Temperature testing device for IGBT module

Abstract

This utility model discloses a temperature testing device for IGBT modules, comprising: a base, a temperature regulating component, and a clamping component. The temperature regulating component is connected to the base. The clamping component includes a mounting base, clamping members, and at least two snap-fit ​​members. The mounting base has a mounting groove for accommodating the IGBT module relative to the temperature regulating component. The clamping members are connected to the IGBT module and detachably connected to the mounting base. At least two snap-fit ​​members are each connected to the mounting base and detachably connected to the base, allowing the mounting base to be detachably connected to the base and the temperature regulating component to abut against the IGBT module. This utility model effectively solves the problem in the prior art of lacking high and low temperature testing devices for temperature stability testing of IGBT modules.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, specifically to a temperature testing device for IGBT modules. Background Technology

[0002] IGBT (Insulated Gate Bipolar Transistor) is a composite fully controllable voltage-driven power semiconductor device composed of BJT (Bipolar Junction Transistor) and MOS (Insulated Gate Field Effect Transistor). IGBT modules combine the advantages of high input impedance of MOSFET and low on-state voltage drop of GTR, and are widely used in rail transportation, smart grids, aerospace, electric vehicles and other fields.

[0003] Currently, the main testing methods for IGBTs include static electrical characteristic testing, dynamic electrical characteristic testing, and reliability testing. Since IGBTs typically operate at high frequencies under high voltage and high temperature conditions, their temperature stability testing is crucial. A common method for conducting temperature stability testing on IGBTs is to place the IGBT module on a heating (or low temperature) platform and, once it reaches the target temperature, transfer it to the testing station for testing.

[0004] Because IGBTs have a wide range of applications and IGBT modules come in various packages, they require high temperature stability during testing. Traditional testing methods cannot guarantee that the modules will be maintained within a relatively stable temperature range during testing. Therefore, it is urgent to address the shortcomings of the aforementioned technologies. Utility Model Content

[0005] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose a temperature testing device for IGBT modules, thereby solving the technical problem of the lack of high and low temperature testing devices for temperature stability testing of IGBT modules in the prior art.

[0006] To achieve the above-mentioned technical objectives, the present invention adopts the following technical solution:

[0007] This utility model provides a temperature testing device for IGBT modules, comprising:

[0008] Base

[0009] Temperature control component, connected to the base; and

[0010] The clamping assembly includes a mounting base, a clamping member, and at least two snap-fit ​​members. The mounting base has a mounting slot for accommodating an IGBT module relative to the temperature control assembly. The clamping member is connected to the IGBT module and is detachably connected to the mounting base. At least two snap-fit ​​members are connected to the mounting base and can be detachably connected to the base, so that the mounting base can be detachably connected to the base and the temperature control assembly abuts against the IGBT module.

[0011] In some embodiments, the base has a slot, and the latching member includes a latching block. The latching block is disposed opposite to the slot and is movably connected to the mounting base. The latching block can engage with the slot.

[0012] In some embodiments, the slot has an inverted T-shaped cross-section and has a first segment and a second segment. The cross-sectional area of ​​the first segment is smaller than that of the second segment, and the first segment is positioned closer to the mounting base than the second segment. The cross-sectional area of ​​the snap-fit ​​block is equal to that of the first segment. The snap-fit ​​block can be inserted into the slot and rotate relative to the base to abut against the inner wall of the larger diameter segment of the slot, thereby restricting the snap-fit ​​block from sliding out along the smaller diameter segment.

[0013] In some embodiments, the mounting base has a rotating hole relative to the slot, and the snap-fit ​​component further includes a rotating shaft, a rotating block, and a first elastic part. The rotating shaft is inserted into the rotating hole and can rotate relative to the rotating hole. The snap-fit ​​block is connected to one end of the rotating shaft and can be inserted into the slot. The area of ​​the snap-fit ​​block is larger than the cross-sectional area of ​​the rotating shaft. The rotating block is connected to the other end of the rotating shaft, and the area of ​​the rotating block is larger than the cross-sectional area of ​​the rotating shaft. One end of the first elastic part abuts against the rotating block, and the other end abuts against the mounting base.

