A pump source, a laser, and laser processing equipment

Abstract

This utility model discloses a pump source, a laser, and laser processing equipment. The pump source includes: multiple light-emitting chips and a short-circuit protection structure equal in number to the number of light-emitting chips; the light-emitting chips are used to convert input electrical energy into light output, and the light-emitting chips are connected in series; a short-circuit protection structure is connected in parallel with a light-emitting chip, and the short-circuit protection structure is used to isolate the circuit of a failed light-emitting chip from other light-emitting chips; the short-circuit protection structure includes a temperature control switch, which is thermally connected to the light-emitting chips, and the temperature control switch has the characteristic of changing from a non-conducting state to a conducting state when a preset temperature is reached or exceeded. This utility model embodiment can automatically short-circuit a failed light-emitting chip, preventing current from flowing through the failed light-emitting chip and avoiding further heating of the failed light-emitting chip.

Description

Technical Field

[0001] This utility model relates to the field of optical technology, and in particular to a pump source, laser, and laser processing equipment. Background Technology

[0002] Pump light is generated in a laser through a pump source, which is the core component of the laser. Currently, in order to meet the requirements of high power output, most laser pump sources adopt a structure design of multiple chips connected in series.

[0003] In practical use, a single chip in the pump source may fail. When a single chip fails, its resistance increases sharply. When current flows through the failed chip, it generates a large amount of heat, causing the chip's temperature to rise rapidly. This heat is then conducted to surrounding chips and other components of the pump source, leading to excessively high temperatures across the entire pump source. Excessive temperatures not only reduce the pump source's efficiency but also cause performance degradation in other chips, and may even trigger the overheat protection mechanism, rendering the pump source unable to continue operating. This affects the laser's normal operation and lifespan, increasing equipment maintenance costs and downtime. Utility Model Content

[0004] This invention provides a pump source-laser and laser processing equipment to solve the problem that the temperature of a failed light-emitting chip in the pump source continues to rise, affecting the normal operation of the entire pump source.

[0005] In a first aspect, the present invention provides a pump source, comprising: a plurality of light-emitting chips and a plurality of short-circuit protection structures; the light-emitting chips are used to convert input electrical energy into light output, each of the light-emitting chips is connected in series, and a short-circuit protection structure is connected in parallel with a light-emitting chip, the short-circuit protection structure being used to isolate a failed light-emitting chip from the circuits of other light-emitting chips.

[0006] The short-circuit protection structure includes a temperature control switch, which is thermally connected to the light-emitting chip. The temperature control switch has the characteristic of changing from a non-conducting state to a conducting state when a preset temperature is reached or exceeded.

[0007] Optionally, the preset temperature is 65℃-200℃.

[0008] Optionally, the temperature control switch is thermally connected to the light-emitting chip.

[0009] Optionally, the temperature control switch includes one of a temperature-sensitive switch and a temperature control trigger.

[0010] Optionally, the temperature control switch includes a conductive channel and a conductive metal with a melting point within a preset melting point range;

[0011] The conductive metal is disposed within the conductive channel, and the two ends of the conductive channel are respectively connected to the two electrodes of the light-emitting chip;

[0012] The conductive metal is thermally connected to the light-emitting chip. When the light-emitting chip fails and its temperature rises above the melting point of the conductive metal, the conductive metal melts within the conductive channel, connecting the two electrodes of the failed light-emitting chip. Optionally, the conductive channel includes a first segment, a second segment, and a third segment. The first end of the first segment is connected to the negative electrode of the light-emitting chip, the first end of the second segment is connected to the positive electrode of the light-emitting chip, the second ends of the first segment and the second segment are connected, and both the second ends of the first segment and the second segment are connected to the third segment.

[0013] The conductive metal is disposed in the third pipe section. After the conductive metal melts, it flows into the first pipe section and the second pipe section, connecting the two electrodes of the failed light-emitting chip.

[0014] Optionally, the conductive channel includes a first segment, a second segment, and a third segment. The first end of the first segment is connected to the negative electrode of the light-emitting chip, the first end of the second segment is connected to the positive electrode of the light-emitting chip, the second end of the first segment is connected to the first end of the third segment, and the second end of the third segment is connected to the second end of the second segment.

