A portable aluminum-cased mobile phone liquid cooling heat sink

Abstract

This utility model provides a portable aluminum-cased liquid-cooled heat sink for mobile phones, including a cooling head and a coolant circulation module. The coolant circulation module includes an aluminum heat sink casing, a liquid storage bag, and a diaphragm pump. A condenser is integrated into the aluminum heat sink casing, and the condenser has a condensation channel with internally threaded holes. A heat dissipation column is integrally formed at the top of the condenser, forming a first mounting cavity, which houses a cooling fan. A second outlet is connected to a first inlet via a coolant inlet pipe. The first outlet is connected to a first connection port, which is connected to a second connection port. The second connection port is connected to the diaphragm pump, which is connected to the inlet of the condensation channel. The outlet of the condensation channel is connected to the second inlet. Compared to traditional casings, the aluminum heat sink casing has significantly improved thermal conductivity. Furthermore, the internally threaded holes on the condenser serve as condensation channels, enhancing thermal conductivity and fundamentally improving heat conduction and dissipation capabilities.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to a liquid cooling heat sink for portable aluminum-cased mobile phones. Background Technology

[0002] With the trend towards higher performance in electronic devices, heat dissipation efficiency directly impacts operational stability and lifespan. Take mobile phones as an example: during live streaming, the camera operates continuously, the image is encoded and transmitted in real time, and network data is frequently exchanged, causing multiple processor cores to operate at full capacity. Furthermore, when playing mobile games, the demands of high-quality rendering and complex scene calculations place the chip under high load for extended periods, leading to rapid device temperature increases. Early air-cooled heat sinks, with their convenient installation and forced convection to remove heat from electronic devices, provided basic cooling. Their working principle involved using a fan to drive airflow, creating heat dissipation channels on the surface of the electronic device, quickly reducing its temperature and meeting the basic heat dissipation needs of users at the time.

[0003] However, with continuous improvements in chip manufacturing processes and increasing integration, the heat flux per unit area of ​​electronic devices has risen sharply, making it increasingly difficult for air-cooled heat sinks to meet the demands. In high-load scenarios such as mobile live streaming and gaming, air-cooled heat sinks often experience slow cooling speeds and incomplete heat dissipation, leading to malfunctions such as screen stuttering, live stream interruptions, game frame drops, and even automatic shutdowns due to overheating, severely impacting user experience. Against this backdrop, liquid cooling heat sinks, due to their highly efficient heat dissipation characteristics, have gradually become the mainstream choice.

[0004] Existing liquid cooling radiators typically consist of a cooling head and a liquid circulation module. In practical applications, the cooling head is in direct contact with the heat-generating parts of the electronic device, exchanging heat and cold to achieve the purpose of cooling the electronic device.

[0005] However, current liquid cooling radiators on the market face significant technical bottlenecks. The outer casing of their liquid circulation modules is mostly made of plastic. While this material offers advantages such as low cost and good processability, its low thermal conductivity means the plastic casing contributes almost nothing to heat dissipation. To compensate for insufficient heat dissipation, manufacturers often increase the size of the condenser radiator to increase the heat dissipation area, resulting in a large overall size and poor portability for liquid cooling radiators. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a portable aluminum-cased liquid cooling heat sink for mobile phones. The aluminum casing increases the heat dissipation area, enhances the heat dissipation effect, reduces the size of the heat sink, and optimizes the cooling head. The use of vacuum insulation technology greatly improves the cooling efficiency.

[0007] This utility model is implemented as follows:

[0008] This utility model provides a portable aluminum-cased mobile phone liquid cooling heat sink, including a cooling head and a coolant heat dissipation circulation module. The coolant heat dissipation circulation module includes an aluminum heat sink casing, a liquid storage bag, and a diaphragm pump.

[0009] A condenser is provided in the aluminum heat dissipation shell, and the condenser is integrated with the aluminum heat dissipation shell. Several heat dissipation columns are integrally formed at the top of the condenser, and the heat dissipation columns form a first mounting cavity. A cooling fan is connected to the first mounting cavity. A second mounting cavity is also provided at the bottom of the condenser. The liquid storage bag and the diaphragm pump are both located in the second mounting cavity. The condenser has a condensation channel with an internal thread hole.

