An optical module

Abstract

In the optical module disclosed herein, the temperature of the thermally conductive connection area between the light emitting component and the upper housing is used to characterize the optical module's housing temperature. Inside the MCU, a first register stores the drive current of the TEC (Diverterless Transformer), a second register stores the monitored temperature of the temperature sensor, and a third register stores the housing temperature characterization value. The generation of the housing temperature characterization value involves: generating a compensation temperature based on the TEC drive current, and then compensating the monitored temperature of the temperature sensor using this compensation temperature to obtain the housing temperature characterization value. The compensation temperature characterizes the local high-temperature point in the laser region, while the MCU's monitored temperature characterizes the overall ambient temperature level of the optical module. Combining these two values ​​allows for the simultaneous reflection of both the local high-temperature point and the overall temperature state of the optical module. Therefore, the generated housing temperature characterization value is closer to the highest temperature of the upper housing of the optical module, and thus closer to the temperature of the thermally conductive connection area between the light emitting component and the upper housing, improving the accuracy of housing temperature monitoring.

Description

Technical Field

[0001] This disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve. Utility Model Content

[0003] In some embodiments, an optical module is provided to improve the accuracy of optical module housing temperature monitoring.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Upper shell;

[0006] The lower housing is fitted and connected to the upper housing to form a wrapping cavity;

[0007] The circuit board is disposed within the encapsulated cavity;

[0008] A light-emitting component, electrically connected to the circuit board, wherein the temperature of the thermally conductive connection area between the light-emitting component and the upper housing is used to characterize the housing temperature of the optical module, and the light-emitting component includes:

[0009] Lasers are used to emit light signals;

[0010] The TEC, a surface used to support the laser, is configured to receive drive current for temperature regulation of the laser;

[0011] An MCU, electrically connected to the circuit board, has a built-in temperature sensor. The MCU includes:

[0012] The first register is used to store the drive current of the TEC;

[0013] The second register is used to store the temperature monitored by the temperature sensor;

[0014] The third register is used to store the optical module housing temperature characterization value. The generation of the optical module housing temperature characterization value includes: generating a compensation temperature based on the drive current of the TEC, and compensating the monitoring temperature of the temperature sensor with the compensation temperature to obtain the optical module housing temperature characterization value.

[0015] The above technical solution has the following advantages or beneficial effects: The optical module includes an upper housing, a lower housing, a circuit board, an optical emitting component, and an MCU. The upper and lower housings can be closed to form a cavity, and the circuit board is located inside the cavity. The optical emitting component is electrically connected to the circuit board. The optical emitting component includes a laser and a TEC (thermal conductive layer). The laser is used to emit optical signals, and the surface of the TEC is used to support the laser and is configured to receive drive current, which regulates the temperature of the laser under the action of the drive current. Real-time monitoring and reporting of the optical module's shell temperature are required. The temperature of the thermally conductive connection area between the optical emitting component and the upper housing is used to characterize the optical module's shell temperature. The shell temperature of the optical module is approximately equal to the highest temperature of the upper housing of the optical module; therefore, the closer the monitored and reported temperature is to the highest temperature of the upper housing, the higher the monitoring accuracy. The MCU includes a first register, a second register, and a third register. The first register stores the drive current of the TEC, the second register stores the monitored temperature of the temperature sensor, and the third register stores the shell temperature characterization value of the optical module. The generation of the optical module's shell temperature characterization value includes: generating a compensated temperature based on the TEC (Digital Temperature Coefficient) drive current, and then compensating for the temperature monitored by the temperature sensor using this compensated temperature to obtain the optical module's shell temperature characterization value. The magnitude of the TEC drive current is approximately linearly related to the temperature of the thermal environment where the laser is located; therefore, the thermal load of the laser's area can be indirectly characterized through the TEC drive current. The compensated temperature characterizes the local high-temperature points in the laser's area, while the MCU's monitored temperature characterizes the overall ambient temperature level of the optical module. By compensating for the MCU's monitored temperature with the compensated temperature, both the local high-temperature points and the overall temperature state of the optical module can be reflected simultaneously. This results in a shell temperature characterization value that is closer to the highest temperature of the upper shell of the optical module, and thus closer to the temperature of the thermally conductive connection area between the light emitting component and the upper shell, ultimately closer to the actual shell temperature value of the optical module, improving the accuracy of shell temperature monitoring.

[0016] In some embodiments, the MCU includes:

[0017] The fourth register is used to store the conversion factor;

[0018] The fifth register is used to store calibration coefficients;

[0019] The sixth register is used to store the compensation coefficients;

[0020] The MCU is configured as follows:

[0021] The compensation temperature is generated based on the driving current of the TEC and the conversion factor.

[0022] A calibration monitoring temperature is generated based on the monitored temperature of the temperature sensor and the calibration coefficient.

[0023] The optical module housing temperature characterization value is generated based on the compensation temperature, the calibration monitoring temperature, and the compensation coefficient.

