A leaded EMB sensor
By connecting the metal PAD to the conductive component with leads, the processing technology of EMB sensors is simplified, the problem of low yield is solved, and efficient production and low-cost manufacturing are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANJING YUANGAN MICROELECTRONICS CO LTD
- Filing Date
- 2025-07-04
- Publication Date
- 2026-07-03
AI Technical Summary
The low yield of existing EMB sensors is mainly due to the high micron-level alignment requirements between the chip metal PAD and the conductive components, which makes production difficult and costly, and also poses a risk of short circuits or poor soldering defects.
By using leads to electrically connect the metal PAD to the first conductive element, the processing technology is simplified, the ease of operation is improved, and the process requirements for chip structure and size are reduced.
It improves the yield of EMB sensors, reduces production costs, extends service life, and increases detection accuracy, making it suitable for installation in confined spaces.
Smart Images
Figure CN224456045U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of EMB sensor technology, and in particular to an EMB sensor with leads. Background Technology
[0002] Currently, force-sensitive chips in EMB sensors are generally connected using flip-chip bonding. While this method enables high-density connections, it presents several challenges during manufacturing: First, it requires micron-level alignment between the chip's metal pads and conductive components, demanding extremely high chip dicing precision. Second, even a slight inconsistency in the height of the metal pads can lead to short circuits or poor soldering. Finally, the limited installation space further complicates production. Once a soldering fault is detected, the entire sensor typically needs to be scrapped, resulting in a low yield rate and severely hindering industrialization. Although improvements such as precision alignment platforms and double-layer alignment marks can increase yield, the high equipment investment costs and limited returns still fail to meet the demands of large-scale EMB sensor manufacturing. Utility Model Content
[0003] Based on the above, the purpose of this utility model is to provide an EMB sensor with leads, which electrically connects the metal PAD to the first conductive element through leads, which is easy to implement and improves the yield of EMB sensors.
[0004] To achieve the above objectives, the present invention adopts the following technical solution:
[0005] An EMB sensor with leads, comprising:
[0006] The base has mounting holes and hydraulic grooves.
[0007] A sealing membrane is fixed on the base and forms a hydraulic cavity with the hydraulic groove, the hydraulic cavity being filled with hydraulic medium;
[0008] The cover plate is fixed to the sealing film;
[0009] The mounting component is fixed in the mounting hole and has a mounting groove thereon, the mounting groove being in communication with the hydraulic chamber;
[0010] A force-sensitive chip is disposed in the mounting groove and is used to detect the pressure of the hydraulic medium in the mounting groove;
[0011] A first conductive element is disposed through the mounting element and one end of it extends into the mounting groove;
[0012] One end of the lead is connected to the metal PAD of the force-sensitive chip, and the other end is connected to the first conductive element.
[0013] As a preferred embodiment of a leaded EMB sensor, the leaded EMB sensor further includes a protective plate fixed to the top of the mounting component. The protective plate has a plurality of connecting holes, each of which connects the hydraulic chamber and the mounting groove.
[0014] As a preferred embodiment of an EMB sensor with leads, the protective plate is a ceramic plate, and the plurality of connecting holes on the ceramic plate are arranged in rows and columns.
[0015] As a preferred embodiment of an EMB sensor with leads, the force-sensitive chip has a plurality of metal PADs and a plurality of first conductive elements, with each of the plurality of metal PADs corresponding to one of the plurality of first conductive elements.
[0016] As a preferred embodiment of an EMB sensor with leads, the base includes a pressure seat and an annular seat disposed outside the pressure seat. The lower end face of the annular seat is provided with a placement groove. The EMB sensor with leads also includes a PCB and a second conductive component. The PCB is fixed in the placement groove, one end of the second conductive component is connected to the PCB, and the other end extends out of the annular seat.
[0017] As a preferred embodiment of an EMB sensor with leads, the lower end face of the base is provided with a countersunk hole, and the EMB sensor with leads also includes a protective cover, which is fixed in the countersunk hole and covers the placement groove, with the lower end face of the protective cover being higher than the lower end face of the base.
