An on-vehicle camera module upper glue-filling packaging structure

Abstract

The utility model provides a kind of vehicle camera module upper glue pouring packaging structure, it is related to camera technical field, and it includes: upper mould;Lower mould is provided in upper mould bottom, PCB board is provided in lower mould top, camera module chip is provided in PCB board top, protective frame for protecting camera module chip is provided in camera module chip top.The kind of vehicle camera module upper glue pouring packaging structure uses PCB board upper glue pouring packaging means, not only can PCB board and camera module chip and protective frame be connected, and camera module chip and PCB board connection gold wire can be protected, to strengthen the stability of camera module, and air can be discharged when glue is packaged by multiple air outlet holes, avoid the generation of bubble, and light-transmitting plate can protect camera module chip, to reduce the risk of physical medium to cause imaging quality difference.

Description

Technical Field

[0001] This utility model relates to the field of camera technology, specifically a potting and encapsulation structure for an in-vehicle camera module. Background Technology

[0002] With the development of automotive intelligence, in-vehicle cameras are playing an increasingly important role in assisted driving and autonomous driving. In-vehicle camera modules need to have good imaging quality, shock resistance and stability to adapt to complex driving environments.

[0003] Currently, most existing camera module chip packaging processes use BGA packaging, which has drawbacks such as poor image quality, high price, and long cycle time; or COB packaging, which has problems such as uneven glue filling, difficulty in removing air bubbles, and inability to guarantee filling quality, resulting in unstable performance of camera modules, easy failure, and affecting their use and reliability in automobiles. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a potting encapsulation structure for an automotive camera module. By using potting encapsulation on a PCB board, the gold wires connecting the camera module chip and the PCB board can be protected, thereby enhancing the stability of the camera module.

[0005] The technical problem to be solved by this utility model is achieved by the following technical solution:

[0006] A potting and encapsulation structure for an automotive camera module includes: an upper mold; a lower mold is disposed at the bottom of the upper mold, a PCB board is disposed at the top of the lower mold, a camera module chip is disposed at the top of the PCB board, and a protective frame for protecting the camera module chip is disposed at the top of the camera module chip.

[0007] Optionally, the protective frame has a rectangular structure and a hollow interior. A light-transmitting sheet is installed inside the protective frame. A fixing groove is provided on the top of the lower mold, which fits with the PCB board. A hollow groove is provided on one side of the inner wall of the fixing groove, wherein the fixing groove is used to fix the PCB board to the top of the lower mold.

[0008] Optionally, a sealing block is connected to the bottom of the upper mold. A glue injection hole a is provided on one side of the top of the sealing block, and a vent hole a is provided on the other side of the top of the sealing block. A glue injection hole b is provided on one side of the top of the protective frame, and a vent hole b is provided on the other side of the top of the protective frame. The glue injection hole b communicates with the interior of the protective frame. A glue injection hole c is provided on one side of the top of the upper mold, and a vent hole c is provided on the other side of the top of the upper mold. The glue injection holes a, b, and c are used to inject glue between the protective frame and the PCB and the camera module chip.

[0009] The camera module chip has four mounting holes at the bottom of the upper mold and four slots at the top of the lower mold. The bottom of the lower mold has four slots with a hexagonal structure, and the top of the upper mold has four openings. The slots and openings are connected to the mounting holes. The bottom of the upper mold is connected to four positioning blocks, and the top of the lower mold has four positioning grooves. The positioning grooves and positioning blocks are used to position the upper mold and the lower mold when they are fitted together.

[0010] The beneficial effects of this utility model are:

[0011] The advantages of this invention are that by using a potting encapsulation method on the PCB board, the PCB board can be connected to the camera module chip and the protective frame, and the gold wires connecting the camera module chip and the PCB board can be protected, thereby enhancing the stability of the camera module. Furthermore, multiple vent holes can expel air during the encapsulation process, preventing the formation of air bubbles. The light-transmitting plate can protect the camera module chip, thereby reducing the risk of poor image quality caused by physical media. Attached Figure Description

[0012] Figure 1 This is an exploded view of the overall structure of this utility model.

[0013] Figure 2 This is a cross-sectional view of the overall structure of this utility model.

[0014] Figure 3 This is a schematic diagram of the upper mold structure of this utility model.

