A headset

Abstract

An earphone includes a connected sound-generating part and an ear hook. The ear hook houses a circuit board assembly. The sound-generating part includes a first housing, a first microphone, a second microphone, a speaker, and a flexible circuit board disposed within the first housing. The first and second microphones are located on different side walls of the first housing. The first microphone, second microphone, and speaker are respectively connected to the flexible circuit board, and the circuit board assembly is electrically connected to the flexible circuit board. Using a flexible circuit board instead of wires and cables to connect the microphone and speaker, and then connecting the earphone's circuit board assembly via the flexible circuit board, effectively simplifies the internal wiring structure of the earphone, enhances the stability of electrical connections between related components, reduces the space occupied within the limited sound-generating part, and allows for a larger speaker design. Simultaneously, using multiple microphones at different locations within the sound-generating part to pick up external sound provides support for active noise cancellation in the earphone.

Description

[0001] This application claims priority to Chinese application No. 202411844133.7, filed on December 15, 2024, the contents of which are incorporated herein by reference in part. Technical Field

[0002] This application relates to the field of acoustic technology, specifically to a type of headphone. Background Technology

[0003] Headphones have become an indispensable tool in people's daily lives and work. They can be used with mobile phones, computers, and other terminal devices to provide users with an auditory feast. As users' demands for headphones continue to increase, in addition to stable output performance, the rationality of the headphone's structural layout and other factors are also important factors affecting the user experience. Utility Model Content

[0004] The main technical problem this application addresses is to provide an earphone, including a sound-producing part and an ear hook connected to the sound-producing part. The ear hook is used to place the sound-producing part near the ear canal without blocking the ear canal opening during wearing. The ear hook contains a circuit board assembly, and the sound-producing part includes a first housing, a speaker, a flexible circuit board, a first microphone, and a second microphone.

[0005] The first microphone and the second microphone are disposed on different side walls of the first housing; the speaker and the flexible circuit board are disposed inside the first housing, the speaker, the first microphone and the second microphone are respectively connected to the flexible circuit board, and the circuit board assembly is electrically connected to the flexible circuit board.

[0006] An earphone according to the above embodiment includes a sound-emitting part and an ear hook. The ear hook has a circuit board assembly inside. The sound-emitting part includes a second shell, a first microphone, a second microphone, a speaker, and a flexible circuit board disposed within the second shell. The first and second microphones are disposed on different side walls of the second shell. The first microphone, the second microphone, and the speaker are respectively connected to the flexible circuit board. The circuit board assembly is electrically connected to the flexible circuit board. On the one hand, using a flexible circuit board instead of wires and cables to connect the microphone and speaker together, and then electrically connecting the earphone's circuit board assembly through the flexible circuit board, effectively simplifies the wiring structure inside the sound-emitting part, enhances the stability of the electrical connection between related components and the compactness of the overall structure of the sound-emitting part, and reduces the occupation of the limited space inside the sound-emitting part, allowing for a larger speaker design size. On the other hand, using multiple microphones at different positions of the sound-emitting part to pick up external sound can support active noise cancellation in the earphone. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of the outline of the front side of the ear as described in this application.

[0008] Figure 2 This is a schematic diagram illustrating the wearing state of the earphones when worn on the ear, according to one embodiment.

[0009] Figure 3 A schematic diagram of the overall outline structure of an earphone according to one embodiment (I).

[0010] Figure 4 A schematic diagram of the overall outline structure of an earphone according to one embodiment (II).

[0011] Figure 5 A schematic diagram of the overall outline structure of an earphone according to one embodiment (III).

[0012] Figure 6 This is a schematic diagram of the internal structure of an earphone with the housing omitted, according to one embodiment.

[0013] Figure 7 This is a schematic diagram of the system architecture of an earphone according to one embodiment.

[0014] Figure 8 This is a schematic diagram of the sound-producing part in an earphone according to one embodiment.

[0015] Figure 9 This is an exploded view of the sound-producing part in an earphone according to one embodiment.

[0016] Figure 10 This is a schematic diagram of the flexible circuit board in an earphone according to one embodiment (I).

[0017] Figure 11 This is a schematic diagram (II) of the flexible circuit board in an earphone according to one embodiment.

[0018] Figure 12 This is a schematic diagram of an exemplary structural architecture of a speaker in an earphone according to one embodiment (I).

[0019] Figure 13 This is a schematic diagram (II) of an exemplary structural architecture of a speaker in an earphone according to one embodiment.

[0020] Figure 14 This is a schematic diagram of the structure of the flexible wall of the sound-emitting part in an earphone according to one embodiment.

[0021] Figure 15 This is a schematic diagram of the structure of the adapter in an earphone according to one embodiment.

[0022] Figure 16 This is a schematic diagram of the structure of a converter circuit board in an earphone according to one embodiment.

[0023] Figure 17This is an exploded view of the battery compartment in an earphone according to one embodiment. Detailed Implementation

[0024] The present application will be further described in detail below with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by related similar element numbers. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid overwhelming the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art. Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for clearly describing a particular embodiment and do not imply a necessary order, unless otherwise stated that a certain order must be followed. The component numbers used herein, such as "first," "second," etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections (linkages).

[0025] Figure 1 This is a schematic diagram illustrating the physiological structure of an exemplary ear, based on headphones provided in some embodiments of this application. Please refer to [link / reference]. Figure 1 The exemplary ear may include physiological parts such as the external auditory canal 101, the concha 102, the cymba conchae 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, the earlobe 108, and the crus of the helix 109. Although the external auditory canal 101 has a certain depth and extends to the tympanic membrane of the ear, unless otherwise specified, the external auditory canal 101 can be understood as its entrance (i.e., the ear canal) away from the tympanic membrane. Furthermore, the physiological parts such as the concha 102, the cymba conchae 103, and the triangular fossa 104 have a certain volume and depth in three-dimensional space, and the concha 102 is directly connected to the external auditory canal 101, which can be simply regarded as the aforementioned ear canal being located at the bottom of the concha 102.

[0026] Regarding the headphones provided in some embodiments of this application, stable wearing of the headphones can be achieved by utilizing one or more physiological parts of the ear. For example, since physiological parts such as the external auditory canal 101, concha 102, cymba concha 103, and triangular fossa 104 have a certain depth and volume in three-dimensional space, they can meet the requirements for stable wearing of the headphones. When the headphones are in the wearing state, the entire or part of the headphone structure can contact the upper part of the external auditory canal 101 (such as one or more physiological parts such as the cymba concha 103, triangular fossa 104, antihelix 105, scaphoid fossa 106, helix 107, and crus of helix 109); when the headphones are in the wearing state, the entire or part of the headphone structure can also be located within one or more physiological parts of the ear, for example, located within... Figure 1 The first region P1, enclosed by the dashed line, includes at least the auricular sac 103 and the triangular fossa 104. For example, located in... Figure 1 The second region P2, enclosed by the dotted line, includes at least the concha cavity 102. Exemplarily, when the headphones are worn, the entire or part of the headphone structure may also be located on the front side of the helix foot 109, for example... Figure 1 Within the third region P3 enclosed by the dashed line.

[0027] Due to individual differences among users, ears may vary in shape, size, and other dimensions. To facilitate description and understanding, and to minimize or even eliminate these individual differences, unless otherwise specified, this application primarily uses an ear model with a "standard" shape and size as a reference to describe the structure of the headphones in different embodiments and how they are worn on that ear model. For example, a simulator (such as the GRAS 45BC KEMAR) containing a head and its (left and right) ears can be manufactured based on ANSI:S3.36, S3.25, and IEC:60318-7 standards as a reference for wearing headphones, thus representing the scenario of most users normally wearing headphones.

[0028] Therefore, descriptions such as "user wearing," "in wearing state," and "under wearing state" in this application can refer to the headphones described in this application being worn on the ears of the aforementioned simulator. Of course, considering the individual differences among different users, the structure, shape, size, thickness, etc. of one or more parts of the ear can be differentiated according to different ear shapes and sizes. These differentiated designs can be manifested in the characteristic parameters of one or more parts of the headphones having different ranges of values ​​to adapt to different ears.

[0029] It should be noted that in fields such as medicine and anatomy, the sagittal plane of the human body can be defined.

[0030] The body has three basic planes: the sagittal plane, the coronal plane, and the horizontal plane; and three basic axes: the sagittal axis, the coronal axis, and the vertical axis. The sagittal plane is a section perpendicular to the ground along the anteroposterior direction of the body, dividing it into left and right parts. The coronal plane is a section perpendicular to the ground along the left and right direction of the body, dividing it into anterior and posterior parts. The horizontal plane is a section parallel to the ground along the vertical direction of the body, dividing it into superior and inferior parts. Correspondingly, the sagittal axis is the axis along the anteroposterior direction of the body and perpendicular to the coronal plane; the coronal axis is the axis along the left and right direction of the body and perpendicular to the sagittal plane; and the vertical axis is the axis along the vertical direction of the body and perpendicular to the horizontal plane.

[0031] Furthermore, the "front side of the ear" mentioned in this application is a concept relative to "back side of the ear." The former refers to the side of the ear away from the head, while the latter refers to the side of the ear facing the head; both refer to the user's ear. Specifically, by observing the ear of the simulator along the direction of the human coronal axis, one can obtain... Figure 1 The diagram shows the front outline of the ear.

[0032] It should be noted that the above description of the ear is for illustrative purposes only and is not intended to limit the scope of this application. Those skilled in the art can make various changes and modifications based on the description in this application, and such changes and modifications still fall within the protection scope of this application.