[0018] As a preferred embodiment of an EMB sensor with leads, the pressure seat is an annular seat, the sealing diaphragm is an annular diaphragm, and the annular diaphragm is fixed to the upper end face of the annular seat.
[0019] As a preferred embodiment of an EMB sensor with leads, the hydraulic chamber is an annular cavity, the cover plate is an annular plate, the inner diameter of the annular plate is larger than the inner diameter of the annular cavity, and the outer diameter of the annular plate is smaller than the outer diameter of the annular cavity.
[0020] The beneficial effects of this utility model are as follows:
[0021] The EMB sensor with leads disclosed in this utility model transmits the braking force sequentially through the cover plate and sealing membrane to the liquid in the hydraulic chamber when the cover plate or base is subjected to braking force. This force then acts on the force-sensitive chip in the mounting groove, thereby detecting the braking force. This utility model uses leads to electrically connect the metal PAD to the first conductive element, which not only simplifies the processing technology, improves the convenience of operation, and increases the production yield, but also significantly reduces the process requirements for the structure and size of the force-sensitive chip, thus reducing production costs. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0023] Figure 1 This is a cross-sectional view of the leaded EMB sensor provided in a specific embodiment of this utility model;
[0024] Figure 2 yes Figure 1 A magnified view of a portion at point A;
[0025] Figure 3 This is a schematic diagram of a leaded EMB sensor provided in a specific embodiment of this utility model.
[0026] In the picture:
[0027] 1. Base; 101. Hydraulic chamber; 102. Countersunk hole; 103. Placement groove; 104. Injection hole; 11. Pressure bearing seat; 12. Annular seat;
[0028] 21. Sealing membrane; 22. Sealing element;
[0029] 3. Cover plate;
[0030] 41. Mounting component; 410. Mounting slot; 42. Force-sensitive chip; 421. Metal PAD;
[0031] 51. First conductive element; 52. Second conductive element;
[0032] 6. Lead wire;
[0033] 7. Protective plate; 70. Connecting hole;
[0034] 8. PCB;
[0035] 9. Protective cover. Detailed Implementation
[0036] To make the technical problems solved by this utility model, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0037] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.
[0038] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; or internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0039] This embodiment provides an EMB sensor with leads, such as Figures 1 to 3 As shown, the device includes a base 1, a sealing membrane 21, a cover plate 3, a mounting component 41, a force-sensitive chip 42, a first conductive component 51, and a lead wire 6. The base 1 has a mounting hole (not shown) and a hydraulic groove (not shown). The sealing membrane 21 is fixed on the base 1 and forms a hydraulic cavity 101 with the hydraulic groove. The hydraulic cavity 101 is filled with hydraulic medium. The cover plate 3 is fixed on the sealing membrane 21. The mounting component 41 is fixed in the mounting hole and has a mounting groove 410 on it. The mounting groove 410 communicates with the hydraulic cavity 101. The force-sensitive chip 42 is disposed in the mounting groove 410 and is used to detect the pressure of the hydraulic medium in the mounting groove 410. The first conductive component 51 is disposed through the mounting component 41 and one end of it extends into the mounting groove 410. One end of the lead wire 6 is connected to the metal PAD 421 of the force-sensitive chip 42, and the other end is connected to the first conductive component 51 to realize the electrical connection between the metal PAD 421 and the first conductive component 51.
[0040] The EMB sensor with leads provided in this embodiment transmits the braking force sequentially through the cover plate 3 and the sealing membrane 21 to the liquid in the hydraulic chamber 101 when the cover plate 3 or the base 1 is subjected to braking force. This force then acts on the force-sensitive chip 42 in the mounting groove 410, thereby detecting the braking force. In this embodiment, the metal PAD is electrically connected to the first conductive element 51 by the lead wire 6. This not only simplifies the processing technology, improves the convenience of operation, and increases the yield rate, but also significantly reduces the process requirements for the structure and size of the force-sensitive chip 42, thereby reducing production costs.