[0015] Figure 4 This is a schematic diagram of the lower mold structure of this utility model.

[0016] Figure 5 This is a schematic diagram of the sealing block structure of this utility model.

[0017] Figure 6 This is a schematic diagram of the protective frame structure of this utility model.

[0018] Figures 1-6 In the middle section: 1-Upper mold; 101-Lower mold; 102-PCB board; 103-Camera module chip; 104-Protective frame; 2-Light-transmitting sheet; 3-Fixing groove; 301-Empty groove; 4-Sealing block; 401-Injection hole a; 402-Vent hole a; 5-Injection hole b; 501-Vent hole b; 502-Injection hole c; 503-Vent hole c; 6-Mounting hole; 601-Card slot; 602-Opening; 7-Positioning block; 701-Positioning groove. Detailed Implementation

[0019] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0020] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0021] like Figures 1-6 As shown, a potting and encapsulation structure for an in-vehicle camera module includes: an upper mold 1, a lower mold 101 at the bottom of the upper mold 1, a PCB board 102 at the top of the lower mold 101, a camera module chip 103 at the top of the PCB board 102, and a protective frame 104 at the top of the camera module chip 103 for protecting the camera module chip 103.

[0022] The protective frame 104 has a rectangular structure and a hollow interior. A light-transmitting sheet 2 is installed inside the protective frame 104. When the bottom of the protective frame 104 is attached to the top of the PCB board 102, the bottom of the light-transmitting sheet 2 will be attached to the top of the camera module chip 103. The light-transmitting sheet 2 is made of optical glass material. Therefore, the light-transmitting sheet 2 can not only protect the camera module chip 103 from contamination, but also will not affect the light reception effect of the camera module chip 103. The protective frame 104 is made of high-transparency white glass D263T material, so the protective frame 104 has a certain degree of light transmittance.

[0023] The lower mold 101 has a fixing groove 3 on its top, which fits into the PCB board 102. A hollow groove 301 is provided on one side of the inner wall of the fixing groove 3. The fixing groove 3 facilitates the PCB board 102 to be snapped into place on the top of the upper mold 1. The hollow groove 301, together with the fixing groove 3, can penetrate the entire lower mold 101. Therefore, the hollow groove 301 and the fixing groove 3 facilitate the demolding of the PCB board 102.

[0024] The upper mold 1 has a sealing block 4 connected to its bottom. One side of the top of the sealing block 4 has an injection hole a401, and the other side has an vent a402. The protective frame 104 has an injection hole b5 on one side of its top, and an vent b501 on the other side. The injection hole b5 communicates with the interior of the protective frame 104. The upper mold 1 has an injection hole c502 on one side of its top, and an vent c503 on the other side. The sealing block 4 is made of silicone material, allowing it to be press-fitted against the PCB board 102. The sealing block 4 is designed to limit the movement of the PCB board 102. The injection holes a401, b5, and c502 allow glue to be injected between the PCB board 102, the protective frame 104, and the camera module chip 103. Once the glue has solidified, it connects the PCB board 102 to the protective frame 104 and the camera module chip 103, and covers the gold wires on the top of the PCB board 102, thereby protecting the gold wires and the camera module chip 103 and enhancing the stability of the camera module. The glue used is a thermosetting adhesive.

[0025] The upper mold 1 has four mounting holes 6 at its bottom and the lower mold 101 has four hexagonal slots 601 at its bottom and four openings 602 at its top. The slots 601 and openings 602 are connected to the mounting holes 6. The hexagonal slots 601 can limit the hexagonal nuts on the outside, making it easy to thread one end of the bolt to the nut. When threading the bolt to the nut, the bolt head should fit against the inside of the opening 602. This allows the upper mold 1 and the lower mold 101 to be fastened together. The bolts are designed with hexagonal slots on their heads, making it easy for workers to use tools to unscrew the bolts from the openings 602.

[0026] The upper mold 1 has four positioning blocks 7 connected to its bottom, and the lower mold 101 has four positioning grooves 701 on its top. Since the four positioning blocks 7 and the four positioning grooves 701 are positioned opposite each other, when the bottom of the upper mold 1 and the top of the lower mold 101 are in contact, the upper mold 1 and the lower mold 101 can be positioned by the four positioning blocks 7 and the four positioning grooves 701.

