A chip substrate feeding machine

Abstract

This invention provides a chip substrate unloading machine, relating to the field of chip manufacturing technology. In this invention, a first conveying device is used to transport chip substrates, while a second and third conveying device are arranged parallel and vertically spaced, both used to transport material boxes. The transfer device has an interconnected driving mechanism and a clamping mechanism. The clamping mechanism is configured to clamp an empty material box when it is transported to a first target position by the second conveying device. Driven by the driving mechanism, the clamping mechanism moves the empty material box to the end of the first conveying device to receive the chip substrate, and moves the material box containing the chip substrate to a second target position of the third conveying device, so that the third conveying device unloads the material box. This technical solution enables automatic movement of the material box to receive unloaded chip substrates and automatic loading and unloading of the material boxes. While an empty material box is being loaded, a material box containing a chip substrate can be unloaded, thereby increasing the unloading speed of the chip substrate and improving production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, and in particular to a chip substrate feeding machine. Background Technology

[0002] In the field of chip manufacturing technology, after chip packaging, the substrate containing the packaged chips needs to be unloaded. Ordinary unloading mechanisms cannot meet the requirements for fully automated unloading, and manual intervention is still required during the unloading process, resulting in low production efficiency. Therefore, there is an urgent need to design an unloading machine that can improve the unloading speed of chip substrates. Utility Model Content

[0003] One objective of this invention is to provide a chip substrate cutting machine that solves the technical problem of low chip substrate cutting efficiency in the prior art.

[0004] A further objective of this invention is to avoid damaging the chip substrate during the chip substrate pushing process.

[0005] Specifically, this utility model provides a chip substrate cutting machine, comprising:

[0006] The first conveying device is arranged in a preset direction and is used to convey the chip substrate;

[0007] The second conveying device is disposed beside the first conveying device and is used to convey a material box, the material box having multiple mounting portions for placing the chip substrate;

[0008] The third conveying device, which is parallel to the first conveying device and arranged at vertical intervals, is used to convey the material box;

[0009] A transfer device is disposed at the end of the first conveying device and has a drive mechanism and a clamping mechanism connected to each other. The clamping mechanism is configured to clamp the empty material box when the empty material box is conveyed to the first target position by the second conveying device. Under the drive of the drive mechanism, the clamping mechanism moves the empty material box to the end of the first conveying device to receive the chip substrate, and moves the material box loaded with the chip substrate to the second target position of the third conveying device so that the third conveying device unloads the material box.

[0010] Optionally, the clamping mechanism includes:

[0011] The base frame is connected to the drive mechanism;

[0012] The first driving component is mounted on the base frame;

[0013] A first clamping plate is connected to the first driving member and is configured to move vertically under the drive of the first driving member to clamp the top of the material box when the material box moves to the first target position.

[0014] A second clamping plate is connected to the base frame and is configured to be located at the bottom of the material box and support the material box when the material box moves to the first target position.

[0015] Optionally, the driving mechanism includes a horizontal driving mechanism and a vertical driving mechanism connected to each other. The horizontal driving mechanism is configured to controllably drive the clamping mechanism to move along the preset direction, and the vertical driving mechanism is configured to controllably drive the clamping mechanism to move vertically.

[0016] Optionally, the second conveying device is arranged in a direction perpendicular to the preset direction, and the transfer device is located at the end of the second conveying device near the first conveying device.

[0017] Optionally, it also includes:

[0018] A pushing device is installed beside the first conveying device. The pushing device is configured to push the chip substrate into the material box when the chip substrate moves along the first conveying device to the third target position.

[0019] Optionally, the pushing device includes:

[0020] The first mounting plate is installed vertically on the side of the first conveying device;

[0021] A conveyor belt device is installed on one side of the first mounting plate and has a first conveyor belt;

[0022] The second driving component is connected to the conveyor belt device and is used to controllably drive the first conveyor belt transmission.

