An LED light strip

Abstract

This application provides an LED light strip, comprising: a flexible circuit board; a light-emitting component including a base and an LED chip and a resistor disposed on the base, the base being soldered to and electrically connected to the flexible circuit board, the LED chip and the resistor being arranged side by side and electrically connected to each other; and a lens covering the light-emitting component, one end of which is fixedly connected to the flexible circuit board; wherein the flexible circuit board includes soldered portions and bent portions arranged alternately at intervals, and the lens is disposed on the soldered portions to prevent bending of the soldered portions. By guiding stress to the component-free bent portions and structurally reinforcing the soldered portions, the light strip as a whole has better bendability during installation and use, without affecting the normal light emission of the LEDs, significantly improving the reliability and service life of the product and reducing maintenance costs.

Description

Technical Field

[0001] This application relates to the field of light strip technology, and more particularly to an LED light strip. Background Technology

[0002] LED light strips are linear lighting products that use flexible printed circuit boards (FPCs) or other flexible substrates as carriers, arrange multiple surface-mount light-emitting diodes (LEDs) in segments, and use current-limiting / constant current components to achieve constant voltage or constant current driving.

[0003] Most existing flexible LED strips employ a structure where LED beads are arranged side-by-side on a flexible substrate, with surface-mount resistors connected in series between each LED bead to form a segmented current-limiting circuit. A common approach is to group several LEDs and corresponding resistors into a single section, operating under a constant voltage power supply (e.g., 12V / 24V). To improve light output and protect the chips, some products incorporate lenses or encapsulations at the LED locations, making the LED area relatively "thicker" and "harder." During the assembly of advertising lettering, the LED strip must follow the letter's shape and be bent locally at stroke transitions.

[0004] However, because the lens occupies directly above the LED and increases local rigidity, the actual bendable area is usually located in the narrow strip of the substrate between two adjacent LEDs. This area happens to contain series resistors, their pads, and wiring. Bending directly impacts the surface-mount resistors and their solder joints, easily leading to cracking, warping, and detachment of the resistors and solder connections. This damage can cause short circuits and open circuits, reducing product reliability and increasing maintenance costs. Therefore, there is an urgent need for a light strip structure that can be bent effectively without affecting the normal operation of the LEDs, in order to solve these problems. Utility Model Content

[0005] In view of this, it is necessary to provide an LED light strip that does not affect the LED's light emission when bent, in order to solve the above problems.

[0006] An embodiment of this application provides an LED light strip, comprising:

[0007] Flexible circuit boards;

[0008] The light-emitting component includes a base and an LED chip and a resistor disposed on the base. The base is soldered to the flexible circuit board and electrically connected to the flexible circuit board. The LED chip and the resistor are arranged side by side and electrically connected to each other.

[0009] A lens is mounted on the light-emitting component, and one end is fixedly connected to the flexible circuit board;

[0010] The flexible circuit board includes welding portions and bending portions arranged alternately at intervals, and the lens is disposed on the welding portion to prevent the welding portion from bending.

[0011] In at least one embodiment of this application, the base includes a bracket, a first pad, and a second pad arranged parallel to the first pad. The bracket is disposed on the welding part and has an electrical cavity.

[0012] One side of the first pad and the second pad are both located on the welding part, and the other side extends into the electrical cavity. The first pad is welded to the LED chip, and the second pad is welded to the resistor.

[0013] In at least one embodiment of this application, the lens has a lamp cavity, the peripheral surface of the lamp cavity engages with the side of the bracket, the peripheral surface of the lamp cavity extends inward to form a stepped surface, and the side of the bracket away from the welded part is attached to the stepped surface.

[0014] In at least one embodiment of this application, the base further includes an insulating fixing layer disposed on the bracket, the insulating fixing layer being located within the electrical cavity and forming a heat dissipation groove with the bracket;

[0015] The light-emitting component also includes a heat dissipation layer, which is disposed within the heat dissipation groove.

[0016] In at least one embodiment of this application, the light-emitting component further includes a heat dissipation layer, which includes a first heat sink and a second heat sink. The first heat sink is disposed between the first pad and the LED chip, and the second heat sink is disposed between the second pad and the resistor for heat dissipation.