[0014] In some embodiments, the clamping member includes a first PCB board, a plurality of probes, and two elastic locking portions. The first PCB board has two through slots spaced apart from each other. The plurality of probes are disposed opposite to the mounting slots and are all connected to the first PCB board. The two elastic locking portions are disposed opposite to the two sides of the mounting base and are hinged to the mounting base. The elastic locking portions can engage with the through slots to allow the first PCB board to be detachably connected to the mounting base and to allow the plurality of probes to abut against the IGBT module.

[0015] In some embodiments, the elastic locking portion includes a locking block and a second elastic portion. The locking block is rotatably connected to the mounting base. One end of the locking block has a locking portion. The second elastic portion is connected to the mounting base and the other end of the locking block, and is used to drive the locking block to rotate relative to the mounting base and then automatically reset, so that the locking portion engages with the through groove.

[0016] In some embodiments, the mounting base is further provided with at least one guide groove, and the clamping member further includes at least one guide post, one end of which is disposed relative to the guide groove, and the other end is connected to the first PCB board.

[0017] In some embodiments, the clamping assembly further includes a second PCB board, a plurality of banana sockets and a plurality of banana plugs. The second PCB board has a through slot relative to the base and is fitted onto the base through the through slot. The plurality of banana sockets are evenly distributed on both sides of the base and are all connected to the second PCB board. The banana plugs are arranged in a one-to-one correspondence with the banana sockets and are connected to the first PCB board. The banana plugs can be inserted into the banana sockets and electrically connected to the banana sockets.

[0018] In some embodiments, the mounting groove extends through the mounting base and has a third segment and a fourth segment, the cross-sectional area of ​​the third segment being larger than that of the fourth segment, the third segment being disposed away from the base relative to the fourth segment, and the IGBT module being able to abut against the plurality of probes and the temperature control component.

[0019] In some embodiments, the temperature control assembly includes a heat sink substrate, a thermoelectric cooler, and a ceramic plate. The heat sink substrate is connected to a base and can abut against an IGBT module. The thermoelectric cooler has a fixed end and a temperature regulating end. The fixed end of the thermoelectric cooler is connected to the base. The ceramic plate is disposed between the heat sink substrate and the temperature regulating end of the thermoelectric cooler and abuts against both the heat sink substrate and the temperature regulating end of the thermoelectric cooler.

[0020] Compared with existing technologies, the beneficial effects of the temperature testing device for IGBT modules provided by this utility model include: a temperature regulating component is connected to a base; an IGBT module is connected to a mounting slot on the mounting base via a clamping component; at least two snap-fit ​​components are connected to the mounting base and can be detachably connected to the base, allowing the mounting base to be detachably connected to the base and ensuring that the IGBT module and the temperature regulating component are tightly abutted. Compared with existing technologies, by setting the temperature regulating component to abut against the IGBT module, temperature stability testing of the IGBT module under high or low temperature conditions can be performed. Simultaneously, the detachable structure formed by the base, mounting base, and at least two snap-fit ​​components enables rapid installation of the IGBT module and assembly of the testing device, making operation convenient and solving the technical problem of the lack of high and low temperature testing devices for temperature stability testing of IGBT modules in existing technologies. Attached Figure Description

[0021] Figure 1 This is a three-dimensional diagram of a temperature testing device for an IGBT module connected to an IGBT module, according to an embodiment of this utility model.

[0022] Figure 2 This is a cross-sectional view of a temperature testing device for an IGBT module connected to an IGBT module, according to an embodiment of this utility model.

[0023] Figure 3 This is a cross-sectional view from another perspective of a temperature testing device for an IGBT module connected to an IGBT module, according to an embodiment of this utility model.