[0024] The above technical solution has the following advantages or beneficial effects: The MCU includes a fourth register, a fifth register, and a sixth register. The fourth register stores conversion coefficients, the fifth register stores calibration coefficients, and the sixth register stores compensation coefficients. The MCU is configured to: generate a compensation temperature based on the TEC drive current and the conversion coefficients; calibrate the monitored temperature based on the temperature sensor's monitoring temperature and the calibration coefficients to generate a calibrated monitoring temperature; and then generate a temperature characterization value for the optical module housing based on the compensation temperature, the calibrated monitoring temperature, and the compensation coefficients. The conversion coefficients characterize the conversion relationship between the TEC drive current and the compensation temperature, thus the converted compensation temperature can be obtained based on the conversion coefficients. The calibration coefficients represent the degree of calibration of the temperature monitored by the MCU's built-in temperature sensor. The compensation coefficients are used to further compensate for the converted compensation temperature and the calibrated monitoring temperature to improve the housing temperature monitoring accuracy. The compensation temperature characterizes the local high-temperature point in the laser area, and the MCU's monitoring temperature characterizes the overall ambient temperature level of the optical module. By compensating the MCU's monitoring temperature with the compensation temperature, both the local high-temperature point and the overall temperature state of the optical module can be reflected simultaneously. Further compensation based on the compensation coefficients further improves the housing temperature monitoring accuracy.

[0025] In some embodiments, the MCU is configured to:

[0026] Based on the shell temperature calculation model T final =a*I TEC +b*T MCU +c calculates and generates the temperature characterization value of the optical module casing;

[0027] Where a is the conversion factor, b is the calibration factor, c is the compensation factor, and I TEC T is the drive current flowing through the TEC. MCU T represents the temperature monitored by the temperature sensor. final This is the temperature characterization value of the optical module casing.

[0028] The above technical solution has the following advantages or beneficial effects: based on the shell temperature calculation model T final =a*I TEC +b*T MCU +c calculates and generates the temperature characterization value of the optical module casing, where a is the conversion factor, b is the calibration factor, c is the compensation factor, and I TEC T is the drive current flowing through the TEC. MCU T represents the temperature monitored by the temperature sensor. finalThe temperature rating of the optical module's housing is given by coefficients a, b, and c. Coefficients a, b, and c represent the conversion relationship between the TEC drive current and the compensated temperature, the calibration degree of the temperature monitored by the MCU's built-in temperature sensor, and the degree of further compensation based on the actual working environment and conditions of the optical module, respectively. These coefficients work together in the housing temperature calculation model to ensure the final obtained temperature rating T of the optical module's housing. final It can more accurately reflect the highest temperature of the optical module's housing, improving the accuracy of housing temperature monitoring.

[0029] In some embodiments, the TEC is configured to control the junction temperature of the laser to remain constant under the drive of a drive current; wherein, when the case temperature of the optical module increases, the drive current received by the TEC increases to control the junction temperature of the laser to remain constant; when the case temperature of the optical module decreases, the drive current received by the TEC decreases to control the junction temperature of the laser to remain constant.

[0030] The above technical solution has the following advantages or beneficial effects: Under the action of the driving current, the TEC maintains a constant junction temperature of the laser. When the case temperature of the optical module rises, it means that the ambient temperature in the area where the laser is located rises. Therefore, in order to maintain a constant junction temperature of the laser, a larger driving current needs to be applied to the TEC to drive the TEC440 to do more work to counteract the increased ambient temperature. It can be seen that the magnitude of the driving current applied to the TEC is positively correlated with the case temperature of the optical module. Therefore, the driving current of the TEC can be used as a reference parameter for monitoring the case temperature of the optical module. When the case temperature of the optical module rises, the driving current received by the TEC increases to control the junction temperature of the laser to remain constant. When the case temperature of the optical module decreases, the driving current received by the TEC decreases to control the junction temperature of the laser to remain constant.

[0031] In some embodiments, the TEC includes a first substrate and a second substrate;

[0032] Multiple sets of alternately arranged N-type semiconductor portions and P-type semiconductor portions are provided between the first substrate and the second substrate;

[0033] The TEC includes a first electrode portion and a second electrode portion. The first electrode portion is electrically connected to the second electrode portion through an N-type semiconductor portion and a P-type semiconductor portion connected in series between the first substrate and the second substrate.

[0034] The first electrode portion and the second electrode portion are respectively electrically connected to a current source on the surface of the circuit board to supply power to the N-type semiconductor portion and the P-type semiconductor portion between the first substrate and the second substrate.

[0035] The above technical solution has the following advantages or beneficial effects: The TEC includes a first substrate and a second substrate. Multiple sets of alternately arranged N-type semiconductor sections and P-type semiconductor sections are provided between the first substrate and the second substrate. The TEC includes a first electrode section and a second electrode section. The first electrode section is electrically connected to the second electrode section through the N-type semiconductor sections and P-type semiconductor sections connected in series between the first substrate and the second substrate. The first electrode section and the second electrode section are respectively electrically connected to a current source on the surface of the circuit board to supply power to the N-type semiconductor sections and P-type semiconductor sections between the first substrate and the second substrate. By adjusting the direction and magnitude of the driving current provided by the current source, the direction and magnitude of heat transfer between the first substrate and the second substrate can be changed, thereby controlling the temperature of the second substrate and regulating the temperature of the laser carried by the second substrate.

