A chip package testing apparatus

CN224456421UActive Publication Date: 2026-07-03SHENZHEN PAISIDI POWER SEMICON CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN PAISIDI POWER SEMICON CO LTD
Filing Date
2025-04-17
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Existing chip packaging testing equipment requires constant replacement of fixed positions when testing different locations on the packaged chip, which causes the packaged chip to shift and results in low testing efficiency.

Method used

The system employs lateral and longitudinal movement components in conjunction with pressure drive components to achieve position adjustment and pressure testing of the packaged chip, and uses pressure sensors to detect the pressure tolerance of the packaged chip.

Benefits of technology

It enables efficient and accurate testing of packaged chips, reduces testing errors, and improves testing efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model relates to the field of chip testing technology and discloses a chip packaging testing device, including a working support platform. A bottom support plate is fixedly connected to the inner bottom of the working support platform. A correction testing component is provided on the top surface of the bottom support plate. A lateral moving component is provided on the inner top of the working support platform. A longitudinal moving component is provided on the top surface of the lateral moving component. A pressure driving component is provided at the bottom of the longitudinal moving component. This utility model, through the action of the lateral moving component and the longitudinal moving component, allows the pressure driving component to be adjusted in position according to actual needs, thereby testing the packaged chip. At the same time, the pressure sensor at the bottom detects the pressure resistance of the packaged chip, thereby completing the testing of the packaged chip.
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Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, specifically a chip packaging testing device. Background Technology

[0002] The housing used to mount semiconductor integrated circuit chips serves to place, fix, seal, and protect the chips, as well as enhance their electrothermal performance. It also acts as a bridge between the internal world of the chip and the external circuitry—the contacts on the chip are connected to the pins of the package housing by wires, and these pins are then connected to other devices through wires on the printed circuit board.

[0003] Current chip packaging and testing equipment includes a main body with grooves around its top. Each groove houses a support base. A first electric push rod moves a fixed box downwards, causing a pressing seat at the bottom of the fixed box to move downwards simultaneously, applying pressure to the chip board. Simultaneously, a motor drives a first gear, which in turn drives a second gear, to rotate a threaded rod. This causes a movable plate, driven by a threaded sleeve, to move towards the center, limiting the chip board's position and ensuring it aligns with the support base. The pressing seat also applies pressure to the chip board, ensuring it fits tightly against the top of the support base. The device facilitates testing of the chip packaging, and the pressure sensor can provide feedback on the pressure value of each chip board. The second electric push rod is then used to pressurize the extrusion seat, ensuring that the pressure value of each chip board is consistent with the others. However, when testing packaged chips, it is necessary to test different positions of the chip during the test. Existing equipment can only continuously change the position of the packaged chip, but when testing after moving the packaged chip, the packaged chip will shift, which will reduce the error during the test and lead to low testing efficiency. Improvement is needed. Therefore, we propose a chip packaging testing device. Utility Model Content

[0004] Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a chip packaging and testing device that solves the aforementioned problems.

[0006] (II) Technical Solution

[0007] To achieve the above-mentioned objectives, this utility model provides the following technical solution:

[0008] A chip packaging test device includes a working support platform, a bottom support plate fixedly connected to the inner bottom of the working support platform, a correction test component disposed on the top surface of the bottom support plate, a lateral movement component disposed on the inner top of the working support platform, a longitudinal movement component disposed on the top surface of the lateral movement component, and a pressure drive component disposed at the bottom of the longitudinal movement component.

[0009] Preferably, the working support platform has a test installation slot inside, a motor fixing platform is provided on the rear side of the top surface inside the working support platform, a transverse rotation hole is provided on the right side of the top surface inside the working support platform, and a longitudinal sliding groove is provided on the top surface inside the working support platform.

[0010] Preferably, the correction test assembly includes a correction clamping cylinder, a correction clamping push rod, a bottom support plate, a pressure sensor, and a correction clamping slide plate. The bottom support plate is fixedly connected to the bottom of the test mounting slot. Cylinder fixing bosses are fixedly connected to both sides of the top surface of the bottom support plate. A pressure sensor is fixedly connected to the center of the top surface of the bottom support plate. A correction clamping cylinder is fixedly connected to the top surface of the cylinder fixing boss. A correction clamping push rod is slidably connected to the left side of the correction clamping cylinder. A correction clamping slide plate is fixedly connected to the left side of the correction clamping push rod. A correction clamping slide plate is slidably connected to the top surface of the cylinder fixing boss.