[0024] Figure 4 This is a three-dimensional view of the connection between the base and the temperature control component provided in one embodiment of the present invention;

[0025] Figure 5 This is a three-dimensional view of the connection between the mounting base and the clamping assembly provided in one embodiment of the present invention;

[0026] Figure 6 This is a three-dimensional view of the connection between the mounting base and the clamping assembly provided in one embodiment of the present invention.

[0027] Explanation of reference numerals in the attached figures:

[0028] Base 100; Slot 110; Temperature control component 200; Heat sink substrate 210; Thermoelectric cooler 220; Ceramic plate 230; Heat dissipation fins 240; Cooling fan 250; Clamping component 300; Mounting base 310; Mounting slot 311; Clamping member 320; First PCB board 321; Through slot 3211; Probe 322; Elastic snap-fit ​​part 323; Locking block 3231; Second elastic part 3232; Guide post 324; Snap-fit ​​member 330;

[0029] Snap-fit ​​block 331; rotating shaft 332; rotating block 333; first elastic part 334; second PCB board 340; banana socket 350; banana plug 360; IGBT module 400. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0031] To address the technical problem of lacking a high and low temperature testing device for temperature stability testing of IGBT module 400, this utility model provides a temperature testing device for IGBT module. This device enables temperature stability testing of IGBT module 400 under high or low temperature conditions by setting a temperature regulating component 200 to abut against the IGBT module 400. Furthermore, the device utilizes a detachable structure composed of a base 100, mounting base 310, and at least two snap-fit ​​components 330, allowing for rapid installation of the IGBT module 400 and assembly of the testing device, making operation convenient.

[0032] Please see Figures 1 to 3 , Figures 1 to 3 This is a schematic diagram of the structure of a temperature testing device for an IGBT module in one embodiment of the present invention. The temperature testing device for the IGBT module 400 includes: a base 100, a temperature regulating component 200, and a clamping component 300. The temperature regulating component 200 is connected to the base 100. The clamping component 300 includes a mounting base 310, a clamping member 320, and at least two snap-fit ​​members 330. The mounting base 310 has a mounting groove 311 for accommodating the IGBT module 400 relative to the temperature regulating component 200. The clamping member 320 is connected to the IGBT module 400 and is detachably connected to the mounting base 310. At least two snap-fit ​​members 330 are connected to the mounting base 310 and can be detachably connected to the base 100, so that the mounting base 310 can be detachably connected to the base 100 and the temperature regulating component 200 abuts against the IGBT module 400.

[0033] Compared to existing technologies, this device enables temperature stability testing of the IGBT module 400 under high or low temperature conditions by setting the temperature control component 200 to abut against the IGBT module 400. At the same time, the base 100, mounting base 310 and at least two snap-fit ​​components 330 form a detachable structure, which enables rapid installation of the IGBT module 400 and assembly of the testing device. It is easy to operate and can solve the technical problem of lacking high and low temperature testing devices to perform temperature stability testing on the IGBT module 400 in existing technologies.

[0034] Furthermore, IGBT (Insulated Gate Bipolar Transistor) is a composite fully controllable voltage-driven power semiconductor device composed of BJT (Bipolar Junction Transistor) and MOS (Insulated Gate Field Effect Transistor). IGBT modules combine the advantages of high input impedance of MOSFET and low on-state voltage drop of GTR, and are widely used in rail transportation, smart grids, aerospace, electric vehicles and other fields.

[0035] Furthermore, in this device, the snap-fit ​​component 330 is snapped into the base 100.

[0036] In this embodiment, as Figure 2 , Figure 3 As shown, the temperature control assembly 200 includes a heat sink substrate 210, a thermoelectric cooler 220, and a ceramic plate 230. The heat sink substrate 210 is connected to the base 100 and can abut against the IGBT module 400. The thermoelectric cooler 220 has a fixed end and a temperature regulating end. The fixed end of the thermoelectric cooler 220 is connected to the base 100. The ceramic plate 230 is disposed between the heat sink substrate 210 and the temperature regulating end of the thermoelectric cooler 220 and abuts against both the heat sink substrate 210 and the temperature regulating end of the thermoelectric cooler 220.