[0010] The cooling head has a first inlet and a first outlet, and the liquid storage bag has a second inlet, a second outlet, a first connection port and a second connection port. The second outlet is connected to the first inlet through a cold liquid inlet pipe, the first outlet is connected to the first connection port through a cold liquid outlet pipe, the first connection port is connected to the second connection port, the second connection port is connected to a diaphragm pump, the diaphragm pump is connected to the inlet of the condensation channel through a first pipe, and the outlet of the condensation channel is connected to the second inlet through a second pipe.

[0011] Furthermore, the cooling head includes a cooling head housing, a heat-conducting block, a cooling wafer, and a cold-conducting block;

[0012] The heat-conducting block and the cooling chip are both disposed inside the cooling head housing, and the cooling chip is in contact with the heat-conducting block. The heat-conducting block has a cooling channel with an internal threaded hole, and the first inlet and the first outlet are both connected to the cooling channel.

[0013] The cooling block contacts the cooling wafer, and also serves as a cover for sealing the cooling head housing;

[0014] The outer side of the cooling block is also provided with a magnetic suction part, which is formed by uniformly mixing magnetic powder and thermally conductive silicone, or the magnetic suction part is formed by a magnetic ring and magnetic powder thermally conductive silicone. The outer side of the cooling block is provided with a magnetic ring groove, the magnetic ring is installed in the magnetic ring groove, and the magnetic powder thermally conductive silicone is formed on the outer side of the cooling block.

[0015] The cooling block has a suction hole for evacuating a vacuum. After evacuating the inside of the cooling head housing, a vacuum cavity is formed inside the cooling head housing, giving it vacuum insulation capability. The suction hole is also used to inject aerogel into the cooling head housing, and the aerogel is used to prevent air molecule convection.

[0016] Furthermore, the liquid storage bag includes a resilient bag body and an exhaust valve, the bag body and the exhaust valve being connected and sealed together;

[0017] The second inlet, the second outlet, the first connection port, and the second connection port are all located on the exhaust valve, and the second inlet and the second outlet are connected to the bag body. The second inlet and the second outlet are both located at the lower part of the exhaust valve.

[0018] The exhaust valve is also connected to a coolant inlet for replenishing coolant. The coolant inlet extends to the outside of the aluminum heat sink housing and is connected to the bag body. The coolant inlet is located above the exhaust valve and is sealed by a sealing plug.

[0019] Furthermore, the aluminum heat sink housing is fitted with an iron dust cover, and a magnetic induction sensor is installed inside the dust cover. The magnetic induction sensor is connected to the control motherboard. When the cooling head is magnetically attached to the dust cover and the magnetic induction sensor senses the magnetic field, the control motherboard stops the heat sink.

[0020] Furthermore, a temperature sensor for measuring the internal temperature of the cooling head housing is also provided inside the cooling head housing. The temperature sensing end of the temperature sensor extends into the cooling head housing, and the temperature sensor is connected to the control motherboard.

[0021] Furthermore, a thermal protection temperature sensor is also provided inside the aluminum heat sink housing. The thermal protection temperature sensor is used to detect the temperature of the aluminum heat sink housing. When the temperature of the aluminum heat sink housing rises to a set temperature, the cooling chip of the cooling head stops working.

[0022] Furthermore, the condenser radiator has several internally threaded holes along its length. Each end of the condenser radiator has a mounting groove, and each mounting groove has several countersunk grooves on its end face. Each countersunk groove connects two internally threaded holes, and the countersunk grooves at both ends of the condenser radiator are offset by one internally threaded hole, so that the several internally threaded holes form a serpentine coil shape. A sealing strip is also installed in the mounting groove. The sealing strip has a protrusion that matches the countersunk groove. The protrusion is embedded in the countersunk groove and has a gap from the end face of the countersunk groove, so that the internally threaded holes in the same countersunk groove are connected.