[0011] Preferably, the lateral movement assembly includes a lateral drive slide plate, a lateral drive motor, and a lateral drive screw. The lateral drive motor is fixedly connected to the top surface of the motor mounting platform, and the lateral drive screw is fixedly connected to the output shaft of the lateral drive motor. The lateral drive screw is rotatably connected to the inner side of the lateral rotation hole. The lateral drive slide plate is slidably connected to the top surface of the longitudinal slide groove. A second longitudinal threaded hole is provided on the top right side of the lateral drive slide plate. A longitudinal sliding groove penetrating the bottom surface is provided in the middle of the top surface of the lateral drive slide plate. A longitudinal rotation hole is provided on the top of the lateral drive slide plate. The lateral drive screw is threadedly connected to the inner side of the second longitudinal threaded hole.

[0012] Preferably, the longitudinal movement assembly includes a longitudinal drive motor, a longitudinal drive screw, and a longitudinal drive slider. The longitudinal drive motor is fixedly connected to the top left side of the transverse drive slide plate. The output shaft of the longitudinal drive motor is fixedly connected to the longitudinal drive screw. The longitudinal drive screw is rotatably connected to the inner side of the longitudinal rotation hole. The longitudinal drive slider is slidably connected to the inner side of the longitudinal sliding groove. A longitudinal threaded hole penetrating the left side is opened on the right side of the longitudinal drive slider. The longitudinal drive screw is threadedly connected to the inner side of the longitudinal threaded hole.

[0013] Preferably, the pressure driving assembly includes a pressure testing head, a pressure driving hydraulic rod, and a hydraulic driving cylinder. The bottom surface of the longitudinal driving slider is fixedly connected to the hydraulic driving cylinder, the bottom surface of the hydraulic driving cylinder is slidably connected to the pressure driving hydraulic rod, and the bottom surface of the pressure driving hydraulic rod is fixedly connected to the pressure testing head.

[0014] (III) Beneficial Effects

[0015] Compared with the prior art, the advantages of this utility model are:

[0016] This invention utilizes the functions of a lateral movement component and a longitudinal movement component to allow the pressure drive component to be positioned according to actual needs, thereby enabling the testing of the packaged chip. Simultaneously, a pressure sensor at the bottom detects the pressure resistance of the packaged chip, thus completing the testing of the packaged chip. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram showing the overall structure of this utility model disassembled;

[0019] Figure 3 This is a cross-sectional view of the overall structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the working support platform in part of the structure of this utility model.

[0021] In the diagram: 1. Working support platform; 2. Correction clamping cylinder; 3. Correction clamping push rod; 4. Bottom support plate; 5. Pressure sensor; 6. Correction clamping slide plate; 7. Pressure test head; 8. Pressure-driven hydraulic rod; 9. Hydraulic drive cylinder; 10. Lateral drive slide plate; 11. Longitudinal drive motor; 12. Longitudinal drive screw; 13. Longitudinal drive slider; 14. Lateral drive motor; 15. Lateral drive screw; 16. Cylinder fixing boss; 17. Longitudinal rotation hole; 18. Longitudinal threaded hole one; 19. Longitudinal sliding groove; 20. Motor fixing platform; 21. Lateral rotation hole; 22. Longitudinal sliding groove; 23. Longitudinal threaded hole two; 24. Test mounting slot. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a technical solution;

[0024] A chip packaging test device includes a working support platform 1, a bottom support plate 4 fixedly connected to the inner bottom of the working support platform 1, a correction test component disposed on the top surface of the bottom support plate 4, a lateral movement component disposed on the top inner side of the working support platform 1, a longitudinal movement component disposed on the top surface of the lateral movement component, and a pressure drive component disposed at the bottom of the longitudinal movement component.

[0025] Furthermore, the work support platform 1 has a test installation slot 24 inside, a motor fixing platform 20 is provided on the rear side of the top surface inside the work support platform 1, a transverse rotation hole 21 is provided on the right side of the top surface inside the work support platform 1, and a longitudinal sliding groove 22 is provided on the top surface inside the work support platform 1.