[0015] The conductive metal is disposed in the third pipe section. After the conductive metal melts, it flows into the first pipe section and the second pipe section, connecting the two electrodes of the failed light-emitting chip.

[0016] Optionally, the temperature control trigger includes a temperature sensor, a controller, and a switch connected by a signal. The temperature sensor is thermally connected to the light-emitting chip, and the controller is used to output a command to control the switch to turn on when the signal from the temperature sensor reaches a preset temperature.

[0017] Secondly, embodiments of the present invention also provide a laser, including a gain medium and a pump source as described in any embodiment of the first aspect.

[0018] Thirdly, this utility model embodiment also provides a laser processing device, including the laser described in the second aspect.

[0019] This utility model discloses a pump source, a laser, and a laser processing device. Each light-emitting chip is equipped with a short-circuit protection structure. When a light-emitting chip fails and its temperature rises above the melting point of the conductive metal, the short-circuit protection structure automatically short-circuits the failed chip, preventing current from flowing through it and thus avoiding further heating. By automatically short-circuiting the failed chip, the problem of it affecting other chips and causing the pump source to malfunction is prevented. This timely isolation of the failed chip ensures the normal operation of the pump source, improves laser reliability, reduces laser maintenance frequency, and extends laser lifespan. Furthermore, automatic short-circuit protection of the failed chip reduces ineffective energy consumption and energy waste during equipment operation, achieving energy conservation and environmental protection.

[0020] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a circuit diagram of a pump source provided in an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of a temperature control switch provided in an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the short-circuit protection state of a temperature control switch provided in an embodiment of this utility model;

[0025] Figure 4 This is a schematic diagram of another temperature control switch provided in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the short-circuit protection state of another temperature control switch provided in this embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of another temperature control switch provided in an embodiment of the present invention;

[0028] Figure 7 This is a schematic diagram of the short-circuit protection state of another temperature control switch provided in this embodiment of the present invention. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0031] Figure 1 This is a circuit diagram of a pump source provided in an embodiment of this utility model, for reference. Figure 1The pump source includes: multiple light-emitting chips 100 and a short-circuit protection structure 200 equal in number to the multiple light-emitting chips 100; the light-emitting chips 100 are used to convert input electrical energy into light output, and the light-emitting chips 100 are connected in series, and a short-circuit protection structure 200 is connected in parallel with a light-emitting chip 100, and the short-circuit protection structure 200 is used to isolate the circuit of the failed light-emitting chip 100 from that of other light-emitting chips 100; the short-circuit protection structure 200 includes a temperature control switch 210. The temperature control switch 210 is thermally connected to the light-emitting chip 100, and the temperature control switch 210 has the characteristic of changing from a non-conducting state to a conducting state when a preset temperature is reached or exceeded. In this embodiment of the present invention, each light-emitting chip 100 is provided with a corresponding short-circuit protection structure 200. When a light-emitting chip 100 fails and its temperature rises above the melting point of the conductive metal 212, the short-circuit protection structure 200 can automatically short-circuit the failed light-emitting chip 100, and the current no longer flows through the failed light-emitting chip 100, preventing the failed light-emitting chip 100 from continuing to heat up. By automatically short-circuiting the failed light-emitting chip 100, the problem of the failed light-emitting chip 100 continuing to heat up and causing the failure of other light-emitting chips, thus preventing the pump source from working properly, is avoided. The failed light-emitting chip 100 can be isolated in time, ensuring the normal operation of the pump source, improving the reliability of the laser, reducing the maintenance frequency of the laser, and extending the service life of the laser.

[0032] Optionally, based on the above embodiments, the preset temperature is 65℃-200℃.

[0033] Optionally, based on the above embodiments, the temperature control switch 210 is thermally connected to the light-emitting chip 100.

[0034] The thermal conduction methods include direct contact between the temperature control switch 210 and the light-emitting chip 100, or contact between the temperature control switch 210 and the light-emitting chip 100 through a thermally conductive material (common thermally conductive materials include thermally conductive grease, thermally conductive silicone pads, etc.), or limiting the distance between the conductive metal 212 and the light-emitting chip 100 to a preset distance. For example, the distance between the conductive metal 212 and the light-emitting chip 100 is 1-5mm.