[0023] The advantages of this utility model are:

[0024] 1. Compared to traditional plastic casings, the aluminum heatsink housing has significantly improved thermal conductivity, enabling more efficient heat transfer and dissipation, fundamentally enhancing heat dissipation capabilities. Simultaneously, internally threaded holes are created in the condenser duct between the first and second mounting chambers to serve as condensation channels. This internal thread structure significantly increases the heat dissipation area of ​​the condenser channel, further improving heat exchange efficiency. This design eliminates the need to increase the heat dissipation area by enlarging the casing while maintaining effective heat dissipation, effectively reducing the overall size of the heatsink and significantly improving its portability. This solves the problem of traditional liquid-cooled heatsinks being inconvenient to carry due to their large size.

[0025] 2. The cooling head employs a vacuum process to create a vacuum cavity inside, reducing convection between the hot and cold sides of the cooling wafers. This minimizes heat transfer caused by air convection, significantly improving the cooling effect and greatly enhancing cooling efficiency. Furthermore, aerogel is injected into the cooling head housing before vacuuming. The aerogel prevents the convection of small amounts of air molecules in the vacuum environment, further strengthening the long-lasting vacuum insulation effect.

[0026] 3. Both the second inlet and the second outlet of the coolant reservoir are located below the vent valve. When air mixes with the coolant, because air is less dense than coolant, it will naturally collect at the top of the elastic bag. The lower inlet and outlet effectively prevent air from re-entering the coolant circulation loop, preventing problems such as poor circulation and reduced heat dissipation efficiency caused by air mixing, thus ensuring stable operation of the cooling system. Simultaneously, the coolant inlet located at the top of the vent valve is connected to the bag. When adding coolant, opening the sealing plug of the inlet allows coolant to be injected, and air inside the bag can be smoothly discharged through the inlet, ensuring that the added coolant is free of air bubbles, further improving the reliability of the circulation system.

[0027] 4. The coolant reservoir bag features a flexible design that adapts to changes in coolant temperature and volume expansion / contraction. When the coolant temperature rises and its volume expands, the bag expands accordingly; when the temperature drops and its volume contracts, the bag contracts, effectively balancing the pressure within the circulation system. This prevents damage to pipes or components due to pressure fluctuations, improving the radiator's adaptability and lifespan under different operating conditions. Attached Figure Description

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] Figure 1 This is a schematic diagram of a portable aluminum-cased mobile phone liquid cooling heat sink according to the present invention.

[0030] Figure 2 for Figure 1 An exploded view of the structure shown.

[0031] Figure 3 This is a schematic diagram of the coolant heat dissipation circulation module in this utility model.

[0032] Figure 4 Schematic diagram of the explosion structure of the cooling head in this utility model Figure 1 .

[0033] Figure 5 Schematic diagram of the explosion structure of the cooling head in this utility model Figure 2 .

[0034] Figure 6 This is a schematic diagram of the aluminum heat dissipation shell structure in this utility model. Figure 1 .

[0035] Figure 7 This is a schematic diagram of the aluminum heat dissipation shell structure in this utility model. Figure 2 .

[0036] Figure 8 This is a cross-sectional view of the condensation outlet at the aluminum heat dissipation shell in this utility model.

[0037] Figure 9 This is a schematic diagram of the aluminum heat dissipation shell structure in this utility model. Figure 2 .

[0038] Explanation of the labels in the diagram:

[0039] 1. Cooling head; 101. First inlet; 102. First outlet; 2. Aluminum heat sink casing; 21. First mounting cavity; 211. Heat dissipation column; 22. Second mounting cavity; 3. Liquid storage bag; 31. Second inlet; 32. Second outlet; 33. First connection port; 34. Second connection port; 35. Bag body; 36. Exhaust valve; 37. Liquid replenishment port; 38. Sealing plug; 4. Diaphragm pump; 5. Cooling fan; 6. Condensate radiator; 61. Inner screw 62. Perforation; 63. Mounting groove; 7. Countersunk groove; 8. Rigid tube; 9. First pipe; 10. Second pipe; 11. Dust cover; 12. Control main board; 13. Temperature sensor; 14. Cooling head housing; 15. Heat-conducting block; 16. Cooling chip; 17. Cooling block; 18. Magnetic suction part; 19. Magnetic ring; 10. Magnetic powder thermal conductive silicone; 11. Suction hole; 12. Sealing strip; 13. Protrusion; 14. Thermal protection temperature sensor. Detailed Implementation