[0036] In some embodiments, an optical module is provided, comprising:

[0037] Upper shell;

[0038] The lower housing is fitted and connected to the upper housing to form a wrapping cavity;

[0039] The circuit board is disposed within the encapsulated cavity;

[0040] A light-emitting component, electrically connected to the circuit board, wherein the temperature of the thermally conductive connection area between the light-emitting component and the upper housing is used to characterize the housing temperature of the optical module, and the light-emitting component includes:

[0041] Lasers are used to emit light signals;

[0042] The TEC, a surface used to support the laser, is configured to receive drive current for temperature regulation of the laser;

[0043] The MCU is electrically connected to the circuit board and has a built-in temperature sensor. The MCU is configured to generate a compensation temperature based on the drive current of the TEC, and to compensate the monitored temperature of the temperature sensor by the compensation temperature, thereby obtaining the temperature characterization value of the optical module shell.

[0044] The above technical solution has the following advantages or beneficial effects: The optical module includes an upper housing, a lower housing, a circuit board, an optical emitting component, and an MCU. The upper and lower housings can be closed to form an enclosed cavity, and the circuit board is located inside the enclosed cavity. The optical emitting component is electrically connected to the circuit board. The optical emitting component includes a laser and a TEC (thermal conductive layer). The laser is used to emit optical signals, and the TEC surface is used to support the laser and is configured to receive drive current, which regulates the temperature of the laser under the action of the drive current. Real-time monitoring and reporting of the optical module's shell temperature are required. The temperature of the thermally conductive connection area between the optical emitting component and the upper housing is used to characterize the optical module's shell temperature. The shell temperature of the optical module is approximately equal to the highest temperature of the upper housing of the optical module; therefore, the closer the monitored and reported temperature is to the highest temperature of the upper housing, the higher the monitoring accuracy. The MCU is configured to generate a compensation temperature based on the drive current of the TEC, and to compensate the temperature monitored by the temperature sensor using the compensation temperature, thereby obtaining the characterization value of the optical module's shell temperature. The driving current of the TEC (Digital Temperature Coefficient) is approximately linearly related to the temperature of the laser's thermal environment. Therefore, the driving current of the TEC can indirectly characterize the thermal load of the laser's region. The compensated temperature characterizes the local high-temperature points in the laser's region, while the MCU's monitored temperature characterizes the overall ambient temperature level of the optical module. By compensating the MCU's monitored temperature with the compensated temperature, both the local high-temperature points and the overall temperature state of the optical module can be reflected simultaneously. This results in a shell temperature characterization value that is closer to the highest temperature of the optical module's upper shell, and thus closer to the temperature of the thermally conductive connection area between the light emitting component and the upper shell. Consequently, it is closer to the actual shell temperature value of the optical module, improving the accuracy of shell temperature monitoring.

[0045] In some embodiments, the MCU includes:

[0046] The first register is used to store the drive current of the TEC;

[0047] The second register is used to store the temperature monitored by the temperature sensor;

[0048] The fourth register is used to store the conversion factor;

[0049] The fifth register is used to store calibration coefficients;

[0050] The sixth register is used to store the compensation coefficients;

[0051] The MCU is configured as follows:

[0052] The compensation temperature is generated based on the driving current of the TEC and the conversion factor.

[0053] A calibration monitoring temperature is generated based on the monitored temperature of the temperature sensor and the calibration coefficient.

[0054] The optical module housing temperature characterization value is generated based on the compensation temperature, the calibration monitoring temperature, and the compensation coefficient.

[0055] The above technical solution has the following advantages or beneficial effects: The MCU includes a first register, a second register, a fourth register, a fifth register, and a sixth register. The first register stores the drive current of the TEC (Digital Transistor), the second register stores the monitored temperature of the temperature sensor, the fourth register stores conversion coefficients, the fifth register stores calibration coefficients, and the sixth register stores compensation coefficients. The MCU is configured to: generate a compensated temperature based on the TEC drive current and the conversion coefficients; calibrate the monitored temperature based on the temperature sensor's monitored temperature and the calibration coefficients to generate a calibrated monitored temperature; and then generate a temperature characterization value for the optical module housing based on the compensated temperature, the calibrated monitored temperature, and the compensation coefficients. The conversion coefficients characterize the conversion relationship between the TEC drive current and the compensated temperature; therefore, the converted compensated temperature can be obtained based on the conversion coefficients. The calibration coefficients represent the degree of calibration of the temperature monitored by the MCU's built-in temperature sensor. The compensation coefficients are used to further compensate for the converted compensated temperature and the calibrated monitored temperature to improve the housing temperature monitoring accuracy. The compensated temperature characterizes the local high temperature point in the area where the laser is located, while the MCU's monitored temperature characterizes the overall ambient temperature level of the optical module. By compensating the MCU's monitored temperature with the compensated temperature, both the local high temperature point and the overall temperature status of the optical module can be reflected simultaneously. Furthermore, based on the compensation coefficient, further compensation can be made to further improve the accuracy of the shell temperature monitoring.

[0056] In some embodiments, the MCU is configured to:

[0057] Based on the shell temperature calculation model T final =a*I TEC +b*T MCU +c calculates and generates the temperature characterization value of the optical module casing;

[0058] Where a is the conversion factor, b is the calibration factor, c is the compensation factor, and I TEC T is the drive current flowing through the TEC. MCU T represents the temperature monitored by the temperature sensor. final This is the temperature characterization value of the optical module casing.

