A heating device structure for fabricating semiconductor power testing devices

Abstract

This utility model discloses a heating device structure for fabricating semiconductor power testing devices, including a housing. A heating element is connected to the housing, and the heating element includes a storage component mounted on the housing for device storage and retrieval and horizontal position adjustment. The storage component includes a support frame slidably connected to the housing. A cover plate is fixedly connected to the left side of the support frame, and a driving component is installed on the right side of the housing. This utility model relates to the field of semiconductor power testing device fabrication technology. This heating device structure for fabricating semiconductor power testing devices allows a vacuum pump, vent hood, filter tank, cooling shell, cooling pipe, low-temperature centrifugal pump, extraction pipe, reflux pipe, vent pipe, and external liquid storage tank to work together. According to requirements, the interior of the housing is vacuumed, heated, and heated for harmful gas recovery. Heating and cooling of the hot gas accelerate device cooling, facilitating the subsequent removal of the processed device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor power testing device fabrication technology, specifically a heating device structure for fabricating semiconductor power testing devices. Background Technology

[0002] In the fabrication of semiconductor power testing devices, a corresponding heating device structure is required. Referring to the semiconductor aging thermal testing device in patent application CN220491840U, it includes a worktable with a test base fixed on it. The test base has several pin holes that match the semiconductor device, and each pin hole has a connection terminal fixed in it. This affects the efficiency of semiconductor device aging testing. As described in the aforementioned patent, when using the existing heating device structure for fabricating semiconductor power testing devices, most devices cannot perform vacuuming of the storage end before heating according to the user's needs, which can easily cause oxidation and contamination of the device. After heating, it is difficult to recover the harmful impurities generated during device heating while promoting device cooling, which can easily cause safety hazards. In addition, the long device cooling time can affect subsequent replacement and heating efficiency. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a heating device structure for preparing semiconductor power testing devices, which solves the problems of difficulty in performing corresponding vacuuming, heating, and impurity recovery at the storage end as required.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a heating device structure for fabricating semiconductor power testing devices, comprising a housing, wherein the housing is connected to a heating element for heating the semiconductor power testing device, the heating element comprising:

[0005] A storage component, mounted on a housing, is used for device storage and retrieval and horizontal position adjustment. The storage component includes a support frame slidably connected to the housing. A cover plate is fixedly connected to the left side of the support frame. A drive component for adjusting the horizontal position of the support frame is mounted on the right side of the housing. A first heating frame is fixedly connected to the lower side of the housing near the support frame. An adjustment component for adjusting the heating of the upper end of the device is connected to the upper side of the housing.

[0006] A vacuum pumping unit, installed on the upper part of the housing, is used for vacuuming the interior of the housing. The vacuum pumping unit includes a vacuum pump fixedly connected to the housing. A filter canister is fixedly connected to the left side of the vacuum pump. A cooling shell, fixedly connected to the housing, is fixedly connected to the left side of the filter canister. A cooling tube is fixedly connected to the inner side of the cooling shell. A cryogenic centrifugal pump, whose discharge end is fixedly connected to the cooling tube, is fixedly connected to the top outer side of the housing. A suction tube for extracting liquid nitrogen is fixedly connected to the suction end of the cryogenic centrifugal pump. A return pipe is fixedly connected to the lower end of the other side of the cooling tube. A vent pipe is fixedly connected to the left side of the cooling shell. A vent hood, fixedly connected to the housing, is fixedly connected to the lower left side of the vent pipe.

[0007] Preferably, the driving component includes a motor fixedly connected to the front right side of the housing, two sets of bevel gear assemblies connected to the front output end of the motor, two sets of lead screws driven by the bevel gear assemblies and threaded to the support frame rotatably connected to the inner side of the housing, the output end of the motor being coaxially and fixedly connected to the driving bevel gear in the bevel gear assembly, and the driven bevel gear in the bevel gear assembly being coaxially and fixedly connected to the lead screw.

[0008] Preferably, the adjusting component includes a cylinder fixedly connected to the top of the housing, a connecting plate fixedly connected to the extended side of the bottom of the cylinder near the inner end of the housing, a second heating frame for heating the device fixedly connected to the lower side of the connecting plate, and four sets of guide rods fixedly connected to the inner side of the housing and slidably connected to the edge of the second heating frame respectively.

[0009] Preferably, a filter plate is fixedly connected to the lower side of the vent hood, a solenoid valve is fixedly connected to the vacuum pump's suction end, and the two sides of the filter tank are fixedly connected to the cooling shell and the solenoid valve respectively through two sets of flanges.

