A brand new, specially sealed, dustproof, and waterproof light source
By employing a multi-layered sealing structure and a positive pressure air curtain mechanism, the problem of water mist contamination of the light source on semiconductor cutting equipment has been solved, achieving miniaturization of the light source and efficient recognition, thereby improving imaging clarity and equipment space utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BOJIEXIN (SHENZHEN) SEMICON CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-07-03
AI Technical Summary
Existing light sources cause water mist to contaminate the lens and light source on semiconductor cutting equipment, affecting the recognition effect. At the same time, their large size does not meet the requirements for equipment miniaturization.
It employs a multi-layer sealing structure and a positive pressure air curtain mechanism to prevent water mist from entering the optical components, and cleans the product surface through an independent air blowing channel. It integrates the light source, air path and sealing structure to reduce the system size.
It effectively prevents water mist pollution, ensures light source brightness and imaging clarity, achieves light source miniaturization and functional integration, and improves recognition reliability.
Smart Images

Figure CN224457202U_ABST