A tray stage assembly for a chip lithography machine

Abstract

This utility model relates to a chip lithography machine pallet assembly in the field of chip manufacturing equipment. It includes a lithography machine body with a pallet body mounted on it. A positioning plate is detachably connected to the pallet body, and the positioning plate has a pre-set positioning groove. The assembly also includes a carrier plate slidably connected within the positioning groove to support the chip to be processed. The carrier plate is initially positioned in the positioning groove. The pallet body has an internal lifting mechanism. In this application, the carrier plate is initially embedded in the positioning groove, and its upper surface is lower than the positioning plate, forming a stepped structure. This physical limitation prevents chip displacement, thus improving processing accuracy and preventing damage. The lifting mechanism converts the horizontal thrust of the screw into the vertical lifting force of the top block via an inclined plane transmission. This design is simple and highly accurate, precisely controlling the lifting height of the carrier plate to reduce equipment failure rate. After the carrier plate is ejected, its upper surface is higher than the positioning plate, solving the problem of inconvenient chip handling, reducing the risk of contact damage, and improving loading and unloading efficiency.

Description

Technical Field

[0001] This utility model relates to a tray mold assembly for a chip lithography machine, and more particularly to a tray mold assembly for a chip lithography machine used in the field of chip manufacturing equipment. Background Technology

[0002] As the core component of electronic devices, chips directly determine the computing speed, power consumption, and stability of terminal products. They are widely used in smartphones, computers, aerospace, and other fields. Among them, logic chips, memory chips (such as DRAM and NAND Flash), power chips, image sensor chips (CIS), and other types of chips all require precise etching of circuit patterns through photolithography during the manufacturing process.

[0003] Currently, in the photolithography process, the chip to be processed needs to be supported and positioned by a tray stage assembly to ensure that the photolithography exposure system can accurately etch circuit patterns on the chip surface. Therefore, the positioning stability, motion accuracy and ease of operation of the tray stage have become one of the key factors affecting the chip processing yield.

[0004] However, current chip lithography machine pallet stage assemblies on the market mostly employ complex drive devices such as cylinder drives and motor lead screw drives to achieve the lifting function of the carrier plate. These devices are not only bulky and prone to spatial interference with other components inside the lithography machine, but also suffer from problems such as aging of seals and motor failures, resulting in a high equipment failure rate. At the same time, the transmission links of complex drive devices are long, making it difficult to accurately control the lifting height of the carrier plate and to flexibly adapt to the positioning requirements during chip processing and the pick-and-place requirements after processing. In addition, in some pallet stage designs, after processing, the carrier plate is flush with or lower than the positioning plate, and the chip is still constrained by the positioning groove. When the robot or manual picks and places the chip, it must overcome the obstruction of the positioning groove, which is not only inconvenient and inefficient, but also prone to chip edge damage due to contact and collision during the pick-and-place process, further reducing the chip production yield. In view of this, this utility model is proposed. Utility Model Content

[0005] The technical problem to be solved by this utility model in view of the above-mentioned prior art is that the existing equipment has a complex drive structure, high failure rate, and unreasonable design of the bearing plate, which affects production efficiency and yield.

[0006] To address the aforementioned issues, this utility model provides a chip lithography machine tray assembly, comprising a lithography machine body equipped with a tray body, a positioning plate detachably connected to the tray body, and a positioning groove pre-set on the positioning plate, and further comprising: a carrier plate for carrying the chip to be processed is slidably connected within the positioning groove, the carrier plate being initially placed in the positioning groove, and a lifting mechanism provided inside the tray body, which can push the carrier plate out of the positioning groove after chip processing is completed, with the upper surface of the carrier plate being higher than the upper surface of the positioning plate in the pushed-out state.

[0007] As a further improvement of this application, the lifting mechanism includes a guide rod and a top block. The guide rod is slidably connected to the mold table body. One end of the guide rod, which passes through the upper surface of the mold table body, is detachably connected to the support plate. The side wall of the top block is inclined. The top block is disposed inside the mold table body and is connected to the end of the guide rod that passes through the mold table body. A screw is threadedly connected to the mold table body. One end of the screw that passes through the mold table body abuts against the inclined surface of the top block.