[0059] The above technical solution has the following advantages or beneficial effects: based on the shell temperature calculation model T final =a*I TEC +b*T MCU +c calculates and generates the temperature characterization value of the optical module casing; where a is the conversion factor, b is the calibration factor, c is the compensation factor, and I TEC T is the drive current flowing through the TEC. MCUT represents the temperature monitored by the temperature sensor. final The temperature rating of the optical module's housing is given by coefficients a, b, and c. Coefficients a, b, and c represent the conversion relationship between the TEC drive current and the compensated temperature, the calibration degree of the temperature monitored by the MCU's built-in temperature sensor, and the degree of further compensation based on the actual working environment and conditions of the optical module, respectively. These coefficients work together in the housing temperature calculation model to ensure the final obtained temperature rating T of the optical module's housing. final It can more accurately reflect the highest temperature of the optical module's housing, improving the accuracy of housing temperature monitoring.

[0060] In some embodiments, the compensation temperature generated based on the drive current of the TEC is positively correlated with the housing temperature of the optical module.

[0061] The above technical solution has the following advantages or beneficial effects: Under the action of the driving current, the TEC maintains a constant junction temperature of the laser. When the case temperature of the optical module rises, it means that the ambient temperature in the area where the laser is located rises. Therefore, in order to maintain a constant junction temperature of the laser, a larger driving current needs to be applied to the TEC to drive the TEC440 to do more work to counteract the increased ambient temperature. It can be seen that the magnitude of the driving current applied to the TEC is positively correlated with the case temperature of the optical module. Therefore, the driving current of the TEC can be used as a reference parameter for monitoring the case temperature of the optical module. When the case temperature of the optical module rises, the driving current received by the TEC increases to control the junction temperature of the laser to remain constant. When the case temperature of the optical module decreases, the driving current received by the TEC decreases to control the junction temperature of the laser to remain constant.

[0062] In some embodiments, the MCU includes:

[0063] The third register is used to store the temperature rating of the optical module housing.

[0064] The above technical solution has the following advantages or beneficial effects: the MCU may include a third register. This third register stores the obtained optical module housing temperature for reporting purposes. Based on the reported housing temperature value, heat dissipation control or anomaly diagnosis of the optical module can be performed. When the reported housing temperature value exceeds a preset safety threshold, the optical module's heat dissipation mechanism is triggered, such as starting the fan or increasing the heat dissipation efficiency of the heat sink, to prevent the optical module from being damaged due to overheating. Attached Figure Description

[0065] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0066] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0067] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0068] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0069] Figure 4 An exploded view of an optical module according to some embodiments;

[0070] Figure 5 This is a structural diagram of a light emitting component according to some embodiments;

[0071] Figure 6 An exploded view of a light emitting component according to some embodiments;

[0072] Figure 7 An exploded structural diagram of a TEC according to some embodiments;

[0073] Figure 8 This is a schematic diagram illustrating the working principle of a TEC according to some embodiments;

[0074] Figure 9 This is a schematic diagram of a method for monitoring the housing temperature of an optical module according to some embodiments;

[0075] Figure 10 This is an internal structure of an MCU according to some embodiments. Detailed Implementation

[0076] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0077] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0078] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0079] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0080] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0081] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0082] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0083] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0084] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0085] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0086] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0087] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0088] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0089] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0090] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0091] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0092] Figure 2 This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0093] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0094] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0095] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0096] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0097] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0098] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0099] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0100] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0101] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0102] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0103] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0104] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0105] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0106] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0107] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0108] In some implementations, the gold fingers 301 are disposed on one side of the surface of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is required.

[0109] In some implementations, the gold fingers of the circuit board extend from the opening 204 and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers 301 are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0110] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0111] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0112] In some embodiments, the optical module includes a light emitting component 400. In some embodiments, the optical module includes a light receiving component 500.

[0113] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0114] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0115] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0116] Figure 5 This is a structural diagram of a light-emitting component according to some embodiments. Figure 5 As shown, in some embodiments, the light emitting component 400 includes a tube base 410, a tube cap 420, and other devices disposed within the tube cap 420 and the tube base 410. The tube cap 420 covers one end of the tube base 410, and the tube base 410 includes a plurality of pins. The pins are used to realize the electrical connection between the flexible circuit board and other electrical devices within the light emitting component 400, thereby realizing the electrical connection between the light emitting component 400 and the circuit board 300.

[0117] Figure 6 This is an exploded view of a light emitting component according to some embodiments. Figure 6 As shown, in some embodiments, the light emitting component 400 includes a laser 430, which generates signal light that passes through the cap 480. The laser 430 may be an electro-absorption modulated laser (EML), and the EML laser chip is monolithically integrated from a DFB laser and an EAM modulator. By using external modulation technology, the EML laser chip avoids the interaction between photons and electrons in the laser during high-speed modulation, reducing the large chirp caused by direct modulation, thereby enabling higher transmission rates.

[0118] In some embodiments, the light emitting component 400 includes a TEC440. The surface of the TEC440 is used to support the laser 430.

