A glue injection fixture for thin film capacitor modules

Abstract

A glue-filling fixture for a thin-film capacitor module includes an upper mold, a lower mold, a connecting positioning pin, and a snap-fit ​​clamp. The upper and lower molds are connected or opened via the snap-fit ​​clamp and the connecting positioning pin. A first split fixture is provided between the upper and lower molds. The first split fixture includes a first upper mold clamping pin, a first lower mold clamping pin, and a position correction block. The position correction block has an upper connecting post and a lower connecting post at its upper and lower ends, respectively. The upper connecting post is connected inside the first upper mold clamping pin, and the lower connecting post passes through a hole in the first copper busbar and the product's plastic shell before connecting to the first lower mold clamping pin. In this invention, the position correction block on the first split fixture prevents scratches on the copper busbar when the upper and lower molds are connected and fixed, as the copper busbar is not fixed.

Description

Technical Field

[0001] This utility model relates to a production equipment for thin film capacitor modules, and more particularly to a glue injection fixture for thin film capacitor modules. Background Technology

[0002] Film capacitors are high-performance capacitors with non-polarity, high insulation resistance, excellent frequency characteristics, and very low dielectric loss. During their production, they need to be encapsulated by filling them with liquid compounds such as resin using a potting device to enhance the overall integrity of the capacitor and improve its resistance to external impacts and vibrations.

[0003] When applying adhesive to a film capacitor module, the external terminals on the copper busbar need to be positioned at the corresponding locations on the product's plastic casing. An adhesive applicator is then used to secure the product's plastic casing and the external terminals on the copper busbar. This ensures the positional accuracy and contour of the external terminals on the copper busbar of the film capacitor module. However, existing adhesive applicators are prone to scratching the external terminals when securing the product's plastic casing and the external terminals on the copper busbar, leading to product defects. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a glue injection fixture for film capacitor modules. This glue injection mold is not easy to scratch the external terminals of the copper busbar.

[0005] To solve the above-mentioned technical problems, the technical solution proposed by this utility model is as follows: a glue injection fixture for a thin film capacitor module, comprising an upper mold, a lower mold, a connecting positioning pin, and a snap clamp, wherein the upper mold and the lower mold are connected or opened by the snap clamp and the connecting positioning pin; a first split fixture is provided between the upper mold and the lower mold; the first split fixture includes a first upper mold fixture pin, a first lower mold fixture pin, and a position correction block; the upper and lower ends of the position correction block are respectively provided with an upper connecting post and a lower connecting post; the upper connecting post is connected inside the first upper mold fixture pin, and the lower connecting post passes through the first copper busbar hole and the product plastic shell and is connected to the first lower mold fixture pin.

[0006] Preferably, in the above-mentioned injection fixture for film capacitor modules, the first copper busbar hole is located on the first external through hole of the product's plastic shell.

[0007] Preferably, in the above-mentioned injection fixture for thin-film capacitor modules, the upper mold is provided with a copper busbar hole pin; the copper busbar hole pin presses downward against the second copper busbar hole.

[0008] Preferably, in the above-mentioned injection fixture for film capacitor modules, the second copper busbar hole is located on the protruding connecting part of the product's plastic shell.

[0009] Preferably, in the above-mentioned injection fixture for thin-film capacitor modules, a second split fixture is provided between the upper mold and the lower mold. The second split fixture includes a second upper mold fixture pin and a second lower mold fixture pin. The connecting pin on the second lower mold fixture pin passes through a third copper busbar hole and connects to the connecting hole of the second upper mold fixture pin.

[0010] Preferably, in the above-mentioned injection fixture for film capacitor modules, the third copper busbar hole is located on the second external through hole of the product's plastic shell.

[0011] Compared with the prior art, the advantages of this utility model are as follows: In this utility model, by setting the position correction block on the first split fixture, it is possible to prevent the copper busbar from being scratched when the upper mold and the lower mold are connected and fixed, since the copper busbar is not fixed. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the front of the glue injection fixture used for the thin film capacitor module in Example 1.