[0033] Please see Figures 2 to 17 Some embodiments of this application provide headphones including a sound-emitting part 10 and an ear hook connected to the sound-emitting part 10; in the wearing state, at least a portion of the ear hook can be located between the back of the ear and the head, and the sound-emitting part 10 can be located in front of the ear. For example, please refer to... Figure 2 The ear hook allows the sound-emitting part 10 to be worn near the external auditory canal 101 without blocking the position of the external auditory canal 101. It should be noted that due to individual differences among different users, when the earphone is worn by different users, the sound-emitting part 10 may partially cover the external auditory canal 101, but the external auditory canal 101 is still not blocked. The following is a detailed explanation.

[0034] Please see Figures 6 to 9The sound-emitting part 10 includes a first housing 11, a speaker 12, and one or more microphones. The speaker 12 is located inside the first housing 11 and primarily converts electrical signals into mechanical vibrations when powered on, thereby generating sound output. For example, the sound output by the speaker 12 may include conversation sounds, noise-canceling sounds, or other sound signals. The microphones are located inside the first housing 11 or on its side wall and are mainly used to collect or pick up sound signals, such as ambient sounds, user voices, and sounds output by the sound-emitting part 10. Regarding the mechanical vibration of the speaker 12, this vibration can be based on bone conduction, acting directly on the user's auditory nerve primarily through the user's bones and tissues, or it can be based on air conduction, acting on the user's tympanic membrane primarily through air, thereby affecting the auditory nerve. For the sound heard by the user, the former can be simply referred to as "bone conduction sound," and the latter as "air conduction sound." Therefore, the speaker 12 can generate both bone conduction sound and air conduction sound, or both simultaneously.

[0035] Please see Figures 3 to 7 as well as Figures 15 to 17 The ear hook includes an adapter 20 and a battery compartment 30. The adapter 20 connects the battery compartment 30 and the sound-emitting part 10. The adapter 20 includes a second housing 21 and an interaction button 22 disposed on the second housing 21. The battery compartment 30 includes a third housing 31, a circuit board assembly 32, a battery assembly 33, an earphone antenna 34, and a wear detection structure 35. The circuit board assembly 32 is disposed inside the third housing 31 and is directly or indirectly electrically connected to the speaker 12, the battery assembly 33, the microphone, the interaction button 22, the earphone antenna 34, and the wear detection structure 35. The circuit board assembly 32 can be understood as the main control board or motherboard of the earphone and a collection of related components. It mainly plays a role in regulating and managing all or part of the functional components of the earphone to support the realization of all or part of the earphone's functions, such as power on / off and working mode switching. The battery assembly 33 is located inside the third housing 31 and is mainly used to power the electrical components in the earphone. The earphone antenna 34 is located in the third housing 31, for example, on the side wall of the third housing 31, and can support the data information interaction between the earphone and external devices (such as mobile phones, computers, etc.). The wear detection structure 35 is located in the third housing 31, for example, on the side wall of the third housing 31, and can be used to detect whether the earphone is being worn, so as to support the prevention of accidental activation of the earphone and the reduction of earphone power consumption. The interaction button 22 is located in the second housing 21, for example, at least part of the interaction button 22 protrudes from the side wall of the second housing 21, and can be used to support the input of preset command information, such as input of power on / off information, volume adjustment information, working mode switching information, etc. based on user operation.

[0036] In some embodiments, the sound-emitting part 10, the adapter part 20, and the battery compartment part 30 can be relatively independent functional units. For example, the first housing 11, the second housing 21, and the third housing 31 are relatively independent housing structures, which can be distinguished by the parting lines at their connection points. The headphones are assembled by connecting the adapter part 20 between the sound-emitting part 10 and the battery compartment part 30. The adapter part 20 can also be part of the battery compartment part 30. For example, the part of the battery compartment part 30 used to connect the sound-emitting part 10 and occupying a certain structural space can be regarded as the adapter part 20.

[0037] In other embodiments, besides the speaker 12 being located in the first housing 11, the interaction button 22, circuit board assembly 32, battery assembly 33, earphone antenna 34, wear detection structure 35, and other functional components (such as charging interface, programming interface, etc.) required by the earphone's functional configuration can be located in different positions on the ear hook according to the earphone's structural design. For example, the circuit board assembly 32, interaction button 22, and interface structure can be located in the second housing 21 to form the ear hook's adapter 20, while the battery assembly 33, earphone antenna 34, wear detection structure 35, etc., can be located in the third housing 31 to form the ear hook's battery compartment 30. That is, apart from the speaker 12 and some related functional components (such as the microphone), all other functional components of the earphone are located on the ear hook, such as one or both of the adapter 20 and the battery compartment 30. Of course, depending on the earphone's functional configuration requirements, the earphone antenna 34, interaction button 22, and wear detection structure 35 can be selectively omitted; however, these details will not be elaborated here.

[0038] In some embodiments, to improve the stability of the headphones when worn, the headphones may employ any one or a combination of the following methods: First, at least a portion of the ear hook (specifically, the battery compartment 30) is configured as a contoured structure (e.g., an arc-shaped hook) that conforms to at least one of the back of the ear and the head, thereby increasing the contact area between the ear hook and the ear or head, and thus increasing the resistance to the headphones falling off the ear. Second, at least a portion of the ear hook is configured as an elastic structure, so that the ear hook has a certain elastic deformation when worn, thereby increasing the pressure of the ear hook on the ear or head, and thus increasing the resistance to the headphones falling off the ear. Third, at least a portion of the ear hook is configured to rest against the head when worn, so that the ear hook forms a reaction force pressing against the ear, causing the sound-emitting part 10 to press against the front of the ear, thereby increasing the resistance to the headphones falling off the ear. Fourth, the sound-emitting part 10 and the ear hook (specifically, the battery compartment 30) are configured to clamp the physiological parts of the ear, such as the area where the helix 107 and the area where the concha 102 are located, from the front and back sides of the ear when worn, thereby increasing the resistance to the earphone falling off the ear. Fifth, the sound-emitting part 10 is configured to extend at least partially into the physiological parts of the ear, such as the concha 102, cymba concha 103, triangular fossa 104, and scaphoid fossa 106, when worn, thereby increasing the resistance to the earphone falling off the ear.

[0039] In summary, by placing the speaker 12 and microphone in the sound-emitting part 10, and the circuit board assembly 32, battery assembly 33, headphone antenna 34, interaction button 22, and wear detection structure 35 in the ear hook, the speaker 12 can obtain ample and stable structural assembly space or a larger design size in the sound-emitting part 10. This provides support for significantly increasing the effective sound output area, ensuring sound output intensity, and improving the listening effect. Furthermore, in the headphone's structural system, by placing the speaker 12 and components such as the circuit board assembly 32 in different housings, structural isolation can be formed, avoiding any adverse effects on the speaker 12's output. Simultaneously, distributing the core functional components such as the speaker 12, microphone, circuit board assembly 32, and battery assembly 33 in the sound-emitting part 10 and ear hook facilitates modular design of the headphone, creating conditions for reducing assembly difficulty, manufacturing, and disassembly / maintenance costs. Moreover, the different placement of the speaker 12 and battery assembly 33 on the headphone allows for adjustment of the headphone's center of gravity, resulting in a more balanced weight distribution when worn, thereby improving the stability and comfort of wearing the headphone.

[0040] Considering the crucial influence of the sound-generating section 10 on the overall structural architecture and performance of the headphones, the following section primarily introduces the sound-generating section 10 and its related structures. For easier distinction and description, please refer to [link to relevant documentation]. Figure 3 and combined Figure 2In this paper, the sound-emitting part 10 is defined by its orthogonal major axis, minor axis, and thickness direction. The major axis can be defined as the direction with the longest extension dimension in the shape of the two-dimensional projection surface of the sound-emitting part 10 (e.g., its projection in the sagittal plane of the human body). For example, when the projected shape of the sound-emitting part 10 is rectangular or approximately rectangular, the major axis can be understood as the length direction of the sound-emitting part 10. The minor axis can be defined as the direction perpendicular to the major axis in the shape of the two-dimensional projection surface of the sound-emitting part 10. For example, when the projected shape of the sound-emitting part 10 in the sagittal plane is rectangular or approximately rectangular, the minor axis can be understood as the height direction of the sound-emitting part 10. Correspondingly, the thickness direction can be defined as the direction perpendicular to both the major and minor axes. For example, when worn, the thickness direction is consistent with the direction of the human coronal axis, both pointing towards the left and right sides of the body. Viewed from the thickness direction or the human coronal axis direction, the outline shape of the sound-emitting part 10 can be a regular or irregular geometric shape such as a rectangle, ring, ellipse, polygon, U-shape, V-shape, or semicircle.

[0041] Please also see Figure 4 , Figure 5 and Figure 9 This document defines several different housing sidewalls for the first housing 11, including an inner sidewall 11-1, an outer sidewall 11-2, an upper sidewall 11-3, a lower sidewall 11-4, and a bottom sidewall 11-5. Specifically, the inner sidewall 11-1 is the housing sidewall facing the ear in the thickness direction when worn; the outer sidewall 11-2 is the housing sidewall facing away from the ear in the thickness direction when worn; the upper sidewall 11-3 is the housing sidewall close to the top of the head in the short axis direction when worn; the lower sidewall 11-4 is the housing sidewall away from the top of the head in the short axis direction when worn; and the bottom sidewall 11-5 is the housing sidewall facing the ear or away from the adapter 20 in the long axis direction when worn. It is understood that these multiple different housing sidewalls together form a housing space capable of accommodating the speaker 12 and related components.