[0026] Furthermore, the correction test assembly includes a correction clamping cylinder 2, a correction clamping push rod 3, a bottom support plate 4, a pressure sensor 5, and a correction clamping slide plate 6. The bottom support plate 4 is fixedly connected to the bottom of the test mounting slot 24. Cylinder fixing bosses 16 are fixedly connected to both sides of the top surface of the bottom support plate 4. The pressure sensor 5 is fixedly connected to the center of the top surface of the bottom support plate 4. The correction clamping cylinder 2 is fixedly connected to the top surface of the cylinder fixing boss 16. The correction clamping push rod 3 is slidably connected to the left side of the correction clamping cylinder 2. The correction clamping slide plate 6 is fixedly connected to the left side of the correction clamping push rod 3. The correction clamping slide plate 6 is slidably connected to the top surface of the cylinder fixing boss 16. Through the function of the correction test assembly, the chip is clamped and corrected from both sides to ensure that the chip is in the correct position before testing.

[0027] Furthermore, the lateral movement component includes a lateral drive slide plate 10, a lateral drive motor 14, and a lateral drive screw 15. The lateral drive motor 14 is fixedly connected to the top surface of the motor mounting platform 20, and the lateral drive screw 15 is fixedly connected to the output shaft of the lateral drive motor 14. The lateral drive screw 15 is rotatably connected to the inner side of the lateral rotation hole 21. The lateral drive slide plate 10 is slidably connected to the top surface of the longitudinal slide groove 22. A longitudinal threaded hole 23 is provided on the top right side of the lateral drive slide plate 10. A longitudinal sliding groove 19 penetrating the bottom surface is provided in the middle of the top surface of the lateral drive slide plate 10. A longitudinal rotation hole 17 is provided on the top of the lateral drive slide plate 10. The lateral drive screw 15 is threadedly connected to the inner side of the longitudinal threaded hole 23. Through the action of the lateral movement component, the lateral position of the pressure drive component can be adjusted.

[0028] Furthermore, the longitudinal movement component includes a longitudinal drive motor 11, a longitudinal drive screw 12, and a longitudinal drive slider 13. The longitudinal drive motor 11 is fixedly connected to the top left side of the transverse drive slide plate 10. The output shaft of the longitudinal drive motor 11 is fixedly connected to the longitudinal drive screw 12. The longitudinal drive screw 12 is rotatably connected to the inner side of the longitudinal rotation hole 17. The longitudinal drive slider 13 is slidably connected to the inner side of the longitudinal sliding groove 19. A longitudinal threaded hole 18 penetrating the left side is opened on the right side of the longitudinal drive slider 13. The longitudinal drive screw 12 is threadedly connected to the inner side of the longitudinal threaded hole 18. Through the action of the longitudinal movement component, the longitudinal position of the pressure drive component can be adjusted.

[0029] Furthermore, the pressure driving assembly includes a pressure test head 7, a pressure driving hydraulic rod 8, and a hydraulic driving cylinder 9. The bottom surface of the longitudinal driving slider 13 is fixedly connected to the hydraulic driving cylinder 9, and the pressure driving hydraulic rod 8 is slidably connected inside the bottom surface of the hydraulic driving cylinder 9. The bottom surface of the pressure driving hydraulic rod 8 is fixedly connected to the pressure test head 7. Through the action of the pressure driving assembly, pressure is applied to the packaged chip to complete the pressure test.