[0013] Figure 2 for Figure 1 A magnified structural diagram of point A in the middle.

[0014] Figure 3 This is a schematic diagram of the back of the glue injection fixture used for the thin film capacitor module in Example 1.

[0015] Figure 4 for Figure 2 A magnified structural diagram at point B in the middle.

[0016] Figure 5 This is a schematic diagram of the injection fixture for the thin-film capacitor module in Example 1 when it is unloaded.

[0017] Figure 6 This is a schematic diagram of the structure of the first split fixture in Example 1.

[0018] Figure 7 This is a cross-sectional view of the first split fixture in Example 1.

[0019] Figure 8 This is a schematic diagram of the position correction block in Example 1.

[0020] Figure 9 This is a schematic diagram of the structure of the second split fixture in Example 1.

[0021] Figure 10 This is a cross-sectional view of the second split fixture in Example 1.

[0022] Legend

[0023] 1. Upper mold; 2. Lower mold; 3. Connecting positioning pin; 4. Fastener clip; 5. First split fixture; 51. First upper mold fixture pin; 52. First lower mold fixture pin; 53. Position correction block; 531. Upper connecting post; 532. Lower connecting post; 6. First copper busbar hole; 7. Copper busbar hole pin; 8. Second copper busbar hole; 9. Product shell; 91. Protruding connecting part; 92. First external through hole; 93. Second external through hole; 10. Second split fixture; 101. Second upper mold fixture pin; 102. Second lower mold fixture pin; 11. Third copper busbar hole. Detailed Implementation

[0024] To facilitate understanding of this utility model, it will be described more comprehensively and in detail below with reference to the accompanying drawings and preferred embodiments. However, the scope of protection of this utility model is not limited to the following specific embodiments.

[0025] It should be noted that when a component is described as being "fixed to, attached to, connected to or connected to" another component, it can be directly fixed to, attached to, connected to or connected to the other component, or it can be indirectly fixed to, attached to, connected to or connected to the other component through other intermediate connectors.

[0026] Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by those skilled in the art. The technical terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the scope of protection of this invention. Example

[0027] like Figure 1 The illustration shows a glue injection fixture for a thin-film capacitor module, comprising an upper mold 1, a lower mold 2, a connecting positioning pin 3, and a snap clamp 4. The upper mold 1 and the lower mold 2 are connected or opened via the snap clamp 4 and the connecting positioning pin 3. A first split fixture 5 is provided between the upper mold 1 and the lower mold 2. The first split fixture 5 includes a first upper mold fixture pin 51, a first lower mold fixture pin 52, and a position correction block 53. The upper and lower ends of the position correction block 53 are respectively provided with an upper connecting post 531 and a lower connecting post 532. The upper connecting post 531 is connected inside the first upper mold fixture pin 51, and the lower connecting post 532 passes through the first copper busbar hole 6 and the product plastic shell 9 and is connected to the first lower mold fixture pin 52.

[0028] In this embodiment, the first copper busbar hole 6 corresponds to the external connection part of the copper busbar in the control section of the thin-film capacitor module; the first copper busbar hole is set on the first external through hole 92 of the product shell 9. Since the copper busbar of the control section is not fixed to the core of the thin-film capacitor, the first copper busbar hole 6 of the control section can wiggle on the first external through hole 92 of the product shell 9. Since the upper mold 1 and the lower mold 2 are clamped very tightly when connected, the clamping force of the first split clamp 5 on the first copper busbar hole 6 is relatively large; the traditional split clamp is made of stainless steel and does not have a position correction block 53. During clamping, the first copper busbar hole 6 is prone to scratching between the pin 51 of the first upper mold clamp and the pin 52 of the first lower mold clamp, thereby scratching the first copper busbar hole 6 and causing poor electrical performance.