[0042] In some embodiments, please refer to Figures 8 to 11The sound-emitting part 10 includes multiple microphones and a flexible printed circuit board 13 (FPC). Among the multiple microphones, there is a first microphone 14 and a second microphone 15. The first microphone 14 and the second microphone 15 are disposed on different side walls of the first housing 11, for example, the first microphone 14 is disposed on the inner side wall 11-1 and the second microphone 15 is disposed on the upper side wall 11-3. Furthermore, the speaker 12, the first microphone 14 and the second microphone 15 are all electrically connected to the flexible printed circuit board 13. For example, the flexible printed circuit board 13 is fixed around the periphery of the speaker 12 and electrically connected to the speaker 12, while the first microphone 14 and the second microphone 15 are soldered and fixed to the flexible printed circuit board 13, thereby constructing the speaker 12, the flexible printed circuit board 13, the first microphone 14 and the second microphone 15 into an integral structure that is relatively independent of the first housing 11.

[0043] Specifically, the flexible circuit board 13 can be electrically connected to the circuit board assembly 32 through wires, cables, connectors, etc., laid in the ear hook, thereby establishing an electrical connection between the circuit board assembly 32 and functional components such as the speaker 12 and the microphone based on the flexible circuit board 13.

[0044] Firstly, within the sound-emitting section 10, a flexible circuit board 13 electrically connects the first microphone 14, the second microphone 15, and the speaker 13. This effectively simplifies the wiring structure inside the sound-emitting section 10, avoiding problems such as messy wiring and large space occupation caused by using wires and cables. This allows for the use of a larger speaker 12 to enhance the headphone's output performance. Secondly, based on the integrated functional structure composed of the speaker 12, the flexible circuit board 13, and multiple microphones, the flexible circuit board 13 electrically connects to the circuit board assembly 32. This effectively reduces the difficulty of assembling and disassembling the sound-emitting section 10 and the ear hook, improving the efficiency of headphone assembly and disassembly. At the same time, it enhances the stability of the electrical connection between the speaker 12 (along with the microphones) and the circuit board assembly 32, and improves the structural compactness between the internal functional components of the sound-emitting section 10, preventing the speaker 12 and microphones from separating due to accidental drops or collisions. Third, the flexible circuit board 13 can effectively adapt to the microphone's placement position, reducing the impact of the wiring structure inside the sound-emitting part 10 on the speaker 12. Thus, based on the cooperation between the speaker 12 and the microphone, the microphones located on different side walls of the first housing 11 can be used to pick up sound signals from different positions of the sound-emitting part 10, providing support for the headphones to actively reduce ambient noise.

[0045] In some embodiments, please refer to Figure 10 and Figure 11The flexible circuit board 13 adopts an integrated branch structure, meaning that the flexible circuit board 13 has a main body 13-1 connected as one piece and multiple branches; wherein, the multiple branches extend in different directions relative to the main body 13-1 to accommodate the placement of the microphone and the positions where the flexible circuit board 13 is electrically connected to the circuit board assembly 32 and the speaker 12. For example, please refer to... Figures 3 to 6 , Figure 8 and Figure 9 One end of the sound-emitting part 10 is connected to an ear hook in the long axis direction (for example, the end of the first housing 11 away from the bottom sidewall 11-5 in the long axis direction is connected to the second housing 21); the speaker 12 is disposed inside the first housing 11 with its diaphragm facing the inner sidewall 11-1 or the outer sidewall 11-2, the first microphone 14 is disposed on the inner sidewall 11-1, and the second microphone 15 is disposed on the upper sidewall 11-3.

[0046] At this time, please refer to Figures 9 to 11 The main body 13-1 can be disposed around the outer periphery of the speaker 12 in the thickness direction and electrically connected to the speaker 12; for example, the ratio of the length of the main body 13-1 to the periphery of the speaker 12 can be less than 1, so that the main body 13-1 is disposed around the outer periphery of the speaker 12 in a semi-enclosing manner. For ease of distinction and description, the two opposite ends of the main body 13-1 in its length direction are defined as the first end and the second end of the main body 13-1, respectively; the first end of the main body 13-1 is located on the side of the speaker 12 away from the bottom sidewall 11-5 (or close to the ear hook) in the long axis direction, and the second end of the main body 13-1 is located on the side of the speaker 12 facing the upper sidewall 11-3 in the short axis direction; it can also be understood that the main body 13-1 extends from the side of the speaker 12 close to the second housing 12 in the long axis direction, passes sequentially through the lower sidewall 11-4 and the bottom sidewall 11-5, and terminates on the side of the speaker 12 facing the upper sidewall 11-3.

[0047] Correspondingly, along the length of the main body 13-1, multiple branches are connected at different positions on the main body 13-1; specifically, the multiple branches may include a first branch 13-2, a second branch 13-3, and a third branch 13-4; wherein: the second branch 13-3 is connected to the second end of the main body 13-1 along the length of the main body 13-1, so that the second branch 13-3 is adapted to the setting position of the second microphone 15 and connected to the second microphone 15; the third branch 13-4 is connected to the first end of the main body 13-1, so that... The third branch 13-4 is adapted to the electrical connection position of the flexible circuit board 13 and the circuit board assembly 32; the first branch 13-2 is located between the second branch 13-3 and the third branch 13-4 in the length direction of the main body 13-1, and the first branch 13-2 extends along the width direction (or the thickness direction of the sound-emitting part 10) of the main body 13-1 to one side of the main body 13-1, for example, to the side of the speaker 12 facing the inner sidewall 11-1, so that the first branch 13-2 is adapted to the setting position of the first microphone 14 and connected to the first microphone 14.

[0048] On the one hand, by utilizing the different extension directions or relative positions of multiple branches relative to the main body 13-1, the structural form of the flexible circuit board 13 can be matched with the microphone's placement position, simplifying the wiring structure inside the sound-emitting part 10 and providing support for enhancing the structural compactness of the sound-emitting part 10.

[0049] Specifically, the first microphone 14 is connected (e.g., soldered) via the first branch 13-2, the second microphone 15 is connected via the second branch 13-3, and the circuit board assembly 32 is electrically connected via the third branch 13-4, so that the structure of the flexible circuit board 13 can adapt to the placement of the microphones and their electrical connection with the circuit board assembly 32 and the speaker 12. By utilizing the structural connection between the main body 13-1 and the speaker 12, the first microphone 14, the second microphone 15 and the speaker 12 can be structurally integrated to form a relatively complete functional structure, which is beneficial for the structural disassembly and assembly of the sound-emitting part 10 or the headphones.

[0050] On the other hand, the flexible circuit board 13 adopts a branch structure, which can effectively reduce the amount of material used in the flexible circuit board 13, creating conditions for reducing the manufacturing cost of the headphones, and also reduce the space occupied by the flexible circuit board 13 in the internal space of the first housing 11, allowing the speaker 12 to have a larger design size. At the same time, since the part of the flexible circuit board 13 used to electrically connect to the circuit board assembly 32 (i.e., the third branch 13-4) has the sound-emitting part 10 close to the adapter 20, this can effectively shorten the electrical connection distance between the flexible circuit board 13 and the circuit board assembly 32, which is beneficial to improving the anti-interference of the headphones or the sound-emitting part 10.

[0051] In other embodiments, the flexible circuit board 13 may also adopt other forms of branch structure. For example, the third branch 13-4 may be omitted, and the first end of the main body 13-1 may be used as the part of the flexible circuit board 13 for electrically connecting the circuit board assembly 32; or the part of the main body 13-1 located on the side of the speaker 12 away from the bottom sidewall 11-5 in the long axis direction may be used to electrically connect the circuit board assembly 32. In this case, the first end of the main body 13-1 may extend to the side of the speaker 12 facing the upper sidewall 11-3 and connect to the second branch 13-3, and the second end of the main body 13-1 may extend to the side of the speaker 12 facing the lower sidewall 11-4 or the bottom sidewall 11-5 and connect to the first branch 13-2. For example, the first end of the main body 13-1 is located on the side of the speaker 12 near the ear hook in the long axis direction. The main body 13-1 extends from the first end through the upper sidewall 11-3, so that the second end of the main body 13-2 is located on the side of the speaker 12 facing the bottom sidewall 11-3 in the long axis direction. At this time, the second branch 13-3 can be omitted, and the part of the main body 13-1 corresponding to the upper sidewall 11-3 or the second microphone 14 can be used as the part to connect the second microphone 14. The first branch 13-2 is connected to the second end of the main body 13-1 and extends along the width direction of the main body 13-3 to the side of the speaker 12 facing the inner sidewall 11-1. For example, microphones are provided on the inner sidewall 11-1, the outer sidewall 11-2 and the upper sidewall 11-3. In this case, in addition to the first branch 13-2 and the second branch 13-3, a fourth branch may be included among the multiple branches. The fourth branch extends along the width direction of the main body 13-3 to the side of the speaker 12 facing the outer sidewall 11-2, so as to connect the microphone provided on the outer sidewall 11-2.

[0052] In other words, depending on the type of speaker 12 (e.g., speaker 12 can be a dual-diaphragm speaker or a single-diaphragm speaker), the number of microphones, and their specific placement, the flexible circuit board 13 can adopt a corresponding integrated branch structure. These details will not be elaborated upon here.

[0053] In some embodiments, please refer to Figures 8 to 11 as well as Figure 16 The flexible circuit board 13 is provided with a first electrical connector 16, and the inside of the ear hook is provided with a second electrical connector 23 that is electrically connected to the circuit board assembly 32. The first electrical connector 16 and the second electrical connector 23 are detachably connected (e.g., pluggable) to realize the electrical connection between the flexible circuit board 13 and the circuit board assembly 32, thereby reducing the difficulty of electrical connection between the flexible circuit board 13 and the circuit board assembly 32 and providing support for the quick assembly and disassembly of the headphones.