[0037] By setting up the thermoelectric cooler 220 to adjust the temperature of the heat sink substrate 210, the heat sink substrate 210 can meet the testing requirements of the IGBT module 400 under high or low temperature conditions.

[0038] Furthermore, the ceramic plate 230 is disposed between the heat sink substrate 210 and the temperature regulation end of the thermoelectric cooler 220 to realize heat transfer. The heat sink substrate 210 is also provided with a temperature sensor, which can intelligently control the heating or cooling capacity of the thermoelectric cooler 220. Here, the heat sink substrate 210, the thermoelectric cooler 220 and the ceramic plate 230 are all conventional settings known to those skilled in the art, and will not be described in detail here.

[0039] Furthermore, in some embodiments, such as Figure 2 , Figure 3 As shown, the base 100 has a hollow structure, and the temperature control component 200 also includes multiple heat dissipation fins 240 and at least one cooling fan 250.

[0040] Multiple heat dissipation fins 240 are disposed within the base 100, and the multiple heat dissipation fins 240 are evenly disposed along the surface of the thermoelectric cooler 220 and are all connected to the thermoelectric cooler 220. At least one cooling fan 250 is connected within the base 100 to accelerate the heat dissipation of the surface of the heat dissipation fins 240. Here, the heat dissipation fins 240 and the cooling fan 250 are conventional arrangements known to those skilled in the art, and will not be described in detail here.

[0041] In this embodiment, as Figures 2 to 4 As shown, the base 100 has a slot 110, and the snap-fit ​​component 330 includes a snap-fit ​​block 331. The snap-fit ​​block 331 is disposed relative to the slot 110 and is movably connected to the mounting base 310. The snap-fit ​​block 331 can engage with the slot 110.

[0042] The engagement between the snap-fit ​​block 331 and the slot 110 enables a detachable connection between the mounting base 310 and the base 100.

[0043] In one embodiment, such as Figure 4 As shown, the cross-section of the slot 110 is an inverted T-shape, and has a first segment and a second segment. The cross-sectional area of ​​the first segment is smaller than that of the second segment, and the first segment is positioned closer to the mounting base 310 than the second segment. The cross-sectional area of ​​the snap-fit ​​block 331 is equal to that of the first segment. The snap-fit ​​block 331 can be inserted into the slot 110 and rotate relative to the base 100 to make the snap-fit ​​block 331 abut against the inner wall of the large-diameter section of the slot 110, so as to restrict the snap-fit ​​block 331 from sliding out along the small-diameter section.

[0044] The user first inserts the snap-fit ​​block 331 into the slot 110. After the snap-fit ​​block 331 passes through the first segment and is inserted into the second segment, the user rotates the snap-fit ​​block 331 relative to the base 100 at a certain angle, so that the snap-fit ​​block 331 can be snapped into the inner wall of the second segment of the slot 110, thereby realizing the detachable connection between the mounting block and the base 100.

[0045] Furthermore, the snap-fit ​​block 331 is strip-shaped, and the cross-sectional area of ​​the snap-fit ​​block 331 is less than or equal to the cross-sectional area of ​​the first segment of the slot 110, so that the snap-fit ​​block 331 can pass through the first segment of the slot 110. Here, after the user rotates the snap-fit ​​block 331 by 90°, the snap-fit ​​block 331 and the first segment of the slot 110 are set perpendicular to each other, which can improve the stability of the device snap-fit.

[0046] In one embodiment, please refer to Figure 5 , Figure 6 The mounting base 310 has a rotating hole relative to the slot 110. The snap-fit ​​component 330 also includes a rotating shaft 332, a rotating block 333, and a first elastic part 334. The rotating shaft 332 is inserted into the rotating hole and can rotate relative to the rotating hole. The snap-fit ​​block 331 is connected to one end of the rotating shaft 332 and can be inserted into the slot 110. The area of ​​the snap-fit ​​block 331 is larger than the cross-sectional area of ​​the rotating shaft 332. The rotating block 333 is connected to the other end of the rotating shaft 332. The area of ​​the rotating block 333 is larger than the cross-sectional area of ​​the rotating shaft 332. One end of the first elastic part 334 is connected to the rotating block 333, and the other end abuts against the mounting base 310.

