An IEGIS-based integrated circuit chip testing device

Abstract

This application relates to the field of integrated circuit board technology, and more particularly to a detection device for integrated circuit chips based on IEGIS. To solve the problem of inconvenient rapid positioning of circuit chips, it includes a frame, with a detection component located above the frame and a power component located below the frame. A positioning component is located inside the frame. The frame includes a carrier plate, and two sets of support legs are fixedly mounted on the bottom surface of the carrier plate. This application utilizes a reducer and a motor to enable the control board to rotate. Furthermore, the control board, guide groove, and guide rod work together to enable the control block to move synchronously, allowing the control block to slide within the cross groove. This allows control of the connecting plate, pressure groove, and first spring to clamp and position the chip horizontally and vertically. Simultaneously, the second spring allows for clamping of workpieces of different sizes, preventing workpiece loosening and detachment.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit board technology, specifically to a detection device for integrated circuit chips based on IEGIS. Background Technology

[0002] Integrated circuit boards are the basic carriers for mounting integrated circuits. They are usually made of silicone and are green in appearance. In circuits, they are identified by "IC" or "N". Their core structure integrates components such as transistors, resistors, and capacitors on a single crystal silicon wafer. Combined with multi-layer wiring of semiconductor technology, they form a complete electronic circuit and are widely used in television, audio, computer and communication equipment and other fields.

[0003] Currently, in the process of integrated circuit production, testing devices are needed to test circuit chips. However, although the current testing devices can perform testing, they still have some shortcomings in actual use. For example, it is not convenient to quickly locate the circuit chip during use, resulting in slow efficiency in circuit chip testing.

[0004] Based on this, this utility model designs a detection device for integrated circuit chips based on IEGIS to solve the problem. Utility Model Content

[0005] The purpose of this invention is to provide a detection device for integrated circuit chips based on IEGIS, so as to solve the problem of inconvenience in quickly locating circuit chips in the above-mentioned background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a detection device for integrated circuit chips based on IEGIS, comprising a frame, a detection component on the top of the frame, a power component on the bottom of the frame, a positioning component inside the frame, a carrier plate, two sets of support legs fixedly mounted on the bottom surface of the carrier plate, a control panel fixedly mounted on the upper surface of the carrier plate, a bracket fixedly mounted on the upper surface of the carrier plate, and a cross groove formed on the upper surface of the carrier plate;

[0007] The detection assembly includes a hydraulic cylinder mounted on the upper surface of the bracket. A pressure sensor is fixedly mounted on the telescopic end of the hydraulic cylinder. A mounting plate is fixedly mounted on the bottom surface of the pressure sensor. Two sets of detection pins are fixedly mounted on the bottom surface of the mounting plate.

[0008] The positioning assembly includes two sets of control blocks slidably mounted on the inner wall of the cross groove. Each set of control blocks has a sliding hole at one end close to the other. A sliding rod is slidably mounted on the inner wall of each sliding hole. Two sets of connecting plates are fixedly mounted at the ends of the two sets of sliding rods close to each other. A concave plate is fitted onto the outer surface of each connecting plate. Two first springs are fixedly mounted on the inner top wall of each concave plate. The bottom end of each first spring is fixedly mounted to the upper surface of the connecting plate. A pressure groove is formed on one side of each set of concave plates close to the other. A second spring is fixedly mounted on one side of each set of connecting plates far from each other. The ends of the two sets of second springs far from each other are respectively fixedly mounted to the sides of the two sets of control blocks close to each other. A positioning block is fixedly mounted at one end of each set of sliding rods far from each other. Two sets of sliding grooves are formed on the inner wall of the cross groove. A slider is slidably mounted on the inner wall of each sliding groove. The sides of the two sets of sliders close to each other are respectively fixedly mounted to the sides of the two sets of control blocks far from each other.