[0017] In at least one embodiment of this application, the insulating fixing layer further includes an integrally formed fixing part and a partition part. The fixing part surrounds the peripheral surface of the heat dissipation layer, and the partition part divides the heat dissipation groove into a first groove and a second groove. The first heat dissipation fin is disposed in the first groove, and the second heat dissipation fin is disposed in the second groove.

[0018] In at least one embodiment of this application, when viewed along a direction perpendicular to the bracket, the projected area of ​​the first groove is denoted as a, and the projected area of ​​the second groove is denoted as b, satisfying 2b≤a≤3b.

[0019] In at least one embodiment of this application, the first pad has a first through hole, the second pad has a second through hole, and the bracket portion extends into the first through hole and the second through hole, respectively engaging and connecting with the first pad and the second pad.

[0020] In at least one embodiment of this application, the lens includes a body, a protrusion, and a frosted portion. The protrusion is arranged around the side of the body away from the flexible circuit board, and the frosted portion is disposed on the outer peripheral surface of the body.

[0021] In at least one embodiment of this application, the light-emitting component further includes a fluorescent layer that fills and seals the electrical cavity.

[0022] The aforementioned LED light strip concentrates the light-emitting components in the welding section and alternates between the welding section and the bending section. This ensures that when the light strip is bent under stress, deformation preferentially occurs in the bending section, rather than affecting the resistor and its solder joints. A lens cover is placed on the light-emitting components and fixed to the flexible circuit board, further improving the local rigidity of the welding section. By guiding stress to the component-free bending section and structurally reinforcing the welding section, the light strip as a whole has better bendability during installation and use, without affecting the normal light emission of the LEDs. This significantly improves the reliability and lifespan of the product and reduces maintenance costs. Attached Figure Description

[0023] Figure 1 This is a perspective view of the LED light strip described in this application;

[0024] Figure 2 This is a cross-sectional view of a single LED chip assembly in the LED light strip described in this application;

[0025] Figure 3 for Figure 2 Enlarged view of part A in the image;

[0026] Figure 4 This is a first exploded view of a single LED chip assembly in the LED light strip described in this application;

[0027] Figure 5 for Figure 4 Enlarged view of part B in the image;

[0028] Figure 6 This is a bottom view of a single LED bead in the LED light strip described in this application;

[0029] Figure 7 This is a partial exploded view of the light-emitting component described in this application;

[0030] Figure 8 This is a second exploded view of a single LED chip assembly in the LED light strip described in this application;

[0031] Figure 9 for Figure 8 Enlarged view of section C in the image.

[0032] Explanation of main component symbols

[0033] 100. An LED light strip; 10. A flexible circuit board; 11. A welding part; 12. A bending part; 20. A light-emitting component; 21. A base; 211. A bracket; 212. A first solder pad; 2121. A first through hole; 213. A second solder pad; 2131. A second through hole; 214. An electrical cavity; 215. An insulating fixing layer; 2151. A fixing part; 2152. A separating part; 21521. A first groove; 21522. A second groove; 216. A heat dissipation groove; 22. An LED chip; 23. A resistor; 24. A heat dissipation layer; 241. A first heat sink; 242. A second heat sink; 25. A fluorescent layer; 30. A lens; 31. A lamp cavity; 312. A stepped surface; 32. A main body; 33. A protrusion; 34. A frosted part. Detailed Implementation

[0034] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0035] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have an intervening component. When a component is considered to be "placed" on another component, it can be directly placed on the other component or may also have an intervening component. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "back," and similar expressions used in this article are for illustrative purposes only.

[0036] An embodiment of this application provides an LED light strip, comprising:

[0037] Flexible circuit boards;

[0038] A light-emitting component includes a base and an LED chip and a resistor disposed on the base. The base is soldered to the flexible circuit board and electrically connected to the flexible circuit board. The LED chip and the resistor are arranged side by side and electrically connected to each other.

[0039] A lens is mounted on the light-emitting component, and one end is fixedly connected to the flexible circuit board;

[0040] The flexible circuit board includes welding portions and bending portions arranged alternately at intervals, and the lens is disposed on the welding portion to prevent the welding portion from bending.