[0119] In some embodiments, by changing the direction and magnitude of the driving current applied to the TEC440, the TEC440 can be controlled to cool or heat the laser 430 mounted on its surface, thereby maintaining a constant temperature of the laser 430 and ensuring stable wavelength and output power. The TEC440 is mainly used to control the junction temperature of the laser 430 to remain constant, where junction temperature refers to the PN junction temperature of the laser 430. The TEC440 achieves cooling or heating by consuming current to transfer heat.

[0120] Figure 7 This is an exploded structural diagram of a TEC according to some embodiments. Figure 8 This is a schematic diagram illustrating the working principle of a TEC according to some embodiments. For example... Figure 7 and Figure 8 As shown, in some embodiments, TEC440 may include a first substrate 441 and a second substrate 442, which are arranged vertically opposite each other.

[0121] In some embodiments, a plurality of alternating N-type semiconductor portions 443 and P-type semiconductor portions 444 are provided between the first substrate 441 and the second substrate 442. Each N-type semiconductor portion 443 and each P-type semiconductor portion 444 are connected in series to form a thermocouple pair. A plurality of alternating N-type semiconductor portions 443 and P-type semiconductor portions 444 form a plurality of thermocouple pairs. Thus, multiple thermocouple pairs are distributed between the first substrate 441 and the second substrate 442, and these multiple thermocouple pairs are connected in series with each other.

[0122] In some embodiments, the N-type semiconductor portion 443 is obtained by doping an intrinsic semiconductor with a pentavalent impurity element, and the P-type semiconductor portion 444 is obtained by doping an intrinsic semiconductor with a trivalent impurity element. The primary charge carriers in the N-type semiconductor portion 443 are electrons, and the primary charge carriers in the P-type semiconductor portion 444 are holes. The charge carriers in both the N-type and P-type semiconductor portions 443 move in the same direction.

[0123] In some embodiments, the TEC440 may include a first electrode portion 445 and a second electrode portion 446. The first electrode portion 445 is electrically connected to the second electrode portion 446 via a plurality of thermocouple pairs connected in series between the first substrate 441 and the second substrate 442. The current flowing into the first electrode portion 445 travels sequentially up and down, passing through each of the series-connected thermocouple pairs to reach the second electrode portion 446.

[0124] In some embodiments, the first electrode portion 445 is electrically connected to the N-type semiconductor portion 443, and the second electrode portion 446 is electrically connected to the P-type semiconductor portion 444.

[0125] In some embodiments, the first electrode portion 445 and the second electrode portion 446 are respectively electrically connected to a current source on the surface of the circuit board 300, thereby supplying power to the thermocouple pair between the first substrate 441 and the second substrate 442. By adjusting the direction and magnitude of the provided driving current, the direction and magnitude of heat transfer between the first substrate 441 and the second substrate 442 can be changed, thereby controlling the temperature of the second substrate 442, and adjusting the temperature of the laser 430 carried by the second substrate 442.

[0126] In some embodiments, it is required to monitor and report the housing temperature of the optical module in real time, with a monitoring accuracy of ±3°C, to facilitate self-adjustment of system heat dissipation and self-diagnosis in case of system abnormalities. For example, when the reported housing temperature exceeds a preset safety threshold, the optical module's heat dissipation mechanism is triggered, such as starting the fan or increasing the heat dissipation efficiency of the heat sink, to prevent the optical module from being damaged due to overheating.

[0127] In some embodiments, the case temperature of the optical module refers to the temperature of a specific measurement point on the surface of the upper housing 201, which is close to the main heat source, such as the laser 430. For example, the case temperature of the optical module is characterized by the temperature of the thermally conductive connection area between the light emitting component 400 and the upper housing 201. The light emitting component 400 and the upper housing 201 are thermally connected via a thermally conductive gel. The heat generated by the light emitting component 400 is transferred to the upper housing 201 through the thermally conductive gel. Therefore, the surface temperature of the upper housing 201 is a better indicator of the temperature state and level of the optical module than the surface temperature of the lower housing 202.

[0128] In some embodiments, the housing temperature of the optical module is approximately equal to the highest temperature of the upper housing 201 of the optical module. The closer the monitored and reported temperature is to the highest temperature of the upper housing 201 of the optical module, the higher the monitoring accuracy.

[0129] In some embodiments, the temperature is sampled using the built-in temperature sensor of the MCU302, and then an algorithm is used to fit the current case temperature. The temperature collected by the built-in temperature sensor of the MCU302 can reflect the overall temperature change trend and overall temperature state of the optical module, and can characterize the overall ambient temperature level of the optical module. However, since the MCU302 is usually placed at the edge of the circuit board, at a certain distance from the main heat sources such as the laser 430, the temperature monitored by its built-in temperature sensor lags behind the temperature of the thermally conductive connection area between the light emitting component 400 and the upper housing 201, that is, lags behind the case temperature of the optical module, thus resulting in reduced monitoring accuracy.