[0041] This embodiment of the leaded EMB sensor also includes a protective plate 7 fixed to the top of the mounting component 41, such as... Figure 1 and Figure 2 As shown, the protective plate 7 has several connecting holes 70, each connecting hole 70 connecting the hydraulic chamber 101 and the mounting groove 410. The protective plate 7, acting as a physical barrier, effectively prevents the top sealing membrane 21 from contacting the lead wire 6, completely avoiding the risk of electrical short circuits caused by contact between the sealing membrane 21 and the lead wire 6, extending the service life of the EMB sensor, and improving the detection accuracy of the force-sensitive chip 42. The connecting holes 70 on the protective plate 7 ensure the effective transmission of the hydraulic medium's pressure without affecting the isolation function of the protective plate 7. Specifically, in this embodiment, the protective plate 7 is a ceramic plate, which is bonded to the mounting component 41, and the several connecting holes 70 on the ceramic plate are arranged in rows and columns. It should be noted that in other embodiments of this utility model, the material of the protective plate 7 is not limited to ceramic in this embodiment; it can also be plastic or other insulating materials, selected according to actual needs, and is not limited here.
[0042] In this embodiment, the force-sensitive chip 42 has four metal PADs 421, four first conductive elements 51, and four leads 6. The four metal PADs 421, four first conductive elements 51, and four leads 6 are arranged in a one-to-one correspondence. It should be noted that in other embodiments of this invention, the number of metal PADs 421, first conductive elements 51, and leads 6 are the same and correspond one-to-one; the specific number is set according to actual needs.
[0043] like Figure 1 and Figure 3 As shown, the base 1 in this embodiment includes a pressure-bearing seat 11 and an annular seat 12 disposed outside the pressure-bearing seat 11. The upper end surface of the pressure-bearing seat 11 is higher than the upper end surface of the annular seat 12, and the lower end surface of the pressure-bearing seat 11 is flush with the lower end surface of the annular seat 12. The lower end surface of the annular seat 12 is provided with a placement groove 103. The EMB sensor with leads also includes a PCB 8 and a second conductive element 52. The PCB 8 is fixed in the placement groove 103, one end of the second conductive element 52 is connected to the PCB 8, and the other end of the second conductive element 52 extends out of the annular seat 12.
[0044] In this embodiment, the pressure-bearing base 11 and cover plate 3 form the main pressure-sensing structure. Compared with existing structures, this increases the pressure-bearing contact area, suppresses the bending deformation of the EMB sensor, and improves the reliability of the EMB sensor. The PCB 8 is placed in the placement groove 103 on the lower end face of the annular base 12, and the second conductive element 52 is led out from the bottom of the annular base 12 of the EMB sensor. Compared with the traditional top lead 6 method, this solves the installation interference problem in the narrow braking space, is suitable for braking systems with limited top mounting space, and significantly reduces the assembly difficulty. In addition, by mounting the PCB 8 on the annular base 12, the overall thickness and weight of the EMB sensor are reduced, providing greater flexibility for the layout of the braking system.
[0045] like Figure 1 and Figure 3 As shown, the lower end face of the base 1 has a countersunk hole 102. The EMB sensor with leads also includes a protective cover 9, which is fixed inside the countersunk hole 102 and covers the placement groove 103. The lower end face of the protective cover 9 is higher than the lower end face of the base 1 to prevent deformation of the protective cover 9 under stress. In addition, the side of the PCB 8 is spaced apart from the side wall of the placement groove 103. This structure not only facilitates the assembly of the PCB 8 in the placement groove 103, reducing assembly requirements and production costs, but also accommodates thermal deformation displacement, preventing the PCB 8 from warping or cracking due to thermal expansion, and extending the service life of the PCB 8.
[0046] like Figure 1 and Figure 3 As shown, the base 1 has two injection holes 104. One end of each injection hole 104 is connected to the hydraulic chamber 101, and the other end is equipped with a seal 22. The hydraulic medium in the hydraulic chamber 101 is silicone oil. It should be noted that in other embodiments of this invention, the number of injection holes 104 on the base 1 can be one, and the specific number of injection holes 104 is set according to actual needs. In other embodiments, the injection holes 104 can also be completely sealed by welding using welding columns. The hydraulic medium can also be water or other liquid media, selected according to actual needs.
