a printing fixture. By controlling the thickness of the photosensitive emulsion coating: 32μm-55μm; the printing GAP value: 0.5mm-3mm; the printing squeegee pressure: 0.05MPa-0.20MPa; and the squeegee stepping speed: 0.01m / s-0.10m / s, each layer of the design model is printed on a green ceramic tape of corresponding thickness. The printed inductor linewidth is 92-100μm, and the length and width error of the printed capacitor is within 5μm.

[0037] S6. Lamination: The printed green ceramic tapes are laminated in the design order using specialized equipment (such as a fully automatic alignment and lamination machine).

[0038] S7. Isostatic pressing: The laminated membrane is subjected to final pressing using isostatic pressing; maximum isostatic pressing temperature: 70℃-75℃; holding time: 600s-900s; holding pressure: 5100psi-8300psi, forming a Bar block;

[0039] S8. Cutting: Divide the Bar block into independent product units;

[0040] S9. De-glue removal: Perform de-glue removal operation on the segmented products for 36 hours according to the de-glue removal curve;

[0041] S10. Sintering: The product after debinding is sintered in a tunnel furnace; there are 8-10 sintering temperature zones, sintering temperature: 850℃-900℃, and holding time: 80min-100min.

[0042] S11, Chamfering: Chamfering the sintered product;

[0043] S12, Silver coating: Apply silver coating to the external electrodes of the product after chamfering using a fully automatic end electrode silver coating machine;

[0044] S12. Printing: Printing the side lead electrodes of the chip ceramic body using screen printing. The supporting equipment is a high-precision printer. The high-precision printer uses a matching printing fixture to fix the product position on the printing table of the equipment, prepares the side lead electrode pattern of the chip on the film, and transfers it to the nylon screen covered with photosensitive emulsion after exposure. By controlling the printing GAP value: 0.5mm-3mm; the printing squeegee pressure: 0.05Mpa-0.20MPa; the squeegee stepping speed: 0.01m / s-0.10m / s, the designed chip side lead pattern is printed on the side of the chip ceramic body. The length and width dimensions of the printing are controlled within ±20um, and the printing thickness is controlled within ±3um, which meets the appearance engineering standards of the product. The above completes the printing of four side lead electrodes.

[0045] S13, Silvering: Silvering process is carried out on the silver-plated products; Silvering is carried out in a tunnel furnace; there are 6 sintering temperature zones, sintering temperature: 600℃-715℃, holding time: 25min-35min;

[0046] S14. Electroplating: Electroplating the product after it has been heated with silver to form the final product.

[0047] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A printing fixture for chip pin electrodes, characterized in that, It includes a positioning plate, tape, and padding material. The positioning plate has multiple through holes for placing the chip ceramic body that are evenly arranged in the longitudinal and transverse directions and are consistent with the length and width of the chip ceramic body. The tape is attached to the bottom of the positioning plate to limit and bond the bottom of the chip ceramic body. The padding material is provided with square sleeve holes that are consistent with the chip ceramic body.

2. The printing fixture for chip pin electrodes according to claim 1, characterized in that, The padding material should be a 100µm thick plastic sheet, and at least one sheet should be used.

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