Multi-size substrate adsorption device

Abstract

This utility model belongs to the technical field of perovskite battery marking equipment, specifically relating to a multi-size substrate adsorption device. The device includes: a base with a carrier plate embedded in its upper surface; the surface of the carrier plate is divided into several substrate placement positions; each substrate placement position has at least one negative pressure adsorption groove group at its edge; several negative pressure pipes are embedded inside the base to communicate with the corresponding adsorption groove groups; by setting several substrate placement positions of different sizes on the surface of the carrier plate, and setting corresponding adsorption groove groups and corresponding negative pressure pipes on the edges of each substrate placement position, the adsorption effect on substrates of different sizes can be satisfied.

Description

Technical Field

[0001] This utility model belongs to the technical field of perovskite battery marking equipment, specifically relating to a multi-size substrate adsorption device. Background Technology

[0002] In existing negative pressure adsorption devices, the adsorption base typically uses a single air passage inside and corresponding adsorption holes are opened on the surface of the adsorption base to perform negative pressure adsorption on the substrate placed on the surface of the adsorption base. However, the size of the substrate to be processed varies. The perovskite industry commonly uses sizes from 200×200mm to 800×1200mm. When the size of the substrate to be adsorbed changes, the adsorption base of the corresponding size needs to be replaced, resulting in low processing efficiency.

[0003] Therefore, a multi-size substrate adsorption device is designed to solve the technical problem that the adsorption base in the prior art cannot adsorb substrates of different sizes.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0005] This disclosure provides at least one multi-size substrate adsorption device.

[0006] In a first aspect, embodiments of this disclosure provide a multi-size substrate adsorption device, comprising:

[0007] The base has a carrier plate embedded in its upper surface;

[0008] The surface of the carrier plate is divided into several substrate placement positions; wherein

[0009] The substrate placement position has at least one negative pressure adsorption tank group at its edge position, and the base is embedded with several negative pressure pipes to communicate with the corresponding adsorption tank group.

[0010] In one optional embodiment, the carrier plate and its surface substrate placement positions are rectangular; wherein

[0011] One corner of the carrier plate is set as a reference point, and the placement positions of each substrate partially overlap to form a common corner that coincides with the reference point.

[0012] In one optional embodiment, a plurality of negative pressure pipes are respectively embedded inside the base along two sides adjacent to the reference point; wherein

[0013] Each of the negative pressure tubes is parallel to the corresponding side of the substrate placement position that is far from the reference point.

[0014] In one optional embodiment, the negative pressure adsorption tank assembly includes:

[0015] The substrate includes I-shaped grooves evenly spaced along its placement edge, L-shaped grooves located at right angles, and T-shaped grooves connecting the longitudinal and transverse edges; among which...

[0016] Furthermore, each of the aforementioned slots is connected to a corresponding negative pressure pipe; and

[0017] Several air tubes, one end of which is connected to the corresponding negative pressure tube, and the other end of which is connected to the corresponding slot.

[0018] In one optional embodiment, a vacuum device is provided on one side of the base; wherein

[0019] The vacuum device is connected to the port of a corresponding negative pressure pipe via several pipelines; and

[0020] The control panel is equipped with several solenoid valves, and each solenoid valve is configured to control the opening and closing of a corresponding pipeline.

[0021] In one optional embodiment, a gas source box is provided on one side of the vacuum device; wherein

[0022] The gas source box is connected to the vacuum device via a suction pipe; and

[0023] The control valve is located on the suction tube.

[0024] In one optional embodiment, the substrate is made of glass, silicon wafer, or PET material.

[0025] In one alternative embodiment, the carrier plate surface is made of aluminum alloy or aluminum oxide.

[0026] In one optional embodiment, the substrate size ranges from 15*15mm to 300*400mm.

[0027] The beneficial effect of this utility model is that the device sets several substrate placement positions of different sizes on the surface of the carrier plate, and sets corresponding adsorption grooves and corresponding negative pressure pipes on the edge of each substrate placement position to meet the adsorption effect of substrates of different sizes.

[0028] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0029] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0030] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the overall three-dimensional structure provided in the embodiments of this disclosure;

[0032] Figure 2 This is a schematic diagram of the three-dimensional structure of the base provided in an embodiment of the present disclosure;

[0033] Figure 3 This is an enlarged structural diagram of the base end corner provided in an embodiment of this disclosure;

[0034] Figure 4 This is an overall plan view provided for an embodiment of this disclosure.

[0035] In the picture:

[0036] 1. Base; 10. Pipe opening; 11. Negative pressure adsorption tank assembly; 110. T-shaped slot; 111. L-shaped slot; 112. I-shaped slot; 12. Negative pressure pipe; 120. Air pipe; 13. Substrate placement position; 14. Carrier plate; 140. Reference point;

[0037] 2. Vacuum device;

[0038] 3. Control panel; 30. Solenoid valve;

[0039] 4. Gas source box; 40. Suction pipe; 41. Control valve. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0041] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0042] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0043] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0044] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0045] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0046] Research has found that existing negative pressure adsorption devices generally use a single air passage inside the adsorption base and open corresponding adsorption holes on the surface of the adsorption base to perform negative pressure adsorption on the substrate placed on the surface of the adsorption base. However, the size of the substrate to be processed varies. When the size of the substrate to be adsorbed is changed, the adsorption base of the corresponding size needs to be replaced, resulting in low processing efficiency.

