Semiconductor saturable absorber package structure

Abstract

This invention provides a semiconductor saturable absorber packaging structure, relating to the field of laser technology. The semiconductor saturable absorber packaging structure includes a shell, a base, a semiconductor saturable absorber, a fixing member, and an optical fiber; the base is rotatably connected to one end of the shell; the semiconductor saturable absorber is located inside the shell and disposed on the base, with the rotation axis of the semiconductor saturable absorber coinciding with the rotation axis of the base; the fixing member is movably disposed at the other end of the shell along a direction close to or away from the rotation axis of the base, and the fixing member has a through hole; the optical fiber is disposed within the through hole, and the axis of the optical fiber located inside the shell is parallel to and offset from the rotation axis of the semiconductor saturable absorber. The above-described semiconductor saturable absorber packaging structure can greatly maximize the utilization rate of the semiconductor saturable absorber, thereby increasing its service life several times over.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a semiconductor saturable absorber packaging structure. Background Technology

[0002] A semiconductor saturable absorber mirror (SESAM) is a nonlinear optical device based on semiconductor materials. It is mainly used in lasers to achieve passive Q-switching or mode-locking to generate ultrashort pulse lasers.

[0003] Applications of ultrafast lasers (such as scientific research, industry, medical and communications) often have high requirements for the stability of laser output, and SESAM's packaging technology is crucial to the performance, reliability and lifespan of ultrafast lasers.

[0004] By optimizing process parameters, improving thermal management technology, and providing a highly reliable clean environment and packaging, the lifespan of SESAMs can be increased from billions of pulses to over ten billion pulses. However, further increasing the lifespan of SESAMs will encounter certain bottlenecks. Utility Model Content

[0005] In order to solve the problems existing in the prior art, one of the objectives of this utility model is to provide a semiconductor saturable absorber packaging structure.

[0006] This utility model provides the following technical solution:

[0007] A semiconductor saturable absorber package structure, comprising:

[0008] shell;

[0009] A base, which is rotatably connected to one end of the outer casing;

[0010] A semiconductor saturable absorber is located inside the housing and disposed on the base, wherein the rotation axis of the semiconductor saturable absorber coincides with the rotation axis of the base;

[0011] A fastener is movably disposed at the other end of the housing along a direction close to or away from the rotation axis of the base, and the fastener is provided with a through hole;

[0012] An optical fiber is disposed within the through-hole, and the axis of the optical fiber located within the housing is parallel to and offset from the axis of rotation of the semiconductor saturable absorber.

[0013] As a further alternative to the semiconductor saturable absorber packaging structure, the housing is provided with a plurality of fixing slots, which are arranged along a direction close to or away from the rotation axis of the base, and the fixing member is detachably disposed in any one of the fixing slots.

[0014] As a further optional embodiment of the semiconductor saturable absorber packaging structure, the semiconductor saturable absorber packaging structure further includes a seal that is detachably disposed within the fixing groove.

[0015] As a further alternative to the semiconductor saturable absorber packaging structure, the seal is provided with a protrusion, at least a portion of which is located outside the fixing groove.

[0016] As a further alternative to the semiconductor saturable absorber packaging structure, the fixing member includes a first fixing part and a second fixing part, the width of the first fixing part being greater than the width of the second fixing part, the first fixing part abutting against the end of the housing, and the second fixing part being detachably disposed in either of the fixing slots.

[0017] As a further alternative to the semiconductor saturable absorber packaging structure, the outer casing is provided with scale lines, and the base is provided with scale pointers.

[0018] As a further optional embodiment of the semiconductor saturable absorber packaging structure, the semiconductor saturable absorber packaging structure further includes a rotation drive, the drive end of which is connected to the base.

[0019] As a further optional embodiment of the semiconductor saturable absorber packaging structure, a thermally conductive adhesive layer is provided on the base, and the semiconductor saturable absorber is connected to the base through the thermally conductive adhesive layer.

