A high-speed insertion device for multi-layer stacking of PCB boards
By combining the base, pressing mechanism and limiting mechanism, the problem of large error in high-frequency signal transmission of existing high-speed insertion devices is solved, realizing high-precision and stable connection of PCB board, and ensuring stable signal transmission and low attenuation.
CN224419039UActive Publication Date: 2026-06-26JIANGSU HANGYU CHUANGZHI TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU HANGYU CHUANGZHI TECH CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-06-26
Smart Images
Figure CN224419039U_ABST
Abstract
The utility model provides a kind of high-speed insertion device for PCB multilayer superposition belongs to PCB multilayer superposition technical field, this high-speed insertion device for PCB multilayer superposition includes pedestal, pressure joint mechanism, floating mechanism and limit mechanism, the pedestal is as the basis support part of whole device, it is rectangular body seat structure, for bearing the weight and pressure of PCB board;The pressure joint mechanism includes lower pressing die and upper pressing die, the lower pressing die is fixed on the pedestal, the upper pressing die corresponds with the lower pressing die;The floating mechanism and the limit mechanism are respectively arranged between the lower pressing die and the upper pressing die;The utility model provides a kind of high-speed insertion device for PCB multilayer superposition, can solve the problem that the existing high-speed insertion device cannot guarantee operating speed at the same time, reduce error, the stability and reliability of high connection are low.
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