[0029] In this embodiment, the first upper mold clamping pin 51 and the first lower mold clamping pin 52 can be made of stainless steel, and the position correction block 53 can be made of brass or rubber. Since the side of the first copper busbar hole 6 facing the first lower mold clamping pin 52 contacts the position correction block 53, and the position correction block 53 is made of brass or rubber, which has a much lower hardness than stainless steel, it is less likely to damage the copper busbar at the first copper busbar hole 6. A position correction block 53 is provided between the first copper busbar hole 6 and the first upper mold clamping pin 51, and the upper connecting post 531 and the lower connecting post 532 of the position correction block 53 are respectively inserted into the corresponding receiving holes of the first upper mold clamping pin 51 and the first lower mold clamping pin 52; thus, scratches are less likely to occur between the first copper busbar hole 6 and the position correction block 53, thereby protecting the first copper busbar hole 6 from scratches.

[0030] In this embodiment, the upper mold 1 is provided with a copper busbar hole pin 7; the copper busbar hole pin 7 presses downward against the second copper busbar hole 8. The second copper busbar hole 8 is provided on the protruding connecting part 91 of the product shell 9. In this embodiment, the second copper busbar hole 8 corresponds to the outer part of the positioning AC copper busbar. Since the second copper busbar hole 8 is provided on the protruding connecting part 91 of the product shell 9, and the positioning AC copper busbar is fixed on the core, it is only necessary to provide a copper busbar hole pin 7 on the upper mold 1 to press downward against the positioning hole of the second copper busbar hole 8 to complete the positioning.

[0031] In this embodiment, a second split fixture 10 is provided between the upper mold 1 and the lower mold 2. The second split fixture 10 includes a second upper mold fixture pin 101 and a second lower mold fixture pin 102. A connecting pin on the second lower mold fixture pin 102 passes through a third copper busbar hole 11 and connects to the connecting hole of the second upper mold fixture pin 101. The third copper busbar hole 11 is provided on the second external through hole 93 of the product shell 9.

[0032] In this embodiment, the third copper busbar hole 11 corresponds to the outer part of the copper busbar connected to the core. During the glue injection process, the third copper busbar hole 11 is welded to the core, so that the third copper busbar hole 11 cannot move on the second outer through hole 93 of the product plastic shell 9. When the upper mold 1 and the lower mold 2 are connected, under normal circumstances, the second upper mold clamping pin 101 will not scratch the surface of the third copper busbar hole 11.

Claims

1. A glue injection jig for a thin film capacitor module, characterized by: The device includes an upper mold, a lower mold, a connecting positioning pin, and a snap fastener. The upper mold and the lower mold are connected or opened via the snap fastener and the connecting positioning pin. A first split fixture is provided between the upper mold and the lower mold. The first split fixture includes a first upper mold fixture pin, a first lower mold fixture pin, and a position correction block. The upper and lower ends of the position correction block are respectively provided with an upper connecting post and a lower connecting post. The upper connecting post is connected inside the first upper mold fixture pin, and the lower connecting post passes through the first copper busbar hole and the product plastic shell and is connected to the first lower mold fixture pin.

2. The glue injection jig for thin film capacitor module according to claim 1, wherein: The first copper busbar hole is located on the first external through hole of the product's plastic shell.

3. The glue injection fixture for thin film capacitor module according to claim 1, wherein: The upper mold is provided with a copper busbar hole pin; the copper busbar hole pin is pressed downward against the second copper busbar hole.

4. The glue injection fixture for thin film capacitor module according to claim 3, wherein: The second copper busbar hole is located on the protruding connecting part of the product's plastic shell.

5. The dispensing fixture for thin-film capacitor modules according to claim 1, characterized in that: A second split fixture is provided between the upper mold and the lower mold. The second split fixture includes a second upper mold fixture pin and a second lower mold fixture pin. The connecting pin on the second lower mold fixture pin passes through a third copper busbar hole and connects to the connecting hole of the second upper mold fixture pin.

6. The glue injection fixture for thin film capacitor module according to claim 5, wherein: The third copper busbar hole is located on the second external through hole of the product's plastic shell.

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