[0009] Preferably, the power assembly includes two sets of U-shaped plates mounted on the bottom surface of the carrier plate. A reducer is fixedly mounted on the bottom surface of each U-shaped plate. A motor is fixedly mounted on the input end of each reducer. A transmission rod is rotatably mounted on the output end of the reducer. A control plate is fixedly mounted on the top end of the transmission rod. Two sets of guide grooves are formed on the upper surface of the control plate. A guide rod is slidably mounted on the inner wall of each guide groove. The top end of each guide rod is fixedly mounted to the bottom end of the control block.

[0010] Preferably, a fixing seat is fixedly installed on both the left and right sides of the U-shaped plate, and the upper surface of each fixing seat is fixedly installed to the bottom surface of the carrier plate.

[0011] Preferably, a guide rail is fixedly installed on the inner bottom wall of the U-shaped plate, and two sets of limiting blocks are slidably installed on the inner wall of the guide rail, with the top of each limiting block being fixedly installed to the bottom surface of the control plate.

[0012] Preferably, two sets of insulating pads are fixedly installed on the upper surface of the carrier plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: by using a reducer and a motor, the control board can be rotated, and by using the control board, guide groove and guide rod, the control block can be moved synchronously, allowing the control block to slide inside the cross groove. This enables the connection plate, pressure groove and first spring to clamp and position the chip in the horizontal and vertical directions. At the same time, with the second spring, workpieces of different sizes can be clamped, preventing the workpieces from loosening and falling off. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a three-dimensional structural schematic diagram of the present invention from a top view;

[0017] Figure 3 This is a schematic diagram of the disassembled structure of this utility model;

[0018] Figure 4 This is a three-dimensional structural schematic diagram of the orthographic section of this utility model;

[0019] Figure 5 This is the split structure of the concave plate of this utility model.

[0020] The attached diagram lists the components represented by each number as follows:

[0021] 1. Frame; 101. Carrier plate; 102. Support leg; 103. Control panel; 104. Bracket; 105. Cross groove; 106. Insulating pad; 2. Detection assembly; 201. Hydraulic cylinder; 202. Pressure sensor; 203. Mounting plate; 204. Detection needle; 3. Power assembly; 301. U-shaped plate; 302. Reducer; 303. Motor; 304. Control board; 305. Guide groove; 306. Guide rod; 307. Fixed base; 308. Transmission rod; 309. Guide rail; 310. Limit block; 4. Positioning assembly; 401. Control block; 402. Sliding hole; 403. Sliding rod; 404. Concave plate; 405. Second spring; 406. Positioning block; 407. Sliding groove; 408. Slider; 409. First spring; 410. Connecting plate; 411. Pressure groove. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1 to 4This utility model provides a technical solution: a detection device for integrated circuit chips based on IEGIS, including a frame 1, a detection component 2 above the frame 1, a power component 3 below the frame 1, a positioning component 4 inside the frame 1, the frame 1 including a carrier plate 101, two sets of support legs 102 fixedly installed on the bottom surface of the carrier plate 101, a control panel 103 fixedly installed on the upper surface of the carrier plate 101, a bracket 104 fixedly installed on the upper surface of the carrier plate 101, and a cross groove 105 formed on the upper surface of the carrier plate 101.

[0024] Please see Figure 1 The detection component 2 includes a hydraulic cylinder 201 mounted on the upper surface of the bracket 104. A pressure sensor 202 is fixedly mounted on the telescopic end of the hydraulic cylinder 201. A mounting plate 203 is fixedly mounted on the bottom surface of the pressure sensor 202. Two sets of detection needles 204 are fixedly mounted on the bottom surface of the mounting plate 203. The hydraulic cylinder 201 can push the detection needles 204 to move downward, so that the detection needles 204 can detect integrated circuit chips.