[0041] The aforementioned LED light strip concentrates the light-emitting components in the welding section and alternates between the welding section and the bending section. This ensures that when the light strip is bent under stress, deformation preferentially occurs in the bending section, rather than affecting the resistor and its solder joints. A lens cover is placed on the light-emitting components and fixed to the flexible circuit board, further improving the local rigidity of the welding section. By guiding stress to the component-free bending section and structurally reinforcing the welding section, the light strip as a whole has better bendability during installation and use, without affecting the normal light emission of the LEDs. This significantly improves the reliability and lifespan of the product and reduces maintenance costs.

[0042] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0043] Please see Figures 1-9 This application provides an LED light strip 100, including a flexible circuit board 10, a light-emitting component 20, and a lens 30. The light-emitting component 20 includes a base 21 and an LED chip 22 and a resistor 23 disposed on the base 21. The base 21 is soldered to the flexible circuit board 10 and electrically connected to the flexible circuit board 10. The LED chip 22 and the resistor 23 are arranged side by side and electrically connected to each other. The lens 30 covers the light-emitting component 20, and one end is fixedly connected to the flexible circuit board 10.

[0044] The flexible circuit board 10 includes a welding portion 11 and a bending portion 12 arranged alternately at intervals. The lens 30 is disposed on the welding portion 11 to prevent the welding portion 11 from bending.

[0045] Specifically, in this embodiment, it should be noted that an LED light strip 100 includes three main parts: a flexible circuit board 10, a light-emitting component 20, and a lens 30. The flexible circuit board 10, as the basic carrier of the entire light strip, is designed with alternating welding sections 11 and bending sections 12 along the length of the light strip. This periodic partitioning structure clearly divides the functional areas and bending areas. The light-emitting component 20 is concentrated in the welding section 11, which includes a base 21 and LED chips 22 and resistors 23 disposed on the base 21. The LED chips 22 and resistors 23 are arranged side-by-side and connected electrically to form a basic light-emitting circuit unit. The base 21 is firmly welded to the welding section 11 of the flexible circuit board 10 via solder joints, thereby achieving mechanical fixation and electrical interconnection between the light-emitting component 20 and the flexible circuit board 10.

[0046] Furthermore, the lens 30 is positioned above the light-emitting component 20, covering the LED chip 22 and resistor 23 to form an integrated encapsulated protection. One end of the lens 30 is fixedly connected to the welding portion 11 of the flexible circuit board 10 and is fully covered along the welding portion 11. It should be emphasized that the lens 30 is only located above the welding portion 11 and does not extend into the bending portion 12 area. The lens 30 and the base 21 together form a rigid support structure, which greatly improves the overall rigidity of the welding portion 11 and effectively prevents the welding portion 11 from bending or warping during the installation or use of the light strip, thereby protecting the structural integrity of the light-emitting component 20 and its solder joints. The bending portion 12 does not have any components or the lens 30, maintaining flexibility and adaptability. When the light strip needs to detour or turn, the bending deformation can be naturally concentrated and released at the bending portion 12.

[0047] Through this structural arrangement, the entire light strip forms a periodic distribution of "rigid welding area - flexible bending area - rigid welding area", so that the welding part 11 undertakes optical, electrical and structural protection functions, while the bending part 12 is specifically used for deformation, realizing reasonable zoning management of function and stress.

[0048] Preferably, the technical solution implemented in this embodiment has significant advantages in terms of mechanical reliability. When the light strip encounters bending requirements during installation, due to the difference in stiffness between the welded part 11 and the bending part 12, external force cannot be directly applied to the welded part 11, and the welded part 11 remains basically straight under the protection of the lens 30; the bending stress is naturally guided to the adjacent bending part 12 for concentrated release, fundamentally avoiding failure phenomena such as cracking, warping, and detachment of the resistor 23, LED chip 22, or their solder joints due to stretching or compression.

[0049] Furthermore, in terms of optical performance, the lens 30, positioned above the soldering section 11, enables secondary light distribution of the LED light output, resulting in more uniform light emission and reducing glare or graininess from point light sources. Since the lens 30 is fixed to the soldering section 11 of the flexible circuit board 10, it will not deform or shift with bending, ensuring that the relative position of the optical components and the LED chip 22 remains stable, resulting in consistent and reliable light output over a long period. Simultaneously, the lens 30 also serves as a protective cover, preventing dust, moisture, and external impacts from directly contacting the LED chip 22 and the resistor 23, thereby further extending their service life.

