A cooler for reinforcing heat dissipation of a BMS board

Abstract

The utility model discloses a cooler for strengthening BMS board heat dissipation, it includes: battery package insulating cover board, heat dissipation sealing board, slide rail, sliding block and insulating screw, the battery package insulating cover board top surface recessed is provided with the step groove, the heat dissipation sealing board is set up in the upper portion of step groove, the lower portion of step groove is filled with insulating coolant, the slide rail interval is set up in the bottom of battery package insulating cover board, the first heat conduction column that extends to the step groove in the interval is set up on the slide rail, the sliding block interval is set up in the slide rail bottom, the sliding block is provided with the screw bush that points to below, the insulating screw is set up in screw bush and extends downward, utilize the heat radiation of slide rail and sliding block and receive BMS board, and utilize insulating screw and BMS board contact, directly send the heat to sliding block and slide rail, and pass first heat conduction column and transmit the heat to insulating coolant, finally through heat dissipation sealing board and send out, has improved the cooling effect of BMS board.

Description

Technical Field

[0001] This utility model relates to the field of BMS board heat dissipation technology, and in particular to a cooler for enhancing the heat dissipation of BMS boards. Background Technology

[0002] A BMS board is an integrated circuit board used to protect rechargeable battery packs, providing overcharge protection, over-discharge protection, overcurrent protection, and short-circuit protection, thereby improving the safety of the battery pack.

[0003] Battery packs typically consist of a sealed casing, housing the battery and BMS board together. This compact structure reduces space usage but hinders heat dissipation. The battery generates heat during charging and discharging, making the operating environment for the BMS board unfriendly. Current technology usually involves mounting heat sinks on the BMS board for cooling; however, these heat sinks are also within the battery pack, resulting in less than ideal heat dissipation performance, requiring improvement. Utility Model Content

[0004] The purpose of this invention is to provide a cooler for enhancing the heat dissipation of a BMS board, thereby improving the cooling effect.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A cooler for enhancing heat dissipation of a BMS board includes: a battery pack insulating cover, a heat dissipation sealing plate, slide rails, sliders, and insulating screws. The top surface of the battery pack insulating cover has a recessed stepped groove. The heat dissipation sealing plate is disposed above the stepped groove, and the lower part of the stepped groove is filled with insulating coolant. The slide rails are spaced apart at the bottom of the battery pack insulating cover. The slide rails have first heat-conducting columns that extend upward into the stepped groove at intervals. The sliders are spaced apart at the bottom of the slide rails. The sliders have downward-pointing threaded sleeves. The insulating screws are disposed in the threaded sleeves and extend downward.

[0007] The first heat-conducting column is provided with a retaining ring located at the bottom of the stepped groove.

[0008] The slider is equipped with fastening screws that point towards the slide rail.

[0009] The insulating screw is a ceramic insulating screw.

[0010] The heat dissipation sealing plate is made of aluminum.

[0011] The heat dissipation sealing plate is provided with heat dissipation grooves at intervals.

[0012] The bottom of the heat dissipation sealing plate is provided with second heat-conducting columns that extend downward into the insulating coolant.

[0013] The battery pack insulating cover has stepped holes at its top edge.

[0014] The beneficial effects of this utility model are as follows: A cooler for enhancing the heat dissipation of a BMS board utilizes a slide rail and a slider to receive the heat radiation from the BMS board, and uses an insulating screw to contact the BMS board, directly transferring heat to the slider and slide rail. The heat is then transferred to the insulating coolant through the first heat-conducting column, and finally dissipated through the heat dissipation sealing plate, thereby improving the cooling effect of the BMS board, reducing overheating problems, and helping to improve the stability of the BMS board in use. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 yes Figure 1 A schematic diagram of the structure when the insulating screw contacts the BMS board. Detailed Implementation

[0017] The following is combined Figures 1-2 The technical solution of this utility model will be further illustrated through specific embodiments.

[0018] like Figure 1 The cooler shown is for enhancing heat dissipation of the BMS board, used for heat dissipation of the BMS board 13 in the battery pack. It includes: a battery pack insulating cover 1, a heat dissipation sealing plate 2, a slide rail 3, a slider 4, and insulating screws 8. The top edge of the battery pack insulating cover 1 has stepped holes 11 to facilitate the connection of the screws to the battery pack housing for sealing the top of the battery pack housing. The battery pack insulating cover 1 can be made of insulating plastic and molded using injection molding.

[0019] A stepped groove 12 is recessed in the top surface of the battery pack insulating cover 1. The heat dissipation sealing plate 2 is disposed above the stepped groove 12, and the lower part of the stepped groove 12 is filled with insulating coolant. The heat dissipation sealing plate 2 seals the upper part of the stepped groove 12 to prevent leakage of the insulating coolant. The heat dissipation sealing plate 2 can be fixed to the stepped groove 12 with sealant or screws, resulting in a stable structure.