[0008] As a further improvement of this application, it also includes a drive handle, which is attached to one end of the screw that extends out of the mold body.

[0009] As a further improvement of this application, one end of the screw that passes through the interior of the mold body is rotatably connected to a frame, and a roller is rotatably connected to the frame via a rotating shaft. The roller contacts the inclined surface of the top block. Slide rods are symmetrically connected inside the mold body, and the frame is slidably connected to the slide rods via supports.

[0010] As another improvement of this application, the top block is set as a counterweight.

[0011] As a further improvement to this application, one end of the spring sleeved on the guide rod is connected to the top block, and the other end is connected to the inner wall of the mold body.

[0012] As a further improvement to this application, the upper end of the guide rod and the lower end face of the bearing plate are both provided with magnetic blocks, and the two magnetic blocks are attracted to each other magnetically.

[0013] As a further improvement to this application, a locking block is symmetrically connected to the upper end of the mold body, a locking groove corresponding to the locking block is provided on the positioning plate, a sliding groove is provided on one side of the locking block, a locking core is slidably connected in the sliding groove, and a spring provided in the sliding groove has one end connected to the locking core and the other end connected to the inner wall of the sliding groove.

[0014] As a further improvement to this application, the upper surface of the locking block is inclined.

[0015] In summary, the lifting mechanism of this application converts the horizontal thrust of the screw into the vertical lifting force of the top block through inclined plane transmission. It has a simple and compact structure, high transmission accuracy, and can accurately control the lifting height of the bearing plate to meet the different position requirements of processing and loading / unloading, avoid the failure of complex drive devices, and reduce the equipment failure rate.

[0016] After the carrier plate is ejected, its upper surface is higher than the positioning plate, which allows the chip to be removed from the positioning slot limit, making it easier for a robot or manual to quickly pick up and put down the chip. This solves the problem of inconvenience in picking up and putting down the chip after processing because it is lower than the positioning plate, reduces the risk of contact damage to the chip during the picking and putting process, and improves loading and unloading efficiency.

[0017] The carrier plate is initially embedded in the positioning groove and its upper surface is lower than the positioning plate, forming a stepped structure. The side wall of the positioning groove fits the chip edge through physical limiting, which can block external vibration and equipment impact, avoid horizontal displacement or tilting of the chip, ensure the relative position stability of the chip and the lithography exposure system, improve processing accuracy, and prevent the chip from being damaged at the edge due to displacement and collision with the positioning plate.

[0018] The lock block and lock cylinder can be installed and removed without tools. The inclined design of the upper surface of the lock block can automatically push the lock cylinder into the slide groove, eliminating the need for manual pressing and achieving one-click installation. This avoids installation jamming, reduces the difficulty of operation, and improves the efficiency of replacing the positioning plate. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the mold platform body and positioning plate of this utility model;

[0021] Figure 3 This is a cross-sectional view of the mold platform body and positioning plate of this utility model. Figure 1 ;

[0022] Figure 4 This is a cross-sectional view of the mold platform body and positioning plate of this utility model. Figure 2 ;

[0023] Figure 5 This is a schematic diagram showing the unfolded structure of the mold platform body and positioning plate of this utility model;

[0024] Figure 6 This is a partial structural schematic diagram of the present invention;

[0025] Figure 7 This utility model Figure 3 Enlarged view of part A in the middle.

[0026] Explanation of the labels in the diagram:

[0027] 1. Photolithography machine body; 101. Mold table body; 102. Positioning plate; 103. Positioning groove; 104. Bearing plate; 2. Locking block; 201. Locking groove; 202. Slide groove; 203. Locking core; 204. Spring 1; 3. Guide rod; 301. Top block; 302. Spring 2; 303. Screw; 304. Drive handle; 4. Frame; 401. Roller; 402. Support; 403. Slide rod; 5. Magnetic block. Detailed Implementation

[0028] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0029] Figure 1 , Figure 2 , Figure 3 The diagram shows a chip lithography machine tray assembly, including a lithography machine body 1 with a tray body 101 mounted on it. A positioning plate 102 is detachably connected to the tray body 101, and a positioning groove 103 is pre-set on the positioning plate 102. The assembly also includes a carrier plate 104 that carries the chip to be processed, which is slidably connected in the positioning groove 103. The carrier plate 104 is initially placed in the positioning groove 103. A lifting mechanism is provided inside the tray body 101. After the chip processing is completed, the lifting mechanism can push the carrier plate 104 out of the positioning groove 103. In the pushed-out state, the upper surface of the carrier plate 104 is higher than the upper surface of the positioning plate 102.