[0050] In one specific embodiment, the base 21 includes a bracket 211, a first solder pad 212 and a second solder pad 213 arranged parallel to the first solder pad 212. The bracket 211 is disposed on the welding part 11 and has an electrical cavity 214.

[0051] One side of the first pad 212 and the second pad 213 are both provided on the welding part 11, and the other side extends into the electrical cavity 214 respectively. The first pad 212 is welded to the LED chip 22, and the second pad 213 is welded to the resistor 23.

[0052] Specifically, the base 21 includes a bracket 211, a first solder pad 212, and a second solder pad 213 arranged parallel to the first solder pad 212. The bracket 211 is mounted on the soldering portion 11 of the flexible circuit board 10 and has an electrical cavity 214 therein. This electrical cavity 214 provides an independent and enclosed mounting space for the LED chip 22 and the resistor 23, allowing the light-emitting component 20 to be rationally arranged and protected.

[0053] Furthermore, by implementing the technical solution of this embodiment, the LED chip 22 and resistor 23 can be separated by the electrical cavity 214, avoiding mutual interference between them during welding or operation. One end of the pad is welded to the welding part 11 of the flexible circuit board 10, ensuring electrical conductivity with the circuit board, while the other end extends into the electrical cavity 214 to be welded to the component, effectively shortening the current transmission path, reducing the contact resistance 23, and improving electrical performance. At the same time, the electrical cavity 214 provides protection for the pad and component solder joint, reducing the risk of external force or bending stress directly acting on the solder joint, thereby reducing failures such as poor soldering and cracking. Thus, this embodiment further improves the robustness and reliability of the welded connection between the LED chip 22 and resistor 23, enabling the light strip to maintain stable electrical performance and mechanical strength during bending and long-term use.

[0054] In one specific embodiment, the lens 30 has a lamp cavity 31, the peripheral surface of the lamp cavity 31 engages with the side of the bracket 211, the peripheral surface of the lamp cavity 31 extends inward to form a stepped surface 312, and the side of the bracket 211 opposite to the welding part 11 is attached to the stepped surface 312.

[0055] Specifically, the lens 30 has a lamp cavity 31 located inside the lens 30, which covers and protects the light-emitting component 20 below. The peripheral surface of the lamp cavity 31 is connected to the side of the bottom bracket 211 by a snap-fit ​​connection, that is, the peripheral structure of the lamp cavity 31 and the side of the bracket 211 are precisely fitted together, thereby achieving a firm positioning and assembly of the two. As the peripheral surface of the lamp cavity 31 extends inward, a stepped surface 312 is formed. This stepped surface 312 is located inside the lamp cavity 31 and is used to provide additional positioning reference and stable support for the bracket 211, making the structure more stable.

[0056] Furthermore, through this dual-coordinated structure of top-bottom and side-mounted components, the lens 30 and the bracket 211 achieve precise assembly and reliable connection, enabling the light-emitting component 20, the flexible circuit board 10, and the lens 30 to form a complete integrated structural unit. This design not only ensures the precise position of the lens 30 relative to the bracket 211 but also enhances the sealing and protection capabilities of the internal space of the lamp cavity 31, contributing to the safe and stable operation of internal components such as the LED chip 22 and the resistor 23.

[0057] In one specific embodiment, the base 21 further includes an insulating fixing layer 215 disposed on the bracket 211. The insulating fixing layer 215 is located inside the electrical cavity 214 and forms a heat dissipation groove 216 with the bracket 211.

[0058] The light-emitting component 20 also includes a heat dissipation layer 24, which is disposed within the heat dissipation groove 216.

[0059] Specifically, the base 21 includes not only a bracket 211, a first solder pad 212, and a second solder pad 213, but also an insulating fixing layer 215 disposed on the bracket 211. This insulating fixing layer 215 is installed inside the electrical cavity 214 to isolate electrical components and prevent short circuits between different electrical areas. A heat dissipation groove 216 is structurally designed between the insulating fixing layer 215 and the bracket 211, i.e., a recessed space with a specific shape is reserved inside the electrical cavity 214 to accommodate the heat dissipation components. The insulating fixing layer 215, through its groove walls, limiting shoulder surface, and the bottom of the groove in the bracket 211, jointly provides circumferential limiting, vertical support, and anti-tilting and anti-displacement constraints for the heat dissipation layer 24, ensuring that the heat dissipation layer 24 is stably held in the designed position and maintains a constant pressure state.