[0054] For example, please refer to Figure 15 and Figure 16The adapter section 20 also includes an adapter circuit board 24, which is disposed inside the second housing 21. The adapter circuit board 24 can be electrically connected to the circuit board assembly 32 disposed inside the third housing 31 via wires or cables. The interactive button 22 can be soldered and fixed to the adapter circuit board 24. Correspondingly, the first electrical connector 16 can be a male connector soldered and fixed to the third branch 13-4, and the second electrical connector 23 can be a female connector soldered and fixed to the adapter circuit board 24. During the assembly process, the circuit board assembly 32, battery assembly 33, adapter circuit board 24, second housing 21, and third housing 31 can be pre-assembled to form an ear hook with a battery compartment 30 and an adapter section 20. Then, using the pluggable connection between the first electrical connector 16 and the second electrical connector 23, the combined structure of the microphone, speaker 12, and flexible circuit board 13 is electrically connected to the adapter circuit board 24. Finally, the first housing 11 and the second housing 12 are combined and connected to form the overall structure of the earphone.

[0055] Based on this, the cooperation between the first electrical connector 16 and the second electrical connector 23 facilitates the simple and convenient connection of relevant functional components within a confined structural space, thereby reducing the difficulty of assembling and disassembling the headphones and ensuring the stability of the electrical connections between the relevant functional components. Simultaneously, since the adapter circuit board 24 can share some of the functions of the circuit board assembly 32, it not only helps to reduce the size of the circuit board assembly 32 and fully utilize the internal space of the battery compartment 30 and the adapter 20, but also adapts to the placement of functional components such as the headphone antenna 34, the wear detection structure 35, and the interaction button 22, enhancing the flexibility of the placement of these functional components.

[0056] In other embodiments, the adapter circuit board 24 may be omitted, and the second electrical connector 23 may be fixedly disposed inside the second housing 21.

[0057] In some embodiments, please refer to Figures 9 to 11The third branch 13-4 is bent and connected to the main body 13-1, so that the third branch 13-4 and the main body 13-1 are opposite each other in the direction of mutual mating of the first electrical connector 16 and the second electrical connector 23; for example, the first ends of the third branch 13-4 and the main body 13-1 are stacked opposite each other in the long axis direction. In this way, when the first electrical connector 16 is provided in the third branch 13-4, based on the structural relationship of the relative stacking of the third branch 13-4 and the main body 13-1, the detachable plug-in connection form and mating direction between the first electrical connector 16 and the second electrical connector 23 can be adapted, making it easy to insert the first electrical connector 16 into the second electrical connector 23 by applying a force toward the ear hook side to the speaker 12, etc., thereby realizing the connection between the first electrical connector 16 and the second electrical connector 23 and reducing the assembly difficulty between related functional components in the headphones.

[0058] In some embodiments, please refer to Figure 9 The inner surface of the side wall of the first housing 11 is also provided with a receiving groove 11-6. The receiving groove 11-6 can be provided on the corresponding side wall of the first housing 11 in accordance with the direction or length of the main body 13-1. For example, the receiving groove 11-6 can be formed by thinning a portion of the upper side wall 11-3, the lower side wall 11-4 and the bottom side wall 11-5.

[0059] Regarding the sound-emitting part 10, the main body part 13-1 can be accommodated by the receiving groove 11-6, so as to fix the flexible circuit board 13 between the corresponding side wall of the first housing 11 and the speaker 12. This not only reduces the space occupied by the flexible circuit board 13 on the speaker 12, but also enhances the structural stability and compactness of the sound-emitting part 10 itself. It also helps to fix the microphone on the corresponding side wall of the first housing 11, avoiding the relative positional shift of the first housing 11, microphone, speaker 12 and flexible circuit board 13.

[0060] In other embodiments, without affecting the output of the speaker 12 or the performance of the sound-emitting part 10, the side wall of the first housing 11 corresponding to the branch of the flexible circuit board 13 may also be provided with a receiving groove 11-6 that can accommodate the corresponding branch, so as to make full use of the structure of the first housing 11.

[0061] In some embodiments, please refer to Figure 11An antistatic structure 18 is also connected between the flexible circuit board 13 and the first housing 11. This antistatic structure 18 may include structural components with antistatic properties, such as metal foam. For example, the first housing 11 may be made of metal (e.g., an integral structure with the inner sidewall 11-1, outer sidewall 11-2, upper sidewall 11-3, and lower sidewall 11-4 made of metal) to enhance the mechanical strength of the first housing 11 and provide a stable structural space for the speaker 12 and the like. The antistatic structure 18 can be disposed between the main body 13-1 and the corresponding sidewall of the second housing 11, for example, with metal foam clamped and fixed between the main body 13-1 and the lower sidewall 11-4. Thus, the antistatic structure 18 provides good electrostatic protection for the flexible circuit board 13 and the like. Based on the selection of the structure and materials of the antistatic structure 18, the interior of the sound-emitting part 10 can also serve as a buffer and provide physical sound insulation.

[0062] As mentioned above, please refer to Figures 4 to 11 In some embodiments, the multiple microphones in the sound-emitting part 10 include a first microphone 14 and a second microphone 15; wherein, the first microphone 14 is disposed on the inner sidewall 11-1 and the second microphone 15 is disposed on the upper sidewall 11-3; by means of the first microphone 14 and the second microphone 15, sound signals can be picked up from different positions of the sound-emitting part 10, thereby providing support for realizing the active noise cancellation function of the headphones, which will be described in detail below.

[0063] Please see Figure 4 , Figure 5 , Figure 8 and Figure 9 The inner sidewall 11-1 is provided with a first pickup hole 11-7 for acoustic communication with the first microphone 14. For example, the distance between the centroid of the first pickup hole 11-7 and the lower sidewall 11-4 in the short axis direction can be between 1mm and 10mm, and the distance between the centroid of the first pickup hole 11-7 and the bottom sidewall 11-5 in the long axis direction can be between 3mm and 13mm. In this way, when worn, the first pickup hole 11-7 can be located close to the external auditory canal 101. The upper sidewall 11-3 is provided with a second pickup hole 11-8 for acoustic communication with the second microphone 15, so that the second microphone 15 can pick up sound signals from outside the sound-emitting part 10 through the second pickup hole 11-8.

[0064] Based on this, the first microphone 14 can be used to collect the user's voice, or as a feedback microphone to collect residual noise near the external auditory canal 101, or as a feedforward microphone to collect ambient noise near the external auditory canal 101. For example, when worn, since the first pickup hole 11-7 is closer to the external auditory canal 101 than the second pickup hole 11-8, the sound collected by the first microphone 14 through the first pickup hole 11-7 can more accurately reflect the sound near the external auditory canal 101 or the sound heard by the user. Therefore, by using the first microphone 14 to collect residual noise at the external auditory canal 101, the circuit board assembly 32 can provide feedback and adjust the magnitude and phase of the noise-canceling sound output by the speaker 12 according to the sound signal collected by the first microphone 14. The residual noise mentioned above can be understood as the noise remaining after the noise-canceling sound and the ambient noise are canceled out at the external auditory canal 101.

[0065] The second microphone 15 can be used to collect the user's voice and also as a feedforward microphone to collect external environmental noise. Since the second pickup hole 11-8 is located on the upper side wall 11-3, when worn, the ear, adapter 20, and sound-emitting part 10 will partially block the second pickup hole 11-8. This will result in less wind noise in the sound collected by the second microphone 15, reducing the impact of airflow from behind the user's body along the sagittal axis on the second microphone 15, thereby effectively reducing wind noise in the external environmental noise collected by the second microphone 15. Since the presence of wind noise can interfere with the active noise cancellation of the headphones, the environmental noise collected by the second microphone 15 is beneficial to improving the effect of active noise cancellation in environments with wind noise.

[0066] In some embodiments, please refer to Figure 5 and Figure 8When the first microphone 14 is disposed on the inner sidewall 11-1, a protruding structure 11-9 protruding along the thickness direction from the outer surface of the inner sidewall 11-1 can be provided on the inner sidewall 11-1, and the first pickup hole 11-7 is disposed on the protruding structure 11-9. The first microphone 14 can be disposed inside the first housing 11 or in the protruding structure 11-9. Firstly, in the wearing state, the protruding structure 11-9 can reduce the distance between the first pickup hole 11-7 and the external ear canal 101, which not only makes the sound collected by the first microphone 14 closer to the sound actually heard by the user, but also helps to reduce wind noise in the sound collected by the first microphone 14. Secondly, the protruding structure 11-9 protrudes and extends along the thickness direction toward the side where the external ear canal 101 is located, and the comfort of wearing the headphones can be improved by selecting the contour shape and size of the protruding structure 11-9. Thirdly, with the first microphone 14 located within the protruding structure 11-9, the distance between the first microphone 14 and the first pickup hole 11-7 can be effectively shortened, ensuring the sound pickup effect of the first microphone 14; it can also reduce the space occupied by the first microphone 14 inside the first housing 11, thus creating conditions for using a larger size speaker 12.

[0067] In some embodiments, please refer to Figure 4 , Figure 6 , Figure 7 and Figure 16 A third microphone 25 is provided inside the adapter 10 (i.e., inside the second housing 21). This third microphone 25 can be electrically connected to the circuit board assembly 32 via the adapter circuit board 24, for example, the third microphone 25 can be soldered onto the adapter circuit board 24. Based on the different combinations and relative positions of the first microphone 14, the second microphone 15, and the third microphone 25, depending on the scenario, the headphones can support only active noise cancellation or user voice acquisition, or they can support both active noise cancellation and user voice acquisition simultaneously. In other words, the roles of the first microphone 14, the second microphone 15, and the third microphone 25 in the headphones can be set to be the same or different, or their roles can be switched as needed.