[0040] Please see Figures 1 to 9 This utility model provides a portable aluminum-cased mobile phone liquid cooling heat sink, including a cooling head 1 and a coolant heat dissipation circulation module. The coolant heat dissipation circulation module includes an aluminum heat dissipation shell 2, a liquid storage bag 3 and a diaphragm pump 4; the liquid storage bag 3 contains coolant.

[0041] A condenser 6 is provided in the aluminum heat dissipation shell 2. The condenser 6 is integrated with the aluminum heat dissipation shell 2. Several heat dissipation columns 211 are integrally formed at the top of the condenser 6. The heat dissipation columns 211 form a first mounting cavity 21. The first mounting cavity 21 is connected to a cooling fan 5. A second mounting cavity 22 is also provided at the bottom of the condenser 6. The liquid storage bag 3 and the diaphragm pump 4 are both located in the second mounting cavity 22. The condenser 6 has a condensation channel with an internal threaded hole 61. The condensation channel is in the shape of a serpentine coil.

[0042] The cooling head 1 has a first inlet 101 and a first outlet 102. The liquid storage bag 3 has a second inlet 31, a second outlet 32, a first connection port 33, and a second connection port 34. The second outlet 32 ​​is connected to the first inlet 101 via a cold liquid inlet pipe. The first outlet 102 is connected to the first connection port 33 via a cold liquid outlet pipe. The first connection port 33 communicates with the second connection port 34. The second connection port 34 is connected to the diaphragm pump 4. The second connection port 34 can be connected to the diaphragm pump 4 via a rigid pipe 7, so that the diaphragm pump 4 and the liquid storage bag 3 form a stable connection structure. The diaphragm pump 4 is connected to the inlet of the condensation channel via a first pipe 8. The outlet of the condensation channel is connected to the second inlet 31 via a second pipe 9. In this invention, each inlet, outlet, or connection port is sealed to the corresponding component via a sealing ring (such as an O-ring) to prevent coolant leakage.

[0043] After the diaphragm pump 4 starts, the coolant flows as follows: the coolant flows out of the storage bag 3 from the second outlet 32, enters the heat-conducting block 14 through the first inlet 101, and cools the cooling wafer 15 by heat exchange. After heat exchange, the coolant flows out of the heat-conducting block 14 from the first outlet 102, passes through the first connection port 33 and the second connection port 34, and flows back into the diaphragm pump 4. Subsequently, the coolant is pumped into the condensation channel, where the heat of the coolant is transferred to the condenser 6. The cooling fan 5 carries away the heat from the condenser 6, thus cooling the coolant. After heat exchange, the coolant flows back into the storage bag 3 through the second inlet 31.

[0044] Specifically, the liquid storage bag 3 includes an elastic bag body 35 and an exhaust valve 36, which are connected and sealed together.

[0045] The second inlet 31, the second outlet 32, the first connection port 33 and the second connection port 34 are all provided on the exhaust valve 36, and the second inlet 31 and the second outlet 32 ​​are connected to the bag body 35. The second inlet 31 and the second outlet 32 ​​are both located at the lower part of the exhaust valve 36.

[0046] The exhaust valve 36 is also connected to a coolant inlet 37 for replenishing coolant. The coolant inlet 37 extends to the outside of the aluminum heat sink housing 2. The coolant inlet 37 is connected to the bag body 35. The coolant inlet 37 is located above the exhaust valve 36 and is sealed by a sealing plug 38.