[0060] Furthermore, the light-emitting component 20 further includes a heat dissipation layer 24, which is disposed inside the heat dissipation groove 216 and closely adheres to the groove wall or bottom surface of the heat dissipation groove 216. Through this arrangement, the heat dissipation layer 24 can maintain close contact with heat-generating elements such as LED chip 22 or resistor 23, so that the heat generated during operation can be quickly and efficiently conducted to the heat dissipation groove 216, and finally further diffused to the bracket 211 and flexible circuit board 10 through the heat dissipation groove 216, achieving efficient thermal management.

[0061] In one specific embodiment, the light-emitting component 20 further includes a heat dissipation layer 24, which includes a first heat sink 241 and a second heat sink 242. The first heat sink 241 is disposed between the first pad 212 and the LED chip 22, and the second heat sink 242 is disposed between the second pad 213 and the resistor 23 for heat dissipation.

[0062] Specifically, by introducing a heat dissipation layer 24 into the light-emitting component 20, and the heat dissipation layer 24 including a first heat sink 241 and a second heat sink 242, independent heat dissipation of the LED chip 22 and the resistor 23 is achieved, thereby achieving significant optimization in terms of thermal management, component protection and overall reliability.

[0063] Furthermore, the first heat sink 241 is disposed between the first pad 212 and the LED chip 22; the second heat sink 242 is disposed between the second pad 213 and the resistor 23, and both directly contact their respective heat-generating components to form dedicated heat dissipation paths. Compared with the traditional LED light strip where the LED and resistor 23 share a heat dissipation path, this structure is more refined and efficient.

[0064] In one specific embodiment, the insulating fixing layer 215 further includes an integrally formed fixing part 2151 and a partition part 2152. The fixing part 2151 surrounds the periphery of the heat dissipation layer 24, and the partition part 2152 divides the heat dissipation groove 216 into a first groove 21521 and a second groove 21522. The first heat dissipation fin 241 is disposed in the first groove 21521, and the second heat dissipation fin 242 is disposed in the second groove 21522.

[0065] Specifically, the insulating fixing layer 215 is further optimized into an integrally molded structure. This structure has two major functional units: a fixing part 2151 and a separating part 2152. Both are manufactured as a whole from the same insulating material, without the need for additional splicing or assembly.

[0066] Furthermore, the fixing part 2151 is distributed in a ring shape, completely covering and surrounding the outer peripheral surface of the heat dissipation layer 24, playing a stabilizing and limiting role, ensuring that the heat dissipation layer 24 will not shake or shift within the heat dissipation groove 216.

[0067] The partition 2152 is located in the middle of the heat dissipation groove 216, which physically isolates the heat transfer and airflow interaction between the two grooves, making the two grooves form independent thermal management units. This avoids the disorderly diffusion and mixing of heat, prevents the heat from one heat source from affecting the working stability of the other heat source, and divides the originally single heat dissipation groove 216 into two independent spaces: the first groove 21521 is used to place the first heat sink 241, which corresponds to the LED chip 22; the second groove 21522 is used to place the second heat sink 242, which corresponds to the resistor 23.

[0068] Furthermore, since the fixing part 2151 and the partition part 2152 are integrally formed, the overall structure is more stable, ensuring that the heat dissipation layer 24 always remains in the designed position during stress, thermal cycling or bending, without loosening or misalignment.

[0069] In one specific embodiment, when viewed along a direction perpendicular to the bracket 211, the projected area of ​​the first groove 21521 is denoted as a, and the projected area of ​​the second groove 21522 is denoted as b, satisfying 2b≤a≤3b.

[0070] Specifically, it should be noted that the reason for limiting the projected area 'a' of the first groove 21521 to the projected area 'b' of the second groove 21522 to satisfy 2b≤a≤3b is not only to consider the difference in heat generation between the LED chip 22 and the resistor 23 during operation, but also to the compatibility of the package size and welding process. Since the overall package space of the LED bead bracket 211 is limited, if the area of ​​the first groove 21521 is too small, the heat sink will not be able to fully cover the mounting area of ​​the LED chip 22, making it difficult to meet the heat dissipation requirements of high-power chips; while if the area of ​​the second groove 21522 is too small, there will be insufficient mounting and welding positions for the resistor 23, resulting in poor solder joints or cold solder joints. By controlling the area ratio of the two within the range of 2:1 to 3:1, the heat dissipation and welding space can be reasonably allocated within the limited package size of the bracket 211, ensuring that the LED chip 22 has sufficient heat dissipation area while guaranteeing the stable and reliable welding position of the resistor 23.