[0068] For example, the third microphone 25 can be disposed on the side wall of the second housing 20, which is connected to the outer side wall 11-2 or the upper side wall 11-3. This side wall has a third pickup hole 21-3 that acoustically communicates with the third microphone 25. Exemplarily, the centroid of the third pickup hole 21-3 is between 1mm and 14mm away from the lower side wall 11-4 in the short axis direction, and the centroid of the third pickup hole 21-3 is between 20mm and 35mm away from the bottom side wall 11-5 in the long axis direction. In this way, when worn, the third pickup hole 21-3 can be located in the area directly above the external auditory canal 101 and is not blocked by the ear, the adapter 20, and the sound-emitting part 10.

[0069] At this time, the third microphone 25 can be used to collect the user's voice, or it can be used as a feedforward microphone to collect external ambient noise. For example, when worn, since the third pickup hole 21-3 is not blocked by the ear, the adapter 20, and the sound-emitting part 10, the ambient noise collected by the third microphone 25 is closer to the ambient noise around the user. The circuit board assembly 32 can drive the speaker 12 to output noise-reduced sound that can cancel out the ambient noise based on the signal generated by the third microphone 25. At the same time, since the third microphone 25 is located in the adapter 10, it can avoid occupying the structural space of the sound-emitting part 10, which can support the use of a larger speaker 12 and ensure the sound output effect of the speaker 12.

[0070] In some embodiments, please refer to Figure 4 The line connecting the centroid of the second pickup hole 11-8 and the centroid of the third pickup hole 21-3 can point towards the user's mouth. This makes the third microphone 25 and the second microphone 15 most sensitive to sounds from the user's mouth, resulting in a significant difference between the signals collected by the third microphone 25 and the second microphone 15 from the wearer's mouth. This difference allows for the identification of the user's voice, facilitating subsequent active noise cancellation and ensuring clear call quality. It should be noted that... Figure 4 The bold dashed line represents the centroid line connecting the third pickup hole 21-3 and the second pickup hole 11-8.

[0071] In some embodiments, based on the different positions of the third pickup hole 21-3, the second pickup hole 11-8, and the first pickup hole 11-7 on the earphone, and the differences in the ambient noise collected by the third microphone 25, the second microphone 15, and the first microphone 14 (for example, the difference in ambient noise collected by the third microphone 25 and the second microphone 15 is mainly due to wind noise), at least one of the third microphone 25 and the second microphone 15 can be selected as the feedforward microphone to collect ambient noise, and the first microphone 14 can be selected as the feedback microphone.

[0072] When the wind noise in the collected ambient noise is relatively low, the third microphone 25 can be used as a feedforward microphone to ensure that the ambient noise during active noise cancellation processing is closer to the ambient noise heard by the wearer. When the wind noise in the collected ambient noise is relatively high, the second microphone 15 can be used as a feedforward microphone to reduce the adverse effects of wind noise during noise cancellation processing and improve the accuracy of active noise cancellation processing. The circuit board assembly 32 can drive the speaker 12 to output noise-canceling sound based on the signal generated by the feedforward microphone, while the first microphone 14 can collect residual noise at the external auditory canal 101, so that the circuit board assembly 32 can provide feedback and adjust the magnitude and phase of the noise-canceling sound output by the speaker 12 accordingly, thereby improving the active noise cancellation effect.

[0073] In some embodiments, the selection or determination of one or both of the third microphone 25 and the second microphone 15 as the feedforward microphone can be determined by the user through inputting a preset command via the interactive button 22, or it can be automatically determined by the circuit board assembly 32 based on the corresponding feedback information, or one or both of the third microphone 25 and the second microphone 15 can be directly and defaulted to be the feedforward microphone; all these variations will not be elaborated here.

[0074] It should be noted that in some embodiments, the third microphone 25 (together with the third pickup hole 21-3) can be omitted, and the real-time performance and accuracy of the active noise cancellation of the headphones can be improved by using the cooperation of the first microphone 14 and the second microphone 15; in other embodiments, the third microphone 25 can also be set on the outer wall 11-2, and the third microphone 25 is connected to the flexible circuit board 13.

[0075] In some embodiments, please refer to Figure 4 , Figure 5 and Figure 9 With the first microphone 14 disposed on the inner sidewall 11-1, both the inner sidewall 11-1 and the outer sidewall 11-2 are provided with through-holes for acoustic communication with the loudspeaker 12. For ease of distinction and description, the through-hole in the inner sidewall 11-1 is defined as the first through-hole 11-10, and the through-hole in the outer sidewall 11-2 is defined as the second through-hole 11-11. Both the first through-hole 11-10 and the second through-hole 11-11 employ a micropore array structure. It can be understood that a micropore array structure is an array structure with tiny holes, which can be composed of micrometer-sized holes arranged in a predetermined manner; these holes can be formed by directly drilling holes in the sidewall of the sound-emitting part 10, or they can refer to small holes in an acoustic steel mesh or acoustic yarn (i.e., the inner sidewall 11-1 or the outer sidewall 11-2 can be made of acoustic steel mesh or acoustic yarn).

[0076] On the one hand, by utilizing the micro-pore array structure of the first sound outlet 11-10 and the second sound outlet 11-11, the effective area for sound output can be significantly increased, enabling the headphones to provide higher intensity sound output and improve the listening effect. Simultaneously, with the cooperation of the microphone, it can support the enhancement of the headphones' active noise cancellation effect. For example, taking the first sound outlet 11-10 as an example, based on the sound signal collected by the microphone (e.g., one or more of the first microphone 14, the second microphone 15, and the third microphone 25), the circuit board assembly 32 can adjust the output of the speaker 12 so that the sound produced by the speaker 12 can include noise-canceling sound capable of canceling ambient noise. The noise-canceling sound output through the first sound outlet 11-10 can have the same amplitude and opposite phase to the ambient noise near the external auditory canal 101, thus eliminating the ambient noise near the external auditory canal 101 and forming an active noise cancellation effect. Other sounds produced by the speaker 12 (e.g., alert sounds, played audio, call sounds, etc.) can be guided to the external auditory canal 101 through the first sound outlet 11-10 to improve the listening effect.

[0077] On the other hand, the first sound outlet 11-10 and the second sound outlet 11-11 are configured as a micro-hole array structure, and the two sides of the speaker 12 in the vibration direction are acoustically connected to the first sound outlet 11-10 and the second sound outlet 11-11 respectively. While ensuring sound output efficiency, it can also balance the internal air pressure when the speaker 12 vibrates. This can avoid the problems that are easy to cause by using a single sound outlet with a large aperture, such as affecting the overall appearance of the headphones, accumulating dirt and impurities, and requiring a separate pressure relief hole. It can also avoid the problems that are easy to cause by using a single sound outlet with a small aperture, such as high acoustic impedance, low sound output efficiency, and poor listening effect.

[0078] Of course, the first sound outlet 11-10 and the second sound outlet 11-11 can also adopt a single-hole structure or a multi-hole structure with a larger aperture. Covering the first sound outlet 11-10 and the second sound outlet 11-11 with acoustic steel mesh or acoustic gauze can also increase the effective area for sound output.

[0079] In some embodiments, the minimum distance between the first sound outlet 11-10 and the second sound pickup hole 11-8 can be greater than a third preset threshold, for example, the third preset threshold is between 7mm and 9mm; the minimum distance between the second sound outlet 11-11 and the second sound pickup hole 11-8 can be greater than a fourth preset threshold, for example, the fourth preset threshold is between 7mm and 9mm. By limiting the distance between the first sound outlet 11-10 and the second sound pickup hole 11-8, the second sound pickup hole 11-8 can be moved as far away from the first sound outlet 11-10 as possible, reducing the sound picked up by the second microphone 15 from the output of the first sound outlet 11-10. By limiting the distance between the second sound outlet 11-11 and the second sound pickup hole 11-8, the second sound pickup hole 11-8 can be moved as far away from the second sound outlet 11-11 as possible, reducing the sound picked up by the second microphone 15 from the output of the second sound outlet 11-11.

[0080] In some embodiments, the absolute value of the difference between the distance from the second pickup hole 11-8 to the first sound outlet 11-10 and the distance from the second pickup hole 11-8 to the second sound outlet 11-11 is between 0 and 5 mm. By limiting the absolute value of the difference between the distance from the second pickup hole 11-8 to the first sound outlet 11-10 and the distance from the second pickup hole 11-8 to the second sound outlet 11-11, the sound from the first sound outlet 11-10 at the location of the second pickup hole 11-8 can be canceled out as much as possible with the sound from the second sound outlet 11-11, thereby preventing the second microphone 15 from picking up the sound from both the first and second sound outlets 11-10.

[0081] In some embodiments, the first sound outlet 11-10 and the second sound outlet 11-11 can be considered as outputting sounds with the same amplitude but opposite phase. The absolute value of the difference between the distance from the third sound outlet 21-3 to the first sound outlet 11-10 and the distance from the third sound outlet 21-3 to the second sound outlet 11-11 ranges from 0 to 7 mm. By limiting the absolute value of the difference between the distance from the third sound outlet 21-3 to the first sound outlet 11-10 and the distance from the third sound outlet 21-3 to the second sound outlet 11-11, the sound from the first sound outlet 11-10 and the sound from the second sound outlet 11-11 at the location of the third sound outlet 21-3 can be made to cancel each other out as much as possible.

[0082] For example, when the third pickup hole 21-3 is located at the acoustic null point of the sound field jointly constructed by the first and second output holes 11-10 and 11-11, it can minimize the possibility of the third microphone 25 picking up the sound output from the first and second output holes 11-10. In this way, the sound picked up by the third microphone 25 is mainly ambient noise. Using the signal generated by the third microphone 25 as the basis for the noise-reduced sound produced by the speaker 12 simplifies the signal processing process and improves the effect of active noise cancellation.