[0030] Before chip processing, the carrier plate 104 is embedded in the positioning groove 103, with its upper surface lower than the upper surface of the positioning plate 102, forming a stepped structure. When the chip to be processed is placed on the carrier plate 104, the sidewall of the positioning groove 103 fits against the edge of the chip, and the chip is accurately positioned by physical limiting. This design utilizes the height difference between the positioning groove 103 and the carrier plate 104 to effectively block the impact force generated by external vibration or equipment operation during chip processing, avoid horizontal displacement or tilting of the chip, ensure the relative positional stability of the chip and the lithography exposure system, improve processing accuracy, and prevent edge damage caused by chip displacement and collision with the positioning plate 102.

[0031] After the chip processing is completed, the lifting mechanism inside the mold body 101 is activated. Through mechanical transmission, the support plate 104 is driven to slide upward along the positioning groove 103 until the upper surface of the support plate 104 is higher than the upper surface of the positioning plate 102. At this time, the chip is removed from the limit of the positioning groove 103, which makes it easy for the robot or man to quickly pick up and put down the chip. This solves the problem of the chip being inconvenient to pick up and put down after processing because it is lower than the positioning plate 102, reduces the risk of contact damage to the chip during the picking and putting process, and improves the efficiency of chip loading and unloading.

[0032] Figure 2 , Figure 3 , Figure 4 , Figure 6As shown, the lifting mechanism includes a guide rod 3 and a top block 301. The guide rod 3 is slidably connected to the mold base body 101. One end of the guide rod 3, which passes through the upper surface of the mold base body 101, is detachably connected to the support plate 104. The side wall of the top block 301 is inclined. The top block 301 is located inside the mold base body 101 and is connected to one end of the guide rod 3, which passes through the mold base body 101. A screw 303 is threaded onto the mold base body 101. One end of the screw 303, which passes through the mold base body 101, abuts against the inclined surface of the top block 301.

[0033] When it is necessary to lift the support plate 104, the screw 303 is rotated to push it into the mold table along the threaded hole. The spherical end of the screw 303 presses against the inclined surface of the top block 301, converting the horizontal thrust of the screw 303 into the vertical upward force of the top block 301. This causes the top block 301 to drive the guide rod 3 to slide upward along the linear bearing, thereby pushing the support plate 104 out of the positioning groove 103. When the screw 303 is rotated in the opposite direction, the top block 301 loses its thrust and, under the action of gravity, drives the guide rod 3 and the support plate 104 to reset. This mechanism realizes the conversion of force direction through inclined plane transmission. It has a simple and compact structure, high transmission accuracy, and can accurately control the lifting height of the support plate 104 to meet the different position requirements of chip processing and pick-up and drop. At the same time, it avoids the use of complex drive devices and reduces the equipment failure rate.

[0034] Figure 4 , Figure 5 , Figure 6 As shown, it also includes a drive handle 304, which is connected to one end of the screw 303 that extends to the outside of the mold body 101. The surface of the drive handle 304 is processed with anti-slip texture.

[0035] The operator rotates the screw 303 by holding the drive handle 304, which reduces the force required to rotate the screw 303 by using the lever principle. Compared with directly rotating the screw 303, the drive handle 304 increases the lever arm, making the lifting operation more labor-saving and convenient. At the same time, the anti-slip texture can prevent the hand from slipping during operation, improve the safety and stability of operation, and enhance the human-machine interaction performance of the equipment.

[0036] In addition, the drive handle 304 and screw 303 can be replaced with the screw adjustment component of a micrometer and the graduated screw rod component. This design can not only achieve fine adjustment of the screw 303, but also directly read the adjustment distance through the screw adjustment component of the micrometer.

[0037] Figure 4 As shown, one end of the screw 303 that passes through the interior of the mold body 101 is rotatably connected to a frame 4. A roller 401 is rotatably connected to the frame 4 via a rotating shaft. The roller 401 is in contact with the inclined surface of the top block 301. A slide rod 403 is symmetrically connected inside the mold body 101. The frame 4 is slidably connected to the slide rod 403 via a support 402.