[0035] In this embodiment of the invention, the temperature control switch 210 is thermally connected to the light-emitting chip 100, which can automatically short-circuit the failed light-emitting chip 100 in a timely manner.

[0036] Optionally, based on the above embodiments, the temperature control switch 210 includes one of a temperature-sensitive switch and a temperature control trigger.

[0037] Figure 2 and Figure 3 This is a schematic diagram of the structure of a temperature control switch provided in an embodiment of this utility model, for reference. Figure 2 The temperature control switch 210 includes a conductive channel 211 and a conductive metal 212 with a melting point within a preset melting point range. The conductive metal 212 is disposed within the conductive channel 211, and the two ends of the conductive channel 211 are respectively connected to the two electrodes of the light-emitting chip 100. The conductive metal 212 is thermally connected to the light-emitting chip 100. When the light-emitting chip 100 fails and the temperature rises above the melting point of the conductive metal 212, the conductive metal 212 melts within the conductive channel 211, connecting the two electrodes of the failed light-emitting chip 100.

[0038] It is understandable that the conductive channel 211 can be a conductive groove opened on a plane, or a pipe connecting electrodes at both ends.

[0039] It is understood that the preset melting point range corresponds to the preset temperature of the temperature control switch, that is, the conductive metal 212 is a conductive metal 212 with a melting point between 65℃ and 200℃. It should be noted that the melting point of the conductive metal 212 in this embodiment is higher than the normal operating temperature of the light-emitting chip 100 and lower than the temperature at which the light-emitting chip 100 fails. The conductive metal 212 can include tin-based alloys, lead-based alloys, and bismuth-based alloys. Specifically, it can be a bismuth-indium-tin ternary alloy or an indium-tin eutectic alloy. When the conductive metal 212 is a bismuth-indium-tin ternary alloy, the proportions of the elements are: bismuth 52%, indium 32%, and tin 16%, at which point the melting point of the conductive metal 212 is approximately 96℃.

[0040] It is understood that in this embodiment of the present invention, when the light-emitting chip 100 is working normally, the temperature of the light-emitting chip 100 is lower than the preset melting point range, the conductive metal 212 is solid at this time, and is only in the middle of the conductive channel 211. The electrodes at both ends of the conductive channel 211 cannot conduct, and the short-circuit protection structure 200 is open at this time. Figure 3 This is a schematic diagram of the short-circuit protection state of a temperature control switch provided in an embodiment of this utility model, for reference. Figure 3 When the light-emitting chip 100 fails and the temperature rises above the melting point of the conductive metal 212, the conductive metal 212 melts in the conductive channel 211, connecting the two electrodes of the failed light-emitting chip 100, thereby enabling current conduction, short-circuiting the light-emitting chip 100, and preventing current from continuing to flow through the light-emitting chip 100 and causing the temperature to continue to rise.

[0041] The conductive metal 212, with its preset distance and preset melting point range, can be freely set according to actual conditions, ensuring that the conductive metal 212 can melt in time when the light-emitting chip 100 fails. The shape of the conductive channel 211 can be as follows: Figure 2 The elongated shape shown can also be as follows: Figure 4 and Figure 6The shape is designed with a high center and low ends, with a certain slope, to accelerate the flow rate of the conductive metal 212 after melting.

[0042] Figure 4 This is a schematic diagram of another temperature control switch provided in an embodiment of the present invention. Optionally, based on the above embodiment, refer to... Figure 4 In one embodiment, the conductive channel 211 includes a first tube segment 2111, a second tube segment 2112, and a third tube segment 2113. The first end of the first tube segment 2111 is connected to the negative electrode of the light-emitting chip 100, the first end of the second tube segment 2112 is connected to the positive electrode of the light-emitting chip 100, the second end of the first tube segment 2111 is connected to the second end of the second tube segment 2112, and both the second ends of the first tube segment 2111 and the second end of the second tube segment 2112 are connected to the third tube segment 2113. A conductive metal 212 is disposed in the third tube segment 2113. After the conductive metal 212 melts, it flows into the first tube segment 2111 and the second tube segment 2112, connecting the two electrodes of the failed light-emitting chip 100.

