Multi-chip product package structure and electric control device
By spacing electromagnetic wave sensor and inertial sensor chips on a substrate and encapsulating the ASIC chip with a plastic package, the problems of multi-sensor collaborative operation and signal integrity are solved, achieving efficient integrated packaging and enhancing environmental adaptability and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CARSEM SEMICON (SUZHOU) CO LTD
- Filing Date
- 2025-08-15
- Publication Date
- 2026-07-03
AI Technical Summary
When integrating electromagnetic wave sensors and inertial sensors, existing technologies struggle to ensure collaborative operation of multiple sensors, signal integrity, and environmental adaptability, especially in the face of electromagnetic interference.
An ASIC chip, an electromagnetic wave sensor chip, and an inertial sensor chip are laid flat on a substrate at intervals, bonded together with an insulating adhesive film, and then encapsulated in a plastic package. The ASIC chip is bonded to the inertial sensor chip with a non-conductive die-attach film, and the leads are connected and encapsulated in the plastic package to ensure signal integrity and environmental adaptability.
The integrated packaging of ASIC chip, electromagnetic wave sensor chip and inertial sensor chip has been achieved, ensuring the collaborative operation of multiple sensors, improving signal integrity and environmental adaptability, and enhancing the reliability of the packaging structure.
Smart Images
Figure CN224450313U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a multi-chip product packaging structure and electrical control equipment. Background Technology
[0002] Multi-chip integrated packaging (MCP) technology can integrate multiple chips with different functions into a single package, forming a modular unit with specific preset functions. When designing the package, the target frequency band and application scenario must be comprehensively considered, and packaging process parameters must be optimized through systematic simulation analysis to ensure the performance stability of the sensor in real-world application environments. When integrating electromagnetic wave sensors and inertial sensors into the same package, the sensor signals are susceptible to electromagnetic interference, which places higher technical demands on multi-sensor collaborative operation, signal integrity assurance, and environmental adaptability. Utility Model Content
[0003] The purpose of this invention is to provide a multi-chip product packaging structure and electronic control equipment to achieve integrated packaging of ASIC chips, electromagnetic wave sensor chips and inertial sensor chips, ensuring multi-sensor collaborative operation, signal integrity and environmental adaptability.
[0004] In the first aspect, the multi-chip product packaging structure provided by this utility model includes: a substrate, a molding compound, an ASIC chip, and at least two MEMS chips;
[0005] At least two of the MEMS chips include an electromagnetic wave sensor chip and an inertial sensor chip, which are laid flat and connected to the substrate at intervals.
[0006] The ASIC chip is connected to the inertial sensor chip;
[0007] The molding compound is connected to the substrate, and the molding compound encapsulates the ASIC chip, the electromagnetic wave sensor chip, and the inertial sensor chip.
[0008] In conjunction with the first aspect, the present invention provides a first possible implementation of the first aspect, wherein the electromagnetic wave sensor chip is bonded to the substrate by an insulating adhesive film.
[0009] In conjunction with the first aspect, this utility model provides a second possible implementation of the first aspect, wherein the inertial sensor chip is bonded to the substrate by an insulating adhesive film.
[0010] In conjunction with the first aspect, this utility model provides a third possible implementation of the first aspect, wherein the ASIC chip is bonded to the inertial sensor chip by a non-conductive die-attach film.
[0011] In conjunction with the first aspect, this utility model provides a fourth possible implementation of the first aspect, wherein one of the pads on the ASIC chip is connected to the pads on the inertial sensor chip via a first lead.
[0012] In conjunction with the fourth possible implementation of the first aspect, this utility model provides a fifth possible implementation of the first aspect, wherein another pad on the ASIC chip is connected to the substrate via a second lead.
[0013] In conjunction with the fifth possible implementation of the first aspect, the present invention provides a sixth possible implementation of the first aspect, wherein the first lead and the second lead are encapsulated and fixed within the plastic encapsulation body.
[0014] In conjunction with the first aspect, this utility model provides a seventh possible implementation of the first aspect, wherein the pads on the electromagnetic wave sensor chip are connected to the substrate via a third lead.
[0015] In conjunction with the seventh possible implementation of the first aspect, this utility model provides an eighth possible implementation of the first aspect, wherein the third lead is encapsulated and fixed within the plastic encapsulation body.
[0016] Secondly, the electrical control equipment provided by this utility model is equipped with the multi-chip product packaging structure described in the first aspect.
[0017] The present invention provides the following advantages: by using an electromagnetic wave sensor chip and an inertial sensor chip laid flat and connected to a substrate at intervals, an ASIC chip connected to the inertial sensor chip, and a plastic package connected to the substrate, and by encapsulating the ASIC chip, the electromagnetic wave sensor chip and the inertial sensor chip in the plastic package, the integrated packaging of the ASIC chip, the electromagnetic wave sensor chip and the inertial sensor chip is realized, ensuring the collaborative work of multiple sensors, signal integrity and environmental adaptability.
[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this utility model, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0020] Figure 1A schematic diagram of the MEMS chip, substrate, and insulating adhesive film of the multi-chip product packaging structure provided in this embodiment of the utility model;
[0021] Figure 2 A schematic diagram of the ASIC chip, MEMS chip, substrate, and insulating adhesive film of the multi-chip product packaging structure provided in this embodiment of the utility model;
[0022] Figure 3 A schematic diagram of the multi-chip product packaging structure provided in this embodiment of the present invention before processing the molding compound;
[0023] Figure 4 This is a schematic diagram of a multi-chip product packaging structure provided in an embodiment of the present invention.