[0038] When the screw 303 is rotated, it pushes the frame 4 to move horizontally along the slide bar 403. The roller 401 on the frame 4 rolls on the inclined surface of the top block 301 and applies pressure, which transforms the traditional sliding friction into rolling friction. This greatly reduces the friction during the transmission process, reduces component wear, and extends the service life of the equipment. At the same time, the cooperation between the slide bar 403 and the support 402 ensures that the frame 4 only moves horizontally, avoiding the screw 303 from bearing radial force, ensuring the stability and accuracy of the transmission, and making the lifting process of the bearing plate 104 smoother.

[0039] Figure 3 , Figure 4 As shown, the top block 301 is made of high-density cast iron material, and its weight is greater than the total weight of the guide rod 3, the support plate 104 and the chip, ensuring that the support plate 104 can be moved down and reset when no external force is applied.

[0040] When the screw 303 rotates in the reverse direction and retracts, the top block 301 uses its own gravity to generate a downward pulling force, which drives the guide rod 3 and the carrier plate 104 to automatically fall back to the initial position. Compared with the structure that relies on external elastic elements for reset, the reset process of the counterweight top block 301 is more reliable and is not affected by the aging of elastic elements. At the same time, gravity reset can avoid the problem of over- or under-reset, ensuring the consistency of the position of the carrier plate 104 after each reset and improving the repeatability of chip processing.

[0041] Figure 3 , Figure 6 As shown, one end of the spring 302 sleeved on the guide rod 3 is connected to the top block 301, and the other end is connected to the inner wall of the mold body 101.

[0042] When the top block 301 is lifted, the second spring 302 is compressed and stores elastic potential energy. When the screw 303 retracts, the second spring 302 releases its elastic potential energy, which, together with the gravity of the top block 301, pushes the top block 301, guide rod 3, and bearing plate 104 to quickly and smoothly reset. The addition of the second spring 302 can buffer the impact force during the reset process, avoid damage to components due to rigid collisions, and at the same time speed up the reset speed and improve the working efficiency of the equipment. In addition, the spring force can compensate for the insufficient gravity of the top block 301, ensuring reliable reset under various working conditions.

[0043] Figure 3 As shown, circular permanent magnets are embedded in the upper end face of the guide rod 3 and the lower end face of the support plate 104 as magnetic blocks 5. The opposite polarities of the two magnetic blocks 5 are opposite to ensure that sufficient adsorption force can be generated to fix the support plate 104.

[0044] When installing the carrier plate 104, it is placed at the top of the guide rod 3, and the magnetic attraction between the two magnetic blocks 5 achieves quick positioning and fixation without the need for additional tightening. When it is necessary to replace the carrier plate 104 with a different specification, it can be removed by applying a pulling force slightly greater than the magnetic force. This design simplifies the loading and unloading process of the carrier plate 104, shortens the replacement time, and improves the equipment's adaptability to chips of different sizes. At the same time, the magnetic connection can reduce mechanical wear and avoid the loosening problems that may occur with threaded connections, ensuring the stability of the carrier plate 104 during the processing.

[0045] Figure 2 , Figure 3 , Figure 5 , Figure 7 As shown, a locking block 2 is symmetrically connected to the upper end of the mold body 101. A locking groove 201 corresponding to the locking block 2 is provided on the positioning plate 102. A sliding groove 202 is provided on one side of the locking block 2. A lock cylinder 203 is slidably connected in the sliding groove 202. A spring 204 is provided in the sliding groove 202, with one end connected to the lock cylinder 203 and the other end connected to the inner wall of the sliding groove 202.

[0046] When installing the positioning plate 102, first manually press the lock cylinder 203 into the slide groove 202. As the lock cylinder 203 slides into the slide groove 202, it compresses the spring 204 until the lock cylinder 203 is completely retracted into the slide groove 202. At this time, align the lock groove 201 with the lock block 2 and press it down. When the slide groove 202 is partially blocked by the lock groove 201, the lock cylinder 203 can be released. Then, when the positioning plate 102 is completely attached to the mold table body 101, the lock cylinder 203 pops out under the elastic force of the spring 204, so that it is locked on the surface of the upper end of the positioning plate 102, thereby achieving quick fixation of the positioning plate 102.