[0047] In this embodiment, the mounting component is a mounting column, the pressure seat 11 is an annular seat 12, and the sealing membrane 21 is an annular diaphragm fixed to the upper end face of the annular seat 12. The hydraulic chamber 101 is an annular cavity, and the cover plate 3 is an annular plate. The inner diameter of the annular plate is larger than the inner diameter of the annular cavity, and the outer diameter of the annular plate is smaller than the outer diameter of the annular cavity. When the cover plate 3 or the pressure seat 11 is subjected to braking force, the sealing membrane 21 will deform, ensuring that the cover plate 3 moves downward with the sealing membrane 21. It should be noted that in other embodiments of this utility model, the pressure seat 11 can also be a cylindrical pressure seat, the hydraulic chamber 101 can be a cylindrical cavity, the sealing membrane 21 can be a circular membrane, and the cover plate 3 can be a circular plate, depending on actual needs.
[0048] In this embodiment, the base 1 is a metal base, the pressure-bearing base 11 and the annular base 12 are integrally formed into a metal base, and the sealing membrane 21 is a metal sheet, which is welded or bonded to the metal base. The protective cover 9 is a metal cover, which is a metal plate welded or bonded to the base 1.
[0049] It should be noted that the force-sensitive chip 42 in this embodiment belongs to the prior art. The force-sensitive chip 42 includes a silicon substrate and a borosilicate glass force-receiving block covered on the silicon substrate. Since the thermal expansion coefficients of the silicon substrate and the borosilicate glass force-receiving block are similar, the force-sensitive chip 42 minimizes the change in thermal expansion coefficient caused by temperature rise, improves the operating temperature of the EMB sensor, and enables accurate pressure measurement at high temperatures.
[0050] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.
Claims
1. A leaded EMB sensor characterized by, include: The base has mounting holes and hydraulic grooves. A sealing membrane is fixed on the base and forms a hydraulic cavity with the hydraulic groove, the hydraulic cavity being filled with hydraulic medium; The cover plate is fixed to the sealing film; The mounting component is fixed in the mounting hole and has a mounting groove thereon, the mounting groove being in communication with the hydraulic chamber; A force-sensitive chip is disposed in the mounting groove and is used to detect the pressure of the hydraulic medium in the mounting groove; A first conductive element is disposed through the mounting element and one end of it extends into the mounting groove; One end of the lead is connected to the metal PAD of the force-sensitive chip, and the other end is connected to the first conductive element.
2. The leaded EMB sensor of claim 1, wherein, The leaded EMB sensor also includes a protective plate fixed to the top of the mounting component. The protective plate has several connecting holes, each of which connects to the hydraulic chamber and the mounting groove.
3. The leaded EMB sensor of claim 2, wherein, The protective plate is a ceramic plate, and the plurality of the connecting holes on the ceramic plate are arranged in rows and columns.
4. The leaded EMB sensor of claim 1, wherein, The force-sensitive chip has a number of metal PADs and a number of first conductive elements, with each metal PAD corresponding to one of the first conductive elements.
5. The leaded EMB sensor of claim 1, wherein, The base includes a pressure-bearing seat and an annular seat disposed on the outside of the pressure-bearing seat. The lower end face of the annular seat is provided with a placement groove. The EMB sensor with leads also includes a PCB and a second conductive component. The PCB is fixed in the placement groove. One end of the second conductive component is connected to the PCB, and the other end extends out of the annular seat.
6. The leaded EMB sensor of claim 5, wherein, The lower end face of the base is provided with a countersunk hole. The EMB sensor with leads also includes a protective cover. The protective cover is fixed in the countersunk hole and covers the placement groove. The lower end face of the protective cover is higher than the lower end face of the base.
7. The leaded EMB sensor of claim 5, wherein, The pressure-bearing seat is an annular seat, and the sealing membrane is an annular diaphragm, which is fixed to the upper end face of the annular seat.
8. The leaded EMB sensor according to claim 1, characterized in that, The hydraulic chamber is an annular cavity, and the cover plate is an annular plate. The inner diameter of the annular plate is larger than the inner diameter of the annular cavity, and the outer diameter of the annular plate is smaller than the outer diameter of the annular cavity.