Group punching dies with urethane cushioning layer

Abstract

This utility model discloses a group punching die with a urethane buffer layer in the field of mold processing technology. It includes a bottom die and a support plate. The support plate is fixedly connected to the bottom die. A pad die is fixedly connected to the support plate. A top plate is fixedly connected to the top plate. A telescopic rod is fixedly connected to one end of the top plate. A spring is fitted onto the surface of the telescopic rod. A buffer plate is fixedly connected to one end of the telescopic rod. A baffle is fixedly connected to one end of the pad die. The telescopic rod, spring, buffer plate, and baffle provide a buffering function for the top plate. When the top plate presses down and impacts the pad die, the buffer plate strikes the surface of the baffle, causing the telescopic rod to compress the spring, thus providing better protection for the top plate.

Description

Technical Field

[0001] This utility model belongs to the field of mold processing technology, specifically relating to a group punching mold with a urethane buffer layer. Background Technology

[0002] Molds are various shapes and tools used in industrial production to obtain desired products through methods such as injection molding, blow molding, extrusion, die casting, forging, smelting, and stamping. In short, a mold is a tool used to create shaped objects. This tool is composed of various parts, and different molds are composed of different parts. It mainly achieves the shaping of objects by changing the physical state of the material being molded. It is often referred to as the "mother of industry."

[0003] According to patent application number CN202021819259.6, a pressure cutting die with good cushioning performance is disclosed, comprising: a bottom die; a die groove provided on the top of the bottom die; an upper die; the upper die includes a top plate, a cutting die and a blade; a buffer groove provided on the bottom of the top plate; an elastic rubber provided in the buffer groove; the cutting die movably hanging on the bottom of the top plate; and the blade disposed on the bottom of the cutting die and located above the bottom die.

[0004] The above technical solution still has some defects in actual use. It mainly achieves the buffering function through a layer of elastic rubber, which has a poor buffering effect and cannot effectively protect the top plate. Therefore, we propose a group punching die with a urethane rubber buffer layer. Utility Model Content

[0005] The purpose of this invention is to provide a group punching die with a urethane buffer layer to solve the problem of poor buffering effect mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a group punching die with a urethane buffer layer, comprising a bottom die and a support plate. The bottom die has a support plate on its top, and the support plate is fixedly connected to the bottom die. The support plate has a pad die on its top, and the pad die is fixedly connected to the support plate. The pad die has a top plate on its top, and one end of the top plate has a telescopic rod, which is fixedly connected to the top plate. A spring is sleeved on the surface of the telescopic rod, and one end of the telescopic rod has a buffer plate, which is fixedly connected to the telescopic rod. One end of the pad die has a baffle, which is fixedly connected to the pad die.

[0007] Preferably, the top of the pad mold is provided with a mold groove, and there are multiple mold grooves. The top of the pad mold is provided with a first buffer pad, and the first buffer pad and the pad mold are fixed by adhesive bonding.

[0008] Preferably, the bottom of the top plate is provided with a buffer membrane, and the bottom of the buffer membrane is provided with a fixing block, and the fixing block and the buffer membrane are fixedly connected.

[0009] Preferably, the bottom of the fixing block is provided with a second buffer pad, and the second buffer pad is fixedly connected to the fixing block.

[0010] Preferably, the top of the mold is provided with a first mounting hole, and the first mounting hole has multiple holes.

[0011] Preferably, the bottom of the top plate is provided with a pressure groove, and the surface of the pressure groove is provided with a cutting blade, and the cutting blade and the pressure groove are detachably connected.

[0012] Preferably, a mounting plate is provided on one side of the bottom mold, and a second mounting hole is provided at one end of the bottom mold, wherein there are multiple second mounting holes.

[0013] Preferably, there are six sets of telescopic rods and springs, located at both ends of the top plate.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. The top plate is cushioned by the telescopic rod, spring, buffer plate and baffle. When the top plate is pressed down and the mold is impacted, the buffer plate will hit the surface of the baffle, which will drive the telescopic rod to compress the spring, thus achieving the cushioning function of the top plate and better protecting the top plate.

[0016] 2. The provided mold groove and first buffer pad realize the secondary buffer function of the top plate. The provided fixing block realizes the fixation of the second buffer pad. The provided second buffer pad can further protect the top plate. The provided pressure groove and cutting blade realize the cutting and shaping of the mold. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the exploded structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the top plate structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the planar structure of this utility model.

[0021] In the diagram: 1. Bottom mold; 2. Support plate; 3. Pad mold; 4. Top plate; 5. Telescopic rod; 6. Spring; 7. Buffer plate; 8. Baffle; 9. Mold groove; 10. First buffer pad; 11. Buffer membrane; 12. Fixing block; 13. Second buffer pad; 14. First mounting hole; 15. Pressure groove; 16. Cutting blade; 17. Mounting plate; 18. Second mounting hole. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a technical solution: a group punching die with a urethane buffer layer, including a bottom die 1 and a support plate 2. The support plate 2 is provided on the top of the bottom die 1 and is fixedly connected to the bottom die 1. A pad die 3 is provided on the top of the support plate 2 and is fixedly connected to the support plate 2. A top plate 4 is provided on the top of the pad die 3. A telescopic rod 5 is provided at one end of the top plate 4 and is fixedly connected to the top plate 4. A spring 6 is sleeved on the surface of the telescopic rod 5. A buffer plate 7 is provided at one end of the telescopic rod 5 and is fixedly connected to the telescopic rod 5. A baffle 8 is provided at one end of the pad die 3 and is fixedly connected to the pad die 3. Through the provided telescopic rod 5, spring 6, buffer plate 7 and baffle 8, the buffer function of the top plate 4 is realized. When the top plate 4 presses down and impacts the pad die 3, the buffer plate 7 will hit the surface of the baffle 8, thereby driving the telescopic rod 5 to compress the spring 6, realizing the buffer function of the top plate 4 and better protecting the top plate 4.