[0083] In some embodiments, the minimum distance between the third microphone hole 21-3 and the first sound output hole 11-10 can be greater than a first preset threshold, for example, the first preset threshold is between 12mm and 14mm; the minimum distance between the third microphone hole 21-3 and the second sound output hole 11-11 can be greater than a second preset threshold, for example, the second preset threshold is between 5mm and 7mm. By limiting the distance between the first sound output hole 11-10 and the third microphone hole 21-3, the third microphone hole 21-3 can be moved as far away from the first sound output hole 11-10 as possible, reducing the sound collected by the third microphone 25 from the output of the first sound output hole 11-10. Similarly, by limiting the distance between the second sound output hole 11-11 and the third microphone hole 21-3, the third microphone hole 21-3 can be moved as far away from the second sound output hole 11-11 as possible, reducing the sound collected by the third microphone 25 from the output of the second sound output hole 11-11.

[0084] In some embodiments, please refer to Figure 9 , Figure 12 and Figure 13 The loudspeaker 12 can be a dual-diaphragm loudspeaker, which includes a magnetic circuit assembly 12-1, a first diaphragm 12-2, a second diaphragm 12-3, and a voice coil. The magnetic circuit assembly 12-1 is located between the first diaphragm 12-2 and the second diaphragm 12-3 in the vibration direction (or the thickness direction of the sound-producing part 10). The first diaphragm 12-2 and the inner sidewall 11-1 (specifically, the part occupied by the first sound outlet 11-10) are opposite to each other in the vibration direction, and the second diaphragm 12-3 and the outer sidewall 11-2 (specifically, the part occupied by the second sound outlet 11-11) are opposite to each other in the vibration direction. The magnetic circuit assembly 12-1 and the voice coil drive the first diaphragm 12-2 and the second diaphragm 12-3 to vibrate respectively to produce sound. Specifically, the magnetic circuit assembly 12-1 may include two sets of magnets, which cooperate with the voice coil to drive the first diaphragm 12-2 and the second diaphragm 12-3 to vibrate and generate sound, respectively. Alternatively, the magnetic circuit assembly 12-1 may include one set of magnets, which is shared by the first diaphragm 12-2 and the second diaphragm 42. As for the flexible circuit board 13, its main body 13-1 may be arranged around the outer periphery of the magnetic circuit assembly 12-1.

[0085] In open-concept environments, the ambient noise heard by users is significantly greater than that when wearing in-ear headphones. Therefore, using dual-diaphragm speakers can improve the output performance of headphones, allowing them to output higher volumes of noise-canceling audio to reduce the noise of a larger ambient environment, thus ensuring the active noise cancellation effect of the headphones.

[0086] For example, by setting up a dual-diaphragm speaker, the magnetic field utilization rate of the magnetic circuit assembly 12-1 and the space utilization rate of the sound-emitting part 10 can be effectively improved. Moreover, the setting of the first diaphragm 12-2 and the second diaphragm 12-3 can significantly increase the effective contact area between the diaphragm and the air, thereby increasing the amount of air that the diaphragm can push during vibration. With the cooperation of the micro-hole array structure of the sound outlet, the headphones can provide a higher intensity sound output.

[0087] For example, the output performance of the headphones can be enhanced by superimposing the sounds output from the first diaphragm 12-2 and the second diaphragm 12-3, thereby improving the headphones' active noise cancellation effect against larger ambient noises. Alternatively, the resonant frequency of the headphones can be adjusted based on the first diaphragm 12-2 and the second diaphragm 12-3 to reduce distortion in the headphone output, enabling the headphones to have a flatter output across a wider frequency range, thus enhancing the active noise cancellation effect.

[0088] In some embodiments where the speaker 12 employs a dual-diaphragm speaker, the effective areas of the first sound outlet 11-10 and the second sound outlet 11-11 can be set to be the same, or the difference between the effective areas of the first sound outlet 11-10 and the second sound outlet 11-11 can be limited to a preset ratio range. This can be understood as the ratio of the absolute value of the difference between the effective areas of the first sound outlet 11-10 and the second sound outlet 11-11 to the smaller of the effective areas of the first sound outlet 11-10 and the second sound outlet 11-11 can be limited to a preset ratio range; this is beneficial for improving the consistency of sound output from the inner and outer sides of the headphones. For example, in some embodiments, the ratio can be less than 30%. For example, in some embodiments, the ratio can be less than 20%. And for example, in some embodiments, the ratio can be less than 10%.

[0089] In some embodiments, the first diaphragm 12-2 and the second diaphragm 12-3 may be driven by different voice coils. For details, please refer to [link to relevant documentation]. Figure 12 The loudspeaker 12 includes a magnetic circuit assembly 12-1, a first diaphragm 12-2, a second diaphragm 12-3, a first voice coil 12-4, and a second voice coil 12-5. One end of the first voice coil 12-4 is located within the magnetic gap of the magnetic circuit assembly 12-1, and the other end of the first voice coil 12-4 is connected to the first diaphragm 12-2. One end of the second voice coil 12-5 is located within the magnetic gap of the magnetic circuit assembly 12-1, and the other end of the second voice coil 12-5 is connected to the second diaphragm 12-3. Thus, the first voice coil 12-4 and the second voice coil 12-5 can drive the first diaphragm 12-2 and the second diaphragm 12-3 to vibrate synchronously or asynchronously. The vibration direction of the first diaphragm 12-2 and the vibration direction of the second diaphragm 12-3 can be the same or opposite, facilitating the superposition of the outputs of the first diaphragm 12-2 and the second diaphragm 12-3, or adjusting the resonant frequency of the headphones, etc.

[0090] For example, the aforementioned dual-voice-coil dual-diaphragm loudspeaker may further include a first connector that connects the first voice coil 12-4 and the second voice coil 12-5, so that the first diaphragm 12-2 and the second diaphragm 12-3 can vibrate more synchronously, which helps to improve the consistency of vibration between the first diaphragm 12-2 and the second diaphragm 12-3, reduce the distortion of the headphone output, and improve the active noise cancellation effect and sound quality of the headphone.

[0091] In some embodiments, please refer to Figure 13 The first diaphragm 12-2 and the second diaphragm 12-3 can also be driven by the same voice coil. For ease of distinction and description, this voice coil is defined as the third voice coil 12-6. At least a portion of the third voice coil 12-6 extends into the magnetic gap of the magnetic circuit assembly 12-1. One end of the third voice coil 12-6 is connected to the first diaphragm 12-2, and the other end is connected to the second diaphragm 12-3. Thus, the third voice coil 12-6 can drive the first diaphragm 12-2 and the second diaphragm 12-3 to vibrate synchronously and in the same direction, ensuring the consistency of the vibration of the first diaphragm 12-2 and the second diaphragm 12-3.

[0092] Considering that if the size of the third voice coil 12-6 is too large, it may reduce the driving force of the third voice coil 12-6; in some embodiments, in order to ensure the driving force of the third voice coil 12-6, the third voice coil 12-6 can be connected to the second diaphragm 12-3 through the second connector 12-7.

[0093] Of course, other suitable loudspeakers 12 may be selected as needed, such as single-diaphragm loudspeakers; that is, the specific type and structure of loudspeakers 12 include, but are not limited to, the loudspeakers 12 mentioned above.

[0094] In some embodiments, please refer to Figure 2 , Figure 4 , Figure 5 , Figure 8 , Figure 9 and Figure 14 When worn, the sound-emitting part 10 (specifically, the first housing 11) extends at least partially into the concha cavity 102 or is located in a physiological part such as the antihelix 105 at one end in the long axis direction. In this case, a flexible wall 17 can be provided on the first housing 11. The Shore hardness of the flexible wall 17 is less than that of the first housing 11. For example, the flexible wall 17 can be made of a material with a certain degree of flexibility or elasticity, such as silicone or rubber, and the first housing 11 can be made of a material with a certain degree of mechanical strength, such as metal or plastic.

[0095] By selectively setting the Shore hardness of the flexible wall 17 and the Shore hardness of the first housing 11, the flexible wall 17 can be made to contact with human skin to improve the comfort of wearing the headphones, while ensuring that the sound-generating part 10 maintains a stable structural shape and provides stable structural support for related functional components (such as the speaker 12).

[0096] In some embodiments, please refer to Figure 4 , Figure 5 , Figure 8 , Figure 9 and Figure 14 The first housing 11 has a flexible wall 17 at the end away from the ear hook along its long axis. For example, the projected outline of the flexible wall 17 in the thickness direction is approximately U-shaped. This allows the flexible wall 17 to cover at least a portion of the bottom sidewall 11-5 and a portion of the upper sidewall 11-3 and lower sidewall 11-4, or the flexible wall 17 can be constructed as part of the housing sidewall of the first housing 11 (i.e., the flexible wall 17 can be constructed as the entire bottom sidewall 11-5 and a portion of the upper sidewall 11-3 and lower sidewall 11-4). This ensures that when the earphone is worn, at least a portion of the flexible wall 17 can abut against the concha wall, improving the comfort of wearing the earphone. It should be noted that... Figure 5 The reference numeral 19 / 11-5 in the attached figure indicates the flexible wall 17 or the bottom side wall 11-5.

[0097] In some embodiments, please refer to Figure 4 , Figure 5 , Figure 8 , Figure 9 and Figure 14 The first housing 11 may have a first opening at the end away from the ear hook in the long axis direction. The flexible wall 17 includes a contact layer 17-1 and an inner lining layer 17-2. The Shore hardness of the contact layer 17-1 is less than that of the first housing 11 and the inner lining layer 17-2. For example, the contact layer 17-1 is a one-piece structure made of silicone material, the inner lining layer 17-2 is a one-piece structure made of plastic material, and the first housing 11 is a one-piece structure made of aluminum alloy material.