[0010] Preferably, the main body of the cooling tube is spirally arranged inside the cooling shell, the inner side of the filter tank is filled with several activated carbon meshes, and a one-way valve is installed on the rear side of the shell.

[0011] Preferably, the left side of the housing near the cover plate has a feed inlet that is slidably connected to the support frame, and the extraction pipe and return pipe are both fixedly connected to a nitrogen tank for storing nitrogen in the outside.

[0012] Beneficial effects

[0013] This invention provides a heating apparatus structure for fabricating semiconductor power testing devices. Compared with the prior art, it has the following advantages:

[0014] (1) The structure of the heating device for preparing semiconductor power testing device is designed by setting a vacuum pump, a vent hood, a filter canister, a cooling shell, a cooling tube, a low-temperature centrifugal pump, a material extraction tube, a return tube, a vent tube, and an external liquid storage tank in the device to work together to perform vacuuming, heat extraction, and heating of the inside of the shell as needed, thereby reducing the impact of the gas on the heated device during the heating process. After the heating is completed and the device is removed, the device is cooled down by heat extraction and cooling of the hot gas, which helps to remove the device after processing. In addition, the activated carbon in the filter canister adsorbs harmful impurities, thereby reducing safety hazards.

[0015] (2) The structure of the heating device for preparing semiconductor power testing device is provided in the device. When the device on the support frame moves to the inside of the housing and is located between the first heating frame and the second heating frame, the height of the connecting plate and the second heating frame is adjusted by the cylinder so that the second heating frame is close to the upper side of the device. The first heating frame and the second heating frame cooperate with each other to heat both sides of the device. This setting makes it easy for the user to make corresponding adjustments to the heating end according to the size of the device being heated, thereby improving the heating efficiency of the device. Attached Figure Description

[0016] Figure 1 This is a sectional perspective view of the present invention;

[0017] Figure 2 This is an enlarged view of the driving component of this utility model;

[0018] Figure 3 This is an enlarged view of the adjusting component of this utility model;

[0019] Figure 4 This is a perspective view of the present invention.

[0020] In the diagram: 1. Shell; 2. Storage component; 21. Support frame; 22. Cover plate; 23. Drive component; 231. Motor; 232. Bevel gear assembly; 233. Lead screw; 24. First heating frame; 25. Adjusting component; 251. Cylinder; 252. Connecting plate; 253. Second heating frame; 3. Vacuuming component; 31. Vacuum pump; 32. Vent hood; 33. Filter canister; 34. Cooling shell; 35. Cooling pipe; 36. Low-temperature centrifugal pump; 37. Material extraction pipe; 38. Return pipe; 39. Vent pipe. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] refer to Figure 1-4 This utility model provides the following two technical solutions:

[0023] First embodiment: A heating device structure for preparing a semiconductor power testing device includes a housing 1, the housing 1 is connected to a heating element for heating the semiconductor power testing device, the heating element includes: a storage element 2, which is installed on the housing 1 for device storage and retrieval and horizontal position adjustment, the storage element 2 includes a support frame 21 slidably connected to the housing 1, a cover plate 22 is fixedly connected to the left side of the support frame 21, a driving element 23 for adjusting the horizontal position of the support frame 21 is installed on the right side of the housing 1, a first heating frame 24 is fixedly connected to the lower side of the housing 1 near the support frame 21, and an adjusting element 25 for adjusting the heating of the upper end of the device is connected to the upper side of the housing 1;

[0024] Vacuuming component 3 is installed on the upper end of housing 1 for vacuuming inside housing 1. Vacuuming component 3 includes a vacuum pump 31 fixedly connected to housing 1. A discharge pipe is fixedly connected to the exhaust end of vacuum pump 31. A filter tank 33 is fixedly connected to the left suction end of vacuum pump 31. A cooling shell 34 fixedly connected to housing 1 is fixedly connected to the left side of filter tank 33. A cooling pipe 35 is fixedly connected to the inner side of cooling shell 34. A low-temperature centrifugal pump 36 fixedly connected to the top of outer side of housing 1 and fixedly connected to cooling pipe 35 is a discharge end. A suction pipe 37 for extracting liquid nitrogen is fixedly connected to the suction end of low-temperature centrifugal pump 36. A return pipe 38 is fixedly connected to the lower end of the other side of cooling pipe 35. A vent pipe 39 is fixedly connected to the left side of cooling shell 34. A vent hood 32 fixedly connected to housing 1 is fixedly connected to the lower left side of vent pipe 39.