[0043] Optionally, based on the above embodiments, continue to refer to... Figure 4 The first pipe section 2111 and the second pipe section 2112 are both inclined toward the third pipe section 2113, and the inclination angle of the first pipe section 2111 and the second pipe section 2112 is 5°-90°.

[0044] It is understandable that the angle between the first tube segment 2111 and the plane where the negative electrode contact point A of the light-emitting chip 100 is located is 5°-90°, and the angle between the second tube segment 2112 and the plane where the positive electrode contact point B of the light-emitting chip 100 is located is 5°-90°.

[0045] Figure 5 This is a schematic diagram of the short-circuit protection state of the aforementioned temperature control switch, for reference. Figure 5 The three pipe sections are interconnected. Solid conductive metal 212 is disposed in the third pipe section 2113. When the light-emitting chip 100 fails, the temperature rises, the low-melting-point metal melts, and conducts electricity through the first pipe section 2111 and the second pipe section 2112, connecting the negative electrode contact point A and the positive electrode contact point B of the light-emitting chip 100. Both the first pipe section 2111 and the second pipe section 2112 are inclined towards the third pipe section 2113, resulting in a slope where the conductive channel 211 is higher in the middle and lower at both ends, which accelerates the flow rate of the melted conductive metal 212.

[0046] Figure 6 This is a schematic diagram of another temperature control switch provided in an embodiment of the present invention. Optionally, based on the above embodiment, refer to... Figure 6In one embodiment, the conductive channel 211 includes a first segment 2111, a second segment 2112, and a third segment 2113. The first end of the first segment 2111 is connected to the negative electrode of the light-emitting chip 100, the first end of the second segment 2112 is connected to the positive electrode of the light-emitting chip 100, the second end of the first segment 2111 is connected to the first end of the third segment 2113, and the second end of the third segment 2113 is connected to the second end of the second segment 2112. A conductive metal 212 is disposed within the third segment 2113. Figure 7 This is a schematic diagram of the short-circuit protection state of the aforementioned temperature control switch, for reference. Figure 7 After the conductive metal 212 melts, it flows into the first pipe section 2111 and the second pipe section 2112, connecting the two electrodes of the failed light-emitting chip 100.

[0047] Optionally, based on the above embodiments, continue to refer to... Figure 6 The first pipe section 2111 and the second pipe section 2112 are both inclined toward the third pipe section 2113, and the inclination angle of the first pipe section 2111 and the second pipe section 2112 is 5°-90°.

[0048] It is understandable that the angle between the first tube segment 2111 and the plane where the negative electrode contact point A of the light-emitting chip 100 is located is 5°-90°, and the angle between the second tube segment 2112 and the plane where the positive electrode contact point B of the light-emitting chip 100 is located is 5°-90°.

[0049] It is understood that the conductive channel 211 and the first tube segment 2111, the second tube segment 2112 and the third tube segment 2113 of the conductive channel are made of insulating materials that do not deform within a preset temperature range (65℃-200℃), such as glass, plastic, ceramic and other materials.

[0050] Optionally, based on the above embodiments, the temperature control trigger includes a temperature sensor, a controller, and a switch connected by signals. The temperature sensor is thermally connected to the light-emitting chip 100, and the controller is used to output a command to control the switch to turn on when the signal from the temperature sensor reaches a preset temperature.