[0098] In a specific implementation, the contact layer 17-1 can be layered and covered on the outside of the inner liner layer 17-2 by means of bonding, die bonding, welding, etc. The flexible wall 17 formed by the contact layer 17-1 and the inner liner layer 17-2 covers the first opening and is connected and fixed to the first housing 11 (e.g., bonding, welding, snap-fit, etc.), thereby constructing the flexible wall 17 as the entirety of the bottom side wall 11-5 of the first housing 11 and a part of the upper side wall 11-3 and the lower side wall 11-4.

[0099] Therefore, while ensuring the comfort of wearing headphones based on the flexible wall 17, the split structure combination relationship between the flexible wall 17 and the first housing 11 facilitates the assembly, disassembly and maintenance of the speaker 12, etc., and also helps to reduce the structural complexity and manufacturing difficulty of the sound-emitting part 10 (for example, it is convenient to set the micro-hole array structure of the sound hole as needed); in addition, the inner lining layer 17-2 forms a structural support for the contact layer 17-1, which not only facilitates the structural combination of the flexible wall 17 and the first housing 11, but also helps to maintain the stability of the outline shape of the combination of the first housing 11 and the flexible wall 10.

[0100] In other embodiments, the first housing 11 can be assembled from multiple components, that is, the first housing 11 itself can adopt a modular assembly structure; for example, the first housing 11 can be composed of two modular sub-housings, which facilitates the assembly, disassembly, and maintenance of the speaker 12, flexible circuit board 13, and microphone. In some embodiments, the first housing 11 and the flexible wall 17 can also be made of the same material, for example, both the first housing 11 and the flexible wall 17 can be made of silicone material, in which case the Shore hardness of the surface of the flexible wall 17 can be set to be less than the Shore hardness of the surface of the first housing 11.

[0101] As mentioned above, in some embodiments, the inner liner 17-2 and the first opening may be omitted, and the contact layer 12 may be directly attached to the outer side wall of the first housing 11 by means of adhesive or other means (for example, covering the entire bottom side wall 11-5 and a portion of the upper side wall 11-3 and the lower side wall 11-4).

[0102] As mentioned above, in some embodiments, the first housing 11 is a one-piece structure made of metal materials such as aluminum alloy and stainless steel, and the contact layer 17-1 is a one-piece structure made of silicone material; thus, the softness of silicone material can effectively improve the comfort of wearing the headphones, while the use of materials such as aluminum alloy for the first housing 11 can support the enhancement of the overall metallic texture and quality of the headphones.

[0103] In some embodiments, the flexible wall 17 may have a partitioned structure, with different regions having different Shore hardness or materials; for example, the region of the flexible wall 17 corresponding to the microphone or where the microphone is located may use a relatively hard material (e.g., rigid plastic material), while other regions or regions forming the bottom sidewalls 11-5 may use a relatively hard material (e.g., silicone material). It can be understood that the microphone or microphone pickup hole may be located in a partition of the flexible wall 17 with a relatively hard material.

[0104] The following section mainly introduces the ear hooks and their related structures.

[0105] In some embodiments, please refer to Figures 4 to 6 as well as Figure 17The ear hook also includes an elastic metal wire 40, while the third housing 31 includes a housing portion 31-1, a cover portion 31-2, and the elastic metal wire 40. For ease of distinction and description, the end of the housing portion 31-1 that is close to or connected to the adapter portion 20 in the length direction of the battery compartment portion 30 (that is, the part occupying a certain length dimension of the housing portion 31-1) is defined as the connecting end, and the other end of the housing portion 31-1 that is opposite to the connecting end in the length direction and occupies a certain length dimension of the housing portion 31-1 is defined as the free end. The elastic metal wire 40 (such as spring steel, titanium alloy, titanium-nickel alloy, chromium-molybdenum steel, aluminum alloy, copper alloy, etc.) is inserted into the housing portion 31-1 to give the battery compartment portion 30 a certain elastic deformation, thereby creating conditions for increasing the stability of the earphone wearing and maintaining a stable structural shape of the battery compartment portion 30. The cover portion 31-2 is located at the free end and is mainly used to open and close the housing portion 31-1 to facilitate the disassembly and assembly of the battery assembly 33, circuit board assembly 32, etc.

[0106] In some embodiments, the Shore hardness of the cover portion 31-2 is greater than that of the housing portion 31-1; for example, the cover portion 31-2 is a one-piece structure made of materials such as metal or plastic, and the housing portion 31-1 is a one-piece structure made of materials such as silicone or rubber. Further, in some embodiments, the cover portion 31-2 is a one-piece structure made of materials such as aluminum alloy or stainless steel, and the housing portion 31-1 is a one-piece structure made of silicone.

[0107] Thus, based on the difference in material hardness between the cover plate portion 31-2 and the housing portion 31-1, the third housing 31 can be constructed into a structure combining softness and rigidity. On the one hand, the flexible material properties of the housing portion 31-1 and its ability to form a large contact area with human skin can effectively improve the comfort of wearing the headphones. On the other hand, the relatively hard material of the cover plate portion 31-2 can provide stable structural support for the housing portion 31-1 from local parts (specifically, the free end). This is beneficial for maintaining the stability of the outer contour of the third housing 31 or the battery compartment portion 30, and also provides ample and stable structural assembly space for the battery assembly 33, circuit board assembly 32, etc., avoiding compression of the circuit board assembly 32, etc. due to large deformation of the housing portion 31-1.

[0108] On the other hand, the combination of hard and soft structure not only helps to reduce the difficulty of disassembling and assembling the battery assembly 33 and the circuit board assembly 32, but also provides support for improving the overall quality of the headphones (such as the metallic texture and aesthetic appearance); in addition, based on the characteristic that the Shore hardness of the cover plate 31-2 is greater than that of the shell 31-1, it is also convenient to disassemble and assemble the third shell 31 itself.

[0109] In other embodiments, the cover plate portion 31-2 and the housing portion 31-1 may also be made of other suitable materials as needed. For example, the housing portion 31-1 may be made of a relatively hard plastic material, in which case the elastic metal wire 40 may be omitted; as long as the Shore hardness of the cover plate portion 31-2 is greater than that of the housing portion 31-1.

[0110] In some embodiments, please refer to Figure 5 and Figure 17 and combined Figure 2 This paper also defines several different sides, such as inner side and outer side, for the free end of housing part 31-1. Among them, the inner side is defined as the side of the free end or housing part 31-1 that is in contact with human skin (e.g., the skin between the back of the ear and the head) when worn. The outer side is defined as the side opposite to the inner side when worn. The outer side is provided with a second opening, and the cover part 31-2 covers the second opening and is connected to the housing part 31-1 (e.g., by gluing, welding, interference fit, etc.).

[0111] For example, the overall outline of the free end is roughly cylindrical, and the outer diameter of the free end can gradually increase from the end closer to the connection end to the end farther away from the connection end and then remain unchanged; the second opening can penetrate the peripheral wall of the free end on the side facing away from the ear when worn, for example, the area ratio of the second opening on the peripheral wall is between 1 / 3 and 1 / 2, the outline shape and size of the cover portion 31-2 are adapted to the second opening, and the outline shape of the battery assembly 33 can be set to adapt to the outline shape of the free end or the third accommodating cavity.

[0112] Firstly, the cover plate 31-2 provides structural support to the softer housing portion 31-1 through the second opening, ensuring that the housing portion 31-1 (specifically, the free end) maintains a relatively stable structural shape. Secondly, the cover plate 31-2 is located away from the skin of the housing portion 31-1, which can avoid or reduce the contact between the relatively hard cover plate 31-2 and the skin, thus improving the comfort of wearing the headphones. Thirdly, the second opening provides ample structural path for assembling the battery assembly 33, circuit board assembly 32, etc., inside the housing portion 31-1, which helps to reduce the difficulty of assembling and disassembling components such as the battery assembly 33 and circuit board assembly 32. Moreover, based on the difference in material hardness between the cover plate 31-2 and the housing portion 31-1, it is easier to achieve the desired assembly difficulty.

[0113] As mentioned above, in some embodiments, please refer to Figure 7The battery compartment 30 includes an earphone antenna 34. Exemplarily, the earphone antenna 34 may include an antenna pattern, which may be formed on the side wall of the third housing 31 (e.g., the inner or outer wall of the cover portion 31-2) using laser-direct-structuring (LDS) technology and electrically connected to the circuit board assembly 32. Exemplarily, the earphone antenna 34 may also include an antenna substrate and an antenna pattern formed on the antenna substrate, and the earphone antenna 34 is disposed inside the third housing 31 and electrically connected to the circuit board assembly 32. Of course, the earphone antenna 34 may also adopt other suitable structures, which will not be described in detail here.

[0114] By placing the headphone antenna 34 in the battery compartment 30, the speaker 12 located in the sound-emitting part 10 can be avoided. This creates conditions for setting a larger speaker 12 or ensuring the output performance of the speaker 12, and also increases the clearance area of ​​the headphone antenna 34, thereby enhancing the anti-interference capability of the headphone antenna 34 and ensuring the wireless communication performance of the headphones.

[0115] In other embodiments, the headphone antenna 34 can also be disposed in the second housing 21, which can also serve to avoid the speaker 12 and enhance anti-interference.

[0116] As mentioned above, in some embodiments, please refer to Figure 7 The battery compartment 30 also includes a wear detection structure 35, which can be arranged in the third housing 31 at a position close to the inner side of the housing 31-1 (for example, the cover 31-2 and the wear detection structure 35 are located on opposite sides of the battery assembly 33).