[0071] Furthermore, by implementing the technical solution of this embodiment, the limitation of 2b≤a≤3b ensures a coordinated relationship between the heat dissipation design, package size, and soldering process. On one hand, the first groove 21521 has a larger area, and the corresponding heat sink can meet the higher heat dissipation requirements of the LED chip 22, effectively reducing the junction temperature and avoiding light decay and shortened lifespan; the second groove 21522 maintains a reasonable area, allowing the resistor 23 to be smoothly mounted and soldered, avoiding poor soldering or misalignment due to insufficient space.

[0072] In one specific embodiment, the first pad 212 has a first through hole 2121, the second pad 213 has a second through hole 2131, and the bracket 211 extends into the first through hole 2121 and the second through hole 2131, respectively fitting and connecting with the first pad 212 and the second pad 213.

[0073] Specifically, the first pad 212 and the second pad 213 each have a first through hole 2121 and a second through hole 2131 respectively on their bodies. These two through holes are located in the middle of the pad or at the corresponding insertion area of ​​the bracket 211, and their size and shape match the bracket 211, allowing the bracket 211 to partially extend into the through holes. During assembly, the corresponding part of the bracket 211 is inserted into the first through hole 2121 and the second through hole 2131 from below or the side, forming a fitting connection with the pad. This allows the bracket 211 and the pad to be connected not only through external mounting or soldering, but also through a physical fitting structure that enhances the overall bonding strength and positioning accuracy.

[0074] Furthermore, the first through hole 2121 and the second through hole 2131 are equivalent to "mounting holes" on the pads, and the bracket 211 enters the hole through a partial protrusion or pin. After insertion, the bracket 211 forms a tight contact with the hole wall, producing a limiting and locking effect. In this structure, the first pad 212 and the bracket 211, and the second pad 213 and the bracket 211, respectively form independent and stable mating units.

[0075] In summary, compared with the traditional method of simply relying on welding or glue to fix the pads, this design provides additional mechanical bonding force and forms a more stable and durable skeleton support for the inside of the LED light strip in terms of space.

[0076] In one specific embodiment, the lens 30 includes a main body 32, a protrusion 33 and a frosted portion 34. The protrusion 33 is arranged around the side of the main body 32 away from the flexible circuit board 10, and the frosted portion 34 is disposed on the outer peripheral surface of the main body 32.

[0077] Specifically, the lens 30 is designed to consist of a main body 32, a protrusion 33, and a frosted part 34. The three work together to enable the lens 30 to not only have basic optical light distribution functions, but also multiple functions such as structural protection, anti-glare, and aesthetics.

[0078] Furthermore, the main body 32 is the core part of the lens 30, and its entire body is made of transparent or high light transmittance material, used to directly cover the light-emitting component 20 where the LED chip 22 and resistor 23 are located. The bottom of the main body 32 is positioned opposite to the welding part 11 of the flexible circuit board 10, and the upper part faces the light emission direction, used to control and adjust the light emitted by the LED.

[0079] Furthermore, the protrusion 33 is arranged in a ring shape and is located on the side of the main body 32 away from the flexible circuit board 10, that is, around the perimeter of the upper surface of the lens 30. The protrusion 33 and the main body 32 are integrally formed and are arranged around the perimeter. Its height is slightly higher than the center of the main body 32, forming a miniature annular protective ring. This ring is used to refract and scatter light at a certain angle when it passes through. Through this refraction, some light can be guided to a wider angle, thereby expanding the illumination range of the LED light strip and achieving wide-angle lighting.

[0080] Furthermore, the frosted part 34 is set on the outer peripheral surface of the main body 32. Through surface microstructure treatment, a diffuse effect is formed, which causes light passing through this area to be scattered, thereby reducing light spots, reducing glare, and improving light uniformity.

[0081] In summary, the rational combination of this triple structure means that the lens 30 not only serves as an optical cover for the LED, but also achieves comprehensive optimization in terms of structural safety, optical performance, and appearance.