[0047] Based on the above research, this disclosure provides a multi-size substrate adsorption device, which sets several substrate placement positions of different sizes on the surface of a carrier plate, and sets corresponding adsorption grooves and corresponding negative pressure pipes on the edge of each substrate placement position to meet the adsorption effect of substrates of different sizes.

[0048] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0049] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0050] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0051] In some embodiments, the carrier plate 14 is embedded in the upper end face of the base 1 and fastened with bolts. One end of the rectangular substrate plate to be processed (not shown in the figure) is overlapped with the reference point 140 and placed in the corresponding substrate placement position 13 on the upper end face of the carrier plate 14. At this time, in the negative pressure adsorption groove group 11 opened on the surface of the carrier plate 14, at least one set of negative pressure pipes 12 overlaps with the edge of the rectangular substrate plate to be processed. The negative pressure pipes 12 are parallel to the long side away from the reference point, reducing the airflow path length and making the adsorption force evenly distributed. After the rectangular substrate plate to be processed is placed in place, the vacuum device 2 is started and the corresponding solenoid valve 30 is controlled to open to connect the vacuum device 2 with the port 10 of the corresponding negative pressure pipe 12. Figure 1 (The pipelines are not shown in the diagram). The vacuum device 2 extracts air from the corresponding negative pressure pipe 12 through the pipeline, and then generates negative pressure on the slots (110, 111, 112) located below the edge of the rectangular substrate to be processed through the corresponding air pipe 120, so as to adsorb the rectangular substrate to be processed.

[0052] For each type I slot 112, several type L slots 111, and several type T slots 110, by Figure 1 and Figure 2It is known that the L-shaped groove 111 preferably overlaps with the right angle of the rectangular substrate plate to be processed, at least one T-shaped groove 110 is located between the two L-shaped grooves 111, and at least one I-shaped groove 112 is collinear with one side of at least one L-shaped groove 112. The negative pressure adsorption groove group 11 formed in this way corresponds to the corresponding substrate placement position 13, thereby satisfying the adsorption of rectangular substrate plates of different sizes to be processed.

[0053] In some embodiments, the surface material of the carrier board 14 is aluminum alloy 6061-T6 or alumina, etc. The overall size of the carrier board 14 is 350X450mm, which can be adapted to substrate sizes of 15*15mm~300*400mm, preferably 300*400mm, 300*300mm, 200*200mm, 210*297mm, 210*105mm, 60*60mm, 15*15mm, 20*20mm, 30*30mm, etc. The substrate can be flexible PET material (polyethylene terephthalate), silicon wafer, glass, etc.

[0054] Each negative pressure tube 12 is individually controlled by a solenoid valve 30, which is connected to the vacuum device 2 to provide adsorption and blowing (vacuum breaking) functions for the carrier plate. It is compatible with various sizes and specifications of substrates, improves efficiency, and reduces waste.

[0055] It should be noted that the connection and working principle of the vacuum device 2, gas source box 4, control valve 41 and solenoid valve 30 are all existing technologies, and will not be elaborated on here.

[0056] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0057] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0058] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0059] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0060] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A multi-size substrate adsorption apparatus, characterized by, include: The base (1) has a carrier plate (14) embedded on its upper surface. The surface of the carrier plate (14) is divided into several substrate placement positions (13); wherein The substrate placement position (13) is provided with at least one negative pressure adsorption tank group (11) at its edge position, and the base (1) is provided with several negative pressure pipes (12) to communicate with the corresponding adsorption tank group (11).

2. The multi-size substrate adsorption device as described in claim 1, characterized in that, The carrier plate (14) and its surface substrate placement positions (13) are rectangular; wherein One corner of the carrier plate (14) is set as a reference point (140), and the substrate placement positions (13) partially overlap to form a common corner and coincide with the reference point.

3. The multi-size substrate adsorption device as described in claim 2, characterized in that, Several negative pressure pipes (12) are respectively embedded inside the base (1) along the two sides adjacent to the reference point; wherein Each of the negative pressure tubes (12) is parallel to the side of the corresponding substrate placement position (13) that is far from the reference point.

4. The multi-size substrate adsorption device as described in claim 3, characterized in that, The negative pressure adsorption tank assembly (11) includes: I-shaped slots (112) are arranged at equal intervals along the edge of the substrate placement position (13), L-shaped slots (111) are located at right angles, and T-shaped slots (110) connect the longitudinal and transverse sides; among which Furthermore, each of the aforementioned slots (110, 111, 112) is connected to the corresponding negative pressure pipe (12); and Several tracheas (120) are connected at one end to the corresponding negative pressure tube (12) and at the other end to the corresponding slots (110, 111, 112).

5. The multi-size substrate adsorption device as described in claim 4, characterized in that, A vacuum device (2) is provided on one side of the base (1); wherein The vacuum device (2) is connected to the port (10) of the corresponding negative pressure pipe (12) through several pipes; and The control panel (3) is provided with a number of solenoid valves (30), and each of the solenoid valves (30) is configured to control the opening and closing of the corresponding pipeline.

6. The multi-size substrate adsorption device as described in claim 5, characterized in that, A gas source box (4) is provided on one side of the vacuum device (2); wherein The gas source box (4) is connected to the vacuum device (2) via a suction pipe (40); and The control valve (41) is located on the suction pipe (40).

7. The multi-size substrate suction device according to claim 1, wherein The substrate is made of glass, silicon wafer, or PET material.

8. The multi-size substrate suction device according to claim 1, wherein The carrier plate (14) is made of aluminum alloy or aluminum oxide.

9. The multi-size substrate suction device according to claim 1, wherein The size range of the substrate is 15*15mm to 300*400mm.

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