A wafer testing apparatus and wafer testing equipment

By setting up multiple sets of probes and test circuits on the wafer testing device, and combining them with selective connection of the current output pads by the pins, the compatibility and cost issues of existing devices when testing different wafers are solved, and efficient and low-cost wafer testing is achieved.

CN224456939UActive Publication Date: 2026-07-03SHENZHEN SHICHUANGYI ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN SHICHUANGYI ELECTRONICS CO LTD
Filing Date
2025-06-24
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Existing wafer testing equipment requires switching to different testing equipment when testing different types of wafers, resulting in low testing efficiency and increased costs.

Method used

The wafer testing device is equipped with a first set of probes, a second set of probes, a first test circuit, and a second test circuit. The device selectively connects to the first current output pad or the second current output pad via pins, enabling testing of wafers of different models and reducing the need for direct device replacement.

Benefits of technology

It improves the adaptability of wafer testing equipment, reduces testing costs, and simplifies operation through pin connection, thereby improving testing efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application discloses a wafer testing apparatus and wafer testing equipment, relating to the field of wafer testing technology. A wafer probe module is disposed on the front side of a test substrate. A first set of probes is used to connect to a first type of wafer to be tested, and a second set of probes is used to connect to a second type of wafer to be tested. A first test circuit is connected to the first set of probes; a second test circuit is connected to the second set of probes; a data interface module is connected to both the first and second test circuits; a power supply module is connected to both the first and second test circuits; a first current output pad and a second current output pad are both disposed on the back side of the test substrate. The first current output pad is connected to the first test circuit, and the second current output pad is connected to the second test circuit. One end of a pin is grounded, and the other end is used to connect to either the first or second current output pad. Through the above design, the adaptability and testing efficiency of the wafer testing apparatus are improved, and the cost of wafer testing is reduced.
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