[0082] In one specific embodiment, the light-emitting component 20 further includes a fluorescent layer 25, which fills and seals the electrical cavity 214.

[0083] Specifically, the light-emitting component 20 also includes a fluorescent layer 25, which fills and seals the interior of the electrical cavity 214. The electrical cavity 214 is an internal cavity formed by a support 211, solder pads, and an insulating fixing layer 215, and houses the LED chip 22, resistor 23, heat dissipation structure, and related electrical connection components. Because the electrical cavity 214 has tiny gaps between its structure and the outside world, if it is not sealed, dust, moisture, and other impurities may seep into it, affecting the performance and reliability of the components.

[0084] Furthermore, the fluorescent layer 25 is made of a fluorescent adhesive or phosphor filler with high light transmittance and high stability, which serves as a sealing filler and completely fills all the gaps in the electrical cavity 214.

[0085] In one specific embodiment, the flexible circuit board has an adhesive layer on the side opposite to the light-emitting component 20.

[0086] In this embodiment, it should be noted that an adhesive layer is provided on the back of the flexible circuit board. This adhesive layer is typically made of double-sided adhesive or pressure-sensitive adhesive and is uniformly coated or laminated onto the back surface of the flexible circuit board. The adhesive layer serves as the direct connection medium between the LED strip and the mounting substrate, and its design fully considers the usage environment, installation method, and reliability requirements of the LED strip.

[0087] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. An LED light strip, characterized in that, include: Flexible circuit boards; A light-emitting component includes a base and an LED chip and a resistor disposed on the base. The base is soldered to the flexible circuit board and electrically connected to the flexible circuit board. The LED chip and the resistor are arranged side by side and electrically connected to each other. A lens is mounted on the light-emitting component, and one end is fixedly connected to the flexible circuit board; The flexible circuit board includes welding portions and bending portions arranged alternately at intervals, and the lens is disposed on the welding portion to prevent the welding portion from bending.

2. The LED light strip according to claim 1, characterized in that, The base includes a bracket, a first solder pad, and a second solder pad arranged parallel to the first solder pad. The bracket is disposed on the welding part and has an electrical cavity. One side of the first pad and the second pad are both located on the welding part, and the other side extends into the electrical cavity. The first pad is welded to the LED chip, and the second pad is welded to the resistor.

3. The LED light strip according to claim 2, characterized in that, The lens has a lamp cavity, the peripheral surface of the lamp cavity engages with the side of the bracket, the peripheral surface of the lamp cavity extends inward to form a stepped surface, and the side of the bracket away from the welding part is attached to the stepped surface.

4. The LED light strip according to claim 2, characterized in that, The base also includes an insulating fixing layer disposed on the bracket, the insulating fixing layer being located inside the electrical cavity and forming a heat dissipation groove with the bracket; The light-emitting component also includes a heat dissipation layer, which is disposed within the heat dissipation groove.

5. An LED light strip according to claim 4, characterized in that, The light-emitting component further includes a heat dissipation layer, which includes a first heat sink and a second heat sink. The first heat sink is disposed between the first pad and the LED chip, and the second heat sink is disposed between the second pad and the resistor for heat dissipation.

6. The LED light strip according to claim 5, characterized in that, The insulating fixing layer also includes an integrally formed fixing part and a partition part. The fixing part surrounds the periphery of the heat dissipation layer, and the partition part divides the heat dissipation groove into a first groove and a second groove. The first heat dissipation fin is disposed in the first groove, and the second heat dissipation fin is disposed in the second groove.

7. An LED light strip according to claim 6, characterized in that, Viewed along a direction perpendicular to the bracket, the projected area of ​​the first groove is denoted as a, and the projected area of ​​the second groove is denoted as b, satisfying 2b≤a≤3b.

8. An LED light strip according to claim 2, characterized in that, The first pad has a first through hole, and the second pad has a second through hole. The bracket portion extends into the first through hole and the second through hole and is respectively fitted and connected to the first pad and the second pad.

9. An LED light strip according to claim 1, characterized in that, The lens includes a main body, a protrusion, and a frosted portion. The protrusion is located on the side opposite to the flexible circuit board, and the frosted portion is disposed on the outer peripheral surface of the main body.

10. An LED light strip according to claim 2, characterized in that, The light-emitting component also includes a fluorescent layer that fills and seals the electrical cavity.

Images