[0030] Working principle: When this utility model is needed, the packaged chip to be tested is placed on the top surface of the pressure sensor 5. At the same time, the correction clamping cylinder 2 on the top surface of the cylinder fixing boss 16 is activated, pushing the correction clamping push rod 3 to move, causing the correction clamping slide plate 6 to slide on the top surface of the cylinder fixing boss 16, thereby clamping and correcting the chip from both sides to ensure that the chip is in the correct position before testing. When it is necessary to move the pressure test position laterally, the lateral drive motor 14 is activated to drive the lateral drive screw 15 to rotate. Through the threaded engagement between the lateral drive screw 15 and the longitudinal threaded hole 23, the lateral drive screw 15 is rotated, thereby driving the lateral drive screw 15 to rotate. The drive slide plate 10 begins to move laterally on the top surface of the longitudinal slide groove 22 to reach the lateral position to be tested. At the same time, the longitudinal drive motor 11 is started to drive the longitudinal drive screw 12 to rotate. Through the threaded engagement between the longitudinal drive screw 12 and the longitudinal threaded hole 18, the longitudinal drive slider 13 is driven to slide inside the longitudinal slide groove 19, thereby moving the longitudinal drive slider 13 longitudinally to the longitudinal position to be tested. At the same time, the hydraulic drive cylinder 9 is started to drive the pressure drive hydraulic rod 8 to drive the pressure test head 7 to perform pressure testing on the surface of the packaged chip, thereby completing the test of the packaged chip.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip packaging and testing device, comprising a work support platform (1), characterized in that: The bottom inner side of the working support platform (1) is fixedly connected to a bottom support plate (4). A correction test component is provided on the top surface of the bottom support plate (4). A transverse moving component is provided on the inner top of the working support platform (1). A test mounting slot (24) is provided inside the working support platform (1). A motor fixing platform (20) is provided on the rear side of the top inner surface of the working support platform (1). A transverse rotating hole (21) is provided on the right side of the top inner surface of the working support platform (1). A longitudinal sliding groove (22) is provided on the top inner surface of the working support platform (1). The lateral movement assembly includes a lateral drive slide plate (10), a lateral drive motor (14), and a lateral drive screw (15). The lateral drive motor (14) is fixedly connected to the top surface of the motor mounting platform (20). The output shaft of the lateral drive motor (14) is fixedly connected to the lateral drive screw (15). The lateral drive screw (15) is rotatably connected to the inner side of the lateral rotation hole (21). The lateral drive slide plate (10) is slidably connected to the top surface of the longitudinal slide groove (22). A longitudinal slide plate (10) is opened on the top right side of the lateral drive slide plate (10). The transverse drive slide plate (10) has a longitudinal sliding groove (19) that penetrates the bottom surface in the middle of the top surface of the threaded hole (23). The transverse drive slide plate (10) has a longitudinal rotating hole (17) in the top. The transverse drive screw (15) is threaded to the inner side of the longitudinal threaded hole (23). The transverse moving assembly has a longitudinal moving assembly on the top surface. The longitudinal moving assembly includes a longitudinal drive motor (11), a longitudinal drive screw (12), and a longitudinal drive slider (13). The transverse drive slide plate (10) is fixedly connected to the top left side. There is a longitudinal drive motor (11), the output shaft of the longitudinal drive motor (11) is fixedly connected to a longitudinal drive screw (12), the longitudinal drive screw (12) is rotatably connected to the inner side of the longitudinal rotation hole (17), the longitudinal drive slider (13) is slidably connected to the inner side of the longitudinal sliding groove (19), the right side of the longitudinal drive slider (13) is provided with a longitudinal threaded hole (18) that passes through the left side, the inner side of the longitudinal threaded hole (18) is threadedly connected to the longitudinal drive screw (12), and a pressure drive component is provided at the bottom of the longitudinal moving component.

2. The chip package testing apparatus of claim 1, wherein: The correction test assembly includes a correction clamping cylinder (2), a correction clamping push rod (3), a bottom support plate (4), a pressure sensor (5), and a correction clamping slide plate (6). The bottom of the test mounting slot (24) is fixedly connected to the bottom support plate (4). The top surfaces of the bottom support plate (4) are fixedly connected to both sides of the cylinder fixing boss (16). The pressure sensor (5) is fixedly connected to the middle of the top surface of the bottom support plate (4). The top surface of the cylinder fixing boss (16) is fixedly connected to the correction clamping cylinder (2). The correction clamping push rod (3) is slidably connected to the left side of the correction clamping cylinder (2). The left side of the correction clamping push rod (3) is fixedly connected to the correction clamping slide plate (6). The top surface of the cylinder fixing boss (16) is slidably connected to the correction clamping slide plate (6).

3. The chip package testing apparatus of claim 1, wherein: The pressure drive assembly includes a pressure test head (7), a pressure drive hydraulic rod (8), and a hydraulic drive cylinder (9). The bottom surface of the longitudinal drive slider (13) is fixedly connected to the hydraulic drive cylinder (9). The bottom surface of the hydraulic drive cylinder (9) is slidably connected to the pressure drive hydraulic rod (8). The bottom surface of the pressure drive hydraulic rod (8) is fixedly connected to the pressure test head (7).