Nickel plating apparatus for semiconductor CVD components

Abstract

This utility model discloses a nickel plating apparatus for semiconductor CVD components, comprising a frame, a mounting bracket disposed on the upper side of the frame, a drive motor with an output shaft disposed on the mounting bracket, a first rotating component sleeved on the lower end of the output shaft, a rotating shaft rotatably inserted into the frame, a second rotating component sleeved on the upper end of the rotating shaft, and a turntable for mounting workpieces disposed on the lower end of the rotating shaft. The first and second rotating components are fitted with transmission components. This utility model's nickel plating apparatus for semiconductor CVD components improves the nickel plating effect and provides good nickel plating uniformity.

Description

Technical Field

[0001] This utility model relates to the field of metal surface treatment technology, and specifically to a nickel plating device for semiconductor CVD components. Background Technology

[0002] Nickel plating, as a surface treatment method, has long played an important role in industrial manufacturing. It involves depositing a layer of nickel metal onto the surface of a substrate through electroplating or electroless plating to enhance the substrate's wear resistance, corrosion resistance, decorative properties, or other specific characteristics. Nickel plating technology is mainly divided into two categories based on its process: electroplating and electroless nickel plating.

[0003] Electroless nickel plating is a surface treatment technology that does not rely on an external power source. Instead, it uses a reducing agent to directly reduce nickel ions in solution and deposit them onto the substrate surface, which acts as a catalyst. This process is typically carried out under appropriate temperature and pH conditions. The reducing agent used can be hypophosphite, borohydride, etc., while the nickel salt is usually derived from compounds such as nickel sulfate or nickel acetate. Electroless nickel plating results in a coating that is hard, wear-resistant, corrosion-resistant, and has good high-temperature resistance, making it particularly suitable for manufacturing products with high precision requirements.

[0004] A crucial component in semiconductor CVD systems is the gas equalization plate, which has multiple small holes with a diameter of 1 ± 0.2 mm. Current technology involves directly immersing the gas equalization plate in a nickel bath for electroless nickel plating. However, this process easily generates air bubbles in the holes, resulting in poor plating quality. Furthermore, the poor fluidity of the electroless nickel plating solution leads to uneven nickel plating uniformity on the gas equalization plate surface. Therefore, a new technical solution is urgently needed to address at least one of these problems. Summary of the Invention

[0005] The purpose of this invention is to provide a nickel plating device for semiconductor CVD components, which improves the nickel plating effect and provides good nickel plating uniformity.

[0006] To achieve the above-mentioned technical objectives and requirements, the technical solution adopted by this utility model is: a nickel plating device for semiconductor CVD components, characterized in that it includes a frame, a mounting bracket disposed on the upper side of the frame, a drive motor with an output shaft disposed on the mounting bracket, a first rotating component sleeved on the lower end of the output shaft, a rotating shaft rotatably inserted into the frame, a second rotating component sleeved on the upper end of the rotating shaft, and a turntable for mounting workpieces disposed on the lower end of the rotating shaft, wherein the first rotating component and the second rotating component are sleeved with transmission components.

[0007] As a preferred technical solution, the turntable includes an annular turntable body, a connecting circular plate coaxially disposed inside the turntable body, and a plurality of mounting rods fixedly disposed on the circumference of the connecting circular plate, wherein the mounting rods are fixedly connected to the inner side of the turntable body.

[0008] As a preferred technical solution, the frame includes a rectangular frame and a reinforcing plate fixedly disposed inside the rectangular frame.

[0009] As a preferred technical solution, a crane connecting rod is fixedly installed on one side of the frame.

[0010] As a preferred technical solution, the first rotating component is a small gear.

[0011] As a preferred technical solution, the second rotating component is a large gear.

[0012] As a preferred technical solution, the transmission component is a transmission chain.

[0013] The beneficial effects of this utility model are:

[0014] 1) Install the gas equalization plate onto the mounting rod. Drive the motor to drive the first rotating component to rotate. The first rotating component drives the second rotating component to rotate through the transmission component. The second rotating component drives the turntable to rotate, thereby driving the gas equalization plate to rotate. During the rotation of the gas equalization plate, the nickel liquid will also flow, so the air bubbles in the small holes will be discharged, improving the nickel plating effect. Moreover, due to the flow of nickel liquid, the nickel plating uniformity of the gas equalization plate is better.

[0015] 2) The mounting rod can fix the gas distribution plate well and also play a stirring role. The circular turntable forms a hollow structure, which will not affect the nickel plating on the surface of the gas distribution plate.

[0016] 3) The frame is rectangular, making it lightweight, and the reinforcing plates enhance its overall strength;

[0017] 4) The gantry connecting rod is connected to the gantry, which facilitates the movement of the frame by the gantry and the entry and exit of the gas equalization plate into and out of the nickel liquid tank. Attached Figure Description

[0018] Figure 1 This is a structural diagram of a nickel plating apparatus for semiconductor CVD components provided in one embodiment of the present invention;

[0019] Figure 2 This is a structural diagram of the gas equalization plate provided in one embodiment of the present invention.

[0020] exist Figures 1-2In the middle, 1. Frame; 101. Reinforcing plate; 2. Mounting bracket; 3. Drive motor; 301. Output shaft; 4. First rotating component; 5. Second rotating component; 6. Turntable body; 7. Connecting circular plate; 8. Mounting rod; 9. Traveling connecting rod; 10. Air distribution plate. Detailed Implementation

[0021] The present invention will now be further described with reference to the accompanying drawings.