[0020] The embodiments of this utility model have the following beneficial effects:

[0021] In the aforementioned semiconductor saturable absorber packaging structure, since the rotation axis of the semiconductor saturable absorber coincides with the rotation axis of the base, while the axis of the optical fiber located inside the housing is parallel to and offset from the rotation axis of the semiconductor saturable absorber, when an irreversible damage occurs at a certain operating point of the semiconductor saturable absorber after long-term operation, rotating the base can change the relative position of the semiconductor saturable absorber and the optical fiber. This allows the operating point of the semiconductor saturable absorber to be changed with the rotation axis of the semiconductor saturable absorber as the center and the distance between the axis of the optical fiber and the rotation axis as the radius, thus restoring the semiconductor saturable absorber packaging structure to normal operation. Furthermore, moving the fixing member along the rotation axis closer to or further away from the base can similarly change the relative position of the semiconductor saturable absorber and the optical fiber, changing the operating point of the semiconductor saturable absorber, and allowing the operating point to be switched again within a new radius by rotating the base. Therefore, the aforementioned semiconductor saturable absorber packaging structure can greatly maximize the utilization rate of the semiconductor saturable absorber, significantly increasing its service life.

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This diagram shows an overall structural schematic of a semiconductor saturable absorber packaging structure provided by an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of the operating point distribution of a semiconductor saturable absorber is shown.

[0026] Figure 3 This diagram illustrates a semiconductor saturable absorber packaging structure according to another embodiment of the present invention.

[0027] Figure 4 This diagram shows an end face view of the outer shell in a semiconductor saturable absorber packaging structure provided by an embodiment of the present invention;

[0028] Figure 5 This shows a schematic cross-sectional view of one end of the housing before the fastener moves;

[0029] Figure 6 This shows a schematic cross-sectional view of one end of the housing after the fastener has moved;

[0030] Figure 7 This diagram shows a longitudinal cross-sectional view of one end of the outer shell in a semiconductor saturable absorber packaging structure provided by an embodiment of the present invention.

[0031] Explanation of key component symbols:

[0032] 100 - Outer shell; 110 - First end plate; 120 - Second end plate; 130 - Third end plate; 131 - Rotating shaft; 140 - Fourth end plate; 150 - Fixing groove; 200 - Base; 210 - Groove; 220 - Thermally conductive adhesive layer; 300 - Semiconductor saturable absorber; 400 - Fixing component; 401 - Through hole; 410 - First fixing part; 420 - Second fixing part; 500 - Optical fiber; 600 - Sealing component; 610 - Protrusion. Detailed Implementation

[0033] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0034] It should be noted that when an element is said to be "fixed" to another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly" on another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0035] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the template description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0038] The inventors of this application have discovered that, due to limitations imposed by material aging and damage thresholds, semiconductor materials may experience defect proliferation, interface delamination, or bonding failure under long-term thermal cycling or high-energy laser irradiation. Alternatively, when the pulse energy exceeds the damage threshold of the SESAM, it can lead to irreversible damage to the SESAM (such as melting or ablation).

[0039] On the one hand, by optimizing process parameters, improving thermal management technology, and providing a highly reliable clean environment and packaging, the lifespan of SESAM can be increased from billions of pulses to over ten billion pulses. However, further increasing the lifespan of SESAM will encounter certain bottlenecks.

[0040] On the other hand, due to the special nature of the packaging and the fact that ultrafast lasers are mainly used in scientific research, industry, medical and communication fields, if SESAM fails during operation, it will take a long time to maintain the ultrafast laser, making it difficult to guarantee the timeliness of actual use.

[0041] Example

[0042] To address the aforementioned issues, this embodiment provides a semiconductor saturable absorber packaging structure for use in lasers. Please refer to [link to relevant documentation]. Figure 1 The semiconductor saturable absorber packaging structure includes a housing 100, a base 200, a semiconductor saturable absorber 300, a fixing member 400, and an optical fiber 500.

[0043] The base 200 is rotatably connected to one end of the housing 100. Correspondingly, the semiconductor saturable absorber 300 is located inside the housing 100 and disposed on the base 200, with the rotation axis of the semiconductor saturable absorber 300 coinciding with the rotation axis of the base 200.

[0044] In addition, the fastener 400 is movably disposed at the other end of the housing 100 along the direction of rotation axis close to or away from the base 200, and the fastener 400 is provided with a through hole 401.

[0045] The optical fiber 500 is disposed in the through hole 401. The axis of the optical fiber 500 located in the housing 100 is parallel to and offset from the rotation axis of the semiconductor saturable absorber 300.