[0025] Please see Figure 2 The positioning component 4 includes two sets of control blocks 401 slidably mounted on the inner wall of the cross groove 105. Each set of control blocks 401 has a sliding hole 402 at one end close to the other. A sliding rod 403 is slidably mounted on the inner wall of each sliding hole 402. Two sets of connecting plates 410 are fixedly mounted at one end close to the other. A concave plate 404 is fitted onto the outer surface of each connecting plate 410. Two first springs 409 are fixedly mounted on the inner top wall of each concave plate 404. The bottom end of each first spring 409 is fixedly mounted to the upper surface of the connecting plate 410. A pressure groove 411 is formed on one side close to the other of each set of concave plates 404. A second spring 405 is fixedly mounted on one side away from the other of each set of connecting plates 410. The ends of the two sets of second springs 405 that are away from each other are respectively connected to the two sets of control blocks 401. The blocks 401 are fixedly installed on their adjacent sides, and positioning blocks 406 are fixedly installed on the opposite ends of the two sets of sliding rods 403. The inner wall of the cross groove 105 is provided with two sets of sliding grooves 407, and a slider 408 is slidably installed on the inner wall of each sliding groove 407. The adjacent sides of the two sets of sliders 408 are fixedly installed with the opposite sides of the two sets of control blocks 401. With the cooperation of the control blocks 401 and the cross groove 105, the control blocks 401 can push the connecting plate 410 to move, and the connecting plate 410 can clamp the workpiece. With the setting of the second spring 405, different integrated circuit chips can be clamped. During the clamping process, the pressure groove 411 can cooperate with the elastic force applied by the first spring 409 to apply pressure to the circuit chip in the horizontal and vertical directions, effectively preventing the circuit chip from loosening.

[0026] Please see Figure 3 The power assembly 3 includes two sets of U-shaped plates 301 mounted on the bottom surface of the carrier plate 101. A reducer 302 is fixedly mounted on the bottom surface of each U-shaped plate 301. A motor 303 is fixedly mounted on the input end of each reducer 302. A transmission rod 308 is rotatably mounted on the output end of the reducer 302. A control plate 304 is fixedly mounted on the top end of the transmission rod 308. Two sets of guide grooves 305 are provided on the upper surface of the control plate 304. A guide rod 306 is slidably mounted on the inner wall of each guide groove 305. The top end of each guide rod 306 is fixedly mounted to the bottom end of the control block 401. With the cooperation of the reducer 302 and the motor 303, the transmission rod 308 can be controlled to rotate, so that the transmission rod 308 can cause the control plate 304 to rotate. Thus, during the rotation of the control plate 304, the guide rod 306 can slide along the guide groove 305, thereby causing the guide rod 306 to push the control blocks 401 closer to each other.

[0027] Please see Figure 3 Fixing seats 307 are fixedly installed on both the left and right sides of the U-shaped plate 301. The upper surface of each fixing seat 307 is fixedly installed with the bottom surface of the carrier plate 101. By using the cooperation between the fixing seat 307 and the U-shaped plate 301, the U-shaped plate 301 can be reinforced, thereby improving the stability of the U-shaped plate 301.

[0028] Please see Figure 3 A guide rail 309 is fixedly installed on the inner bottom wall of the U-shaped plate 301. Two sets of limiting blocks 310 are slidably installed on the inner wall of the guide rail 309. The top of each limiting block 310 is fixedly installed with the bottom surface of the control plate 304. By the cooperation of the guide rail 309 and the limiting block 310, the control plate 304 can be limited, effectively preventing the control plate 304 from shaking.

[0029] Please see Figure 1 Two sets of insulating pads 106 are fixedly installed on the upper surface of the carrier board 101. The insulating pads 106 can increase the insulation and effectively reduce the damage caused by static electricity to the integrated circuit chip.

[0030] The implementation principle of the integrated circuit chip detection device based on IEGIS in this application embodiment is as follows: During use, the integrated circuit chip is placed on the insulating pad 106. Then, the motor 303 is started, causing the reducer 302 to control the rotation of the transmission rod 308. The transmission rod 308 then rotates the control board 304. During the rotation of the control board 304, the guide rod 306 moves along the guide groove 305, pushing the control block 401 to move. This allows the control block 401 to slide along the cross groove 105. As the control block 401 moves, it pushes the connecting plate 410 to clamp the integrated circuit chip. Under the action of the second spring 405, the connecting plate 410 can clamp different workpieces. Then, the hydraulic cylinder 201 is started, pushing the pressure sensor 202 and the mounting plate 203 downwards, allowing the detection needle 204 to detect the integrated circuit chip.