[0024] Icons: 100 - ASIC chip; 200 - MEMS chip; 210 - Electromagnetic wave sensor chip; 220 - Inertial sensor chip; 300 - Substrate; 400 - Molded enclosure; 500 - Insulating adhesive film; 600 - Non-conductive die bond film; 700 - First lead; 800 - Second lead; 900 - Third lead. Detailed Implementation
[0025] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0026] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. Furthermore, the terms "first," "second," and "third" are only used to describe differences in name and should not be construed as indicating or implying relative importance. Physical quantities in formulas, unless otherwise specified, should be understood as basic quantities of the International System of Units (SI) base units, or derived quantities derived from basic quantities through mathematical operations such as multiplication, division, differentiation, or integration.
[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0028] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the multi-chip product packaging structure provided in this embodiment of the present invention includes: a substrate 300, a molding compound 400, an ASIC chip 100 (Application-Specific Integrated Circuit Chip), and at least two MEMS chips 200 (Micro-Electro-Mechanical Systems Chips); the at least two MEMS chips 200 include an electromagnetic wave sensor chip 210 and an inertial sensor chip 220, which are spaced apart and connected to the substrate 300; the ASIC chip 100 is connected to the inertial sensor chip 220; the molding compound 400 is connected to the substrate 300 and encapsulates the ASIC chip 100, the electromagnetic wave sensor chip 210, and the inertial sensor chip 220.
[0029] Specifically, the molding compound 400 is made of resin material. The resin material is filled and cured on the substrate 300, which can not only enclose the ASIC chip 100 and MEMS chip 200, but also isolate them between the electromagnetic wave sensor chip 210 and the inertial sensor chip 220.
[0030] In this embodiment of the invention, the electromagnetic wave sensor chip 210 and the inertial sensor chip 220 are respectively bonded to the substrate 300 by an insulating adhesive film 500.
[0031] In addition, the ASIC chip 100 is bonded to the inertial sensor chip 220 by a non-conductive die bond film 600.
[0032] Furthermore, one of the pads on the ASIC chip 100 is connected to the pad on the inertial sensor chip 220 via a first lead 700. Another pad on the ASIC chip 100 is connected to the substrate 300 via a second lead 800. The pads on the electromagnetic wave sensor chip 210 are connected to the substrate 300 via a third lead 900.
[0033] The first lead 700, the second lead 800, and the third lead 900 are all encapsulated and fixed within the plastic package 400. This prevents the first lead 700, the second lead 800, and the third lead 900 from vibrating during movement and avoids oxidation of the leads, thereby improving the reliability of the package structure.
[0034] During processing, the electromagnetic wave sensor chip 210 and the inertial sensor chip 220 are first bonded to the substrate 300 using an insulating adhesive film 500. Then, the ASIC chip 100 is bonded to the inertial sensor chip 220 using a non-conductive die-bonding adhesive film 600. Next, a first lead 700 is used to connect one of the pads on the ASIC chip 100 to the pad on the inertial sensor chip 220. A second lead 800 is used to connect the other pad on the ASIC chip 100 to the substrate 300. A third lead 900 is used to connect the pad on the electromagnetic wave sensor chip 210 to the substrate 300. Finally, the ASIC chip 100, MEMS chip 200, substrate 300, insulating adhesive film 500, non-conductive die-bonding adhesive film 600, first lead 700, second lead 800, and third lead 900 are encapsulated with resin material and cured to form a molded body 400, thereby preventing product oxidation and ensuring product quality and performance.
[0035] The electrical control device provided in this embodiment of the present invention is equipped with the multi-chip product packaging structure described in the above embodiments. The electrical control device has the technical effects of the multi-chip product packaging structure, which will not be repeated here.
[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A multi-chip product package structure, characterized by comprising: include: The substrate (300), the molding compound (400), the ASIC chip (100), and at least two MEMS chips (200). At least two of the MEMS chips (200) include an electromagnetic wave sensor chip (210) and an inertial sensor chip (220), which are laid out at intervals and connected to the substrate (300). The ASIC chip (100) is connected to the inertial sensor chip (220). The molding compound (400) is connected to the substrate (300), and the molding compound (400) encapsulates the ASIC chip (100), the electromagnetic wave sensor chip (210), and the inertial sensor chip (220).
2. The multi-chip product package structure of claim 1, wherein, The electromagnetic wave sensor chip (210) is bonded to the substrate (300) by an insulating adhesive film (500).
3. The multi-chip product package structure of claim 1, wherein, The inertial sensor chip (220) is bonded to the substrate (300) by an insulating adhesive film (500).
4. The multi-chip product package structure of claim 1, wherein, The ASIC chip (100) is bonded to the inertial sensor chip (220) by a non-conductive die bond film (600).
5. The multi-chip product package structure of claim 1, wherein, One of the pads on the ASIC chip (100) is connected to the pad on the inertial sensor chip (220) via a first lead (700).
6. The multi-chip product package structure of claim 5, wherein, Another pad on the ASIC chip (100) is connected to the substrate (300) via a second lead (800).
7. The multi-chip product package structure of claim 6, wherein, The first lead (700) and the second lead (800) are encapsulated and fixed within the encapsulation (400).
8. The multi-chip product package structure of claim 1, wherein, The solder pads on the electromagnetic wave sensor chip (210) are connected to the substrate (300) via a third lead (900).
9. The multi-chip product package structure of claim 8, wherein, The third lead (900) is encapsulated and fixed within the encapsulation (400).
10. An electrically controlled device, characterized by The electrical control device is equipped with the multi-chip product packaging structure as described in any one of claims 1 to 9.