[0047] The cooperation between the rotating hole and the rotating shaft 332 enables the sliding and rotating connection between the locking block 331 and the mounting base 310. The first elastic part 334 abuts against the rotating block 333 and the other end abuts against the mounting base 310, which can generate an elastic restoring force that automatically resets the locking block 331 after it slides, so that the locking block 331 is locked with the inner wall of the second segment of the slot 110.

[0048] Furthermore, the first elastic part 334 here is a spring, which is sleeved on the rotating shaft 332 and abuts against the rotating block 333 and the mounting base 310 respectively. The first elastic part 334 here can also be a spring sheet or an elastic block. This is a conventional setting known to those skilled in the art, and will not be described in detail here.

[0049] In one embodiment, please refer to Figure 2 , Figure 3 and Figure 6 The clamping member 320 includes a first PCB board 321, a plurality of probes 322 and two elastic snap-fit ​​parts 323. The first PCB board 321 has two through slots 3211 that are spaced apart from each other. The plurality of probes 322 are disposed opposite to the mounting slots 311 and are all connected to the first PCB board 321. The two elastic snap-fit ​​parts 323 are disposed opposite to the two sides of the mounting base 310 and are hinged to the mounting base 310. The elastic snap-fit ​​parts 323 can engage with the through slots 3211 to make the first PCB board 321 detachably connected to the mounting base 310 and to make the plurality of probes 322 abut against the IGBT module 400.

[0050] The IGBT module 400 is elastically clamped in the mounting groove 311 of the mounting base 310 by utilizing the elastic snap-fit ​​structure formed between the first PCB board 321, the elastic snap-fit ​​part 323 and the mounting base 310.

[0051] Furthermore, probe 322 is used to achieve electrical connection between external devices and IGBT module 400.

[0052] In one embodiment, please refer to Figure 2 , Figure 3 and Figure 5 The elastic locking part 323 includes a locking block 3231 and a second elastic part 3232. The locking block 3231 is rotatably connected to the mounting base 310. One end of the locking block 3231 has a locking part. The second elastic part 3232 is connected to the mounting base 310 and the other end of the locking block 3231. It is used to drive the locking block 3231 to rotate relative to the mounting base 310 and then automatically reset, so that the locking part engages with the through groove 3211.

[0053] The locking block 3231 is rotatably connected to the mounting base 310. Under the elastic restoring force generated by the second elastic part 3232, the locking part at one end of the locking block 3231 can engage with the through slot 3211 on the first PCB board 321, which makes it convenient for the user to install the IGBT module 400 into the mounting slot 311.

[0054] Furthermore, the second elastic part 3232 here is a spring, or it can be a spring sheet or an elastic block. This is a conventional setting known to those skilled in the art, and will not be described in detail here.

[0055] In one embodiment, please refer to Figure 5 The mounting base 310 also has at least one guide groove, and the clamping member 320 also includes at least one guide post 324, one end of the guide post 324 is disposed relative to the guide groove, and the other end is connected to the first PCB board 321.

[0056] The guide post 324 and the guide groove cooperate to play a guiding role and enable the probe 322 to form a stable electrical connection with the IGBT module 400.

[0057] Furthermore, there are multiple guide posts 324, which are evenly arranged along the circumference of the IGBT module 400.

[0058] In one embodiment, please refer to Figure 2 , Figure 3 The clamping assembly 300 also includes a second PCB board 340, a plurality of banana sockets 350 and a plurality of banana plugs 360. The second PCB board 340 has a through groove relative to the base 100 and is fitted onto the base 100 through the through groove. The plurality of banana sockets 350 are evenly distributed on both sides of the base 100 and are all connected to the second PCB board 340. The banana plugs 360 are arranged one-to-one with the banana sockets 350 and are connected to the first PCB board 321. The banana plugs 360 can be inserted into the banana sockets 350 and electrically connected to the banana sockets 350.