[0047] The second inlet 31 and the second outlet 32 ​​are located in the lower half of the exhaust valve 36, and the replenishment port 37 is located in the upper half of the exhaust valve 36.

[0048] The second inlet 31 and the second outlet 32 ​​of the coolant storage bag 3 are both located below the vent valve 36. When air mixes into the coolant, because the air density is less than that of the coolant, it will naturally collect at the upper end of the elastic bag body 35. The lower inlet and outlet effectively prevent air from re-entering the coolant circulation loop, preventing problems such as poor circulation and reduced heat dissipation efficiency caused by air mixing, and ensuring stable operation of the heat dissipation system. At the same time, the replenishment port 37 located at the upper part of the vent valve 36 is connected to the bag body 35. When replenishing coolant, the sealing plug 38 of the replenishment port 37 is opened to inject coolant, and the air in the bag body 35 can be smoothly discharged through the replenishment port 37, ensuring that the replenished coolant is free of air bubbles, further improving the reliability of the circulation system.

[0049] Specifically, the cooling head 1 includes a cooling head housing 13, a heat-conducting block 14, a cooling wafer 15, and a cold-conducting block 16;

[0050] The heat-conducting block 14 and the cooling chip 15 are both disposed inside the cooling head housing 13, and the cooling chip 15 is in contact with the heat-conducting block 14. The heat-conducting block 14 has a cooling channel with an internal threaded hole 61. The first inlet 101 and the first outlet 102 are both connected to the cooling channel. The cooling channel is also in the shape of a serpentine coil.

[0051] The cooling block 16 contacts the cooling wafer 15, and the cooling block 16 also serves as a sealing cap for the cooling head housing 13;

[0052] A magnetic suction part 17 is also provided on the outer side of the cooling block 16. The magnetic suction part 17 is composed of magnetic powder and thermally conductive silicone. The magnetic powder and thermally conductive silicone can be uniformly mixed and then formed on the cooling block 16; or the magnetic powder and thermally conductive silicone can be formed sequentially on the cooling block 16 to form a magnetic powder layer and a thermally conductive silicone layer. Of course, the magnetic suction part 17 can also be in the form of a magnetic ring 171 installed on the cooling block 16. In this case, a magnetic ring groove is provided on the outer side of the cooling block, the magnetic ring 171 is installed in the magnetic ring groove, and the cooling block 16 is coated with magnetic powder and thermally conductive silicone 172.

[0053] The cooling block 16 has a suction hole 18 for evacuating a vacuum. After evacuating a vacuum inside the cooling head housing 13, a vacuum cavity is formed inside the cooling head housing 13, giving it vacuum insulation capability. The suction hole 18 is also used to inject aerogel into the cooling head housing 13. The aerogel is used to prevent the convection of a small number of air molecules.

[0054] When the cooling chip 15 is working, one end is the cold end and the other end is the hot end. The cold end is in contact with the cooling block 16, and the heat generated by the operation of the mobile phone is transferred to the cooling block 16; the hot end is in contact with the heat-conducting block 14 and exchanges heat with the coolant flowing inside the heat-conducting block 14.

[0055] After the aerogel is injected, the suction hole 18 is sealed. The aerogel fills the gap between the cooling head housing 13, the heat-conducting block 14, and the cooling chip 15. The interior of the cooling head 1 is vacuum-treated, which serves as vacuum insulation, minimizing heat transfer caused by air convection and significantly improving the insulation effect of the cooling head 1. This ensures that the cooling energy generated by the cooling chip 15 is concentrated on the heat-generating parts of the electronic device, greatly enhancing the cooling efficiency. Injecting aerogel before vacuuming the interior of the cooling head housing 13 prevents air molecule convection, further strengthening the insulation effect and effectively preventing air leakage in the heat-conducting block 16 later. This avoids affecting the insulation performance due to decreased sealing and ensures a stable cooling effect of the cooling head 1 in the long term.