[0023] The first slide rail is installed on the same side of the first mounting plate as the conveyor belt device and is arranged along the preset direction;

[0024] A pushing component is connected to the first conveyor belt and has a push rod in a horizontal direction. The push rod is configured to move along the preset direction when the first conveyor belt is driven, thereby pushing the chip substrate on the first conveying device into the material box.

[0025] Optionally, the push component further includes:

[0026] The second mounting plate is connected to the first conveyor belt and is slidably connected to the first slide rail;

[0027] A third drive unit is connected to the second mounting plate and to the push rod, the third drive unit being configured to controllably drive the push rod to move vertically.

[0028] Optionally, the push component further includes:

[0029] The second slide rail is mounted on the second mounting plate and arranged along the preset direction, and the third driving member is slidably connected to the second slide rail.

[0030] Optionally, it also includes:

[0031] A pressure sensor, installed at the end of the push rod, is used to detect the thrust of the push rod.

[0032] Optionally, it also includes:

[0033] A scanning device, mounted on top of the first conveying device, is used to scan the code on the chip substrate when the chip substrate is moved to the third target position.

[0034] In this invention, the first conveying device is used to convey chip substrates, while the second and third conveying devices are arranged parallel to each other and spaced vertically, both used to convey material boxes. The transfer device has an interconnected driving mechanism and a clamping mechanism. The clamping mechanism is configured to clamp the empty material box when it is conveyed to the first target position by the second conveying device. Driven by the driving mechanism, the clamping mechanism moves the empty material box to the end of the first conveying device to receive the chip substrate, and moves the material box containing the chip substrate to the second target position of the third conveying device, so that the third conveying device can unload the material box. This technical solution enables automatic movement of the material box to receive unloaded chip substrates and automatic loading and unloading of the material boxes. While the empty material box is being loaded, the material box containing the chip substrate can be unloaded, thereby increasing the unloading speed of the chip substrate and improving production efficiency.

[0035] Furthermore, the pushing component in this invention also includes a second slide rail, which is installed on the side of the second mounting plate near the third driving member and arranged along a preset direction. The third driving member is slidably connected to the second slide rail. In this embodiment, the third sliding member is designed to slide along the second slide rail. If the chip substrate gets stuck during the process of the push rod pushing the chip substrate into the material box, the third driving member can slide along the second slide rail, thereby driving the push rod to move in the opposite direction of the pushing direction, thus avoiding damage to the chip substrate.

[0036] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0037] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0038] Figure 1 This is a schematic structural diagram of a chip substrate feeding machine according to an embodiment of the present invention;

[0039] Figure 2 This is a schematic structural diagram of a first conveying device, a second conveying device, and a third conveying device according to an embodiment of the present utility model;

[0040] Figure 3 This is a schematic structural diagram of a clamping mechanism according to an embodiment of the present utility model;

[0041] Figure 4 This is a schematic structural diagram of a drive mechanism according to an embodiment of the present utility model;

[0042] Figure 5 This is a schematic structural diagram of a pushing device according to an embodiment of the present invention;

[0043] Figure 6 This is a schematic structural diagram of a push rod according to an embodiment of the present invention.

[0044] Figure label:

[0045] 100 - Feeding machine, 200 - Material box, 10 - First conveying device, 20 - Second conveying device, 30 - Transfer device, 40 - Scanning device, 50 - Pushing device, 60 - Third conveying device, 70 - Pressure sensor, 31 - Clamping mechanism, 311 - First clamping plate, 312 - Second clamping plate, 313 - Limiting part, 314 - First driving component, 315 - Base frame, 321 - Fourth mounting plate, 322 - Fourth slide rail, 323 - Third slide rail, 324 - Third mounting plate, 325 - Fourth driving component, 326 - Fifth driving component, 327 - Lead screw, 51 - First conveyor belt, 12 - Sensor, 11 - Second conveyor belt, 52 - Synchronous pulley, 53 - Second driving component, 54 - First slide rail, 55 - Second mounting plate, 56 - Second slide rail, 57 - Third driving component, 58 - Push rod, 59 - First mounting plate. Detailed Implementation