[0059] By utilizing the cooperation between the banana socket 350 and the banana plug 360, a stable connection structure is formed between the first PCB board 321 and the second PCB board 340, while also enabling electrical connection.

[0060] Furthermore, the banana socket 350 and banana plug 360 are common and readily available devices on the market, and are conventional settings known to those skilled in the art, so they will not be described in detail here.

[0061] In one embodiment, please refer to Figure 2 , Figure 5The mounting slot 311 penetrates the mounting base 310 and has a third segment and a fourth segment. The cross-sectional area of ​​the third segment is larger than that of the fourth segment. The third segment is positioned away from the base 100 relative to the fourth segment, and the IGBT module 400 can abut against multiple probes 322 and temperature control components 200.

[0062] The heat sink substrate 210 in the temperature control assembly 200 can be partially inserted into the mounting base 310, and the mounting groove 311 penetrates the mounting base 310 to achieve contact between the heat sink substrate 210 and the IGBT module 400, thereby achieving temperature regulation of the IGBT module 400.

[0063] To better understand this utility model, the following is combined with... Figures 1 to 6 The technical solution of this utility model is described in detail below:

[0064] The temperature control component 200 is connected to the base 100. An IGBT module 400 is connected to the mounting slot 311 on the mounting base 310 via a clamping member 320. At least two snap-fit ​​members 330 are connected to the mounting base 310 and can be detachably connected to the base 100, allowing the mounting base 310 to be detachably connected to the base 100 and enabling the temperature control component 200 to abut against the IGBT module 400. Compared to existing technologies, by setting the temperature control component 200 to abut against the IGBT module 400, temperature stability testing of the IGBT module 400 under high or low temperature conditions can be performed. Furthermore, the detachable structure formed by the base 100, mounting base 310, and at least two snap-fit ​​members 330 allows for rapid installation of the IGBT module 400 and assembly of the testing device, making operation convenient.

[0065] The specific workflow of this utility model is as follows: First, the user places the IGBT module 400 to be tested into the mounting slot 311, ensuring that the IGBT module 400 abuts against the bottom interior of the third segment. Next, the guide post 324 is positioned opposite the guide groove. The user manually moves the locking blocks 3231 on both sides, causing the locking part to engage with the through groove 3211. Here, the probe 322 is pressed against the IGBT module 400 to be tested. Then, the user uses the banana socket 350 and banana plug 360 to form an electrical connection between the second PCB board 340 and the first PCB board 321. Finally, the user rotates the locking mechanism... The connecting block 331 allows the connecting block 331 to slide into the slot 110. After the connecting block 331 passes through the first segment of the slot 110, the user rotates the rotating block 333 to rotate the connecting block 331 90° relative to the slot 110. Then, the connecting block 331 can abut against the inner wall of the second segment of the slot 110, thus completing the installation of the IGBT module 400 to be tested. At this time, the IGBT module 400 to be tested abuts against the heat sink substrate 210. The temperature regulation of the heat sink substrate 210 by the thermoelectric cooler 220 can meet the temperature stability test of the IGBT module 400 to be tested.

[0066] This application, through the above structure, can solve the technical problem in the prior art of lacking a high and low temperature testing device to perform temperature stability testing on the IGBT module 400.

[0067] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. A temperature testing device for an IGBT module, characterized by, include: Base Temperature control component, connected to the base; as well as The clamping assembly includes a mounting base, a clamping member, and at least two snap-fit ​​members. The mounting base has a mounting slot for accommodating an IGBT module relative to the temperature control assembly. The clamping member is connected to the IGBT module and is detachably connected to the mounting base. At least two snap-fit ​​members are connected to the mounting base and can be detachably connected to the base, so that the mounting base can be detachably connected to the base and the temperature control assembly abuts against the IGBT module.