[0031] The accompanying drawings in this application are for illustrative purposes only. The dimensions and shapes of the components shown are not actual limitations but are merely schematic representations. In actual implementation, the components can be reasonably configured and adjusted according to specific needs and actual conditions.

[0032] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0033] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An apparatus for detecting IEGIS-based integrated circuit chips, comprising a rack (1), characterized in that: The frame (1) is provided with a detection component (2) above it, a power component (3) below it, a positioning component (4) inside the frame (1), the frame (1) includes a carrier plate (101), two sets of support legs (102) are fixedly installed on the bottom surface of the carrier plate (101), a control panel (103) is fixedly installed on the upper surface of the carrier plate (101), a bracket (104) is fixedly installed on the upper surface of the carrier plate (101), and a cross groove (105) is opened on the upper surface of the carrier plate (101). The detection component (2) includes a hydraulic cylinder (201) mounted on the upper surface of the bracket (104). A pressure sensor (202) is fixedly mounted on the telescopic end of the hydraulic cylinder (201). A mounting plate (203) is fixedly mounted on the bottom surface of the pressure sensor (202). Two sets of detection needles (204) are fixedly mounted on the bottom surface of the mounting plate (203). The positioning component (4) includes two sets of control blocks (401) slidably mounted on the inner wall of the cross groove (105). Each set of control blocks (401) has a sliding hole (402) at one end close to the other. A sliding rod (403) is slidably mounted on the inner wall of each sliding hole (402). Two sets of connecting plates (410) are fixedly mounted at one end close to the other. A concave plate (404) is fitted onto the outer surface of each connecting plate (410). Two first springs (409) are fixedly mounted on the inner top wall of each concave plate (404). The bottom end of each first spring (409) is fixedly mounted to the upper surface of the connecting plate (410). The two sets of concave plates (404)... 04) Each side of the two sets of connecting plates (410) is provided with a pressure groove (411). Each side of the two sets of connecting plates (410) is provided with a second spring (405). The ends of the two sets of second springs (405) are respectively fixedly installed with the sides of the two sets of control blocks (401) that are close to each other. Each end of the two sets of sliding rods (403) is respectively fixedly installed with a positioning block (406). The inner wall of the cross groove (105) is provided with two sets of sliding grooves (407). Each inner wall of the sliding groove (407) is provided with a slider (408). The sides of the two sets of sliders (408) that are close to each other are respectively fixedly installed with the sides of the two sets of control blocks (401) that are far from each other.

2. The IEGIS-based integrated circuit chip detection apparatus according to claim 1, wherein: The power assembly (3) includes two sets of U-shaped plates (301) installed on the bottom surface of the carrier plate (101). A reducer (302) is fixedly installed on the bottom surface of each U-shaped plate (301). A motor (303) is fixedly installed at the input end of each reducer (302). A transmission rod (308) is rotatably installed at the output end of the reducer (302). A control plate (304) is fixedly installed at the top end of the transmission rod (308). Two sets of guide grooves (305) are provided on the upper surface of the control plate (304). A guide rod (306) is slidably installed on the inner wall of each guide groove (305). The top end of each guide rod (306) is fixedly installed with the bottom end of the control block (401).

3. The IEGIS-based integrated circuit chip detection apparatus according to claim 2, wherein: The U-shaped plate (301) is fixedly mounted with a fixing seat (307) on both the left and right sides, and the upper surface of each fixing seat (307) is fixedly mounted with the bottom surface of the carrier plate (101).

4. The IEGIS-based integrated circuit chip detection apparatus according to claim 3, wherein: The inner bottom wall of the U-shaped plate (301) is fixedly installed with a guide rail (309), and the inner wall of the guide rail (309) is slidably installed with two sets of limiting blocks (310). The top of each limiting block (310) is fixedly installed with the bottom surface of the control plate (304).

5. The detection device for integrated circuit chips based on IEGIS according to claim 1, characterized in that: Two sets of insulating pads (106) are fixedly installed on the upper surface of the carrier plate (101).

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