[0117] For example, the wear detection structure 35 may include a capacitive sensor and a metal electrode. The metal electrode may be formed on the side wall of the third housing 31 (specifically, housing part 31-1) using laser-direct-structuring (LDS) technology. The metal electrode may also be an FPC metal electrode arranged close to the inner side of the housing part 31-1. In this way, when worn, the metal electrode is closer to the inner side or human skin, which is conducive to the formation of the capacitive effect.

[0118] For example, the wear detection structure 35 may also include a conductive material layer (e.g., conductive silicone). For instance, part or all of the inner side of the housing portion 31-1 may include a contact material layer (e.g., silicone layer) that is in contact with human skin and a conductive material layer disposed on the inner side of the contact material layer and electrically connected to the circuit board assembly 32. This allows the sidewall of the ear hook to be reused to form the wear detection structure 35. In the wearing state, the conductive material layer forms a capacitive structure with human skin, which can effectively increase the capacitive sensing area and shorten the insulation distance, thereby improving the accuracy and sensitivity of wear detection.

[0119] Of course, other suitable structures can also be used for the wearable detection structure 35, which will not be elaborated here; it should be noted that Figure 4 The bold solid line in the figure indicates the approximate position of the wear detection structure 35 on the third housing 31.

[0120] In other embodiments, the wear detection structure 35 can also be disposed in other parts of the earphone, such as the sound-emitting part 10 (specifically, it can be disposed near the inner side of the flexible wall 17). Alternatively, the wear detection structure 35 can also be disposed in the adapter part 20. All of these methods avoid the wear detection structure 35 occupying structural space in the first housing 11, thus providing support for the configuration of the speaker 12.

[0121] In some embodiments, please refer to Figure 17 The circuit board assembly 32 is located inside the third housing 31 and along the length of the battery compartment 30, it is located closer to the adapter 20 than the battery assembly 33. This avoids the circuit board assembly 32 occupying the structural space of the sound-emitting part 10 and also facilitates the adjustment of the placement of related functional components (such as the headphone antenna 34 and the wear detection structure 35) as needed, thus supporting the simplification of the overall assembly difficulty of the headphones.

[0122] It should be noted that in some embodiments, the circuit board assembly 32 and the battery assembly 33 are both disposed within the third housing 31. To avoid interference between the two components, the battery assembly 33 and the circuit board assembly 32 can be disposed in different sub-accommodating cavities inside the third housing 31. Furthermore, in some embodiments, the different sub-accommodating cavities can be separated by a partition, and the partition has an opening that allows the electrical connection components for connecting the battery assembly 33 and the circuit board assembly 32 to pass through.

[0123] In other embodiments, the circuit board assembly 32 and the battery assembly 33 are both disposed within the third housing 31. To avoid the battery compartment 30 being too large and affecting wearing comfort, the circuit board assembly 32 can use a flexible circuit board as the main structure, and the flexible circuit board and the battery assembly 33 are stacked together. Furthermore, in some embodiments, the flexible circuit board can be stacked with the battery in the radial direction.

[0124] In some embodiments, please refer to Figure 15 and Figure 16 and combined Figures 2 to 6 The second housing 21 includes an inner adapter housing 21-1 and an outer adapter housing 21-2. The inner adapter housing 21-1 is connected to the first housing 11 (e.g., by snap-fit, bonding, welding, etc.). The outer adapter housing 21-2 is fitted over the outer side of the inner adapter housing 21-1 in a sleeve-like manner (e.g., by interference fit, bonding, die-cutting, etc.). The outer adapter housing 21-2 is connected to the battery compartment 30 (e.g., housing 31-1) (e.g., by bonding, welding, etc.). The adapter circuit board 24, the third microphone 25, etc., are disposed inside the inner adapter housing 21-1. The Shore hardness of the outer adapter housing 21-2 is lower than that of the inner adapter housing 21-1. For example, the outer adapter housing 21-2 can be made of silicone or rubber, while the inner adapter housing 21-1 can be made of a relatively hard plastic material or other insulating material.

[0125] The relatively rigid material of the inner shell 21-1 stabilizes the outline of the adapter 20, providing structural support for the mounting of the interaction button 22, third microphone 25, etc., onto the second shell 21. For example, the interaction button 22 can be fixed to the inner shell 21-1, and the trigger end of the interaction button 22 forms a button protrusion on the side wall of the second shell 21 by pressing outward against the outer shell 21-2, so that the user can accurately and naturally press the interaction button 22 while wearing the device. At the same time, the relatively soft material of the outer shell 21-2 allows it to come into contact with the human skin while wearing the device, thereby improving the comfort of wearing the headphones. The combination of rigidity and softness also facilitates the disassembly and maintenance of the adapter 20 and its related components, and enhances the stability of the structural connection between the adapter 20, the sound-emitting part 10, and the battery compartment 30.

[0126] In some embodiments, please refer to Figures 2 to 5 The adapter jacket 21-2 and the housing part 31-1 are an integral structure. For example, the adapter jacket 21-2 and the housing part 31-1 are an integral structure made of silicone material (e.g., a tubular structure). The adapter inner shell 21-1 is a shell structure made of a hard material such as plastic. The adapter inner shell 21-1 is inserted into the adapter jacket 21-2 by means of interference fit, bonding or other methods, thereby forming a second housing 21 that accommodates components such as the adapter circuit board 24 and the third microphone 25.

[0127] This allows for the integrity of the outline structure of the battery compartment 30 and the adapter 20 based on the integrated structure of the adapter sleeve 21-2 and the housing 31-1. The adapter 20 can be quickly formed by inserting the adapter inner shell 21-1 into the adapter sleeve 21-2, and provides support for improving the structural stability of the adapter 20 and for quick assembly and disassembly of related components.

[0128] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. An earphone, characterized by comprising: The device includes a sound-emitting part and an ear hook connecting the sound-emitting part. The ear hook is used to place the sound-emitting part near the ear canal without blocking the ear canal opening when worn. The ear hook contains a circuit board assembly. The sound-emitting part includes a first housing, a speaker, a flexible circuit board, a first microphone, and a second microphone. The first microphone and the second microphone are disposed on different side walls of the first housing; the speaker and the flexible circuit board are disposed inside the first housing, the speaker, the first microphone and the second microphone are respectively connected to the flexible circuit board, and the circuit board assembly is electrically connected to the flexible circuit board.

2. The earphone of claim 1, wherein The flexible circuit board has a main body and multiple branches connected as one piece, and the multiple branches extend in different directions relative to the main body; wherein, the multiple branches include at least one of a first branch, a second branch and a third branch, the first branch is connected to the first microphone, the second branch is connected to the second microphone, and the third branch is electrically connected to the circuit board assembly.

3. The earphone of claim 2, wherein The third branch is provided with a first electrical connector, and the inside of the ear hook is provided with a second electrical connector that is electrically connected to the circuit board assembly; the first electrical connector and the second electrical connector are detachably connected to realize the electrical connection between the flexible circuit board and the circuit board assembly.

4. The earphone of claim 3, wherein The third branch is bent and connected to the main body so that the third branch and the main body are opposite each other in the direction in which the first electrical connector and the second electrical connector cooperate with each other.

5. The earphone of claim 3, wherein The ear hook includes a battery compartment and an adapter, the adapter being connected between the battery compartment and the sound-emitting part; the circuit board assembly is disposed inside the battery compartment, and the adapter circuit board is disposed inside the adapter part; the second electrical connector is disposed on the adapter circuit board to electrically connect the circuit board assembly through the adapter circuit board.

6. The earphone of claim 2, wherein The main body is arranged around the outer periphery of the speaker, and the ratio of the length of the main body to the circumference of the speaker is less than 1; in the length direction of the main body, a plurality of the branches are connected to different positions of the main body.

7. The earphone of claim 6, wherein One end of the main body is connected to the second branch in the length direction, and the other end of the main body is connected to the third branch in the length direction. The first branch is located between the second branch and the third branch in the length direction, and the first branch extends to one side of the main body along the width direction of the main body.

8. The earphone of any one of claims 2-7, wherein, The third branch is located inside the first housing, at the end of the sound-emitting part that is close to and connected to the ear hook.

9. The earphone of any one of claims 2-7, wherein, The inner surface of the side wall of the first housing is provided with a receiving groove, which is used to accommodate the main body.

10. The earphone of claim 1, wherein An anti-static structure is connected between the flexible circuit board and the first housing.

11. The earphone of claim 1, wherein The sound-emitting part has a thickness direction, a major axis direction, and a minor axis direction that are orthogonal to each other. The thickness direction is defined as the direction in which the sound-emitting part approaches and moves away from the user's ear along the user's coronal axis when worn. The minor axis direction is defined as the direction in which the sound-emitting part approaches and moves away from the top of the user's head along the user's vertical axis when worn. One end of the sound-emitting part in the major axis direction is connected to the ear hook. The first microphone is disposed on the inner sidewall of the first housing on the side facing the user's ear in the thickness direction, and the second microphone is disposed on the upper sidewall of the first housing on the side facing the top of the user's head in the short axis direction.

12. The earphone of claim 11, wherein The inner sidewall is provided with a protruding structure that protrudes from the outer surface of the inner sidewall along the thickness direction, and the protruding structure is provided with a first pickup hole that is acoustically connected to the first microphone.

13. The earphone of claim 11 or 12, wherein The ear hook includes a battery compartment and an adapter. The adapter connects the battery compartment and the sound-emitting part. The circuit board assembly is disposed inside the battery compartment. The adapter is provided with a third microphone electrically connected to the circuit board assembly. Alternatively, the sound-emitting part may further include a third microphone, which is disposed on the outer wall of the first housing on the side away from the user's ear in the thickness direction, and the third microphone is connected to the flexible circuit board.

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