[0130] In some embodiments, the TEC440 maintains a constant junction temperature of the laser 430 under the influence of the drive current. When the case temperature of the optical module rises, it means that the ambient temperature in the area where the laser 430 is located has increased. Therefore, in order to maintain a constant junction temperature of the laser 430, a larger drive current needs to be applied to the TEC440 to drive the TEC440 to do more work to counteract the increased ambient temperature. It is evident that the magnitude of the drive current applied to the TEC440 is positively correlated with the case temperature of the optical module. Therefore, the drive current of the TEC440 can be used as a reference parameter for monitoring the case temperature of the optical module.

[0131] In some embodiments, when the case temperature of the optical module increases, the drive current received by TEC440 increases to maintain a constant junction temperature of laser 430. When the case temperature of the optical module decreases, the drive current received by TEC440 decreases to maintain a constant junction temperature of laser 430.

[0132] In some embodiments, the driving current of TEC440 is approximately linearly related to the temperature of the thermal environment where laser 430 is located. Therefore, the thermal load of the region where laser 430 is located can be indirectly characterized by the driving current of TEC440.

[0133] In some embodiments, the temperature represented by the drive current based on TEC440 mainly reflects local temperature control behavior, specifically characterizing the local high-temperature point in the area where laser 430 is located, and cannot fully cover the influence of the overall thermal environment of the optical module.

[0134] In some embodiments, a compensation temperature is generated based on the drive current of the TEC440. This compensation temperature is then used to compensate for the monitored temperature of the temperature sensor built into the MCU302, thereby obtaining a higher-precision optical module housing temperature characterization value. Based on this, the MCU302 is configured to: generate a compensation temperature based on the drive current of the TEC440, and use this compensation temperature to compensate for the monitored temperature of the temperature sensor, thereby obtaining the optical module housing temperature characterization value.

[0135] In some embodiments, when the monitoring temperature of MCU302 is compensated by the compensation temperature, the compensation temperature represents the local high temperature point in the area where the laser 430 is located, and the monitoring temperature of MCU302 represents the overall ambient temperature level of the optical module. The combination of the two can simultaneously reflect the local high temperature point and the overall temperature state of the optical module, so that the generated shell temperature characterization value is closer to the highest temperature of the upper shell 201 of the optical module, and further closer to the temperature of the thermally conductive connection area between the light emitting component and the upper shell, thus being closer to the actual shell temperature value of the optical module and improving the shell temperature monitoring accuracy.

[0136] In some embodiments, when obtaining the compensated temperature based on the drive current of the TEC440, the drive current of the TEC440 can be converted into the compensated temperature using a conversion factor pre-stored in the internal register of the MCU302. Alternatively, it can be based on a preset current-temperature correspondence table. This table records the temperature compensation values ​​corresponding to different drive currents.

[0137] Figure 9 This is a schematic diagram of a method for monitoring the housing temperature of an optical module according to some embodiments. Figure 9 As shown, in some embodiments, the optical module housing temperature monitoring method may include:

[0138] S110: TEC-based drive current generation compensation temperature.

[0139] In some embodiments, MCU302 may include a first register. The first register is used to store the drive current of TEC440.

[0140] In some embodiments, the temperature characterized by the drive current based on TEC440 mainly reflects local temperature control behavior, specifically representing the local high-temperature point in the area where laser 430 is located. The compensated temperature obtained from the drive current based on TEC440 is used to compensate for the monitored temperature of the temperature sensor built into MCU302, thereby obtaining a higher-precision monitoring temperature of the optical module housing.

[0141] In some embodiments, the MCU302 acquires the drive current of the TEC440 in real time through a current sampling circuit on the surface of the circuit board 300 and stores the sampled value in a first register. The current sampling circuit may include a sampling resistor connected in series in the drive circuit of the TEC440. When the TEC440 is working, the drive current flows through the sampling resistor, generating a voltage drop proportional to the current across the sampling resistor. This voltage drop is then transmitted to the analog-to-digital converter for processing, ultimately yielding a value representing the TEC drive current.

[0142] In some embodiments, MCU302 may include a fourth register. The fourth register is used to store the conversion factor 'a'. The conversion factor 'a' can be obtained in advance from experimental data and stored in the fourth register.

[0143] In some embodiments, the compensation temperature can be obtained based on the drive current of the TEC440 and a conversion factor. The conversion factor is used to convert the drive current of the TEC440 into a compensation temperature. The conversion factor characterizes the conversion relationship between the TEC drive current and the compensation temperature.

[0144] In some embodiments, the TEC-based drive current generation compensation temperature may include: via a*I TECThe compensated temperature generated by the drive current based on the TEC can be calculated. Here, 'a' is the conversion factor read from the fourth register, and I... TEC This is the drive current of the TEC read from the first register.

[0145] In some embodiments, generating a compensated temperature based on the TEC's drive current may include using a preset current-temperature correspondence table. This table records the temperature compensation values ​​corresponding to different drive currents. When the actual drive current of the TEC440 is obtained, the corresponding temperature compensation value is obtained by looking up the correspondence table; this is the compensated temperature.

[0146] S120: Generates a calibrated monitoring temperature based on the monitored temperature and calibration coefficient of the temperature sensor.

[0147] In some embodiments, MCU302 may include a second register. The second register is used to store the monitored temperature of the built-in temperature sensor of MCU302, and MCU302 stores the acquired monitored temperature into the second register.