[0056] The cooling head housing 13 is connected to a sealing sleeve. The connecting wire of the cooling chip 15 and the data transmission line of the temperature sensor 12 extend through the sealing sleeve to the outside of the cooling head housing 13. The first inlet 101 and the first outlet 102 also extend through the sealing sleeve to the outside of the cooling head housing 13. The cold liquid inlet pipe, the cold liquid outlet pipe, the data transmission line of the temperature sensor 12 and the connecting wire of the cooling chip 15 are all covered together by the sleeve to form a whole.

[0057] Specifically, the aluminum heat dissipation housing 2 is equipped with a dust cover 10, which is perforated. A magnetic induction sensor (not shown) is installed inside the dust cover 10. The magnetic induction sensor is connected to the control motherboard 11. When the cooling head 1 is magnetically attached to the dust cover 10, and the magnetic induction sensor detects a magnetic field, the control motherboard 11 stops the heat sink. In use, the cooling head 1 is magnetically attached to the back cover of the mobile phone.

[0058] Specifically, the cooling head housing 13 is also equipped with a temperature sensor 12 for measuring the internal temperature of the cooling block 16. The temperature sensing end of the temperature sensor extends into the cooling block 16, and the temperature sensor 12 is connected to the control motherboard 11.

[0059] In this embodiment, the control motherboard 11 is connected to the diaphragm pump 4, the magnetic induction sensor, and the temperature sensor 12. The control motherboard 11 has a display module, which displays the temperature of the cooling head 1 after the heat sink is started. A rechargeable battery for powering the heat sink described in this invention is also installed inside the cooling head housing 13, and the aluminum heat sink housing 2 is provided with a charging interface for charging.

[0060] Specifically, a thermal protection temperature sensor 20 is also provided inside the aluminum heat sink housing. The thermal protection temperature sensor is used to detect the temperature of the aluminum heat sink housing. When the temperature of the aluminum heat sink housing rises to the set temperature, the cooling chip of the cooling head stops working.

[0061] Specifically, the condenser 6 has several internally threaded holes 61 extending along its length. Each end of the condenser 6 has a mounting groove 62, and each mounting groove 62 has several countersunk grooves 63 on its end face. Each countersunk groove 63 connects to two internally threaded holes 61, and the countersunk grooves 63 at both ends of the condenser 6 are offset by one internally threaded hole 61, forming a serpentine coil shape. One end of the condensation channel of the serpentine coil is connected to the diaphragm pump 4, and the other end is connected to the second inlet 31. A sealing strip 19 is also installed in the mounting groove 62. The sealing strip 19 has a protrusion 20 that matches the countersunk groove 63. The protrusion 20 is embedded in the countersunk groove 63, with a gap between it and the end face of the countersunk groove 63, so that the internally threaded holes 61 within the same countersunk groove 63 can communicate. The protrusion 20 embedded in the countersunk groove 63 prevents coolant leakage to the outside of the condenser 6. Furthermore, the design of leaving a gap between the protrusion 20 and the end face of the countersunk groove 63 allows the two internal threaded holes 61 located in the same countersunk groove 63 to communicate with each other.

[0062] While specific embodiments of the present invention have been described above, those skilled in the art should understand that the specific embodiments described are merely illustrative and not intended to limit the scope of the present invention. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A portable liquid cooling radiator for an aluminum-housed cell phone, characterized by: It includes a cooling head and a coolant heat dissipation circulation module, wherein the coolant heat dissipation circulation module includes an aluminum heat dissipation shell, a liquid storage bag and a diaphragm pump; A condenser is provided in the aluminum heat dissipation shell, and the condenser is integrated with the aluminum heat dissipation shell. Several heat dissipation columns are integrally formed at the top of the condenser, and the heat dissipation columns form a first mounting cavity. A cooling fan is connected to the first mounting cavity. A second mounting cavity is also provided at the bottom of the condenser. The liquid storage bag and the diaphragm pump are both located in the second mounting cavity. The condenser has a condensation channel with an internal thread hole. The cooling head has a first inlet and a first outlet, and the liquid storage bag has a second inlet, a second outlet, a first connection port and a second connection port. The second outlet is connected to the first inlet through a cold liquid inlet pipe, the first outlet is connected to the first connection port through a cold liquid outlet pipe, the first connection port is connected to the second connection port, the second connection port is connected to a diaphragm pump, the diaphragm pump is connected to the inlet of the condensation channel through a first pipe, and the outlet of the condensation channel is connected to the second inlet through a second pipe.