[0024] Specifically, the top of the pad mold 3 is provided with a mold groove 9, and there are multiple mold grooves 9. The top of the pad mold 3 is provided with a first buffer pad 10. The first buffer pad 10 and the pad mold 3 are fixed by adhesive. Through the provided mold grooves 9 and the first buffer pad 10, the secondary buffer function of the top plate 4 is realized.

[0025] Specifically, a buffer membrane 11 is provided at the bottom of the top plate 4, and a fixing block 12 is provided at the bottom of the buffer membrane 11. The fixing block 12 and the buffer membrane 11 are fixedly connected. The fixing block 12 is used to fix the second buffer pad 13.

[0026] Specifically, a second buffer pad 13 is provided at the bottom of the fixing block 12. The second buffer pad 13 is fixedly connected to the fixing block 12. The top plate 4 can be further protected by the second buffer pad 13.

[0027] Specifically, the top of the mold 3 is provided with a first mounting hole 14, and there are multiple first mounting holes 14. The mold 3 is installed through the provided first mounting holes 14.

[0028] Specifically, a pressure groove 15 is embedded at the bottom of the top plate 4, and a cutting blade 16 is provided on the surface of the pressure groove 15. The cutting blade 16 and the pressure groove 15 are detachably connected. Through the pressure groove 15 and the cutting blade 16, the mold is cut and shaped.

[0029] Specifically, a mounting plate 17 is provided on one side of the bottom mold 1, and a second mounting hole 18 is provided at one end of the bottom mold 1. Multiple second mounting holes 18 are provided, and the bottom mold 1 is installed through the mounting plate 17 and the second mounting holes 18.

[0030] Specifically, there are six sets of telescopic rods 5 and springs 6, located at both ends of the top plate 4. Because there are six sets of telescopic rods 5 and springs 6, the top plate 4 is more evenly cushioned during buffering.

[0031] In this embodiment, when using this method, the mold to be processed is placed on the surface of the pad mold 3. The hydraulic device drives the top plate 4 to press down, causing it to cut the mold. When the top plate 4 and the pad mold 3 collide, the buffer plate 7 will impact the surface of the baffle 8, thereby causing the telescopic rod 5 to retract and compress the spring 6, thus achieving a buffering effect on the top plate 4 and better protecting it. The mold groove 9 and the first buffer pad 10 provide a secondary buffering function for the top plate 4. The fixing block 12 fixes the second buffer pad 13, further protecting the top plate 4. The pressure groove 15 and the cutting blade 16 achieve the cutting and shaping of the mold.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A set of die cutting moulds with EPOXY buffer layer, comprising a bottom mould and a support plate, characterized in that: The bottom mold has a support plate at its top, which is fixedly connected to the bottom mold. The support plate has a pad mold at its top, which is fixedly connected to the support plate. The pad mold has a top plate at its top, and a telescopic rod is provided at one end of the top plate. The telescopic rod is fixedly connected to the top plate. A spring is fitted on the surface of the telescopic rod. A buffer plate is provided at one end of the telescopic rod, which is fixedly connected to the telescopic rod. A baffle is provided at one end of the pad mold, which is fixedly connected to the pad mold.

2. The group die with the buffer layer of Optigel according to claim 1, wherein: The top of the pad mold is provided with a mold groove, and there are multiple mold grooves. The top of the pad mold is provided with a first buffer pad, and the first buffer pad and the pad mold are fixed together by adhesive bonding.

3. The group die with the buffer layer of Optigel according to claim 1, wherein: The bottom of the top plate is provided with a buffer membrane, and the bottom of the buffer membrane is provided with a fixing block, which is fixedly connected to the buffer membrane.

4. The group die with the buffer layer of Super Strips according to claim 3, characterized in that: The bottom of the fixing block is provided with a second buffer pad, and the second buffer pad is fixedly connected to the fixing block.

5. The group die with the buffer layer of Optigel according to claim 1, wherein: The top of the mold is provided with a first mounting hole, and the first mounting hole has multiple holes.

6. The group die with the Optigel buffer layer according to claim 1, wherein: The bottom of the top plate is embedded with a pressure groove, and the surface of the pressure groove is provided with a cutting blade. The cutting blade and the pressure groove are detachably connected.

7. The group die with the buffer layer of Optigel according to claim 1, wherein: The bottom mold has a mounting plate on one side and a second mounting hole at one end, which has multiple holes.

8. The group die with the Optigel buffer layer according to claim 1, wherein: The telescopic rods and springs are provided in six sets, located at both ends of the top plate.

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