[0148] In some embodiments, MCU302 may include a fifth register. The fifth register is used to store the calibration coefficient b. The calibration coefficient b can be obtained in advance from experimental data and stored in the fifth register.

[0149] In some embodiments, a calibration factor is used to calibrate the temperature monitored by the built-in temperature sensor of the MCU302 to improve monitoring accuracy. The calibration factor represents the degree of calibration of the temperature monitored by the built-in temperature sensor of the MCU302. The calibration factor can correct errors caused by factors such as manufacturing processes and aging of the built-in temperature sensor of the MCU302, thereby improving the accuracy of temperature monitoring.

[0150] In some embodiments, generating a calibration monitoring temperature based on the monitored temperature of a temperature sensor and a calibration coefficient may include: using b*T MCU The calibration monitoring temperature can be calculated. Here, b is the calibration coefficient read from the fifth register, and T... MCU The temperature is read from the second register, which is the temperature monitored by the built-in temperature sensor of the MCU302.

[0151] S130: Generates the optical module shell temperature characterization value based on the compensation temperature, calibration monitoring temperature, and compensation coefficient.

[0152] In some embodiments, the MCU302 may include a sixth register. The sixth register stores a compensation coefficient c. The compensation coefficient c is used to further compensate the converted compensated temperature and the calibrated monitoring temperature to improve the accuracy of the case temperature monitoring. The compensation coefficient c represents the degree of further compensation based on the actual working environment and conditions of the optical module.

[0153] In some embodiments, the compensation coefficient c can be obtained in advance from experimental data and stored in a third register within the MCU302. For example, the compensation coefficient c is obtained in advance from experimental data based on the actual operating environment and conditions of the optical module. The compensation coefficient c can further correct the temperature value obtained from the conversion coefficient and calibration coefficient to more accurately reflect the actual housing temperature of the optical module.

[0154] In some embodiments, generating the optical module housing temperature characterization value based on the compensation temperature, calibration monitoring temperature, and compensation coefficient may include: summing the compensation temperature, calibration monitoring temperature, and compensation coefficient to generate the optical module housing temperature characterization value.

[0155] In some embodiments, coefficients a, b, and c represent the conversion relationship between the TEC drive current and the compensated temperature, the calibration degree of the temperature monitored by the MCU302 built-in temperature sensor, and the degree of further compensation based on the actual working environment and conditions of the optical module, respectively. These coefficients work together to calculate the case temperature, thereby ensuring that the final case temperature characterization value of the optical module can more accurately reflect the highest temperature of the upper housing 201 of the optical module, and improve the accuracy of case temperature monitoring.

[0156] In some embodiments, based on the shell temperature calculation model T final =a*I TEC +b*T MCU +c calculates and generates the temperature characterization value of the optical module casing. Where a is the conversion factor, b is the calibration factor, c is the compensation factor, and I... TEC T is the drive current flowing through the TEC. MCU T represents the temperature monitored by the temperature sensor. final This represents the temperature characterization value of the optical module's casing. The compensated temperature, obtained based on the TEC440's drive current and conversion factor, is a*I. TEC The calibrated monitoring temperature for the MCU302's built-in temperature sensor is b*T, calibrated based on a calibration coefficient. MCU .

[0157] In some embodiments, the compensated temperature obtained based on the drive current and conversion factor of TEC440 can characterize the local high temperature point in the area where the laser 430 is located, and the calibrated temperature monitored by MCU302 can characterize the overall ambient temperature level of the optical module. The combination of the two can simultaneously reflect the local high temperature point and the overall temperature state of the optical module, so that the generated shell temperature is closer to the highest temperature of the shell 201 on the optical module, thereby improving the shell temperature monitoring accuracy.

[0158] In some embodiments, the MCU302 may include a third register. The third register is used to store the obtained optical module housing temperature characterization value for reporting purposes. For example, the MCU302 can continuously read the drive current of the TEC440 and the monitored temperature of the built-in temperature sensor at preset time intervals, and then use the conversion coefficient, calibration coefficient, and compensation coefficient stored in the register to calculate and update the optical module housing temperature characterization value through the housing temperature calculation model, and then report the obtained housing temperature characterization value.

[0159] In some embodiments, the optical module can be controlled for heat dissipation or diagnosed for abnormalities based on the reported case temperature value. When the reported case temperature value exceeds a preset safety threshold, the optical module's heat dissipation mechanism is triggered, such as starting the fan or increasing the heat dissipation efficiency of the heat sink, to prevent the optical module from being damaged due to overheating.

[0160] Figure 10 This is an internal structure of an MCU according to some embodiments. For example... Figure 10 As shown, in some embodiments, MCU302 may include a first register for storing the drive current of TEC440.

[0161] In some embodiments, MCU302 may include a second register for storing the monitored temperature of the temperature sensor built into MCU302.

[0162] In some embodiments, MCU302 may include a third register for storing the obtained optical module case temperature characterization value.

[0163] In some embodiments, MCU302 may include a fourth register for storing a conversion factor 'a'. The conversion factor 'a' can be obtained in advance from experimental data and stored in the fourth register.

[0164] In some embodiments, MCU302 may include a fifth register for storing calibration coefficient b. The calibration coefficient b can be obtained in advance from experimental data and stored in the fifth register.