[0046] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0047] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0048] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0049] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0050] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0051] Figure 1 This is a schematic structural diagram of a chip substrate cutting machine 100 according to an embodiment of the present invention. Figure 2 This is a schematic structural diagram of a first conveying device 10, a second conveying device 20, and a third conveying device 60 according to an embodiment of the present invention. Figure 1 and Figure 2As shown, in a specific embodiment, the chip substrate unloading machine 100 includes a first conveying device 10, a second conveying device 20, a third conveying device 60, and a transfer device 30. The first conveying device 10 is arranged along a predetermined direction and is used to convey the chip substrate. The second conveying device 20 is disposed beside the first conveying device 10 and is used to convey a material box 200, which has multiple mounting portions for placing the chip substrate. The third conveying device 60 is parallel to the first conveying device 10 and arranged vertically at intervals, and is used to convey the material boxes 200. The transfer device 30 is located at the end of the first conveying device 10 and has a drive mechanism and a clamping mechanism 31 connected to each other. The clamping mechanism 31 is configured to clamp the empty material box 200 when it is conveyed to the first target position by the second conveying device 200. Driven by the drive mechanism, the clamping mechanism 31 moves the empty material box 200 to the end of the first conveying device 10 to receive the chip substrate, and moves the material box 200 loaded with the chip substrate to the second target position of the third conveying device 60 so that the third conveying device 60 unloads the material box 200. Here, the unloading is performed on the material box 200 loaded with the chip substrate.

[0052] This embodiment enables the automatic movement of the material box 200 to receive the unloaded chip substrate, and enables the automatic loading and unloading of the material box 200. While the empty material box 200 is being loaded, the material box 200 loaded with chip substrates can be unloaded, thereby increasing the unloading speed of chip substrates and thus improving production efficiency.

[0053] In some embodiments, the first conveying device 10 includes a pair of second conveyor belts 11 on which the chip substrate is conveyed.

[0054] In some embodiments, the second conveying device 20 and the third conveying device 60 have the same structure, both conveying the material box 200 via a conveyor belt, which will not be described in detail here.

[0055] Figure 3 This is a schematic structural diagram of the clamping mechanism 31 according to an embodiment of the present invention. Figure 3 As shown, in one embodiment, the material box 200 is cuboid, and the two opposite inner walls of the material box 200 are provided with multiple limiting grooves. The limiting grooves can be understood as mounting parts inside the material box 200. The multiple limiting grooves are arranged vertically at intervals. The limiting grooves are used to limit the chip substrate. The chip substrate is pushed into the material box 200 from the end of the limiting groove.

[0056] In some embodiments, the clamping mechanism 31 includes a base frame 315, a first drive member 314, a first clamping plate 311, and a second clamping plate 312. The base frame 315 is connected to the drive mechanism. The first drive member 314 is mounted on the base frame 315. The first clamping plate 311 is connected to the first drive member 314 and is configured to move vertically under the drive of the first drive member 314 to clamp the top of the material box 200 when the material box 200 moves to the first target position. The second clamping plate 312 is connected to the base frame 315 and is configured to be located at the bottom of the material box 200 and support the material box 200 when the material box 200 moves to the first target position. It can be understood that the second clamping plate 312 is fixedly connected to the base frame 315, while the first clamping plate 311 can move up and down. When it is necessary to clamp the material box 200, the clamping mechanism 31 moves to the second conveying device 20, so that the second clamping plate 312 is located at the bottom of the second conveying device 20. When the material box 200 moves to the first target position, it is positioned directly above the second clamping plate 312. In some embodiments, the second clamping plate 312 has a limiting portion 313 for limiting the material box 200. When the material box 200 has not moved to the first target position, the distance between the first clamping plate 311 and the second clamping plate 312 is greater than the height of the material box 200. When the material box 200 moves to the first target position, the first driving member 314 drives the first clamping plate 311 to move downwards and abut against the top of the material box 200, so as to clamp the material box 200 together with the second clamping plate 312. Only after the first clamping plate 311 and the second clamping plate 312 have clamped the material box 200 can the driving mechanism move the material box 200. Here, the first driving member 314 is a cylinder.