[0046] Please combine Figure 2 In the above-mentioned semiconductor saturable absorber packaging structure, since the rotation axis of the semiconductor saturable absorber 300 coincides with the rotation axis of the base 200, and the axis of the optical fiber 500 located inside the housing 100 is parallel to and offset from the rotation axis of the semiconductor saturable absorber 300, when a certain operating point of the semiconductor saturable absorber 300 is irreversibly damaged after long-term operation, the relative position of the semiconductor saturable absorber 300 and the optical fiber 500 can be changed by rotating the base 200. Thus, the operating point of the semiconductor saturable absorber 300 can be changed with the rotation axis of the semiconductor saturable absorber 300 as the center and the distance between the axis of the optical fiber 500 and the rotation axis as the radius, so that the semiconductor saturable absorber packaging structure can be restored to normal operation. Furthermore, by moving the fixing member 400 along the rotation axis closer to or further away from the base 200, the relative position of the semiconductor saturable absorber 300 and the optical fiber 500 can be changed, altering the operating point of the semiconductor saturable absorber 300. This allows for restarting the switching of the operating point within a new radius by rotating the base 200. Therefore, the aforementioned semiconductor saturable absorber packaging structure can greatly maximize the utilization rate of the semiconductor saturable absorber 300, significantly increasing its service life.

[0047] It should be noted that the fixing member 400 can limit the optical fiber 500, ensuring that the end face of the optical fiber 500 and the surface of the semiconductor saturable absorber 300 are always kept at the same distance. In addition, the end face of the optical fiber 500 inside the housing 100 is flattened to ensure that the light transmitted by the optical fiber 500 can be perpendicularly irradiated onto a certain point on the surface of the semiconductor saturable absorber 300, which is the operating point of the semiconductor saturable absorber 300.

[0048] Please refer to it again. Figure 1 In some embodiments, the outer casing 100 is cylindrical, and the base 200 is cylindrical, with the axis of the outer casing 100 coinciding with the axis of the base 200, which is also the axis of rotation of the base 200. The outer casing 100 has an annular first end plate 110 and a circular second end plate 120. The first end plate 110 is rotatably connected to the base 200, and the second end plate 120 is used for mounting and fixing of the fastener 400.

[0049] Meanwhile, an annular groove 210 is provided on the outer periphery of the base 200. The second end plate 120 is embedded in the groove 210, thereby realizing the rotatable connection between the outer shell 100 and the base 200, and keeping the outer shell 100 and the base 200 relatively fixed along the axial direction.

[0050] Understandably, during the manufacturing process, the outer shell 100 is divided into two sub-shells, each machined separately, with any plane containing its own axis as the dividing interface. During assembly, the two sub-shells are first fastened onto the base 200 along the radial direction, and then bolts are used to connect the two sub-shells to each other.

[0051] Please see Figure 3 In other embodiments, the outer casing 100 is cylindrical, and its cross-section can be of any shape, including but not limited to circular, square, etc. The outer casing 100 has a third end plate 130 and a fourth end plate 140. A rotating shaft 131 passes through the third end plate 130, and the rotating shaft 131 is rotatably connected to the third end plate 130 via a bearing. Correspondingly, the base 200 is located inside the outer casing 100, and the base 200 is fixedly connected to the rotating shaft 131. Furthermore, the fourth end plate 140 provides a mounting base 400 for installation and fixation.

[0052] Understandably, during the manufacturing process, at least one of the third end plate 130 and the fourth end plate 140 is a separate design, and is processed and formed separately from the other parts of the housing 100. Taking the separate design of the third end plate 130 as an example, during assembly, the rotating shaft 131 is first assembled with the third end plate 130, and the base 200 is fixedly connected to the rotating shaft 131. The semiconductor saturable absorber 300 is placed on the base 200, and then the third end plate 130 is connected to the other parts of the housing 100 using bolts.

[0053] In some embodiments, a thermally conductive adhesive layer 220 is provided on the base 200, and the semiconductor saturable absorber 300 is connected to the base 200 through the thermally conductive adhesive layer 220.

[0054] The thermally conductive adhesive layer 220 can adhere and fix the semiconductor saturable absorber 300 to the base 200, and at the same time conduct the heat of the semiconductor saturable absorber 300 to the base 200 in a timely manner. The base 200 dissipates heat from the semiconductor saturable absorber 300, which is conducive to the long-term stable operation of the semiconductor saturable absorber 300.