[0165] In some embodiments, MCU302 may include a sixth register for storing compensation coefficient c. The compensation coefficient c can be obtained in advance from experimental data and stored in a third register within MCU302.

[0166] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An optical module characterized by comprising: include: Upper shell; The lower housing is fitted and connected to the upper housing to form a wrapping cavity; The circuit board is disposed within the encapsulated cavity; A light-emitting component, electrically connected to the circuit board, wherein the temperature of the thermally conductive connection area between the light-emitting component and the upper housing is used to characterize the housing temperature of the optical module, and the light-emitting component includes: Lasers are used to emit optical signals; The TEC, a surface used to support the laser, is configured to receive drive current for temperature regulation of the laser; An MCU, electrically connected to the circuit board, has a built-in temperature sensor. The MCU includes: The first register is used to store the drive current of the TEC; The second register is used to store the temperature monitored by the temperature sensor; The third register is used to store the optical module housing temperature characterization value. The generation of the optical module housing temperature characterization value includes: generating a compensation temperature based on the drive current of the TEC, and compensating the monitoring temperature of the temperature sensor with the compensation temperature to obtain the optical module housing temperature characterization value.

2. The optical module according to claim 1, characterized by The MCU includes: The fourth register is used to store the conversion factor; The fifth register is used to store calibration coefficients; The sixth register is used to store the compensation coefficients; The MCU is configured as follows: The compensation temperature is generated based on the driving current of the TEC and the conversion factor. A calibration monitoring temperature is generated based on the monitored temperature of the temperature sensor and the calibration coefficient. The optical module housing temperature characterization value is generated based on the compensation temperature, the calibration monitoring temperature, and the compensation coefficient.

3. The optical module according to claim 2, characterized by The MCU is configured as follows: Based on the shell temperature calculation model T final =a*I TEC +b*T MCU +c calculates and generates the temperature characterization value of the optical module casing; Wherein, a is a conversion coefficient, b is a calibration coefficient, c is a compensation coefficient, I TEC is a driving current flowing through the TEC, T MCU is a monitoring temperature of the temperature sensor, T final is a shell temperature characteristic value of the optical module.

4. The optical module according to claim 1, characterized by The TEC is configured to control the junction temperature of the laser to remain constant under the drive of the drive current; wherein, when the case temperature of the optical module increases, the drive current received by the TEC increases to control the junction temperature of the laser to remain constant; when the case temperature of the optical module decreases, the drive current received by the TEC decreases to control the junction temperature of the laser to remain constant.

5. The optical module according to claim 1, characterized by The TEC includes a first substrate and a second substrate; Multiple sets of alternately arranged N-type semiconductor portions and P-type semiconductor portions are provided between the first substrate and the second substrate; The TEC includes a first electrode portion and a second electrode portion. The first electrode portion is electrically connected to the second electrode portion through an N-type semiconductor portion and a P-type semiconductor portion connected in series between the first substrate and the second substrate. The first electrode portion and the second electrode portion are respectively electrically connected to a current source on the surface of the circuit board to supply power to the N-type semiconductor portion and the P-type semiconductor portion between the first substrate and the second substrate.

6. An optical module characterized by comprising: include: Upper shell; The lower housing is fitted and connected to the upper housing to form a wrapping cavity; A circuit board is disposed within the encapsulated cavity; A light-emitting component, electrically connected to the circuit board, wherein the temperature of the thermally conductive connection area between the light-emitting component and the upper housing is used to characterize the housing temperature of the optical module, and the light-emitting component includes: Lasers are used to emit optical signals; The TEC, a surface used to support the laser, is configured to receive drive current for temperature regulation of the laser; The MCU is electrically connected to the circuit board and has a built-in temperature sensor. The MCU is configured to generate a compensation temperature based on the drive current of the TEC, and to compensate the monitored temperature of the temperature sensor by the compensation temperature, thereby obtaining the temperature characterization value of the optical module shell.

7. The optical module according to claim 6, characterized by The MCU includes: The first register is used to store the drive current of the TEC; The second register is used to store the temperature monitored by the temperature sensor; The fourth register is used to store the conversion factor; The fifth register is used to store calibration coefficients; The sixth register is used to store the compensation coefficients; The MCU is configured as follows: The compensation temperature is generated based on the driving current of the TEC and the conversion factor. A calibration monitoring temperature is generated based on the monitored temperature of the temperature sensor and the calibration coefficient. The optical module housing temperature characterization value is generated based on the compensation temperature, the calibration monitoring temperature, and the compensation coefficient.

8. The optical module according to claim 7, characterized by The MCU is configured as follows: According to the shell temperature calculation model T final = a * I TEC + b * T MCU + c, the shell temperature characterization value of the light module is generated. Where a is the conversion factor, b is the calibration factor, c is the compensation factor, and I TEC T is the drive current flowing through the TEC. MCU T represents the temperature monitored by the temperature sensor. final This is the temperature characterization value of the optical module casing.

9. The optical module of claim 6, wherein, The compensation temperature generated by the drive current of the TEC is positively correlated with the housing temperature of the optical module.

10. The optical module of claim 6, wherein, The MCU includes: The third register is used to store the temperature rating of the optical module housing.

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