[0057] In some embodiments, the driving mechanism includes a horizontal driving mechanism and a vertical driving mechanism connected to each other. The horizontal driving mechanism is configured to controllably drive the clamping mechanism 31 to move along a preset direction, and the vertical driving mechanism is configured to controllably drive the clamping mechanism 31 to move vertically. This can be understood as the driving mechanism being able to drive the material box 200 to move horizontally or vertically. After the clamping mechanism 31 clamps the material box 200, the horizontal driving mechanism first drives the clamping mechanism 31 to move the material box 200 horizontally, causing the material box 200 to disengage from the second conveying device 20 and move it to a position aligned with the first conveying device 10. Then, the vertical driving mechanism drives the clamping mechanism 31 to move the material box 200 vertically, causing one of the mounting portions inside the material box 200 to align with the chip substrate on the second conveyor belt 11 of the first conveying device 10, so as to receive the chip substrate. After the chip substrate enters the cassette 200, the vertical drive mechanism drives the clamping mechanism 31 to move the cassette 200 vertically, so that another mounting part inside the cassette 200 aligns with the chip substrate on the second conveyor belt 11 of the first conveying device 10 to receive the next chip substrate, and so on, until the cassette 200 is full of chip substrates. Preferably, the multiple mounting parts receive the chip substrates sequentially from top to bottom or from bottom to top.

[0058] Figure 4 This is a schematic structural diagram of a drive mechanism according to an embodiment of the present invention. Figure 4 As shown, and see Figure 2 In some embodiments, the horizontal drive mechanism includes a third slide rail 323, a third mounting plate 324, and a fourth drive member 325. The third mounting plate 324 is slidably connected to the third slide rail 323, which is arranged along the extension direction of the second conveying device 20, that is, extending in a direction perpendicular to a preset direction. The fourth drive member 325 is connected to the third mounting plate 324 and is configured to controllably drive the third mounting plate 324 to move along the third slide rail 323. Here, the fourth drive member 325 is a lead screw mechanism, which will not be described in detail here.

[0059] In some embodiments, the vertical drive mechanism includes a fourth slide rail 322, a fourth mounting plate 321, and a fifth drive member 326. The fourth mounting plate 321 is arranged vertically and connected to a third mounting plate 324. The fourth slide rail 322 is mounted vertically on the fourth mounting plate 321, and the base frame 315 is slidably connected to the fourth slide rail 322. Additionally, the vertical drive mechanism also includes a lead screw 327 arranged vertically and connected to the base frame 315. The fifth drive member 326 is a motor and is arranged vertically. The fifth drive member 326 and the lead screw 327 are both arranged vertically, and they are connected by a synchronous belt and a synchronous pulley; details are omitted here.

[0060] In some embodiments, the second conveying device 20 is arranged in a direction perpendicular to a preset direction, and the transfer device 30 is disposed at the end of the second conveying device 20 near the first conveying device 10. In other embodiments, the second conveying device 20 may also be arranged in other directions, which can be determined according to design requirements.

[0061] In some embodiments, the unloading machine 100 further includes a pushing device 50, which is installed beside the first conveying device 10. The pushing device 50 is configured to push the chip substrate into the material box 200 when the chip substrate moves along the first conveying device 10 to a third target position. Here, the third target position can be understood as the end of the first conveying device 100.