[0020] The slide rails 3 are spaced apart at the bottom of the battery pack insulating cover 1. First heat-conducting pillars 5, extending upwards into the stepped groove 12, are spaced apart on the slide rails 3. In this embodiment, a retaining ring 10 is provided on the first heat-conducting pillar 5 located on the bottom surface of the stepped groove 12, improving structural stability. The slide rails 3, the first heat-conducting pillars 5, and the retaining ring 10 can be an integrated aluminum alloy structure. The slide rails 3, the first heat-conducting pillars 5, and the retaining ring 10 are placed into an injection mold for injection molding of the battery pack insulating cover 1, resulting in high production efficiency.

[0021] The sliders 4 are spaced apart at the bottom of the slide rail 3, allowing the sliders 4 to move laterally along the slide rail 3 to adjust their positions. Figure 2 As shown, this is to avoid the component structure on the BMS board 13 below. The slider 4 is provided with a fastening screw 7 pointing to the slide rail 3. The slider 4 is fixed after lateral adjustment by the fastening screw 7 to avoid shaking.

[0022] A downward-pointing threaded sleeve 9 is provided on the slider 4. The threaded sleeve 9 can be welded to the bottom of the slider 4, resulting in a robust structure. The insulating screw 8 is disposed in the threaded sleeve 9 and extends downward. The insulating screw 8 can be rotated within the threaded sleeve 9 for height adjustment, allowing the bottom of the insulating screw 8 to contact the BMS plate 13. This directly transfers the heat from the BMS plate 13 to the slider 4 and the slide rail 3, and then transfers the heat to the insulating coolant in the stepped groove 12 through the first heat-conducting column 5.

[0023] In this embodiment, the insulating screw 8 is a ceramic insulating screw. The ceramic insulating screw has good insulation effect, which ensures the safety of BMS board 13. It also has good heat conduction effect, which can transfer the heat on BMS board 13 to the screw sleeve 9. The screw sleeve 9 and the slider 4 are made of aluminum alloy, which has good heat conduction effect.

[0024] like Figure 1 As shown, the heat dissipation sealing plate 2 is provided with heat dissipation grooves 6 at intervals, which improves the heat dissipation effect. In this embodiment, the heat dissipation sealing plate 2 is made of aluminum plate, which is lightweight, high-strength, and has good heat dissipation effect.

[0025] like Figure 2 As shown, the bottom of the heat dissipation sealing plate 2 is provided with second heat-conducting columns 14 that extend downward into the insulating coolant. The heat is absorbed by the second heat-conducting columns 14 and dissipated through the heat dissipation sealing plate 2, thereby enhancing the heat dissipation and cooling effect of the BMS plate 13.

[0026] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A cooler for enhancing heat dissipation of a BMS board, used for heat dissipation of the BMS board in a battery pack, characterized in that, include: The battery pack includes an insulating cover, a heat dissipation sealing plate, slide rails, sliders, and insulating screws. The top surface of the insulating cover has a recessed stepped groove. The heat dissipation sealing plate is located above the stepped groove, and the lower part of the stepped groove is filled with insulating coolant. The slide rails are spaced apart at the bottom of the insulating cover. The slide rails have first heat-conducting columns that extend upward into the stepped groove at intervals. The sliders are spaced apart at the bottom of the slide rails. The sliders have downward-pointing threaded sleeves. The insulating screws are located in the threaded sleeves and extend downward.

2. The cooler for enhancing heat dissipation of a BMS board according to claim 1, characterized in that, The first heat-conducting column is provided with a retaining ring located at the bottom of the stepped groove.

3. The cooler for enhancing heat dissipation of a BMS board according to claim 1, characterized in that, The slider is equipped with fastening screws that point to the slide rail.

4. The cooler for enhancing heat dissipation of a BMS board according to claim 1, characterized in that, The insulating screws are ceramic insulating screws.

5. The cooler for enhancing heat dissipation of a BMS board according to claim 1, characterized in that, The heat dissipation sealing plate is made of aluminum plate.

6. The cooler for enhancing heat dissipation of a BMS board according to claim 1, characterized in that, The heat dissipation sealing plate is provided with heat dissipation grooves at intervals.

7. The cooler for enhancing heat dissipation of a BMS board according to claim 1, characterized in that, The bottom of the heat dissipation sealing plate is provided with a second heat-conducting column that extends downward into the insulating coolant.

8. The cooler for enhancing heat dissipation of a BMS board according to claim 1, characterized in that, The battery pack insulating cover has stepped holes at its top edge.

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