[0055] For example, the base 200 is made of copper to accelerate heat dissipation.

[0056] In some embodiments, the base 200 is manually adjustable, which is easy to implement and less costly.

[0057] Furthermore, the outer casing 100 is provided with scale lines, and the base 200 is provided with scale pointers.

[0058] As the base 200 rotates, the scale pointer points to different graduation lines. At this time, the user can precisely control the rotation angle of the base 200 with the help of the scale pointer and graduation lines, ensuring that the operating point of the semiconductor saturable absorber 300 is completely changed, and promptly move the fixing member 400 along the direction close to or away from the rotation axis of the base 200 after the base 200 has rotated one revolution, so as to restart the switching of the operating point within the new radius.

[0059] In other embodiments, the above-described semiconductor saturable absorber package structure further includes a rotary drive, the drive end of which is connected to the base 200.

[0060] When the operating point of the semiconductor saturable absorber 300 needs to be changed, the base 200 is rotated by a rotary drive component, and automatic adjustment is achieved through automated design, enabling the entire product to be maintained without manual intervention.

[0061] For example, the rotational drive is a motor.

[0062] Please refer to the following: Figure 4 and Figure 5 In some embodiments, the housing 100 is provided with a plurality of fixing slots 150, which are arranged along a direction close to or away from the rotation axis of the base 200. The fixing member 400 is detachably disposed in any one of the fixing slots 150.

[0063] Understandably, by removing the fastener 400 from its current mounting slot 150 and placing it into another mounting slot 150, the fastener 400 can move relative to the housing 100 along the rotation axis toward or away from the base 200, thereby changing the operating point of the semiconductor saturable absorber 300. At the same time, it is convenient to restart the switching of the operating point within a new radius by rotating the base 200.

[0064] Taking the cylindrical outer shell 100 as an example, its second end plate 120 is provided with a plurality of fixing grooves 150, and the plurality of fixing grooves 150 are arranged along the radial direction of the second end plate 120.

[0065] Furthermore, the above-mentioned semiconductor saturable absorber packaging structure also includes a seal 600, which is detachably disposed within the fixing groove 150.

[0066] In use, the fastener 400 is set in one of the fixing grooves 150, and the remaining fixing grooves 150 are sealed by the sealing member 600 to isolate the inside and outside of the housing 100.

[0067] For example, seal 600 is made of rubber.

[0068] In this embodiment, the fixing groove 150 is a circular groove, and there are six fixing grooves 150, with the outer edges of two adjacent fixing grooves 150 overlapping. Correspondingly, the portion of the fixing member 400 located within the fixing groove 150 is cylindrical, and the sealing member 600 is cylindrical in shape as a whole. The end face of the sealing member 600 is provided with an arc-shaped notch, and the notch extends through both ends of the sealing member 600 along the axial direction of the sealing member 600.

[0069] In addition, the fastener 400 is disposed in one of the fixing grooves 150, and the inner wall of the notch of the sealing member 600 in the adjacent fixing groove 150 is in contact with the surface of the fastener 400.

[0070] Please combine Figure 6 When the fastener 400 is moved from one of the fixing slots 150 to another fixing slot 150, the seal 600 in the other fixing slot 150 is moved to the fixing slot 150 where the fastener 400 was originally located, and the seal 600 is rotated 180°. At the same time, the angle of the seal 600 in the other fixing slots 150 is adjusted accordingly.

[0071] Please see Figure 7 Furthermore, the seal 600 is provided with a protrusion 610, at least a portion of which is located outside the fixing groove 150.

[0072] By clamping the protrusion 610, the user can easily and quickly remove the seal 600 from the fixing groove 150 to change the position of the seal 600.

[0073] For example, the seal 600 has an integrally formed threaded post, which serves as a protrusion 610.

[0074] In some embodiments, the fastener 400 includes a first fastening portion 410 and a second fastening portion 420. The width of the first fastening portion 410 is greater than the width of the second fastening portion 420, and the first fastening portion 410 abuts against an end of the housing 100. The second fastening portion 420 is detachably disposed within any one of the fastening slots 150.

[0075] Specifically, the width of the first fixing part 410 refers to its dimension along any direction perpendicular to the rotation axis of the base 200. When the first fixing part 410 is cylindrical, its width is equal to its diameter. The second fixing part 420 is similar and will not be described in detail here.