[0027] Working principle:

[0028] When using this device, firstly, the camera module chip 103 is mounted on top of the PCB board 102 using a COB process. Then, one end of a gold wire is connected to the pad of the camera module chip 103, and the other end of the gold wire is connected to the PCB board 102. At this time, the gold wire is directly exposed on the top of the PCB board 102. Then, the bottom of the protective frame 104 is attached to the top of the PCB board 102, so that the protective frame 104 is placed outside the camera module chip 103, while the light-transmitting sheet 2 is located on top of the camera module chip 103. Finally, the PCB board 102 is snapped into the fixing groove 3. Then, place the upper mold 1 and sealing block 4 above the lower mold 101, and align the bottom of the upper mold 1 with the top of the lower mold 101. Ensure the upper mold 1 and lower mold 101 are aligned and fitted by the four positioning grooves 701 and four positioning blocks 7. Next, place the hexagonal nut inside the slot 601, and then pass one end of the bolt through the mounting hole 6 on the upper mold 1 and lower mold 101. Rotate the bolt end inside the nut, and install the four bolts and nuts in sequence. This will tightly install the upper mold 1 and lower mold 101, and at this point, the bottom of the sealing block 4... The sealing block 4 is press-fitted with the PCB board 102 to ensure that it can limit the movement of the PCB board 102. Then, glue is injected into the injection hole c502. The glue passes through injection holes a401 and b5 and enters the space between the PCB board 102, the protective frame 104, and the camera module chip 103. Air between the PCB board 102, the protective frame 104, and the camera module chip 103 can be discharged from the vent holes a402, b501, and c503 to the outside of the upper mold 1, fully covering the gold wire. The glue is then heated to a temperature of... The protective frame 104 is pre-cured at 85 degrees Celsius for 30 minutes. During this time, the protective frame 104 is connected to the camera module chip 103 and PCB board 102 with adhesive to form a whole. Then, the protective frame 104, camera module chip 103 and PCB board 102 are demolded. Then, the protective frame 104, camera module chip 103 and PCB board 102 are fully cured at 85 degrees Celsius for 60 minutes. After curing, the protective frame 104, camera module chip 103 and PCB board 102 are removed from the sprue and quality inspected, and the potting and encapsulation process is finally completed.

[0029] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0030] The above provides a detailed description of the potting and encapsulation structure for an in-vehicle camera module provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An upper glue filling package structure of a vehicle-mounted camera module, characterized in that, include: Upper mold (1); The upper mold (1) has a lower mold (101) at its bottom, a PCB board (102) at its top, a camera module chip (103) at its top, and a protective frame (104) at its top to protect the camera module chip (103). 2.The vehicle camera module upper glue filling packaging structure according to claim 1, characterized in that, The protective frame (104) has a rectangular structure and a hollow structure inside. A light-transmitting sheet (2) is installed inside the protective frame (104).

3. The potting and encapsulation structure for the vehicle-mounted camera module according to claim 1, characterized in that, The lower mold (101) has a fixing groove (3) on its top, which fits into the PCB board (102). A hollow groove (301) is provided on one side of the inner wall of the fixing groove (3).

4. The potting and encapsulation structure for the vehicle-mounted camera module according to claim 1, characterized in that, The upper mold (1) is connected to a sealing block (4) at the bottom. The sealing block (4) has an injection hole a (401) on one side of its top and an air outlet a (402) on the other side of its top. 5.The vehicle camera module upper glue filling packaging structure according to claim 1, wherein, The protective frame (104) has an injection hole b (5) on one side of its top and an air vent b (501) on the other side of its top. The injection hole b (5) is connected to the interior of the protective frame (104). The upper mold (1) has an injection hole c (502) on one side of its top and an air vent c (503) on the other side of its top. 6.The vehicle camera module upper glue filling packaging structure according to claim 1, wherein, The bottom of the upper mold (1) and the top of the lower mold (101) are provided with four mounting holes (6). The bottom of the lower mold (101) is provided with four slots (601) in a hexagonal structure. The top of the upper mold (1) is provided with four openings (602). The slots (601) and the openings (602) are respectively connected to the mounting holes (6). 7.The vehicle camera module upper glue filling packaging structure according to claim 1, wherein, The upper mold (1) has four positioning blocks (7) connected to its bottom, and the lower mold (101) has four positioning slots (701) on its top.

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