[0025] The driving component 23 includes a motor 231 fixedly connected to the front right side of the housing 1. The output end of the motor 231 is connected to two sets of bevel gear assemblies 232. The inner side of the housing 1 is rotatably connected to two sets of lead screws 233 driven by the bevel gear assemblies 232 and threadedly connected to the support frame 21. The output end of the motor 231 is coaxially fixedly connected to the driving bevel gear in the bevel gear assembly 232, and the driven bevel gear in the bevel gear assembly 232 is coaxially fixedly connected to the lead screw 233. A filter plate is fixedly connected to the lower side of the vent 32. A solenoid valve is fixedly connected to the suction end of the vacuum pump 31. The two sides of the filter tank 33 are fixedly connected to the cooling shell 34 and the solenoid valve respectively through two sets of flanges.

[0026] The main body of the cooling tube 35 is spirally arranged inside the cooling shell 34. The inner side of the filter tank 33 is filled with several activated carbon meshes. A one-way valve is installed on the rear side of the shell 1, and a filter screen is installed near the outer side of the one-way valve. The left side of the shell 1 near the cover plate 22 has a feed port that is slidably connected to the support frame 21. The extraction pipe 37 and the return pipe 38 are fixedly connected to the nitrogen tank for storing nitrogen in the outside. The vacuum pump 31, the vent 32, the filter tank 33, the cooling shell 34, the cooling tube 35, the low temperature centrifugal pump 36, the extraction pipe 37, the return pipe 38, the vent pipe 39, and the external liquid storage tank cooperate with each other to perform vacuuming, heating, and harmful gas recovery treatment inside the shell 1 as needed.

[0027] The main difference between the second implementation method and the first implementation method is that:

[0028] Adjustment component 25 includes a cylinder 251 fixedly connected to the top of housing 1. A connecting plate 252 is fixedly connected to the bottom extension side of cylinder 251 near the inner end of housing 1. A second heating frame 253 for heating the device is fixedly connected to the lower side of connecting plate 252. Four sets of guide rods are fixedly connected to the inner side of housing 1 and are slidably connected to the edge of the second heating frame 253 respectively.

[0029] When the device on the support frame 21 moves to the inside of the housing 1 and is located between the first heating frame 24 and the second heating frame 253, the height of the connecting plate 252 and the second heating frame 253 is adjusted by the cylinder 251 so that the second heating frame 253 is close to the upper side of the device. The first heating frame 24 and the second heating frame 253 cooperate with each other to heat both sides of the device.

[0030] Furthermore, all content not described in detail in this specification is existing technology known to those skilled in the art, and the model parameters of each electrical appliance are not specifically limited; conventional equipment can be used.

[0031] In use, the user places the semiconductor power test device to be heated on the support frame 21 located on the outside of the housing 1, starts the motor 231, and the motor 231 drives the two sets of lead screws 233 to rotate through the two sets of bevel gear assemblies 232 respectively. The two sets of rotating lead screws 233 adjust the horizontal position of the support frame 21 and the cover plate 22. After the cover plate 22 is locked at the outer end of the left feed port of the housing 1, the motor 231 is turned off. At this time, the device to be heated on the support frame 21 is located between the first heating frame 24 and the second heating frame 253 inside the housing 1. The height of the connecting plate 252 and the second heating frame 253 is adjusted by the cylinder 251. The second heating frame 253 slides along the guide rod to bring the second heating frame 253 close to the upper end of the device to be heated. The vacuum pump 31 is started. The vacuum pump 31 performs vacuum treatment on the inside of the housing 1 through the solenoid valve, filter canister 33, cooling shell 34, vent pipe 39, vent hood 32 and filter plate.