[0076] In use, the second fixing part 420 is embedded in or inserted into the fixing groove 150 to achieve the connection between the fixing member 400 and the outer shell 100. The first fixing part 410 abuts against the end of the outer shell 100 to prevent the entire fixing member 400 from falling into the interior of the outer shell 100.

[0077] In some other embodiments of this application, the outer casing 100 may not have multiple fixing slots 150, but instead has a strip groove, and the fixing member 400 is slidably disposed in the strip groove. At the same time, the outer casing 100 is also provided with a two-dimensional adjustment frame to drive the fixing member 400 to slide in the strip groove, thereby cooperating with the rotatable base 200 to realize point changing in a two-dimensional plane or in a spiral form.

[0078] For example, the two-dimensional adjustment frame can be a linear servo module.

[0079] In summary, in the above-described semiconductor saturable absorber packaging structure, since the rotation axis of the semiconductor saturable absorber 300 coincides with the rotation axis of the base 200, and the axis of the optical fiber 500 located inside the housing 100 is parallel to and offset from the rotation axis of the semiconductor saturable absorber 300, when a certain operating point of the semiconductor saturable absorber 300 suffers irreversible damage after long-term operation, the relative position of the semiconductor saturable absorber 300 and the optical fiber 500 can be changed by rotating the base 200. Thus, the operating point of the semiconductor saturable absorber 300 can be changed with the rotation axis of the semiconductor saturable absorber 300 as the center and the distance between the axis of the optical fiber 500 and the rotation axis as the radius, so that the semiconductor saturable absorber packaging structure can be restored to normal operation. Furthermore, by moving the fixing member 400 along the rotation axis closer to or further away from the base 200, the relative position of the semiconductor saturable absorber 300 and the optical fiber 500 can be changed, altering the operating point of the semiconductor saturable absorber 300. This allows for restarting the switching of the operating point within a new radius by rotating the base 200. Therefore, the aforementioned semiconductor saturable absorber packaging structure can greatly maximize the utilization rate of the semiconductor saturable absorber 300, significantly increasing its service life.

[0080] Furthermore, the aforementioned semiconductor saturable absorber packaging structure enables rapid replacement of the operating point of the semiconductor saturable absorber 300, thereby facilitating rapid laser maintenance and meeting practical application requirements in terms of timeliness, such as ensuring efficient product production.

[0081] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0082] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0083] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A semiconductor saturable absorber packaging structure, characterized in that, include: shell; A base, which is rotatably connected to one end of the outer casing; A semiconductor saturable absorber is located inside the housing and disposed on the base, wherein the rotation axis of the semiconductor saturable absorber coincides with the rotation axis of the base; A fastener is movably disposed at the other end of the housing along a direction close to or away from the rotation axis of the base, and the fastener is provided with a through hole; An optical fiber is disposed within the through-hole, and the axis of the optical fiber located within the housing is parallel to and offset from the axis of rotation of the semiconductor saturable absorber.

2. The semiconductor saturable absorber package structure of claim 1, wherein, The outer casing is provided with multiple fixing slots, which are arranged along the rotation axis of the base or away from it. The fixing member is detachably disposed in any one of the fixing slots.

3. The semiconductor saturable absorber package structure of claim 2, wherein, The semiconductor saturable absorber packaging structure also includes a seal, which is detachably disposed within the fixing groove.

4. The semiconductor saturable absorber package structure of claim 3, wherein, The seal is provided with a protrusion, and at least a portion of the protrusion is located outside the fixing groove.

5. The semiconductor saturable absorber package structure of claim 2, wherein, The fastener includes a first fixing part and a second fixing part. The width of the first fixing part is greater than the width of the second fixing part. The first fixing part abuts against the end of the outer shell, and the second fixing part is detachably disposed in any one of the fixing grooves.

6. The semiconductor saturable absorber package structure of claim 1, wherein, The outer casing is provided with scale lines, and the base is provided with scale pointers.

7. The semiconductor saturable absorber package structure of claim 1, wherein, The semiconductor saturable absorber package structure also includes a rotary drive, the drive end of which is connected to the base.

8. The semiconductor saturable absorber package structure of any of claims 1-7, wherein, A thermally conductive adhesive layer is provided on the base, and the semiconductor saturable absorber is connected to the base through the thermally conductive adhesive layer.

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