2. The temperature testing device for an IGBT module according to claim 1, characterized by, The base has a slot, and the snap-fit ​​component includes a snap-fit ​​block. The snap-fit ​​block is disposed opposite to the slot and is movably connected to the mounting base. The snap-fit ​​block can engage with the slot.

3. The temperature testing device for an IGBT module according to claim 2, characterized by, The slot has an inverted T-shaped cross-section and has a first segment and a second segment. The cross-sectional area of ​​the first segment is smaller than that of the second segment, and the first segment is positioned closer to the mounting base than the second segment. The cross-sectional area of ​​the snap-fit ​​block is equal to that of the first segment. The snap-fit ​​block can be inserted into the slot and rotate relative to the base to abut against the inner wall of the larger diameter section of the slot, thereby preventing the snap-fit ​​block from sliding out along the smaller diameter section.

4. The temperature testing device for an IGBT module according to claim 3, characterized by The mounting base has a rotating hole relative to the slot. The snap-fit ​​component also includes a rotating shaft, a rotating block, and a first elastic part. The rotating shaft is inserted into the rotating hole and can rotate relative to the rotating hole. The snap-fit ​​block is connected to one end of the rotating shaft and can be inserted into the slot. The area of ​​the snap-fit ​​block is larger than the cross-sectional area of ​​the rotating shaft. The rotating block is connected to the other end of the rotating shaft. The area of ​​the rotating block is larger than the cross-sectional area of ​​the rotating shaft. One end of the first elastic part abuts against the rotating block, and the other end abuts against the mounting base.

5. The temperature testing device for an IGBT module according to claim 4, characterized by The clamping component includes a first PCB board, a plurality of probes, and two elastic locking parts. The first PCB board has two through slots spaced apart from each other. The plurality of probes are disposed opposite to the mounting slots and are all connected to the first PCB board. The two elastic locking parts are disposed opposite to the two sides of the mounting base and are hinged to the mounting base. The elastic locking parts can engage with the through slots to allow the first PCB board to be detachably connected to the mounting base and to allow the plurality of probes to abut against the IGBT module.

6. The temperature testing device for an IGBT module according to claim 5, characterized by The elastic locking part includes a locking block and a second elastic part. The locking block is rotatably connected to the mounting base. One end of the locking block has a locking part. The second elastic part is connected to the mounting base and the other end of the locking block. It is used to drive the locking block to rotate relative to the mounting base and then automatically reset, so that the locking part engages with the through groove.

7. The temperature testing device for an IGBT module according to claim 5, characterized by The mounting base is also provided with at least one guide groove, and the clamping member is further provided with at least one guide post, one end of which is disposed opposite to the guide groove, and the other end is connected to the first PCB board.

8. The temperature testing device for an IGBT module according to claim 5, characterized by, The clamping assembly further includes a second PCB board, multiple banana sockets and multiple banana plugs. The second PCB board has a through slot relative to the base and is fitted onto the base through the through slot. The multiple banana sockets are evenly distributed on both sides of the base and are all connected to the second PCB board. The banana plugs are arranged one-to-one with the banana sockets and are connected to the first PCB board. The banana plugs can be inserted into the banana sockets and are electrically connected to the banana sockets.

9. The temperature testing device for an IGBT module according to claim 5, characterized by, The mounting groove extends through the mounting base and has a third segment and a fourth segment. The cross-sectional area of ​​the third segment is larger than that of the fourth segment. The third segment is positioned away from the base relative to the fourth segment, and the IGBT module can abut against multiple probes and the temperature control component.

10. The temperature testing device for an IGBT module according to claim 1, characterized by, The temperature control component includes a heat sink substrate, a thermoelectric cooler, and a ceramic plate. The heat sink substrate is connected to the base and can abut against the IGBT module. The thermoelectric cooler has a fixed end and a temperature regulating end. The fixed end of the thermoelectric cooler is connected to the base. The ceramic plate is disposed between the heat sink substrate and the temperature regulating end of the thermoelectric cooler and abuts against both the heat sink substrate and the temperature regulating end of the thermoelectric cooler.

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