[0022] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "head," "tail," "top," "bottom," "left," "right," "front," "rear," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0023] Please see Figures 1-2 This utility model provides a nickel plating apparatus for semiconductor CVD components, including a frame 1, a mounting bracket 2 disposed on the upper side of the frame 1, a drive motor 3 with an output shaft 301 disposed on the mounting bracket 2, a first rotating member 4 sleeved on the lower end of the output shaft 301, a rotating shaft (not shown) rotatably inserted into the frame 1, a second rotating member 5 sleeved on the upper end of the rotating shaft, and a turntable for mounting workpieces disposed on the lower end of the rotating shaft. The first rotating member 4 and the second rotating member 5 are fitted with transmission components (not shown). A gas equalization plate 10 is installed on the turntable. The drive motor 3 drives the first rotating member 4 to rotate. The first rotating member 4 drives the second rotating member 5 to rotate through the transmission components. The second rotating member 5 drives the turntable to rotate, thereby driving the gas equalization plate 10 to rotate. During the rotation of the gas equalization plate 10, the nickel liquid also flows, so the air bubbles in the small holes are discharged, improving the nickel plating effect. Moreover, due to the flow of nickel liquid, the nickel plating uniformity of the gas equalization plate 10 is better, and nickel particles will not concentrate and adhere to the top surface of the gas equalization plate 10.

[0024] like Figures 1-2As shown, the turntable includes an annular turntable body 6, a connecting circular plate 7 coaxially disposed on the inner side of the turntable body 6, and a plurality of mounting rods 8 fixedly disposed on the circumference of the connecting circular plate 7. The mounting rods 8 are fixedly connected to the inner side of the turntable body 6, and the connecting circular plate 7 is connected to the rotating shaft. The mounting rods 8 can fix the gas equalization plate 10 well and also play a stirring role, increasing the fluidity of the nickel liquid. The annular turntable body 6 forms a hollow structure, which will not affect the nickel plating on the surface of the gas equalization plate 10.

[0025] Specifically, such as Figures 1-2 As shown, the mounting bracket 2 is U-shaped and is fixedly connected to the frame 1. The drive motor 3 is fixedly connected to the mounting bracket 2 or detachably connected. The output shaft 301c passes through the mounting bracket 2. The drive motor 3 is a geared motor. The shaft is rotatably connected to the frame 1 through a bearing (not shown). There are 4 mounting rods 8, which are evenly arranged around the circumference to form a cross structure. The mounting rods 8 are provided with mounting holes (not shown). The mounting holes correspond to the threaded holes at the edge of the air distribution plate 10, which facilitates the installation of the air distribution plate 10.

[0026] like Figures 1-2 As shown, the frame 1 includes a rectangular frame and a reinforcing plate 101 fixedly disposed inside the rectangular frame. The overall weight is light, and the reinforcing plate 101 can enhance the overall strength.

[0027] like Figures 1-2 As shown, a trolley connecting rod 9 is fixedly installed on one side of the frame 1. The trolley is equipped with a basket, and the trolley connecting rod 9 is installed on the basket. The trolley connecting rod 9 is connected to the trolley, which facilitates the trolley to drive the frame 1 to move, and facilitates the gas equalization plate 10 to enter and leave the nickel liquid tank. The frame 1 is set horizontally, so that the gas equalization plate 10 can rotate horizontally, resulting in a better nickel plating effect.

[0028] like Figures 1-2 As shown, the first rotating component 4 is a small gear, the second rotating component 5 is a large gear, and the transmission component is a transmission chain. The structure is simple, practical, and easy to select.

[0029] The above embodiments are merely descriptions for clearly illustrating the present utility model, and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all implementations here, and the obvious variations or modifications derived therefrom are still within the protection scope of the present utility model.

Claims

1. A nickel plating apparatus for semiconductor CVD parts, characterized by comprising: The device includes a frame, a mounting bracket disposed on the upper side of the frame, a drive motor with an output shaft disposed on the mounting bracket, a first rotating component sleeved on the lower end of the output shaft, a rotating shaft rotatably inserted into the frame, a second rotating component sleeved on the upper end of the rotating shaft, and a turntable for mounting workpieces disposed on the lower end of the rotating shaft. The first and second rotating components are fitted with transmission components.

2. The nickel plating apparatus for semiconductor CVD parts according to claim 1, wherein The turntable includes an annular turntable body, a connecting circular plate coaxially disposed inside the turntable body, and a plurality of mounting rods fixedly disposed on the circumference of the connecting circular plate, the mounting rods being fixedly connected to the inner side of the turntable body.

3. The nickel plating apparatus for semiconductor CVD parts according to claim 1, wherein The frame includes a rectangular frame and a reinforcing plate fixedly disposed inside the rectangular frame.

4. The nickel plating apparatus for semiconductor CVD parts according to claim 1, wherein A crane connecting rod is fixedly installed on one side of the frame.

5. The nickel plating apparatus for semiconductor CVD components according to claim 1, characterized in that, The first rotating component is a small gear.

6. The nickel plating apparatus for semiconductor CVD components according to claim 1, characterized in that, The second rotating component is a large gear.

7. The nickel plating apparatus for semiconductor CVD components according to claim 1, characterized in that, The transmission component is a transmission chain.

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