A mold temperature equalization device

Abstract

This utility model provides a mold temperature equalization device, belonging to the field of temperature equalization technology. It mainly addresses the problems of existing temperature equalization devices often lacking zoned temperature control and having complex installation. The proposed technical solution is as follows: A mold temperature equalization device includes a fixed plate, pipes, and a cover plate. Multiple sets of pipes are arranged on the top of the fixed plate, and a cover plate is installed on top of each set of temperature-controlled pipes. Multiple sets of connecting plates and clamping plates are arranged at the bottom of the fixed plate, and a heat spreader is installed at the bottom of the fixed plate. Multiple sets of temperature sensors and fastening bolts are arranged on the top of the cover plate. By symmetrically arranging multiple sets of temperature-controlled pipes, zoned temperature control of the mold surface is achieved, resulting in a uniform mold temperature. The heat spreader assists in conducting heat from the temperature-controlled pipes, accelerating heat conduction and reducing the impact of lag in heat conduction on the temperature of different areas of the mold. The clamping plates conveniently and quickly attach the device to the top of the mold.

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