[0062] Figure 5 This is a schematic structural diagram of a pushing device 50 according to an embodiment of the present invention. Figure 6 This is a schematic structural diagram of the push rod 58 according to an embodiment of the present invention. Figure 5 and Figure 6 As shown, in some embodiments, the pushing device 50 includes a first mounting plate 59, a conveyor belt device, a second drive member 53, a first slide rail 54, and a pushing assembly. The first mounting plate 59 is vertically mounted beside the first conveying device 10. The conveyor belt device is mounted on one side of the first mounting plate 59 and has a first conveyor belt 51. The second drive member 53 is connected to the conveyor belt device for controlled driving of the first conveyor belt 51. The first slide rail 54 is mounted on the same side of the first mounting plate 59 and arranged along a preset direction. The pushing assembly is connected to the first conveyor belt 51 and has a horizontal push rod 58, which is configured to move along the preset direction when the first conveyor belt 51 is driven, thereby pushing the chip substrate on the first conveying device 10 into the material box 200. When a chip substrate needs to be pushed into the cassette 200, the second drive unit 53 drives the conveyor belt device. Since the pushing component is connected to the first conveyor belt 51, the conveyor belt device can drive the pushing component to slide along the first slide rail 54, that is, move in a preset direction, which can drive the push rod 58 to move in the preset direction, thereby pushing the chip substrate into the cassette 200. Afterwards, the second drive unit 53 drives the conveyor belt device to reset. Here, the conveyor belt device also includes a pair of synchronous pulleys 52 mounted on one side of the first mounting plate 59, and the first conveyor belt 51 is sleeved on the pair of synchronous pulleys 52. The second drive unit 53 is a motor.

[0063] In some embodiments, the pushing assembly further includes a second mounting plate 55 and a third driving member 57. The second mounting plate 55 is connected to the first conveyor belt 51 and slidably connected to the first slide rail 54. The third driving member 57 is connected to the second mounting plate 55 and to the push rod 58, and is configured to controllably drive the push rod 58 to move vertically. Here, the third driving member 57 is a cylinder, the piston rod of which extends and retracts vertically, and the push rod 58 is mounted on the end of the piston rod. Here, a cylinder is used to drive the push rod 58 to move up and down. When the chip substrate is conveyed on the first conveying device 10, the piston rod is in a retracted state, so that the push rod 58 is located above the chip substrate and does not affect the normal conveying of the chip substrate. After the chip substrate moves to the unloading position, the second drive unit 53 first drives the third drive unit 57 to move to the tail of the chip substrate, and then the third drive unit 57 drives the push rod 58 to move down so that the push rod 58 is aligned with the chip substrate. After that, the second drive unit 53 drives the first conveyor belt 51 to drive the push rod 58 to push the chip substrate into the material box 200.

[0064] In some embodiments, the pushing component further includes a second slide rail 56, which is mounted on a second mounting plate 55 and arranged in a preset direction, and a third drive member 57 is slidably connected to the second slide rail 56.

[0065] In this embodiment, the third slider is designed to slide along the second slide rail 56. If the chip substrate gets stuck during the process of the push rod 58 pushing the chip substrate to the material box 200, the third drive member 57 can slide along the second slide rail 56, thereby driving the push rod 58 to move in the opposite direction of the pushing direction, so as to avoid damaging the chip substrate and play a buffering role.

[0066] In some embodiments, the chip substrate unloader 100 further includes a pressure sensor 70, mounted on the end of the push rod 58, for detecting the pushing force of the push rod 58. This embodiment, by providing the pressure sensor 70, can detect the pushing force of the push rod 58, preventing the pushing force of the push rod 58 from being too large or too small, thus affecting the normal entry of the chip substrate into the material box 200.

[0067] In some embodiments, the chip substrate unloading machine 100 further includes a scanning device 40, which is mounted on top of the first conveying device 10 and is used to scan the code on the chip substrate when the chip substrate moves to the third target position. This embodiment, by setting the scanning device 40, can scan the code on the chip substrate and automatically count the unloading of the chip substrate.