2. A liquid cooling radiator for portable aluminum-housed mobile phone as claimed in claim 1, wherein: The cooling head includes a cooling head housing, a heat-conducting block, a cooling chip, and a cold-conducting block; The heat-conducting block and the cooling chip are both disposed inside the cooling head housing, and the cooling chip is in contact with the heat-conducting block. The heat-conducting block has a cooling channel with an internal threaded hole, and the first inlet and the first outlet are both connected to the cooling channel. The cooling block is in contact with the cooling wafer, and the cooling block is used as a cover for sealing the cooling head housing; A magnetic suction part is also provided on the outside of the cooling block; the magnetic suction part is formed by uniformly mixing magnetic powder and thermally conductive silicone, or the magnetic suction part is formed by a magnetic ring and magnetic powder thermally conductive silicone. A magnetic ring groove is provided on the outside of the cooling block, the magnetic ring is installed in the magnetic ring groove, and the magnetic powder thermally conductive silicone is formed on the outside of the cooling block. The cooling block has a suction hole for evacuating a vacuum. After evacuating the inside of the cooling head housing, a vacuum cavity is formed inside the cooling head housing, giving it vacuum insulation capability. The suction hole is also used to inject aerogel into the cooling head housing, and the aerogel is used to prevent air molecule convection.

3. The portable aluminum-cased mobile phone liquid cooling heat sink as described in claim 1, characterized in that: The liquid storage bag includes a flexible bag body and an exhaust valve, which are connected and sealed together. The second inlet, the second outlet, the first connection port, and the second connection port are all located on the exhaust valve, and the second inlet and the second outlet are connected to the bag body. The second inlet and the second outlet are both located at the lower part of the exhaust valve. The exhaust valve is also connected to a coolant inlet for replenishing coolant. The coolant inlet extends to the outside of the aluminum heat sink housing and is connected to the bag body. The coolant inlet is located above the exhaust valve and is sealed by a sealing plug.

4. A portable aluminum-cased mobile phone liquid cooling heat sink as described in claim 1, characterized in that: The aluminum heat sink housing is fitted with an iron dust cover. A magnetic induction sensor is installed inside the dust cover. The magnetic induction sensor is connected to the control board. When the cooling head is magnetically attached to the dust cover and the magnetic induction sensor senses the magnetic field, the control board stops the heat sink.

5. A portable aluminum-cased mobile phone liquid cooling heat sink as described in claim 2, characterized in that: The cooling head housing is also equipped with a temperature sensor for measuring the internal temperature of the cooling block. The temperature sensor's sensing end extends into the cooling block, and the temperature sensor is connected to the control motherboard.

6. A portable aluminum-cased mobile phone liquid cooling heat sink as described in claim 1, characterized in that: The aluminum heat sink housing is also equipped with a thermal protection temperature sensor, which is used to detect the temperature of the aluminum heat sink housing. When the temperature of the aluminum heat sink housing rises to the set temperature, the cooling chip of the cooling head stops working.

7. A portable aluminum-cased mobile phone liquid cooling heat sink as described in claim 1, characterized in that: The condenser radiator has several internally threaded holes along its length. Each end of the condenser radiator has a mounting groove, and each mounting groove has several countersunk grooves on its end face. Each countersunk groove connects two internally threaded holes, and the countersunk grooves at both ends of the condenser radiator are offset by one internally threaded hole, so that the several internally threaded holes form a serpentine coil shape. A sealing strip is also installed in the mounting groove. The sealing strip has a protrusion that matches the countersunk groove. The protrusion is embedded in the countersunk groove and has a gap from the end face of the countersunk groove, so that the internally threaded holes within the same countersunk groove are connected.

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