[0047] During disassembly, simply press the lock cylinder 203 into the slide groove 202 to unlock it. This structure allows for the installation and removal of the positioning plate 102 without the need for tools, making the operation convenient.

[0048] Figure 7 As shown, the upper surface of the locking block 2 is inclined;

[0049] When installing the positioning plate 102, the edge of the lock groove 201 first contacts the inclined surface of the lock block 2. As the positioning plate 102 is pressed down, the inclined surface converts the vertical pressure into a horizontal component force, automatically pushing the lock cylinder 203 into the slide groove 202. This design eliminates the step of manually pressing the lock cylinder 203, realizing one-click installation of the positioning plate 102, further simplifying the operation process and improving the efficiency of replacing the positioning plate 102. At the same time, the guiding effect of the inclined surface can avoid jamming during installation, reduce the difficulty of operation, and improve the ease of use of the equipment.

[0050] In light of current practical needs, the above-described embodiments adopted in this application are not limited to these. Any changes made within the scope of knowledge possessed by those skilled in the art without departing from the concept of this application still fall within the protection scope of this utility model.

Claims

1. A lithography machine tray assembly, comprising a lithography machine body (1) on which a tray body (101) is mounted, wherein a positioning plate (102) is detachably connected to the tray body (101), and the positioning plate (102) has a pre-set positioning groove (103), characterized in that, Also includes: A carrier plate (104) for carrying the chip to be processed is slidably connected in the positioning groove (103). The carrier plate (104) is initially placed in the positioning groove (103). The mold body (101) is provided with a lifting mechanism. After the chip processing is completed, the lifting mechanism can push the carrier plate (104) out of the positioning groove (103). In the pushed-out state, the upper surface of the carrier plate (104) is higher than the upper surface of the positioning plate (102).

2. The wafer prober with a carrier plate module assembly according to claim 1, wherein: The lifting mechanism includes a guide rod (3) and a top block (301). The guide rod (3) is slidably connected to the mold table body (101). One end of the guide rod (3) that passes through the upper surface of the mold table body (101) is detachably connected to the support plate (104). The side wall of the top block (301) is inclined. The top block (301) is located inside the mold table body (101) and is connected to one end of the guide rod (3) that passes through the mold table body (101). A screw (303) is threaded onto the mold table body (101). One end of the screw (303) that passes through the mold table body (101) abuts against the inclined surface of the top block (301).

3. The wafer prober board module assembly of claim 2, wherein: It also includes a drive handle (304), which is attached to one end of the screw (303) extending outside the mold body (101).

4. The wafer prober board module assembly of claim 2, wherein: The screw (303) passes through the interior of the mold body (101) and is rotatably connected to a frame (4). A roller (401) is rotatably connected to the frame (4) via a rotating shaft. The roller (401) is in contact with the inclined surface of the top block (301). A slide rod (403) is symmetrically connected inside the mold body (101). The frame (4) is slidably connected to the slide rod (403) via a support (402).

5. The wafer stepper substrate plate module assembly of claim 2, wherein: The top block (301) is set as a counterweight.

6. The wafer photolithography stage assembly of claim 5, wherein: One end of the spring 2 (302) sleeved on the guide rod (3) is connected to the top block (301), and the other end is connected to the inner wall of the mold body (101).

7. The chip lithography machine tray assembly according to claim 2, characterized in that: The upper end of the guide rod (3) and the lower end of the bearing plate (104) are both provided with magnetic blocks (5), and the two magnetic blocks (5) are attracted to each other magnetically.

8. The wafer prober with a carrier plate module assembly according to claim 1, wherein: The upper end of the mold body (101) is symmetrically connected to a locking block (2). The positioning plate (102) has a locking groove (201) corresponding to the locking block (2). A sliding groove (202) is provided on one side of the locking block (2). A lock core (203) is slidably connected in the sliding groove (202). A spring (204) set in the sliding groove (202) has one end connected to the lock core (203) and the other end connected to the inner wall of the sliding groove (202).

9. The wafer photolithography stage assembly of claim 8, wherein: The upper surface of the locking block (2) is inclined.

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