[0068] In some embodiments, the first conveying device 10 further includes a sensor 12 mounted between a pair of second conveyor belts 11 for detecting the chip substrate. When the light emitted by the sensor 12 is blocked by the chip substrate, it indicates that the chip substrate has not moved into position, and the pushing device 50 does not need to operate. When the light emitted by the sensor 12 is not blocked by the chip substrate, it indicates that the chip substrate has moved into position, and the pushing device 50 can operate to push the chip substrate into the material box 200.

[0069] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A chip substrate blanking machine characterized by comprising: include: The first conveying device is arranged in a preset direction and is used to convey the chip substrate; The second conveying device is disposed beside the first conveying device and is used to convey a material box, the material box having multiple mounting portions for placing the chip substrate; The third conveying device, which is parallel to the first conveying device and arranged at vertical intervals, is used to convey the material box; A transfer device is disposed at the end of the first conveying device and has a drive mechanism and a clamping mechanism connected to each other. The clamping mechanism is configured to clamp the empty material box when the empty material box is conveyed to the first target position by the second conveying device. Under the drive of the drive mechanism, the clamping mechanism moves the empty material box to the end of the first conveying device to receive the chip substrate, and moves the material box loaded with the chip substrate to the second target position of the third conveying device so that the third conveying device unloads the material box.

2. The unscrambler of claim 1, wherein, The clamping mechanism includes: The base frame is connected to the drive mechanism; The first driving component is mounted on the base frame; A first clamping plate is connected to the first driving member and is configured to move vertically under the drive of the first driving member to clamp the top of the material box when the material box moves to the first target position. A second clamping plate is connected to the base frame and is configured to be located at the bottom of the material box and support the material box when the material box moves to the first target position.

3. The feeding machine according to claim 2, characterized in that, The driving mechanism includes a horizontal driving mechanism and a vertical driving mechanism connected to each other. The horizontal driving mechanism is configured to controllably drive the clamping mechanism to move along the preset direction, and the vertical driving mechanism is configured to controllably drive the clamping mechanism to move vertically.

4. The feeding machine according to any one of claims 1-3, characterized in that, The second conveying device is arranged in a direction perpendicular to the preset direction, and the transfer device is located at the end of the second conveying device near the first conveying device.

5. The unscrambler of any of claims 1-3, wherein, Also includes: A pushing device is installed beside the first conveying device. The pushing device is configured to push the chip substrate into the material box when the chip substrate moves along the first conveying device to the third target position.

6. The blanker of claim 5, wherein, The pushing device includes: The first mounting plate is installed vertically on the side of the first conveying device; A conveyor belt device is installed on one side of the first mounting plate and has a first conveyor belt; The second driving component is connected to the conveyor belt device and is used to controllably drive the first conveyor belt transmission. The first slide rail is installed on the same side of the first mounting plate as the conveyor belt device and is arranged along the preset direction; A pushing component is connected to the first conveyor belt and has a push rod in a horizontal direction. The push rod is configured to move along the preset direction when the first conveyor belt is driven, thereby pushing the chip substrate on the first conveying device into the material box.

7. The feeding machine according to claim 6, characterized in that, The push component also includes: The second mounting plate is connected to the first conveyor belt and is slidably connected to the first slide rail; A third drive unit is connected to the second mounting plate and to the push rod, the third drive unit being configured to controllably drive the push rod to move vertically.

8. The blanker of claim 7, wherein, The push component also includes: The second slide rail is mounted on the second mounting plate and arranged along the preset direction, and the third driving member is slidably connected to the second slide rail.

9. The blanker of claim 8, wherein, Also includes: A pressure sensor, installed at the end of the push rod, is used to detect the thrust of the push rod.

10. The blanker of claim 9, wherein, Also includes: A scanning device, mounted on top of the first conveying device, is used to scan the code on the chip substrate when the chip substrate is moved to the third target position.

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