[0051] In summary, each light-emitting chip 100 in the pump source provided by this embodiment of the invention is equipped with a short-circuit protection structure 200. When a light-emitting chip 100 fails and its temperature rises above the melting point of the conductive metal 212, the short-circuit protection structure 200 can automatically short-circuit the failed light-emitting chip 100, preventing current from flowing through it and avoiding further heating. By automatically short-circuiting the failed light-emitting chip 100, the problem of abnormal pump source temperature leading to malfunction caused by the failed light-emitting chip 100 continuing to heat up is avoided. The failed light-emitting chip 100 can be isolated in time, ensuring the normal operation of the pump source, improving the reliability of the laser, reducing the maintenance frequency of the laser, and extending the lifespan of the laser. Furthermore, the temperature control switch 210 is thermally connected to the light-emitting chip 100, enabling timely and automatic short-circuiting of the failed light-emitting chip 100. The three pipe sections are interconnected. Solid conductive metal 212 is disposed in the third pipe section 2113. When the light-emitting chip 100 fails, the temperature rises, the low-melting-point metal melts, and flows from the third pipe section 2113 to the first pipe section 2111 and the second pipe section 2112, connecting the negative electrode contact point A and the positive electrode contact point B of the light-emitting chip 100 for conductivity. The first and second pipe sections 2111 and 2112 are both inclined towards the third pipe section 2113, resulting in a slope where the conductive channel 211 is higher in the middle and lower at both ends, which accelerates the flow rate of the melted conductive metal 212. The third pipe section 2113 is in close contact with the light-emitting chip 100, enabling better heat transfer between the light-emitting chip 100 and the conductive metal 212, and automatically short-circuiting the failed light-emitting chip 100 in a timely manner.

[0052] This invention also provides a laser, including a gain medium and a pump source from any of the above embodiments. Since the laser provided in this invention includes the pump source provided in any of the above embodiments, it has the same beneficial effects. For details not described in detail in this embodiment, please refer to the pump source provided in the above embodiments.

[0053] This utility model embodiment also provides a laser processing device, including the laser provided in the above embodiment.

[0054] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A pump source, characterized by, include: Multiple light-emitting chips and multiple short-circuit protection structures are provided; the light-emitting chips are used to convert input electrical energy into light output, and each of the light-emitting chips is connected in series. One of the short-circuit protection structures is connected in parallel with one of the light-emitting chips. The short-circuit protection structure is used to isolate the circuit of a failed light-emitting chip from the circuit of other light-emitting chips. The short-circuit protection structure includes a temperature control switch, which is thermally connected to the light-emitting chip. The temperature control switch has the characteristic of changing from a non-conducting state to a conducting state when a preset temperature is reached or exceeded.

2. The pump source of claim 1, wherein, The preset temperature is 65℃-200℃.

3. The pump source of claim 1, wherein, The temperature control switch is thermally connected to the light-emitting chip.

4. The pump source of claim 1, wherein, The temperature control switch includes one of a temperature-sensitive switch and a temperature control trigger.

5. The pump source of claim 1, wherein, The temperature control switch includes a conductive channel and a conductive metal with a melting point within a preset melting point range; The conductive metal is disposed within the conductive channel, and the two ends of the conductive channel are respectively connected to the two electrodes of the light-emitting chip; The conductive metal is thermally connected to the light-emitting chip. When the light-emitting chip fails and the temperature rises above the melting point of the conductive metal, the conductive metal melts in the conductive channel, connecting the two electrodes of the failed light-emitting chip.

6. The pump source of claim 5, wherein, The conductive channel includes a first segment, a second segment, and a third segment. The first end of the first segment is connected to the negative electrode of the light-emitting chip, the first end of the second segment is connected to the positive electrode of the light-emitting chip, the second ends of the first segment and the second ends of the second segment are connected, and the second ends of the first segment and the second ends of the second segment are both connected to the third segment. The conductive metal is disposed in the third pipe section. After the conductive metal melts, it flows into the first pipe section and the second pipe section, connecting the two electrodes of the failed light-emitting chip.

7. The pump source of claim 5, wherein, The conductive channel includes a first segment, a second segment, and a third segment. The first end of the first segment is connected to the negative electrode of the light-emitting chip, the first end of the second segment is connected to the positive electrode of the light-emitting chip, the second end of the first segment is connected to the first end of the third segment, and the second end of the third segment is connected to the second end of the second segment. The conductive metal is disposed in the third pipe section. After the conductive metal melts, it flows into the first pipe section and the second pipe section, connecting the two electrodes of the failed light-emitting chip.

8. The pump source of claim 4, wherein, The temperature control trigger includes a temperature sensor, a controller, and a switch connected by a signal. The temperature sensor is thermally connected to the light-emitting chip. The controller is used to output a command to control the switch to turn on when the signal from the temperature sensor reaches a preset temperature.

9. A laser characterized by, Includes the gain medium and the pump source as described in any one of claims 1-8.

10. A laser processing apparatus characterized by comprising: Includes the laser as described in claim 9.

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