[0032] After processing is complete, the solenoid valve and vacuum pump 31 are turned off, and power is supplied to the first heating frame 24 and the second heating frame 253. The first heating frame 24 and the second heating frame 253 heat the device. When the device is heated, the power supply to the first heating frame 24 and the second heating frame 253 is stopped, and the one-way valve on the rear side of the housing 1 is opened. Under the action of external negative pressure, outside air is introduced into the housing 1 through the one-way valve. The solenoid valve, vacuum pump 31, and cryogenic centrifugal pump 36 are turned on. The cryogenic centrifugal pump 36 draws liquid nitrogen from the external storage tank through the suction pipe 37, and then the liquid nitrogen is injected into the spiral cooling pipe 35 and finally flows back to the external storage tank through the return pipe 38. At this time, the vacuum pump 31 filters... The canister 33, cooling shell 34, vent pipe 39, and vent hood 32 re-evacuate the shell 1. When the gas passes through the cooling pipe 35 in the cooling shell 34, the liquid nitrogen flowing through the cooling pipe 35 absorbs heat from the gas under the action of heat exchange. Then, when the cooled gas passes through the filter canister 33, the activated carbon mesh in the filter canister 33 adsorbs impurities in the gas. After the treatment is completed, the vacuum pump 31 and the low-temperature centrifugal pump 36 are turned off to reset all links. After the heating treatment is completed, new devices are added and the above heating operation is repeated. The first heating frame 24 and the second heating frame 253 are existing technologies, so their specific internal structure and working principle will not be described in detail.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heating device structure for fabricating semiconductor power testing devices, comprising a housing (1), characterized in that: The housing (1) is connected to a heating element for heating a semiconductor power testing device, the heating element comprising: Storage component (2), installed on housing (1) for device storage and horizontal position adjustment, the storage component (2) includes a support frame (21) slidably connected to housing (1), a cover plate (22) is fixedly connected to the left side of the support frame (21), a drive component (23) for adjusting the horizontal position of the support frame (21) is installed on the right side of housing (1), a first heating frame (24) is fixedly connected to the lower side of housing (1) near the support frame (21), and an adjustment component (25) for adjusting the heating of the upper end of the device is connected to the upper side of housing (1); A vacuum pumping component (3) is installed on the upper end of the housing (1) for vacuuming inside the housing (1). The vacuum pumping component (3) includes a vacuum pump (31) fixedly connected to the housing (1). A filter tank (33) is fixedly connected to the left side of the vacuum pump (31). A cooling shell (34) fixedly connected to the left side of the filter tank (33) is fixedly connected to the housing (1). A cooling pipe (35) is fixedly connected to the inner side of the cooling shell (34). A low-temperature centrifugal pump (36) fixedly connected to the top of the outer side of the housing (1) is fixedly connected to the discharge end and the cooling pipe (35). A suction pipe (37) for extracting liquid nitrogen is fixedly connected to the suction end of the low-temperature centrifugal pump (36). A return pipe (38) is fixedly connected to the lower end of the other side of the cooling pipe (35). A vent pipe (39) is fixedly connected to the left side of the cooling shell (34). A vent hood (32) fixedly connected to the lower left side of the vent pipe (39) is fixedly connected to the housing (1).

2. The structure of a heating device for fabricating a semiconductor power testing device according to claim 1, characterized in that: The driving component (23) includes a motor (231) fixedly connected to the front right side of the housing (1). The output end of the motor (231) is connected to two sets of bevel gear assemblies (232). The inner side of the housing (1) is rotatably connected to two sets of lead screws (233) driven by the bevel gear assemblies (232) and threadedly connected to the support frame (21). The output end of the motor (231) is coaxially fixedly connected to the driving bevel gear in the bevel gear assembly (232). The driven bevel gear in the bevel gear assembly (232) is coaxially fixedly connected to the lead screw (233).

3. The structure of a heating device for fabricating a semiconductor power testing device according to claim 1, characterized in that: The adjusting component (25) includes a cylinder (251) fixedly connected to the top of the housing (1). A connecting plate (252) is fixedly connected to the bottom extension side of the cylinder (251) near the inner end of the housing (1). A second heating frame (253) for heating the device is fixedly connected to the lower side of the connecting plate (252). Four sets of guide rods are fixedly connected to the inner side of the housing (1) and are slidably connected to the edge of the second heating frame (253).

4. The structure of a heating device for fabricating a semiconductor power testing device according to claim 1, characterized in that: A filter plate is fixedly connected to the lower side of the ventilation hood (32), and a solenoid valve is fixedly connected to the suction end of the vacuum pump (31). The filter tank (33) is fixedly connected to the cooling shell (34) and the solenoid valve on both sides through two sets of flanges respectively.

5. The structure of a heating device for fabricating a semiconductor power testing device according to claim 1, characterized in that: The main body of the cooling tube (35) is spirally arranged inside the cooling shell (34), the inner side of the filter tank (33) is filled with several activated carbon meshes, and a one-way valve is installed on the rear side of the shell (1).

6. The structure of a heating device for fabricating a semiconductor power testing device according to claim 1, characterized in that: The left side of the housing (1) near the cover plate (22) is provided with a feed inlet that is slidably connected to the support frame (21). The feed pipe (37) and the return pipe (38) are both fixedly connected to the nitrogen tank that stores nitrogen in the outside.

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